KR100682380B1 - Contact,socket,socket board,and electronic component test apparatus - Google Patents

Abstract

The contact 44 is provided in the hollow part of the 1st coil spring 441 and the 1st coil spring 441, and the 2nd coil whose length is shorter than the length of the wire rod which comprises the 1st coil spring 441. A spring 442 and a contact portion 443 provided at both ends of the first coil spring 441 and the second coil spring 442.

Since the contact 44 having such a structure does not have a probe portion and a casing like the probe pin, the inductance component can be made small and the pitch can be made narrow. Furthermore, since the conductive resin material is not used, it is also excellent in durability.

Contact, Socket, Socket Board, Electronic Component Testing Equipment

Description

CONTACT, SOCKET, SOCKET BOARD, AND ELECTRONIC COMPONENT TEST APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component test apparatus for testing electronic components such as an IC device, and a contact, a socket, and a socket board used in the same. In particular, a contact having excellent low inductance and narrow pitch, and excellent durability, and It relates to a socket, a socket board and an electronic component test apparatus using the same.

In electronic component manufacturing processes such as IC devices, a test apparatus for testing the finally manufactured electronic components is required. In such an electronic component test apparatus, a plurality of IC devices are stored in a tray and conveyed by a device called a handler, and each IC device is brought into electrical contact with a contact portion of the test head, thereby providing a test main device (tester). The test shall be carried out. At this time, each IC device provided for the test is pushed to the contact portion of the test head while being mounted in the test tray. When the test is completed, each IC device is taken out of the test head by the handler and transferred to the tray according to the test result, whereby the classification is carried out into a category of good or bad.

The contact portion of the test head is provided with a socket having a contact (connection terminal) in contact with an external terminal of the IC device in an arrangement corresponding to that of the external terminal of the IC device.

Here, FIGS. 16 and 17 show sockets conventionally used for testing a BGA (Ball Grid Array) type IC device.

The socket 40P of the first type shown in FIG. 16 is most commonly used, and a plurality of probe pins 44P corresponds to the arrangement of the external terminals (solder balls 2B) of the IC device 2. It was supported by the housing 401P in an arrangement.

The probe pin 44P is spring-pushed outwardly (upward / downward) by the coil spring 446P incorporating the coil spring and the coil spring built in the casing 446P, and held by the casing 446P. The probe part 447P is provided.

The lower probe portion 447P has a predetermined contact pressure due to the elasticity of the coil spring built into the casing 446P when the socket 40P is mounted on the socket board (wiring board) installed on the test head. Contact the connection terminal. On the other hand, the upper probe portion 447P has a predetermined contact due to the elasticity of the coil spring built into the casing 446P when the IC device 2 is pushed into the socket 40P by the pusher of the handler. The pressure contacts the external terminal 2B of the IC device 2.

By the way, the recent IC device 2 requires a high frequency test because its operating frequency is high. However, since the conventional probe pin 44P includes the probe portion 447P above and below the casing 446P incorporating the coil spring, the probe pin 44P inevitably needs a predetermined length. If the length of the probe pin 44P is long, the distance between the external terminal 2B of the IC device 2 and the socket board becomes large, and thus the inductance component becomes large, resulting in waveform degradation and adversely affecting the test accuracy. Gives.

In recent years, due to the miniaturization of the package of the IC device 2, the pitch of the external terminal 2B is narrowed. However, since the conventional probe pin 44P includes a casing 446P incorporating a coil spring, there is a limit to reduce the outer diameter, and therefore, it is difficult to narrow the pitch.

The socket 40Q of the second type shown in FIG. 17 is an arrangement corresponding to the arrangement of the plurality of contacts 44Q corresponding to the arrangement of the external terminals 2B of the IC device 2, and the like, such as a thermoplastic elastomer or the like. It is supported by the housing 401Q comprised from an elasticity modulus material. The contact 44Q is formed by circumferentially forming a conductive resin material such as a silicone resin in which metal fine particles such as copper are dispersed.

The lower end of the contact 44Q contacts the connection terminal of the socket board at a predetermined contact pressure by the elasticity of the contact 44Q when the socket 40Q is mounted on the socket board provided on the test head. On the other hand, the upper end of the contact 44Q is the external terminal of the IC device 2 at a predetermined contact pressure by the elasticity of the contact 44Q when the IC device 2 is pushed to the socket 40Q by the pusher of the handler. (2B).

As described above, since the contact 44Q made of a conductive resin material requires a certain size during molding, it is difficult to reduce the inductance component and to narrow the pitch. There was a problem in durability because it greatly decreased.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket, a socket board, and an electronic component test apparatus provided with a contact having such an inductance component with a small inductance component, a narrow pitch, and excellent durability. It is done.

In order to achieve the above object, firstly, the present invention is a contact contacting an external terminal of an area array type electronic component during a test, and the coil spring and the coil spring in the hollow portion of the coil spring. (1) A contact is provided, comprising: a conducting wire for connecting both ends of the wire, the length of which is shorter than the length of the wire rod constituting the coil spring, and which is provided with a flexible wire along with the coil spring.

Examples of the area array type electronic components include IC devices of BGA type and LGA (Land Grid Array) type. The contacts of the present invention are particularly suitable for IC devices of the BGA type.

Since the contact according to the above invention (1) does not have a probe portion like a conventional probe pin, the length can be set short, and the lead wire of the coil spring has a lead shorter than the length of the wire rod constituting the coil spring. Therefore, the inductance component can be made small. In addition, since the contact does not have a casing like a conventional probe pin, the pitch can be narrowed. Moreover, since the said contact does not use a conductive resin material, even if it is repeated use, elasticity does not fall remarkably or electroconductivity falls, and it is excellent in durability.

In the said invention (1), it is preferable that the said conducting wire is made spiral (2). According to the present invention (2), since the conducting wire can stretch and contract with the coil spring, the movement of the coil spring is prevented from being disturbed by the conducting wire. In addition, depending on the setting of the material and shape of the conductive wire, the contact pressure of the contact can be increased, and the contact reliability of the external terminal of the electronic component and / or the connection terminal of the socket board can be improved.

In the above inventions (1, 2), one or both ends of the coil spring are designed so that the contact portion contacting the external terminal of the electronic component and / or the connection terminal of the socket board is designed to close the end opening of the coil spring. Preferred (3). According to the present invention (3), since the contact portion comes into contact with the external terminal of the electronic component and / or the connection terminal of the wiring board (socket board), the contact contact reliability can be improved.

In the said invention (1-3), the said coil spring may be provided with the protrusion which protrudes from the outer peripheral surface of the said coil spring in parts other than the both ends of the said coil spring (4).

According to the said invention (4), it can prevent that a coil spring protrudes from a housing by holding etc. the protrusion part provided in a coil spring in a part of housing.

In the said invention (4), the said coil spring has a diameter part which is partially enlarged in diameter, and the said diameter part may be the said protrusion part (5).

In addition, in the said invention (4), the said coil spring overlaps two coils in a stretch direction, and the edge part of the said coil may be the said protrusion part (6).

In the said invention (6), it is preferable that the edge part of the said coil used as the said projection part is located in two places which mutually oppose each other via the centerline of the said coil spring (7). According to this invention (7), a contact can be supported by a housing in a stable state.

Secondly, the present invention provides a socket comprising the contacts 1 to 7 and a housing for supporting or guiding the contacts in an arrangement corresponding to the arrangement of external terminals of the electronic component under test (8). .

Thirdly, the present invention includes the contacts 1 to 7 and a housing for supporting the contacts in an arrangement corresponding to the arrangement of external terminals of the electronic component under test, wherein the housing is divided into two in the thickness direction, (9) A socket is provided, characterized in that it has a hole through which the contact penetrates, and the hole of the housing is provided with a protrusion accommodating portion for accommodating the protrusion of the coil spring therebetween.

According to the said invention (9), by the housing of a simple structure, a contact can be supported so that a contact may not protrude from a housing.

Fourthly, the present invention provides a socket board (including a socket board integrated with a socket), wherein one end of the contacts 1 to 3 is fixed to be electrically connected to a connection terminal of the socket board. 10).

According to the said invention (10), since a protrusion is provided in a contact and it is not necessary to support a contact with a housing by the protrusion, the structure around a contact can be simplified.

In the said invention (10), it is preferable that the said contact is guided by the housing which has the hole part through which the said contact passes (11).

In the invention (10), although the housing is not an essential requirement, by providing the housing according to the invention (11), the contact can be reliably brought into contact with the external terminal of the electronic component under test.

Fifthly, the present invention provides an electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, wherein the contacts 1 to 7 are provided. An electronic component testing apparatus is provided (12).

Sixthly, the present invention provides an electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, and the sockets 8 and 9 are provided at the contact portion. An electronic component testing apparatus is provided (13).

Seventhly, the present invention provides an electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, and the socket portions 10 and 11 are provided at the contact portion. An electronic component test apparatus is provided (14).

Brief description of the drawings

1 is an overall side view of an IC device test apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a handler in the IC device test apparatus shown in FIG. 1. FIG.

3 is a flow chart of a tray showing a method of processing an IC device under test.

4 is a perspective view showing the structure of a handler IC stocker in the IC device test apparatus shown in FIG. 1;

5 is a perspective view illustrating a customer tray used in the same handler.

6 is a cross-sectional view of main parts in the test chamber of the same handler.

7 is an exploded perspective view showing a test tray used in the same handler.

FIG. 8 is an exploded perspective view showing a structure near a socket in a test head of the IC device test apparatus shown in FIG. 1; FIG.

FIG. 9 is a partially enlarged perspective view of the socket shown in FIG. 8; FIG.

10 is a partial cross-sectional view of a socket according to an embodiment of the present invention.

11 (a) to 11 (c) are perspective views of a contact portion of a contact according to one embodiment of the present invention.

12 is a sectional view of the vicinity of the socket shown in FIG. 8;

FIG. 13 is a cross-sectional view illustrating a state in which the pusher is lowered in FIG. 12. FIG.

14 is a partial cross-sectional view of a socket according to another embodiment of the present invention.

15 is a partial cross-sectional view of a socket and a socket board according to another embodiment of the present invention.

16 is a partial cross-sectional view of a conventional socket.

17 is a cross-sectional view of a conventional socket.

Best Mode for Carrying Out the Invention

[First Embodiment]

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described based on drawing.

First, the whole structure of the electronic component test apparatus (henceforth an "IC device test apparatus") which concerns on this embodiment is demonstrated. As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 sequentially transfers an IC device to be tested (an example of an electronic component) to a socket provided in the test head 5, and stores the IC devices that have been tested in a predetermined tray classified according to the test results. Run In this embodiment, a BGA type IC device having a plurality of external terminals made of solder balls on a lower surface of a rectangular package body is tested.

The socket provided in the test head 5 is electrically connected to the test main device 6 via a cable 7, and the test main device 6 is connected to the test main device 6 via a cable 7. And the IC device is tested by the test electrical signal from the test main device 6.

The lower part of the handler 1 mainly includes a control device for controlling the handler 1, but a space part 8 is provided at a part thereof. The test head 5 is freely arranged in this space portion 8 so that the IC device can be mounted in the socket on the test head 5 via the through hole formed in the handler 1. .                 

The handler 1 is a device for testing an IC device in a temperature state (high temperature) or a low temperature state (low temperature) higher than room temperature. As shown in FIGS. 2 and 3, the thermostat 101 and a test chamber are shown. And a chamber 100 composed of a 102 and a heat removal tank 103. The upper part of the test head 5 shown in FIG. 1 is inserted into the test chamber 102 as shown in FIG. 6, so that the test of the IC device 2 is performed.

3 is a figure for understanding the processing method of the test IC device in the handler of this embodiment, and there exist some parts which planarly showed the member arrange | positioned side by side in the up-down direction actually. Therefore, the mechanical (three-dimensional) structure can be understood mainly with reference to FIG.

As shown in Fig. 2 and Fig. 3, the handler 1 of the present embodiment includes an IC storage unit 200 for storing IC devices which are subsequently tested, and classifying and storing IC devices which have been tested, and The test is performed by the loader unit 300 which sends the IC device under test from the IC storage unit 200 to the chamber unit 100, the chamber unit 100 including the test head, and the chamber unit 100. It consists of an unloader part 400 which takes out and classifies the IC device at the end of the test. Inside the handler 1, the IC device is stored in the test tray TST (see Fig. 7) and conveyed.

A large number of IC devices before being set in the handler 1 are housed in the customer tray KST shown in FIG. 5, and in this state, the IC devices 200 of the handler 1 shown in FIGS. The IC device 2 is transferred and loaded from the customer tray KST to the test tray TST conveyed in the handler 1. As shown in FIG. 3, inside the handler 1, the IC device 2 moves in the state loaded in the test tray TST, and is subjected to high or low temperature stress, and whether or not it operates properly. It is tested (checked) and classified according to the test result. Hereinafter, the inside of the handler 1 is explained in full detail individually.

First, a part related to the IC storage unit 200 will be described.

As shown in FIG. 2, the IC storage unit 200 includes a pre-test IC stocker 201 storing an IC device before a test, and a test termination IC stocker 202 storing IC devices classified according to the test results. Is installed.

As shown in FIG. 4, the pre-test IC stocker 201 and the test-ended IC stocker 202 penetrate from the lower part of the tray support frame 203 and the tray support frame 203 as shown in FIG. 4. An elevator 204 is provided to make it possible to ascend and descend toward. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. In addition, the customer tray KST in this embodiment has an IC device accommodating part of 10 rows x 6 columns, as shown in FIG.

In the IC stocker 201 before the test, the customer tray KST in which the IC device to be tested is stored is stacked and stored. In addition, the test tray IC stocker 202 stacks and stores a customer tray KST in which the classified and sorted IC devices are stored.

In addition, since the pre-test IC stocker 201 and the test termination IC stocker 202 have substantially the same structure, the portion of the pre-test IC stocker 201 is used as the test termination IC stocker 202 or vice versa. It is possible. Therefore, the number of IC stockers 201 before the test and the number of test finished IC stockers 202 can be easily changed as necessary.

As shown in FIG. 2 and FIG. 3, in the present embodiment, two stockers STK-B are provided as the stockers 201 before the test. Next to the stocker STK-B, two empty stockers STK-E sent to the unloader 400 are provided as the test termination IC stocker 202. Next to the test termination IC stocker 202, eight stockers (STK-1, STK-2, ..., STK-8) are installed and configured to be divided into up to eight categories according to the test results. have. In other words, in addition to the classification of the good and defective products, it is possible to classify the good products into high speed, medium speed, low speed, or retesting in bad condition.

Secondly, a part related to the loader 300 will be described.

As shown in FIG. 2, the customer tray KST stored in the tray support frame 203 of the pre-test IC stocker 201 illustrated in FIG. 4 is the IC storage unit 200 and the device substrate 105. It is conveyed from the lower side of the apparatus substrate 105 to the window part 306 of the loader part 300 by the tray transfer arm 205 provided in the liver. In the loader section 300, the IC device under test loaded on the customer tray KST is transferred to the preciser 305 by the XY transfer device 304, where the IC under test is After correcting the mutual position of the device, the test tray (TST) is stopped on the loader unit 300 using the XY transfer device 304 again with the IC device under test transferred to the preserizer 305 thereon. Move it to).                 

As shown in FIG. 2, the XY conveying apparatus 304 which carries the IC device under test from the customer tray KST to the test tray TST is provided with two rails 301 arranged on the upper portion of the apparatus substrate 105. ), A movable arm 302 capable of reciprocating between the test tray TST and the customer tray KST by this two rails 301 (make this direction Y-direction), and the movable arm 3020. And a movable head 303 which is supported by the movable arm 302 and is movable in the X direction along the movable arm 302.

Third, the part related to the chamber 100 is demonstrated.

The test tray TST described above is transferred to the chamber 100 after the IC device under test is loaded in the loader 300, and each IC device under test is mounted on the test tray TST.

As shown in FIG. 2 and FIG. 3, the chamber 100 includes a thermostat 101 that gives a high or low temperature thermal stress to an IC device under test in a test tray TST, and the thermostat 101. To remove the thermal stress applied from the test chamber 102 in which the IC device under thermal stress is applied to the socket on the test head and the IC device tested in the test chamber 102. The heat removal tank 103 is comprised.

In the heat removal tank 103, when the high temperature is applied in the thermostat 101, the IC device under test is cooled by blowing and returned to room temperature. When the low temperature is applied in the thermostat 101, the IC device under test is warmed. Or it heats with a heater etc. and returns to the temperature to which no dew condensation generate | occur | produces. Then, the removed IC device under test is carried out to the unloader unit 400.

As shown in FIG. 2, the thermostatic chamber 101 and the heat removal tank 103 of the chamber 100 are arranged to protrude upward from the test chamber 102.

In addition, as shown conceptually in FIG. 3, the thermostatic chamber 101 is provided with a vertical conveying apparatus, and a plurality of test trays TST are vertically conveyed until the test chamber 102 becomes empty. Stand by while supporting the device. Mainly, in this atmosphere, high or low temperature thermal stress is applied to the IC device under test.

As shown in FIG. 6, the test chamber 102 has a test head 5 disposed below its center, and a test tray TST is carried on the test head 5. Here, all the IC devices 2 stored by the test tray TST shown in FIG. 7 are electrically contacted with the test head 5 in sequence, and with respect to all the IC devices 2 in the test tray TST. Perform the test. On the other hand, the test tray TST where the test is completed is de-heated by the heat removal tank 103, and after returning the temperature of the IC device 2 to room temperature, to the unloader unit 400 shown in FIGS. 2 and 3. Discharged.

In addition, as shown in FIG. 2, an inlet opening for transferring the test tray TST from the apparatus substrate 105 to the upper portion of the thermostatic chamber 101 and the heat removing tank 103, and the apparatus substrate 105. The outlet openings for sending out the test tray TST are respectively formed. The apparatus substrate 105 is equipped with a test tray conveying apparatus 108 for taking out and inserting the test tray TST from this opening. Such a conveying apparatus 108 is configured by, for example, a rotary roller or the like. By the test tray conveying apparatus 108 provided on this apparatus substrate 105, the test tray TST discharged from the heat removal tank 103 is conveyed to the unloader part 400. As shown in FIG.

7 is an exploded perspective view showing the structure of a test tray TST used in this embodiment. The test tray TST has a rectangular frame 12, in which a plurality of grate 13 is parallel and provided at equal intervals. On both sides of the grate 13 and the inside of the side 12a of the parallel frame 12 of the grate 13, a plurality of attachment pieces 14 are formed by protruding at equal intervals in the longitudinal direction. Each insert storage portion 15 is composed of two attachment pieces 14 facing each other among the plurality of attachment pieces 14 provided between the grate 13 and between the grate 13 and the side 12a. It is.

One insert 16 is accommodated in each insert storage portion 15, and the insert 16 is provided in a floating state on two attachment pieces 14 using fasteners 17. FIG. . In this embodiment, the insert 16 is attached to 4x16 pieces as one test tray TST. That is, the test tray TST in this embodiment has the insert storage part 15 of 4 rows x 16 columns. The IC device 2 under test is loaded into the test tray TST by storing the IC device 2 under test in the insert 16 attached to the insert storage section 15.

As shown in FIG. 7 and FIG. 8, an IC storing portion 19 for storing the IC device 2 under test is formed in the center portion of the insert 16. As shown in FIG. In addition, the guide hole 20 into which the guide pin 32 of the pusher 30 is inserted is formed in the center part of both ends of the insert 16, and the attachment piece of a test tray TST is formed in the corner of both ends of the insert 16 ( An attachment hole 21 for 14 is formed.

As shown in FIG. 8, the socket board 50 as a wiring board is arrange | positioned on the test head 5, and the socket 40 which has several contacts 44 is fixed on the socket board 50. As shown in FIG. It is. The contacts 44 are supported by the housing 401 of the socket 40 in the number and pitch corresponding to the external terminals of the IC device 2.

9 and 10, the contact 44 according to the present embodiment includes a second coil spring 442 provided at a hollow portion of the first coil spring 441 and the first coil spring 441, and The contact portion 443 is provided at both ends of the first coil spring 441 and the second coil spring 442. The first coil spring 441 mainly exhibits the function of spring elasticity, and the second coil spring 442 mainly exhibits the function of electrical conduction.

Although the 1st coil spring 441 in this embodiment has a substantially uniform outer diameter other than a center part, it has the enlarged diameter part 444 which diameter (part volume) is large partly in a center part.

The inner diameter of the first coil spring 441 and the outer diameter of the second coil spring 442 are set to dimensions that do not interfere with the first coil spring 441 and the second coil spring 442 even when the contact 44 is compressed. It is.

The length of the wire rod constituting the second coil spring 442 needs to be shorter than the length of the wire rod constituting the first coil spring 441. In particular, the length of the wire rod constituting the second coil spring 442 may be shortest while preserving elasticity as the coil spring. By shortening the wire rod constituting the second coil spring 442 in this manner, the inductance component of the contact 44 can be reduced.                 

In the present embodiment, the upper end / lower end of the first coil spring 441 and the upper end / lower end of the second coil spring 442 are integrally melted by means of laser processing or the like, and the molten part is a contact portion ( 443). The contact portion 443 is formed to close the end opening of the first coil spring 441.

The shape of the surface of the contact portion 443 may be spherical as shown in Fig. 11A, or may be planar as shown in Fig. 11B, as shown in Fig. 11C. Similarly, the surface may be irregular.

As a wire material which comprises the 1st coil spring 441 and the 2nd coil spring 442, it is good to use the metal excellent in mechanical stress characteristics, such as phosphor bronze, stainless steel, beryllium copper, a piano wire, for example. In addition, the entire contact 44, that is, the first coil spring 441, the second coil spring 442, and the contact portion 443 may be plated with a highly conductive metal such as gold.

The housing 401 in this embodiment is comprised by laminating | stacking two housing plates 401a and 402b. In the housing 401 (housing plates 401a and 401b), hole portions 402a and 402b through which the contact 44 penetrates are formed. The hole portions 402a and 402b have a large diameter at a portion where the housing plate 401a and the housing plate 401b are in contact with each other, and have a diameter-receiving portion accommodating portion for accommodating the enlarged diameter portion 444 of the contact 44. 403a and 403b) are formed.

The housing 401 is constructed from an insulating material. As such an insulating material, a liquid crystal polymer (LCP), polyphenylene sulfide (PPS) resin, a silicone resin, a polyimide resin, etc. can be illustrated.

In the socket 40, the enlarged diameter receiving portion 403a formed in the hole 402a of the housing plate 401a and the enlarged diameter receiving portion 403b formed in the hole 402b of the housing plate 401b. The contact 44 is housed so that the contact 44 does not protrude from the housing 401 by inserting the enlarged diameter portion 444 of the coil spring 441 and joining the housing plate 401a and the housing plate 401b. 401 is supported.

The bonding method of the housing plate 401a and the housing plate 401b is not specifically limited, For example, an adhesive agent, a screw, etc. can be used.

In the socket 40, the contact portions 443 above and below the contacts 44 usually protrude from the hole portions 402a and 402b of the housing 401.

When the socket 40 is fixed to the socket board 50 as shown in FIG. 8, the contact portion 443 at the lower side of the contact 44 is connected to the coil springs 441 and 442, particularly the first coil spring 441. By elasticity, the contact terminal of the socket board 50 is reliably contacted by a predetermined contact pressure.

Since the contact 44 in the socket 40 does not have a probe portion like the probe pin, the length can be shortened, and the second coil spring 442 between the upper and lower contacts 443 is provided. Since the conductive path can be shortened, the inductance component can be reduced. In addition, since the contact 44 does not have a casing like the probe pin, the pitch can be narrowed. Furthermore, since the contact 44 is made of a material excellent in mechanical stress characteristics without using a conductive resin material, the elasticity does not significantly decrease or conductivity does not decrease even after repeated use (for example, 20,000 times or more). Excellent in durability

As illustrated in FIGS. 8, 12, and 13, the socket guide 41 is fixed around the socket 40. Two guide pins 32 formed on the pusher 30 are inserted into both side portions of the socket guide 41, and guide bushes 411 for performing alignment between the two guide pins 32 are provided. It is installed.

As shown in FIG. 6, a pusher 30 corresponding to the number of sockets 40 is provided above the test head 5. 12 and 13, a pusher 31 for pushing the IC device 2 under test is provided downward in the lower center of the pusher 31, and is provided at both ends of the lower side of the pusher 30. A guide pin 32 is inserted into the guide hole 20 of the insert 16 and the guide bush 411 of the socket guide 41.

In addition, when the pusher 30 moves downward by the Z-axis driving device 70 between the presser 31 and the guide pin 32, the lower limit is set in contact with the stopper surface 412 of the socket guide 41. The stopper pin 34 which can be provided is provided.

As shown in FIG. 6, each pusher 30 is fixed to the lower end of the adapter 62, and each adapter 62 is elastically held in the match plate 60. The match plate 60 is mounted on the test head 5 so that the test tray TST can be inserted between the pusher 30 and the socket 40. The pusher 30 held by the match plate 60 is free to move in the Z-axis direction with respect to the drive plate (drive body) 72 of the test head 5 or the Z-axis drive device 70. . In addition, the test tray TST is conveyed between the pusher 30 and the socket 40 from the perpendicular | vertical direction (X-axis) to the ground in FIG. A conveying roller or the like is used as the conveying means of the test tray TST into the chamber 100. When the test tray TST is conveyed and moved, the driving plate of the Z-axis driving device 70 rises along the Z-axis direction, and a sufficient gap in which the test tray TST is inserted between the pusher 30 and the socket 40. It is shaped.

As shown in FIG. 6, the press part 74 is fixed to the lower surface of the drive plate 72, and the upper surface of the adapter 62 held by the match plate 60 can be pressed. The drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78, and the drive shaft 78 is moved along the Z axis direction to move the adapter 62. ) Can be pressed.

In addition, the match plate 60 is adapted to match the shape of the IC device 20 to be tested, the number of sockets 40 provided in the test head 5 (the number of IC devices 2 to be measured at the same time), and the like. ) And the pusher 30, the exchange is free. By allowing the exchange of the match plates 60 in this way, the Z-axis driving device 70 can be used for general purposes.

In the present embodiment, in the chamber 100 configured as described above, as illustrated in FIG. 6, the temperature control blower 90 is mounted inside the sealed casing 80 constituting the test chamber 102. have. The temperature control blower 90 has a fan 92 and a heat exchanger 94, sucks air in the casing by the fan 92, and discharges the inside of the casing 80 via the heat exchanger 94. By circulating, the inside of the casing 80 is made into a predetermined temperature condition (high temperature or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchanger 94 of the temperature control blower 90 is constituted of a heat exchanger for heat dissipation or an electrothermal heater, through which a heating medium flows. In order to keep it at high temperature, sufficient heat quantity can be provided. In addition, when making the inside of the casing low temperature, the heat exchange part 94 is comprised by the heat absorption heat exchanger etc. which coolant, such as liquid nitrogen, circulates, and maintains the inside of casing at low temperature, such as -60 degreeC-room temperature. In order to absorb a sufficient amount of heat, The internal temperature of the casing 80 is detected by, for example, the temperature sensor 82, and the air volume of the fan 92, the heat amount of the heat exchanger 94, and the like are controlled so that the inside of the casing 80 is maintained at a predetermined temperature. .

Hot air or cold air (air) generated through the heat exchange part 94 of the temperature control blower 90 flows along the upper portion of the casing 80 along the Y-axis direction, and descends along the casing side wall opposite to the device 90. After returning to the apparatus 90 through the gap between the match plate 60 and the test head 5, the inside of the casing is circulated.

Fourth, a part related to the unloader unit 400 will be described.

In the unloader 400 shown in FIGS. 2 and 3, an XY transport apparatus 404 having the same structure as that of the XY transport apparatus 304 installed in the loader 300 is provided, and in this XY transport apparatus 404. By this, the IC device which has been tested by the test tray TST carried to the unloader 400 is transferred to the customer tray KST and loaded.

As shown in FIG. 2, as long as the customer tray KST conveyed to the unloader unit 400 is disposed on the device substrate 105 of the unloader unit 400 so as to position an upper surface of the device substrate 105. Two pairs of window portions 406 are formed.

An elevator 204 for elevating the customer tray KST is provided below each window 406 (see Fig. 4), and the customer-tested IC device, which has been tested, is loaded and filled. (KST) is loaded and lowered, and this full tray is transferred to the tray transfer arm 205.

Next, the method for testing the IC device 2 in the IC device test apparatus 100 will be described.

In the loader section 300 of the handler 1, the IC device 2 under test mounted on the customer tray KST is attracted to the movable head 303 of the XY transfer device 304, and the test tray TST. After being conveyed onto the IC storage unit 19 of the insert 16 attached thereto, adsorption by the movable head 303 is released and falls into the IC storage unit 19 of the insert 16.

The IC device 2 is stored in the IC storage unit 19 of the insert 16 and heated in the thermostat 101 to a predetermined set temperature, and then conveyed into the test chamber 102.

6 and 12, when the test tray TST equipped with the IC device 2 stops on the test head 5, the Z-axis driving device 70 is driven to drive the drive plate 72. The pressing unit 74 fixed to the pressing unit pushes down the pusher 30 via the adapter 62.

In this way, as shown in FIG. 13, the guide pin 32 of the pusher 30 is inserted into the guide hole 20 of the insert 16, and the pusher 30, the insert 16, and the socket 40 are removed. The positional dance of the is done. The presser 31 of the pusher 30 pushes the package body of the IC device 2 to the socket 40 side, and as a result, the external terminal 2B of the IC device 2 contacts the contact of the socket 40 ( 44 is connected to the upper contact portion 443.

At this time, the contact portion 443 is secured by the elasticity of the coil springs 441 and 442 of the contacts 44, in particular, the first coil spring 441, so as to reliably contact the external terminal 2B of the IC device 2 with a predetermined contact pressure. To contact.

In this state, a test is performed in which a test electric signal is transmitted from the test main device 6 to the IC device 2 under test via the contact 44 of the socket 40. Since the contact 44 of the socket 40 in this embodiment has a small inductance component as described above, the high frequency test can be performed without any problem.

When the test of the IC device 2 under test is completed, the Z-axis driving device 70 is driven to raise the drive plate 72, the match plate 60, and the pusher 30, and with this, the drive plate ( 162 and drive body 165 move upwards.

Second Embodiment

Next, a second embodiment of the present invention will be described. This embodiment relates to another embodiment of the socket 40 in the first embodiment.

As shown in FIG. 14, the socket 40A according to the present embodiment includes a housing 401A and a contact 44A supported by the housing 401A.

The contact 44A according to the present embodiment includes a first coil spring 441aA and a second coil spring 441bA overlapped in the vertical direction, and a hollow portion of the first coil spring 441aA and the second coil spring 441bA. It consists of the 3rd coil spring 442A provided, and the contact part 443aA and 443bA provided in the upper end of the 1st coil spring 441aA, and the lower end of the 2nd coil spring 441bA. The first coil spring 441aA and the second coil spring 441bA mainly exhibit spring elasticity functions, and the third coil spring 442A mainly exhibits electrical conduction functions.

Lower end of the first coil spring 441aA (end of the side in contact with the second coil spring 441bA) and upper end of the second coil spring 441bA (first coil spring 441aA) in the present embodiment. The end of the side in contact with each other is a protrusion 445aA, 445bA which protrudes from the main outer circumferential surface of the coil springs 441aA, 441bA. These protrusions 445aA and 445bA are located at two positions facing each other via the center lines of the coil springs 441aA and 441bA.

In addition, although the 1st coil spring 441aA and the 2nd coil spring 441bA in this embodiment are not specifically joined, it is not limited to this.

The inner diameters of the first coil spring 441aA and the second coil spring 441bA and the outer diameters of the third coil spring 442A are equal to the first coil spring 441aA and the second coil spring 441bA even when the contact 44 is compressed. ) And the third coil spring 442A are set so as not to interfere.

The length of the wire rod constituting the third coil spring 442A is the length of the wire rod constituting the first coil spring 441aA except the protrusion 445aA, and the second coil spring 441bA except the protrusion 445bA. It is necessary to make the length of the wire rod constituting the wire length shorter than the length of the wire rod.

In the present embodiment, the upper end of the first coil spring 441aA, the upper end of the third coil spring 442A, the lower end of the second coil spring 441bA, and the lower end of the third coil spring 442A are laser processed. It melts and integrates by means, such as these, and the melted part becomes the contact part 443A. The contact portion 443A is formed to close the end openings of the first coil spring 441aA and the second coil spring 441bA.

The housing 401A in this embodiment is comprised by laminating | stacking two housing plates 401aA and 401bA. In the housing 401A (housing plates 401aA and 401bA), hole portions 402aA and 402bA through which the contact 44A penetrates are formed. A part of the hole 402aA, 402bA is provided in the part where the housing plate 401aA and the housing plate 401bA contact, and the protrusion part 445aA, 445bA of the said contact 44A is accommodated. Protrusion part accommodating parts 404aA and 404bA are formed. These protrusion part accommodating parts 404aA and 404bA are located in two places which mutually face each other via the centerline of the hole parts 402aA and 402bA.

In the socket 40A, the protrusion 445aA of the first coil spring 441aA is accommodated in the protrusion accommodating portion 404aA formed in the hole 402aA of the housing plate 401aA, and the second coil spring ( The protrusion 445bA of 441bA is accommodated in the protrusion accommodating part 404bA formed in the hole 402bA of the housing plate 401bA, and the housing plate 401aA and the housing plate 401bA are joined to each other so that the contact ( The contact 44A is supported by the housing 401 so that 44A does not protrude from the housing 401A.

The protrusion 445aA of the first coil spring 441aA and the protrusion 445bA of the second coil spring 441bA are located at two positions facing each other via the centerlines of the coil springs 441aA and 441bA. The contact 44A can be supported by the housing 401A in a stable state.

Since the contact 44A in the socket 40A does not have a probe portion like the probe pin, the length can be shortened, and further, between the upper and lower contacts 443A by the third coil spring 442A. Since the conductive path can be shortened, the inductance component can be reduced. In addition, since the contact 44A does not have a casing like the probe pin, it is possible to narrow the pitch. Furthermore, since the contact 44A is made of a material excellent in mechanical stress characteristics without using a conductive resin material, the elasticity does not remarkably decrease or the conductivity does not decrease even after repeated use (for example, 20,000 times or more). Excellent in durability

[Third Embodiment]

Next, a third embodiment of the present invention will be described. This embodiment relates to other embodiments of the socket 40 and the socket board 50 in the first embodiment.

As shown in FIG. 15, the socket 40B according to the present embodiment includes a housing 401B and a contact 44B guided by the housing 401B.

The contact 44B according to the present embodiment includes a first coil spring 441B, a second coil spring 442B provided in a hollow portion of the first coil spring 441B, a first coil spring 441B, and a second coil spring 441B. It consists of the contact part 443B provided in the both ends of the coil spring 442B. The first coil spring 441B mainly exhibits the function of spring elasticity, and the second coil spring 442B mainly exhibits the function of electrical conduction.                 

The first coil spring 441 in this embodiment has an approximately uniform outer diameter. The inner diameter of the first coil spring 441B and the outer diameter of the second coil spring 442B are set so that the first coil spring 441B and the second coil spring 442B do not interfere even when the contact 44B is compressed. It is.

The length of the wire rod constituting the second coil spring 442B needs to be shorter than the length of the wire rod constituting the first coil spring 441B. In particular, the length of the wire rod constituting the second coil spring 442B is preferably shortest while maintaining the elasticity as the coil spring.

In the present embodiment, the upper end / lower end of the first coil spring 441B and the upper end / lower end of the second coil spring 442B are integrally melted by means of laser processing or the like, and the molten part is contacted. It is a part 443B. This contact portion 443B is formed to close the end opening of the first coil spring 441B.

As shown in Fig. 15, the contact portion 443B under the contact 44B is soldered to the contact terminal of the socket board 50B by soldering. In this way, the contact 44B is connected to the socket board 50B. It is fixed.

In this embodiment, the housing 401B becomes one plate. The housing 401B is formed with a hole 402B through which the contact 44B penetrates, and guides the contact 44B in which the inner circumferential wall of the hole 402B extends and contracts.

Since the contact 44B in such a socket 40B does not have a probe portion like the probe pin, it is possible to set the length shorter, and furthermore, between the upper and lower contacts 443B by the second coil spring 442B. Since the conductive path can be shortened, the inductance component can be reduced. In addition, since the contact 44B does not have a casing like the probe pin, the pitch can be narrowed. Furthermore, since the contact 44B is made of a material excellent in mechanical stress characteristics without using a conductive resin material, elasticity does not significantly decrease or conductivity decreases even after repeated use (for example, 20,000 times or more), which is excellent in durability. Do.

The embodiments described above are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents falling within the technical scope of the present invention.

For example, in 2nd Embodiment, the protrusion part 445aA of the 1st coil spring 441aA and the protrusion part 445bA of the 2nd coil spring 441bA may not be needed, and the 1st coil spring 441aA and the 2nd coil are replaced instead. A washer may be provided between the coil springs 441bA, and the washer may be fitted to the housing 401aA and the housing 401bA.

EXAMPLE

The socket of the type shown in FIG. 15 was manufactured. The detail is as follows.

1. Contact

(1) Coil springs on the outside

 Wire Rod: Steel

 Wire diameter: φ0.06 mm

 Coil Outer Diameter: φ0.3 ㎜                 

 Free height: 0.65 mm

 Effective volume: 8 books

(2) inner coil spring

 Wire Rod: Steel

 Wire diameter: φ0.04

 Coil Outer Diameter: φ0.1 mm

 Effective volume: 2 books

(3) contact

 Formation method: laser processing

 Surface shape: Plane

 Connection method of connecting terminal of socket board: With solder

(4) contacts

 Surface Treatment: Full Gold Plating

 Deflection: 0.2 mm

 Contact pressure: 0.3 N

2. Housing

 Material: Liquid Crystal Polymer (LCP)

 Thickness: 0.3 mm

 Length: 17 mm × 35 mm

 Diameter of the hole: φ0.4 mm                 

 Number of holes: 6 rows x 9 columns

 Pitch of the hole: 1.27 mm

 The inductance of the contact was 0.5 nH as a result of measuring the inductance with the material and the analyzer.

Next, when the test was repeated 20,000 or more times for the socket, there was no change in the contact pressure of the contact. Further, the contact portion of the contact was less attached to the solder ball of the IC device, while the solder ball of the IC device was hardly damaged.

As described above, the contacts of the present invention can reduce the inductance component, narrow the pitch, and are excellent in durability. That is, the contacts, sockets, socket boards, and electronic component test apparatus of the present invention are useful for testing electronic components requiring high frequency tests or electronic components with narrow pitches of external terminals.

Claims (15)

As a contact which contacts the external terminal of an area array type electronic component at the time of a test, Coil spring, A conductive wire connecting both ends of the coil spring to the hollow portion of the coil spring, the length of which is shorter than the length of the wire rod constituting the coil spring, and is provided with a spiral conductor that is stretchable together with the coil spring. Contact. delete delete delete As a contact which contacts the external terminal of an area array type electronic component at the time of a test, Coil spring, A conducting wire connecting both ends of the coil spring in the hollow portion of the coil spring, the length of which is shorter than the length of the wire rod constituting the coil spring, and is provided with a flexible wire with the coil spring; The coil spring has an enlarged diameter portion in which only one coil is larger in diameter than portions at both ends of the coil spring. And said enlarged diameter portion is a protrusion portion protruding from a main outer circumferential surface of said coil spring. As a contact which contacts the external terminal of an area array type electronic component at the time of a test, Coil spring, A conducting wire connecting both ends of the coil spring in the hollow portion of the coil spring, the length of which is shorter than the length of the wire rod constituting the coil spring, and is provided with a flexible wire with the coil spring; The coil spring is formed by overlapping two coils in a stretch direction, and the end of the coil is in a portion other than both ends of the coil spring, And a projecting portion protruding from the outer circumferential surface of the coil spring. The method of claim 6, An end portion of the coil serving as the protruding portion is located at two positions facing each other via a centerline of the coil spring. The contact according to any one of claims 1 to 5 and 7, And a housing for supporting or guiding the contact in an arrangement corresponding to the arrangement of external terminals of the electronic component under test. The contact as described in any one of Claims 5-7, A housing supporting the contact in an arrangement corresponding to an arrangement of external terminals of the electronic component under test, The housing is divided into two in the thickness direction and has a hole portion through which the contact penetrates. The hole of the housing is characterized in that the protrusion receiving portion is formed between the protrusion of the coil spring is formed therebetween. A socket board, wherein one end of the contact according to claim 1 is fixed to be electrically connected to a connection terminal of the socket board. The method of claim 10, And the contact is guided by a housing having a hole through which the contact passes. An electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, wherein the contact portion has a contact as defined in any one of claims 1 to 5. Electronic component test apparatus, characterized in that is installed. An electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, wherein the contact portion is provided with the socket according to claim 8. . An electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, wherein the contact portion is provided with the socket board according to claim 10 or 11. Electronic component testing apparatus. An electronic component test apparatus capable of performing a test by pushing an external terminal of an electronic component under test to a contact portion of a test head, wherein the contact portion is provided with the socket according to claim 9. .

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