KR100696377B1 - cutting unit of tape laminating apparatus - Google Patents

Abstract

The present invention relates to a cutting unit of a tape laminating device that can prevent a safety accident of an operator due to a blade cutting a tape attached to a substrate. The cutting unit of the tape laminating apparatus of the present invention is characterized by preventing the operator's safety accident by not exposing the blade of the cutter to the outside except the tape cutting operation. To this end, the cutting unit of the tape laminating apparatus of the present invention may be provided with a protective member having a cover folded so that the blade is exposed to the outside or unfolded so that the blade is not exposed to the outside.

Tape cutter

Description

Cutting unit of tape laminating apparatus

1A to 2 are views for explaining a cutter according to the prior art;

3 is a configuration diagram for explaining the configuration of a laminating device;

4 is a view showing the configuration of a cutting unit of a tape laminating apparatus according to a preferred embodiment of the present invention;

5A and 5B show a cutter with the cover extended and a cutter with the cover folded;

6 is a view showing a cutter installed blade replacement means.

Explanation of symbols on the main parts of the drawings

110: cutting unit

112: substrate support

120: drive unit

160: Cutter

162: blade

170: protection member

172: cover

The present invention relates to a tape laminating device for a semiconductor manufacturing process, and more particularly, to a cutting unit of a tape laminating device that can prevent a safety accident of an operator due to a blade cutting a tape attached to a substrate.

In recent years, backside grinding is performed on semiconductor wafers in order to make the semiconductor package smaller and thinner, and the tape laminating step for the semiconductor manufacturing step is a processing step before this back grinding step. This laminating step is a step of adhering a tape to the front surface of the substrate in order to protect the front surface of the substrate from the grinding water used in the back polishing process of the substrate, or the substrate particles generated after grinding. Corresponding.

The laminating equipment used in the laminating process includes a loading portion on which a cassette on which a wafer is loaded is placed, an alignment portion for aligning and removing the wafer from the loading portion, And a tape adhesive part for supplying and attaching a back polishing tape to the wafer on which the alignment is completed, and a cutting part for cutting the back polishing tape to a wafer size.

At this time, the cutter in the cutting part needs to be replaced because the performance of the back polishing tape is cut on about 200 wafers.

1 and 2 are perspective views illustrating the cutter of the cutting unit of the tape laminating device according to the prior art.

1C and 2, the cutters 50A and 50B are largely of a rectangular shape 50A and a cylindrical shape 50B. After the cutter has processed more than 200 wafers, the operator must stop the wafer backside polishing equipment and remove and replace the internal cutters 50A and 50B.

Then, the used blades 14 and 24 are removed as shown in FIGS. 1A and 1B, and the new blades 14 and 24 are inserted into the grooves 12 therein, and the set screw 16 is a fastening means 16. After assembling the cutters 50A and 50B fitted with the new blades 14 as shown in FIGS. 1C and 2, the blades are assembled to the wafer backside polishing equipment to continue operation.

However, each time the cutter 50A, 50B is removed from the wafer backside polishing equipment, the fastening means 16 are removed by removing the fastening means 16, removing the blades 14 and 24, and inserting the blades 14 and 24 again. There is an inconvenience to tighten. In addition, the worker's hand is exposed to the risk of damaging the blades 14 and 24 in the process of handling the sharp blades 14 and 24 directly by the worker. This may cause a safety accident.

In particular, a safety accident may occur because the sharp cutter is exposed to the outside when the facility is stopped due to various errors.

The present invention is to solve the above-mentioned problems, an object of the present invention is to provide a cutting unit of a tape laminating device of a new type that can prevent the operator's safety accident by the cutter blade and shorten the replacement time of the blade.

The cutting unit of the tape laminating apparatus of the present invention for achieving the above object is characterized in that the cutter blade is not exposed to the outside, except for the tape cutting operation, to prevent the safety accident of the operator.

The cutting unit of the tape laminating apparatus of the present invention comprises: a substrate support on which a substrate on which a tape for backgrinding is attached is placed; A cutter having a blade for cutting the edge tape of the substrate and up / down for tape cutting; A driving unit to move the cutter along an edge of the semiconductor substrate; And a protective member installed on the cutter and having a cover that is folded to expose the blade to the outside or spread out so that the blade is not exposed to the outside.

In the present embodiment, the protective member is a motor for forward and reverse rotation operation; One end may be wound on a shaft of the motor, and the other end may be connected to a lower end of the cover, and the wire may be extended or folded according to forward and reverse rotation of the motor.

In the present embodiment, the cutter includes a cutter body; A storage unit for storing a plurality of blades provided in the cutter body; A blade fixing part provided below the cutter body; A spring shutter installed at an upper portion of the storage part and configured to supply one blade in the storage part to the blade fixing part; A blade supply part connected to the storage part from an upper portion of the cutter body to supply a blade to the storage part; It may have a magnetic region which is installed adjacent to the blade fixing portion.

In the present embodiment, the blade processing unit may be provided with a ball pin to physically fix the blade.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

An embodiment of the present invention will be described in detail with reference to FIGS. 3 to 6. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

Laminator (laminator) shown in Figure 3 is a device used in the process of adhering the tape for preventing contamination on the front surface of the substrate.

Referring to FIG. 3, the laminator equipment 100 includes a loading and unloading part 12, an alignment part 14, a transfer arm 16, and a tape attachment part. 18), a tape cutting part 20 and a robot arm.

In the tape bonding process using the laminator equipment 100, first, a cassette loaded with a substrate is loaded into the loading and unloading portion of the laminator equipment 100. Then, the robot arm 22 of the laminator equipment 100 removes the substrate from the cassette and transfers it to the alignment unit 14 (1 in Fig. 1). Then, the alignment unit 14 completes the alignment by finding the flat zone (linear region formed to distinguish the vertical direction of the substrate) on the substrate while rotating the substrate to the right or left. The aligned substrate is transferred to the tape adhesive unit 18 by the transfer arm 16 (2 in FIG. 1). In the tape bonding portion 18, the anti-fouling tape is attached to the entire surface of the substrate, and is usually adhered by an adhesive unit using a roller. The bonded substrate is again transferred to the tape cutting unit 20 by the robot arm 22 (3 in FIG. 1), where the cutting unit cuts the tape along the size of the substrate, that is, the circumferential surface thereof. The cut substrate is again transferred to the loading and unloading portion 12 by the robot arm 22 (4 in Fig. 1) and placed in a slot of the cassette.

4 is a view showing the configuration of a cutting unit of the tape laminating apparatus according to a preferred embodiment of the present invention.

The cutting unit 110 shown in FIG. 4 is a unit for bonding the tape t to the front surface of the substrate w and cutting the remaining edge tape. The substrate on which the back grinding tape is attached is placed. The loser has a substrate support 112. Above the substrate support 112, a cutter 160 having a blade 162 disposed vertically on one side of the edge of the substrate w, lifting and rotating, and cutting the tape t at the non-contact portion is disposed. The cutter 160 cuts the unnecessary tape at the edge of the substrate while moving along the edge of the substrate by the driver 120.

The driving unit 120 has a horizontal bar 124 horizontally rotated by the rotation motor 122, the cutter 160 is hinged to the end of the horizontal bar (124). In addition, the cutter 160 moves down to an elastic member 126 that provides an elastic force to the cutter so that the blade 162 is in close contact with the edge of the substrate, and a position (shown in FIG. 3) for the cutter 160 to cut. And a cylinder member 128 for pushing the blade outward so that the blade does not collide with the substrate when it is made.

Before cutting, the cutter 160 stands by being pushed outward by the forward operation of the cylinder member 128 (see FIG. 4). And when the cutter 160 is moved down to the cutting position for cutting, the cylinder member 128 is moved backward, the cutter is inclined inward by the elastic force of the elastic member 126 while cutting the cutting in close contact with the substrate edge Will be implemented.

5a shows a state where the blade is hidden, and FIG. 5b shows a state where the blade is exposed.

As shown in FIGS. 5A and 5B, the protection member 170 is installed in the cutter 160. The protective member 170 has a cover 172 which is folded to expose the blade 162 to the outside or spread out so that the blade 15 is not exposed to the outside.

That is, the protective member 170 is to expose the blade 162 to the outside while the cover 172 is folded in the case of using the blade for cutting the tape, vice versa in the opposite case is exposed to the outside There is an effect that can prevent the safety accident of the worker in advance.

The protection member 170 has a motor 174 and wires 176 that are rotated in forward and reverse directions. One end of the wire 176 is connected to the shaft 174a of the motor and the other end is connected to the bottom of the cover 172. The protection member 170 is the cover 172 is unfolded or folded according to the winding and unwinding action of the wire 176 by the forward and reverse rotation of the motor 174.

Next will be described in detail the operation of the protective member 170 configured as described above. First, when the cutter 160 is lowered for tape cutting, the motor 174 is operated by the power source. The wire 176 is wound around the rotational axis of the motor 174, thereby causing the cover 172 to be folded up, resulting in the blade 162 exposed to the outside. When the cutter 160 rises to a position to wait after finishing the tape cutting or a facility error or a momentary stop occurs, the motor 174 rotates in reverse to release the wire 176 wound on the rotation axis of the motor. Accordingly, the cover 172 is unfolded as a result, the blade 162 is hidden into the cover 172 as a result. Although not shown, when the folding or unfolding operation of the cover is completed, the operation of the motor M is automatically stopped. This is a well-known technique in which a function of a general sensor is applied, and thus the description thereof is omitted.

Meanwhile, in the embodiment of the present invention, the cover is expanded or folded by a wire operated by a motor, but other well-known technologies using hydraulic pressure or gas pressure may be used.

As described above, the present invention can prevent the safety accident of the worker in advance by not exposing the blade to the outside by the cover other than the tape cutting operation.

On the other hand, the cutter may be provided with automatic blade replacement means as shown in FIG.

Referring to FIG. 6, in the blade replacement method of the cutter 160 according to the present embodiment, first, a plurality of blades are introduced into the blade supply unit 163 in the cutter body 161 to store them in the blade storage unit 164. do.

The blade storage unit 164 is a front surface of the spring shutter 165 is assumed, and assuming that the direction of the blade supply unit 163 is the rear, the front is made high and the rear is inclined low. Therefore, the blade storage portion 164 made obliquely is to be in close contact with the front edge of the blade 162 in front of the front automatically by gravity. And when it is time to replace the blade 162 by processing more than 200 wafers in the laminator equipment, pull the ball pin (ball pin, 168) of the fastening means in the blade fixing portion 167 to fix the blade 162 Release the used blade 162 to remove it.

Thereafter, when the spring shutter 165 is pressed, the blade moving means 165a at the lower portion of the spring shutter 165 is pressed down as shown by the arrow in the drawing, and one blade is in close contact with the front side of the blade storage portion 164. 162 is moved toward the blade fixing portion 167. At this time, the blade 162 is stopped by the magnetic force of the magnetic region 169 provided adjacent to the blade fixing portion 167. In this state, the blade 162 is fixed to the blade fixing part 167, and the replacement of the new blade is completed by pressing the ball pin 168, which is a fastening means, to completely fix the blade 162 to the blade fixing part 167. .

In addition, the spring shutter 165 may allow the blade 162 to be automatically replaced by making the electronic wafer transmit and receive electrical signals to and from the counter mounted inside the semiconductor wafer backside polishing equipment.

On the other hand, the present invention can be variously modified in the cutting unit of the tape laminating device having the above configuration and may take various forms. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

In the above, the configuration and operation of the cutting unit of the tape laminating apparatus according to the present invention is shown in accordance with the above description and drawings, but this is merely described, for example, and various changes and modifications without departing from the technical spirit of the present invention. Of course this is possible.

As described above, the cutting unit of the tape laminating apparatus of the present invention can prevent the safety accident of the operator in advance by not exposing the blade to the outside by the cover other than the tape cutting operation. In addition, the cutting unit of the present invention is equipped with automatic blade replacement means, it is possible to reduce the replacement time of the blade and at the same time prevent the safety accident of the operator.

Claims (5)

In the cutting unit of the tape laminating device: A substrate support on which a substrate on which a back grinding tape is attached is placed; A cutter having a blade for cutting the edge tape of the substrate and up / down for tape cutting; A driving unit to move the cutter along an edge of the semiconductor substrate; And And a protective member installed on the cutter and having a cover folded to expose the blade to the outside or unfolded so that the blade is not exposed to the outside, When the blade is to be used for cutting the tape, the cutting unit of the tape laminating device, characterized in that the blade is exposed to the outside while the cover is folded. The method of claim 1, The protective member Forward and reverse rotationally operated motors; And And one end of which is connected to the shaft of the motor and the other end of which is connected to a lower end of the cover to allow the cover to be unfolded or folded according to forward and reverse rotation of the motor. The method of claim 1, The cutter is Cutter body; A storage unit for storing a plurality of blades provided in the cutter body; A blade fixing part provided below the cutter body; And Cutting unit of the tape laminating device is installed on the storage unit and comprises a spring shutter for supplying one blade in the storage unit to the blade fixing portion. The method of claim 3, The cutter is A blade supply part connected to the storage part from an upper portion of the cutter body to supply a blade to the storage part; The cutting unit of the tape laminating device further comprises a magnetic region installed adjacent to the blade fixing portion. The method of claim 3, The blade fixing unit cutting unit of the tape laminating device, characterized in that it comprises a ball pin for physically fixing the blade.

Images