KR100672263B1 - Exposure method, exposure apparatus, and mask - Google Patents

Abstract

An object of the present invention is to expose a small number of sheets when performing an exposure process involving screen synthesis.

As a solution, the first pattern and the second pattern are exposed to the substrate by using the mask A having the pattern 1a. The pattern of the mask A is formed of the common pattern KP between the first pattern and the second pattern, and the non-common patterns HP1 and HP2 which are formed in succession with the common pattern KP and are different from the common pattern KP. Have At least a portion of the common pattern KP and the non-common patterns HP1 and HP2 are selected and exposed to the connection fitting.

Description

Exposure method, exposure apparatus, and mask {EXPOSURE METHOD, EXPOSURE APPARATUS, AND MASK}

1 is a view showing a first embodiment of the present invention, which is a plan view of a reticle having a common pattern and a non-common pattern,

2 is a pattern diagram of a glass substrate having a plurality of circuit patterns transferred by the same reticle;

3 is a diagram showing a first embodiment of the present invention, which is a schematic configuration diagram of an exposure apparatus in which a drive control device is connected to a reticle blind and a substrate stage;

4 is a plan view of a blind plate composed of a light shielding portion and a transmission portion, (b) a plan view of a blind plate composed of a light shielding portion, a transmission portion and a photosensitive portion, of a reticle blind constituting the exposure apparatus of the present invention;

5 is a view showing a first embodiment of the present invention, a plan view showing a reticle pattern in a first illumination region;

6 is a view showing a first embodiment of the present invention, a plan view showing a pattern of a reticle in a second illumination region;

7 is a plan view showing the pattern of the reticle in the same other illumination region;

8 is a plan view showing the pattern of the reticle in the same other illumination region;

9 is a view showing a first embodiment of the present invention, a plan view showing a pattern in an illumination region of another reticle;

10 is a plan view showing the pattern of the reticle in the same other illumination region;

11 is a plan view showing a pattern of a reticle in the same other lighting area;

12 is a plan view showing a pattern of a reticle in the same other lighting area;

13 is a view for explaining an intersection where an exposure area intersects;

14 is an exposure dose distribution diagram illustrating a distribution of exposure doses at the same intersection;

15 is an exposure dose distribution diagram illustrating a distribution of exposure doses at the same intersection;

16 is an exposure dose distribution diagram illustrating a distribution of exposure doses at the same intersection;

17 is an exposure dose distribution diagram illustrating a distribution of exposure doses at the same intersection;

18 is an exposure dose distribution diagram showing a distribution of exposure doses at the same intersection;

19 is a diagram for explaining an intersection where an exposure area intersects.

20 is a plan view showing a pattern of a reticle in an illumination region set by a blind plate having a photosensitive portion;

21 is a plan view showing a pattern of a reticle in the same other lighting area;

22 is a plan view showing the pattern of the reticle in the same other illumination region;

23 is a plan view showing the pattern of the reticle in the same other illumination region;

FIG. 24 is a view showing a second embodiment of the present invention, and a pattern diagram of a glass substrate for a liquid crystal display device of 21 inches;

25 is a plan view of three reticles used when exposing the same glass substrate;

26 is a view showing a second embodiment of the present invention, a plan view showing a pattern of a reticle in a first illumination region;

27 is a view showing a second embodiment of the present invention, which is a plan view showing a pattern of a reticle in other lighting regions;

28 is a view showing a second embodiment of the present invention, a plan view showing a pattern in an illumination region of another reticle;

29 is a plan view showing a pattern of the reticle in the same other lighting area;

30 is a view showing a second embodiment of the present invention, a plan view showing a pattern of a reticle in a second lighting area;

31 is a view showing a second embodiment of the present invention, which is a plan view showing a pattern of a reticle in other illumination regions;

32 is a plan view showing a pattern of a reticle in the same other illumination area;

33 is a plan view showing a pattern of a reticle in the same other lighting area;

34 is a plan view showing a pattern of the reticle in the same other lighting area;

35 is a plan view showing a pattern of the reticle in the same other lighting area;

36 is a plan view showing a pattern of a reticle in the same other lighting area;

37 is a plan view showing a pattern of a reticle in the same other illumination area;

38 is a pattern diagram of a glass substrate having a divided circuit pattern;

39 is a plan view showing an example of a mask according to the prior art;

40 is a pattern diagram of a glass substrate having a divided circuit pattern;

It is a top view which shows an example of the mask by a prior art.

* Explanation of symbols for main parts of drawings *

KP: common pattern K1: intersection

HP1, HP2: Non-common pattern P: Glass substrate (substrate)

R, A, B, C: reticle (mask) A1, C1: first pattern

A2, C2: second pattern

SA1, SC1: lighting area (first lighting area)

SA2, SC2: lighting area (second lighting area)

1a, 4a: circuit pattern (pattern) 5: exposure apparatus

7 illumination optical system 9 substrate stage

10: reticle stage (mask stage)

11: drive control device (control device)

17: reticle blind (lighting area setting device)

20: drive mechanism (moving device) 25: transmission part

26: photosensitive part

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask in which an illuminated pattern is transferred to a transfer region, and to an exposure method and an exposure apparatus for transferring the pattern of the mask to a transfer region on a substrate. An exposure method, an exposure apparatus, and a mask are provided.

In general, as an exposure apparatus for manufacturing a liquid crystal display device or the like, after exposing a pattern formed on a mask to a predetermined exposure area of a photosensitive substrate, stepping the photosensitive substrate by a predetermined distance and repeating exposing the pattern of the mask again There is a so-called step-and-repeat type (stepper).

Conventionally, for example, when forming an LCD pattern for a large area liquid crystal display element with a stepper, the screen synthesis method is conventionally used.

This screen synthesis method uses a plurality of masks corresponding to each divided LCD pattern to expose the pattern of the mask in the exposure area of the glass substrate corresponding to one mask, and then steps the glass substrate and simultaneously masks the mask. By exchanging with another one, the pattern of the mask is exposed to the exposure area corresponding to the mask to form an LCD pattern in which a plurality of patterns are synthesized on a glass substrate.

FIG. 38 is a pattern diagram in which circuit patterns 1 of a glass substrate (substrate) P used in manufacturing a 15-inch liquid crystal display device are divided into a plurality (6 in the drawing).

This circuit pattern 1 has a substantially rectangular shape and is composed of a display portion 2 and a peripheral portion 3. The display unit 2 is configured in a pattern in which a plurality of electrodes corresponding to the plurality of pixels (pixels) are regularly arranged. The peripheral part 3 is formed so as to surround the display part 2, and has a conduction part which electrically connects the pattern of each electrode of the display part 2, and the driver circuit (not shown) which drives each electrode. And the circuit pattern 1 is comprised by the division pattern A-F containing these display part 2 and the periphery part 3. As shown in FIG.

On the other hand, FIG. 39 is a plan view of the masks RA to RF on which patterns corresponding to the divided patterns A to F are formed. In the stepper using these masks RA to RF, for example, the mask RA is first mounted, the glass substrate P is moved to a predetermined position corresponding to the division pattern A, and then exposed. The division pattern A is transferred to the glass substrate P. FIG.

Next, the mask RA is replaced with the mask RB, the glass substrate P is moved to a predetermined position corresponding to the division pattern B, and the exposure is performed by exposing the division pattern B to the glass substrate P. Warrior) Then, by sequentially repeating this operation, the division patterns A to F are transferred to the glass substrate P. FIG.

40 is a pattern diagram in which the circuit pattern 4 of the glass substrate (substrate) P used in manufacturing a 21-inch liquid crystal display device is divided into a plurality (15 in the figure). In the same manner as described above, the circuit pattern 4 is configured to be synthesized by the division patterns A to F including the display portion 2 and the peripheral portion 3. In this example, since one part of the display unit 2 is a repeating pattern of the divided patterns A, B, and C, a plurality of shots are exposed with the same mask (for example, a mask having an A pattern). 41 shows masks RA to RF on which patterns corresponding to the divided patterns A to F are formed. Also in this case, the circuit pattern 4 is screen-synthesized by replacing the masks sequentially and exposing the glass substrate P to a predetermined position in the same manner as described above.

However, in performing the above screen synthesis method, a step is generated at the connecting portion of the pattern due to the pattern drawing error of the mask, the aberration of the lens of the projection optical system, the positioning error of the stage for moving the glass substrate, and the like. When the characteristics of the device are impaired or when the screen-synthesized dividing pattern is superimposed in multiple layers, the overlapping error of the exposure area of each layer or the line width of the pattern is discontinuously changed at the connecting portion of the pattern, and the device quality is deteriorated. In order to avoid, what is called connection fitting exposure is implemented.

In this exposure fitting connection, the connection fitting exposure is performed in the adjacent exposure area, and in each exposure area, the exposure amount (exposure energy amount) of this connection part is proportionally directed toward the boundary by changing the exposure time, for example. When exposed by overlapping by decreasing, the exposure amount of this part is made to substantially match the exposure amount of another part, for example, it is disclosed by Unexamined-Japanese-Patent No. 6-244077 and Unexamined-Japanese-Patent No. 7-235466.

 However, the following problems exist in the conventional exposure method, exposure apparatus, and mask as described above.

Of the patterns formed on each of the masks RA to RF, in the pattern of the display portion 2, a plurality of electrodes matching the pixels are regularly arranged. Therefore, even when divided into a plurality of parts, an arrangement pattern partially common to each of the division patterns A to F exists.

However, the dividing patterns A to F differ in the presence or absence of the peripheral portion 3 or the position to which the peripheral portion 3 is connected depending on the position of the divided display portion 2. Therefore, even if it has a partly common pattern, since the masks RA-RF corresponding to the division patterns A-F must be prepared, the load on the cost side was large. In addition, when the number of masks increases, the time required for mask replacement also increases, which causes a problem in improving throughput.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described aspects, and a mask capable of realizing cost reduction and throughput improvement by exposing a small number of sheets even when performing exposure processing involving screen synthesis in device manufacturing, and an exposure method using the mask, and It is an object to provide an exposure apparatus.

MEANS TO SOLVE THE PROBLEM In order to achieve the said objective, this invention employ | adopts the following structures corresponding to FIGS. 1-37 which shows embodiment.

The exposure method of the present invention connects the first pattern A1, C1 and the second pattern A2, C2 to the substrate P by using the masks R, A, B, and C having the pattern 1a. In the exposure method for exposing, the pattern of the mask (A) includes a common pattern (KP) formed continuously with the common pattern (KP) and the common pattern (KP) of the first pattern (A1) and the second pattern (A2); Has different non-common patterns HP1 and HP2, and at least a part of the common patterns KP and the non-common patterns HP1 and HP2 are selected and exposed for connection fitting.

Therefore, in the exposure method of this invention, after exposing the 1st pattern A1 to the board | substrate P, when carrying out exposure exposure of the 2nd pattern A2, the common pattern KP common to 1st pattern A1 is common. ) And at least a part of the non-common pattern HP different from the common pattern KP can be selected and used. Therefore, when exposing the second pattern A2, it is not necessary to separately prepare the mask A having the second pattern A2.

In addition, when the exposure areas on the substrate P corresponding to the illumination areas SA1 and SA2 are arranged in a rectangle so that two sides overlap each other, a photosensitive area in which transmittance gradually changes on one side of the illumination areas SA1 and SA2 is provided. And the illumination areas SA1 and SA2 corresponding to the respective exposure areas can be moved along the one side (the X direction) during exposure. By doing so, the exposure area on the substrate P corresponding to the photosensitive area is exposed with the gradually changed exposure energy amount. In the exposure area adjacent to this exposure area, the overlapped exposure area can be made the same as other parts by overlapping in the photosensitive area.

When the exposure areas are arranged in a rectangular shape as described above, pairs are formed of overlapping exposure areas, and in each pair, the illumination areas SA1 and SA2 corresponding to the exposure areas are exposed in the same direction (diagonal direction) during exposure. Each can be moved along. By doing in this way, in the intersection part K1 of the exposure area arrange | positioned in a rectangle, it can expose with the other half energy amount. Also, in the remaining pairs, the crossing portions K1 can be exposed to the other half by the amount of energy by moving the illumination regions SB1 and SB2 in the same direction during exposure, and the combined amounts of these are the same.

In addition, in the mask (A) having a pattern, the mask of the present invention has a ratio different from the common pattern (KP) and the common pattern (KP) of the plurality of patterns to match the plurality of patterns in the mask (A). The common patterns HP1 and HP2 are formed in succession.

Therefore, in the mask of the present invention, a plurality of patterns can be supported by one mask A by combining the common pattern KP and the non-common patterns HP1 and HP2 different from the common pattern KP.

And the exposure apparatus of this invention is provided with the mask stage 10 which hold | maintains the mask R, A which has a pattern, and the illumination optical system 7 which illuminates the mask R, A, and the mask R, A In the exposure apparatus 5 which exposes the pattern of) to the board | substrate P, the mask A of Claim 8 or 9 is hold | maintained in the mask stage 10, and the illumination area of the mask A is at least An illumination region setting device 17 set in the first illumination region SA1 and the second illumination region SA2, the first pattern A1 exposed to the substrate P by the first illumination region SA1, and The control apparatus 11 which connects and fits the 2nd pattern A2 exposed by the 2nd illumination area | region SA2 to the board | substrate P is provided. It is characterized by the above-mentioned.

Therefore, in the exposure apparatus of the present invention, at least the common pattern KP is set by setting the illumination region of the mask A held on the mask stage 10 to the first illumination region SA1 using the illumination region setting device 17. ), The first pattern A1 having () can be exposed to the substrate P. Next, by setting the illumination area of the mask A to the second illumination area SA2 using the illumination area setting device 17, the second pattern A2 having at least the common pattern KP is formed by the substrate P. FIG. ) Can be exposed. At this time, the 1st, 2nd pattern A1, A2 exposed to the board | substrate P is connected-fit by the control of the control apparatus 11. As shown in FIG.

EMBODIMENT OF THE INVENTION Hereinafter, the 1st Embodiment of the exposure method, exposure apparatus, and mask of this invention is demonstrated, referring FIGS. Here, the glass substrate for manufacturing a 15-inch liquid crystal display device as described above will be described as an example.

In these drawings, the same components as those in Figs. 38 to 41 presented as conventional examples are denoted by the same reference numerals and the description thereof will be simplified.

3 is a schematic configuration diagram of the exposure apparatus 5.

The exposure apparatus 5 projects and transfers a pattern (for example, a liquid crystal display element pattern) formed on the reticle (mask) R onto a rectangular glass substrate (substrate) P. The mercury lamp ( 6) to the illumination optical system 7, the projection optical system 8, the substrate stage 9, the reticle stage (mask stage) 10, the exposure data setting unit 21 and the drive control unit (control unit) 11. It is composed roughly.

The mercury lamp 6 emits a beam B as illumination light. The mercury lamp 6 is provided with an ellipsoidal mirror 6a. The ellipsoidal mirror 6a condenses the illumination light emitted by the mercury lamp 6.

The illumination optical system 7 includes a shutter 12, reflective mirrors 13 and 14, a wavelength selective filter 15, a fly's eye integrator 16, and a reticle blind (lighting area setting device) 17 And a condenser lens 18 in outline. The shutter 12 opens and closes the optical path of the beam B for a predetermined time. The reflecting mirror 13 is condensed by the ellipsoidal mirror 6a and reflects the incident beam B toward the wavelength selective filter 15 in response to the opening operation of the shutter 12. The reflective mirror 14 reflects the beam B passing through the reticle blind 17 toward the condenser lens 18.

The wavelength selective filter 15 passes only the wavelength (g line or i line) required for exposure in the beam B. FIG.

The fly's eye integrator 16 uniforms the illuminance distribution of the beam B that has passed through the wavelength selective filter 15.

The condenser lens 18 forms an image of the illumination area set in the opening S of the reticle blind 17 in the reticle R.

The reticle blind 17 sets the illumination area in which the beam B passing through the fly-eye integrator 16 and the half mirror 13 illuminates the reticle R, as shown in Fig. 4A. Similarly, it is comprised by the blind plates 17a and 17b which move in the direction orthogonal to each other in the plane orthogonal to the beam B, and were formed with the rectangular glass material arrange | positioned with the conjugate surface of the reticle R interposed. Each of the blind plates 17a and 17b is provided with a light shielding portion 24 in which chromium is deposited and shielded from light, and a rectangular transmission portion 25 through which the beam B transmits. In addition, the reticle blinds 17 move the blind plates 17a and 17b so that the respective transmissive portions 25 are combined so that the opening S is formed in accordance with the overlapping range of the transmissive portions 25 and is exposed every time. The sizes of the openings S can be replaced, respectively, and they can be freely moved in the mutually orthogonal directions while keeping the opening widths in the respective directions constant.

In addition, the reticle blind 17 moves at a constant speed during exposure, thereby changing the exposure amount with the change of the position of the opening S, and exposing the exposure area on the glass substrate P corresponding to the position change of the opening S. The exposure amount, ie, the exposure energy amount, is reduced at a constant rate. In addition, the reticle blind 17 includes a drive mechanism (moving device) for driving the blind plates 17a and 17b of the reticle blind 17, respectively, by a transfer mechanism (both not shown) that combines a servomotor and a ball screw ( 20) is installed.

The projection optical system 8 forms an image of the pattern existing in the illumination region of the reticle R on the glass substrate P. FIG.

The reticle stage 10 is to hold the reticle R. The reticle stage 10 is provided with a reticle exchanger (not shown) for exchanging the reticle R.

The substrate stage 9 holds the glass substrate P, and can move freely in directions perpendicular to each other. The moving mirror 9a is formed on this substrate stage 9. The laser beam 19 is emitted from the laser interferometer (not shown) which is a position measuring device in the movable mirror 9a, and the distance between the movable mirror 9a and the laser interferometer, i.e., the substrate stage 9, is based on the interference between the reflected light and the incident light. (Going forward, the position of the glass substrate P) is detected. The substrate stage 9 is provided with a drive mechanism 22 for driving the substrate stage 9 such as a linear motor.

The exposure data setting unit 21 connects the exposure data such as the coordinate position and the size of each of the divided areas in which one exposure area is divided as exposure data, and a part of the adjacent divided areas by overlapping exposure. The data relating to the exposure is input.

The drive control device 11 drives the reticle blind 17 through the drive mechanism 20 so that the adjacent divided areas are connected and exposed on the basis of the exposure data set by the exposure data setting unit 21, and at the same time, the drive mechanism The substrate stage 9 is driven through the 22.

On the other hand, as shown in FIG. 2, the circuit pattern 1 transferred to the glass substrate P is composed of the display portion 2 and the peripheral portion 3. The display unit 2 is configured in a pattern in which a plurality of electrodes according to a plurality of pixels (pixels) are regularly arranged. The peripheral part 3 is formed so as to surround the display part 2, and has a conduction part which electrically connects the pattern of each electrode of the display part 2, and the driver circuit which drives each electrode. The conducting portions are trapezoidal tabs X1 and X2 arranged one at each end in the X-direction of the display portion 2, and eight trapezoids arranged at the same intervals at both ends of the Y-direction of the display portion 2, respectively. It consists of tabs Y1 to Y8 and Y9 to Y16.

Then, the circuit pattern 1 is divided into the display portion 2 and the peripheral portion (divided by the division lines V1 to V3 extending in the Y direction at predetermined intervals in the X direction and the division lines H1 extending in the X direction). It consists of the structure synthesize | combined by the division pattern A1-A4, B1-B4 including 3). Here, the dividing line V1 is set so as to pass through the center of the tab Y3, and the dividing line V3 passes through the center of the tab Y6. In addition, the dividing line V2 is set to pass between the tab Y4 and the tab Y5.

The reticle R for transferring the circuit pattern 1 is composed of two pieces of the reticle (mask) A shown in Fig. 1 (a) and the reticle (mask) B shown in Fig. 1 (b). It is a structure to be used. The reticle A is used to transfer the division patterns A1 to A4, and a circuit pattern (pattern) 1a consisting of a display portion 2a and a peripheral portion 3a and a light shielding band on which chromium is deposited is formed on the surface thereof. 23 is formed with a predetermined projection magnification with the glass substrate P. As shown in FIG.

The peripheral part 3a is comprised from the tab X11, X12 formed in the X direction both ends of the display part 2a, and the three tabs Y21-Y23 formed in the + Y direction end part of the display part 2a. The tabs X11 and X12 have about half of the + Y direction which includes the -Y direction slightly than the dividing line H1 among the patterns to which the tabs X1 and X2 of the glass substrate P are transferred. Similarly, the tabs Y21 to Y23 have patterns to be transferred to the tabs Y1 to Y8 of the glass substrate P, respectively.

The display portion 2a partially has a pattern of the display portion 2 to be transferred to the glass substrate P. FIG. As for the width | variety of the display part 2a, the division direction of the pattern to which the display part 2a is transferred is carried out so that the X direction becomes three lengths of the tabs Y21-Y23, and the Y direction is the same as the said tabs X11, X12. It has a length equivalent to about half of the + Y direction including the -Y direction rather than (H1).

The light shielding stand 23 shields the beam B during the connection fitting exposure, and is formed around the three directions except for the side in the -Y direction of the circuit pattern 1a. In addition, as connection fitting exposure of this embodiment, the system of overlapping part of the pattern (exposure area) exposed adjacently shall be used.

In the reticle A, as shown in Fig. 1 (a), the division line V11 further defines the center of the tab Y23 located at the right end so as to pass through the center of the tab Y21 located at the left end. The dividing lines V14 are virtually set so as to be connected in the Y direction so as to pass by. Further, the dividing line V12 passes between the tab Y21 at the left end and the tab Y22 at the center, and the dividing line V13 passes between the tab Y23 at the right end and the tab Y22 at the center. Each of these is virtually set so as to be connected in the Y direction. Similarly, at the position corresponding to the dividing line H1, the dividing line H11 is virtually set so as to extend in the X direction.

The circuit pattern 1a of the reticle A is separated into a common pattern KP and non-common patterns HP1 and HP2 different from the common pattern KP when exposed to two adjacent divided patterns. . The common pattern KP is set to be transferred to these two divided patterns in common. The non-common patterns HP1 and HP2 are set to be formed continuously with the common pattern KP and with the common pattern P interposed therebetween. And when exposing each divided pattern, it is set so that at least one part of common pattern KP and non-common pattern HP1, HP2 may be selected.

The reticle B is used to transfer the division patterns B1 to B4. Since the reticle B is the same configuration as the reticle A, the reticle B is simply located at both ends of the display portion 2a in the X direction at the tab 3a. (X11, X12) are formed, and the three tabs Y24-Y26 are formed in the edge part at the -Y direction of the display part 2a. The tabs X11 and X12 have about half of the -Y direction in which the tabs X1 and X2 of the glass substrate P are transferred, slightly including the + Y direction than the dividing line H1. Similarly, the tabs Y24 to Y26 have patterns to be transferred to the tabs Y9 to Y16 of the glass substrate P, respectively.

As for the width | variety of the display part 2a, the division direction of the pattern to which the display part 2a is transferred is carried out so that the X direction becomes three lengths of the tabs Y24-Y26, and the Y direction is the same as the said tabs X11, X12. It has a length equivalent to about half of the -Y direction which includes the + Y direction rather than (H1). The light shielding band 23 is formed in the periphery of three directions except the side of the + Y direction of the circuit pattern 1a.

In the reticle B, as shown in Fig. 1 (b), the division line V15 further moves the center of the tab Y26 located at the right end so as to pass through the center of the tab Y24 at the left end. The dividing lines V18 are virtually set so as to extend in the Y direction so as to pass through them. Further, the dividing line V16 passes between the tab Y24 at the left end and the tab Y25 at the center, and the dividing line V17 passes between the tab Y26 at the right end and the tab Y25 at the center. Each of these is virtually set so as to be connected in the Y direction. Similarly, the dividing line H12 is virtually set so that the dividing line H12 may be continued in the X direction at a position corresponding to the dividing line H1.

The circuit pattern 1a of the reticle B is separated into a common pattern KP and non-common patterns HP1 and HP2 different from the common pattern KP when exposed to two adjacent divided patterns. . The common pattern KP is set to be transferred in common to these two division patterns. The non-common patterns HP1 and HP2 are set to be formed continuously with the common pattern KP and with the common pattern P interposed therebetween. And when exposing each divided pattern, it is set so that at least one part of common pattern KP and non-common pattern HP1, HP2 may be selected.

The procedure for transferring the circuit pattern 1 to the glass substrate P using the exposure apparatus and mask of the above configuration will be described below. Here, the division patterns A1 to A4 and B1 to B4 will be described by sequentially transferring the division patterns.

Then, the exposure data setting unit 21 previously exposes exposure area data such as reference coordinate positions and sizes of the divided areas where the divided patterns A1 to A4 and B1 to B4 are divided and exposed, and overlapping exposure in each divided area. The data for which the side to perform the operation is specified.

First, when the reticle A is aligned and set to the reticle stage 10 by a reticle exchanger (not shown), the drive control device 11 reads the data of the exposure data setting unit 21 to drive the drive mechanism 20 ), The blind plates 17a and 17b of the reticle blind 17 are driven. Thereby, the reticle A corresponds to the opening S of the reticle blind 17, and as shown in FIG. 5A, a rectangular illumination area corresponding to the division pattern A1 as the first pattern (first illumination area). SA1 is set. The division pattern A1 is composed of a part of the common pattern KP, the non-common pattern HP1, and the non-common pattern HP2.

Here, the dividing line V14 of the reticle A is virtually set in the dividing line V1 in the glass substrate P. As shown in FIG. At the same time, the dividing line H11 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the right side (side on the + X side) of the illumination area SA1 is set to be offset on the -X side with respect to the virtually divided dividing line V14, corresponding to the overlapping width during the connection fitting exposure. Similarly, the lower side (side on the -Y side) of the illumination area SA1 is set to be offset on the + Y side with respect to the virtually divided dividing line H11, corresponding to the width to be overexposed. In addition, the left side (side on the -X side) and the top side (side on the + Y side) of the illumination area SA1 are set to be exposed to a width equal to or more than the width that the light shielding band 23 overlaps.

On the other hand, the drive control device 11 drives the reticle blind 17 and drives the substrate stage 9 via the drive mechanism 22. Thus, the substrate stage 9 moves so that the glass substrate P is set at a position corresponding to the illumination area SA1 set in the reticle blind 17. When the substrate stage 9 is moved, a laser interferometer (not shown) emits the laser light 19 toward the moving mirror 9a on the substrate stage 9, and measures the distance by the interference between the reflected light and the incident light. The position of the stage 9 (ie, the glass substrate P) is accurately detected.

When the reticle blind 17 and the substrate stage 9 are set at predetermined positions, in the exposure apparatus 5, as shown in Fig. 3, the beam B, which is illumination light from the mercury lamp 6, is an ellipsoidal mirror 6a. Is focused on, and is incident on the wavelength selective filter 15 from the reflection mirror 13 in response to the opening operation of the shutter 12. The beam B, through which only the wavelength necessary for exposure in the wavelength selective filter 15 has passed, reaches the reticle blind 17 after being adjusted to the uniform illuminance distribution in the fly's eye integrator 16.

The beam B passing through the opening S of the reticle blind 17 is reflected by the reflection mirror 14 and is incident on the condenser lens 18. The image of the opening S of the reticle blind 17 is formed by the condenser lens 18 on the reticle A, and the illumination area SA1 of the reticle A corresponding to the opening S is illuminated. The image of the pattern existing in the illumination area SA1 of the reticle A is imaged in the exposure area on the glass substrate P by the projection optical system 8. As a result, the division pattern A1 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SA1.

During this exposure, the blind plates 17a and 17b of the reticle blind 17 move in accordance with the instruction of the drive control device 11, so that the illumination area SA1 is divided on the right side of the illumination area SA1 as shown in FIG. It moves toward the + X direction side to exceed (14), and to the -Y direction side (that is, from the upper left to the lower right in FIG. 5) so that the lower side exceeds the dividing line H11 by a width which overlaps each exposure at a predetermined speed. By the movement of the right side and the lower side, the exposure area on the glass substrate P is exposed in a state where the amount of exposure energy to be exposed is gradually reduced at a constant rate.

Subsequently, the division pattern A2 is exposed as the second pattern. The division pattern A2 is composed of a part of the common pattern KP and the non-common pattern HP1.

In the same manner as above, the blind plates 17a and 17b of the reticle blind 17 and the substrate stage 9 are moved by the control of the drive control device 11. Thereby, the reticle A corresponds to the opening S of the reticle blind 17 and, as shown in Fig. 6A, a rectangular illumination area (second illumination area) corresponding to the division pattern A2 as the second pattern. SA2 is set. Further, the substrate stage 9 moves so that the glass substrate P is set at a position corresponding to the illumination area SA2 set in the reticle blind 17.

Here, the dividing line V13 of the reticle A is virtually set in the dividing line V2 in the glass substrate P. As shown in FIG. In addition, the dividing line V11 of the reticle A is set to the dividing line V1 in the glass substrate P virtually. At the same time, the dividing line H11 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the right side of the illumination area SA2 is set to be offset on the -X side with respect to the virtually set dividing line V13, corresponding to the width to be overexposed. Similarly, the lower side of the illumination area SA2 is set to be offset on the + Y side with respect to the virtually set dividing line H11, corresponding to the width for overlapping exposure. Further, the left side is set beyond the dividing line V11 to coincide with the position of the right side set in the illumination area SA1 before exposure as shown in Fig. 5A. And the upper side of illumination area | region SA2 is set so that it may be exposed by the width more than the width which the light shielding stand 23 overlaps and exposes similarly to the above.

By setting this illumination area SA2, as shown to Fig.1 (a), in the circuit pattern 1a of the reticle A, the pattern between division lines V11 and V13 is a 1st, 2nd pattern. It is set as the common pattern KP of the division patterns A1 and A2. Further, the pattern on the -X side and the pattern between the division lines V13 and V14 than the division line V11 are selected as the non-common patterns HP and HP so as to sandwich the common pattern KP therebetween.

And when the exposure process is performed similarly to the above, the illumination area SA2 of the reticle A corresponding to the opening S of the reticle blind 17 is illuminated. The image of the pattern existing in the illumination area SA2 of the reticle A is imaged on the glass substrate P by the projection optical system 8. As a result, the division pattern A2 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SA2. Here too, the blind plates 17a and 17b of the reticle blind 17 move in accordance with the instruction of the drive control device 11 during the exposure process, so that the illumination area SA2 is on the right side as shown in Fig. 6B. The lower side moves to the + X direction side and the lower side moves by the width for overlapping exposure at a predetermined speed, respectively (that is, from the upper left to the lower right in FIG. 6). As a result, connection-adjustment exposure is performed between adjacent division patterns A1 and A2.

Then, in the same order as described above, the divided pattern A3 set as shown in Figs. 7A and 7B and the divided pattern set as shown in Figs. 8A and 8B ( A4) is the illumination area SA3, SA4 corresponding to each division pattern A3, A4 from + Y, -X side to -Y, + X side (i.e., from top left to bottom right in FIGS. 7 and 8). ) Is sequentially transferred to the exposure area on the glass substrate P corresponding to each of the illumination areas SA3 and SA4 so that the adjacent division patterns are connected and exposed.

When the transfer to the division patterns A1 to A4 is completed, the reticle A on the reticle stage 10 is exchanged with the reticle B shown in Fig. 1B by the reticle exchanger. This reticle B is formed symmetrically with the reticle A in the Y direction. Also in the reticle B, the circuit pattern 1 is transferred to the glass substrate P by sequentially transferring the division patterns B1 to B4 in the same order as the reticle A while connecting and exposing the divided patterns B1 to B4.

Specifically, first, the reticle B corresponds to the opening pattern S of the blind plates 17a and 17b of the reticle blind 17, and corresponds to the division pattern B1 as shown in FIG. 9 (a). The rectangular illumination area SB1 is set. This divided pattern B1 is composed of a part of the common pattern KP, the non-common pattern HP1, and the non-common pattern HP2. Here, the dividing line V18 of the reticle B is virtually set in the dividing line V1 in the glass substrate P. As shown in FIG. At the same time, the dividing line H12 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the right side (side on the + X side) of the illumination area SB1 is set to be offset on the -X side with respect to the virtually divided dividing line V18, corresponding to the overlapping width during the connection fitting exposure. Similarly, the upper side (side on the + Y side) of the illumination area SB1 is set to be offset on the + Y side with respect to the virtually divided dividing line H12, corresponding to the width to be overexposed. In addition, the left side (side on the -X side) and the lower side (side on the -Y side) of the illumination region SB1 are set to be exposed to a width equal to or more than the width that the light shielding band 23 overlaps with.

Then, after the glass substrate P moves the substrate stage 9 to a position corresponding to the illumination region SB1, the illumination region SB1 is illuminated when the exposure treatment is performed in the same manner as above. The image of the pattern existing in the illumination area SB1 of the reticle B is imaged on the glass substrate P by the projection optical system 8. As a result, the division pattern B1 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SB1. Here too, the blind plates 17a and 17b of the reticle blind 17 move in accordance with the instruction of the drive control device 11 during the exposure process, so that the illumination region SB1 is on the right side as shown in Fig. 9B. The lower side moves to the + X direction side and the lower side moves to the -Y direction side (i.e., from the upper left to the lower right in FIG. 9) by the width for overlapping exposure at a predetermined speed. As a result, connection-adjustment exposure is performed between adjacent division patterns A1 and B1.

Subsequently, the division pattern B2 set as shown in Figs. 10 (a) and 10 (b), the division pattern set as shown in Figs. B3) and the divided pattern B4 set as shown in Figs. 12 (a) and 12 (b), and the illumination regions SB2 to SB4 corresponding to the respective divided patterns B2 to B4 are + Y,- By moving from the X side to the -Y and + X side (that is, from the upper left to the lower right in FIGS. 10 to 12), the exposure area adjacent to the exposure area on the glass substrate P corresponding to each illumination area SB2 to SB4 The division patterns are sequentially transferred so that the connection pattern is exposed.

Here, when the exposure areas are not overlapped on only one side but are arranged in a rectangle so as to overlap on two or more sides, for example, as the division patterns A1, A2, B1, and B2, these four as shown in FIG. The intersection K1 of the two exposure areas is overlapped by three or more exposure areas according to the moving direction of the illumination area in the above exposure method.

As described above, the amount of energy exposed to the intersection portion K1 when the illumination region is moved from the + Y, -X side to the -Y, + X side (that is, from the upper left to the lower right in FIG. This will be described with reference to FIG. 18.

As shown in FIG. 13, when each illumination area | region SA1-SA2, SB1-SB2 is moved between the straight lines L1 and L2, and between the straight lines L3 and L4, respectively, the intersection part K1 is a straight line L1-S. A rectangular area surrounded by L4) is obtained. Also, when the intersection of the straight lines L1 and L3 is P1, the intersection of the straight lines L2 and L4 is P2, the intersection of the straight lines L2 and L3 is P3, and the intersection of the straight lines L1 and L4 is P4, the illumination is performed when exposing the divided pattern A1. A disadvantage of the area SA1 is shifted in the diagonal direction of the exposure area rectangularly arranged from the intersection P1 to the intersection P2. At this time, if the exposure amount irradiated to the area which is not overlapped by one exposure is made into 100%, as shown in FIG. 14, the intersection part K1 will have the exposure amount of 100% of intersection P1, and the intersection P2-P4 will be 0. The exposure amount distribution of the square weight which becomes the exposure amount of% is shown.

Further, when exposing the dividing pattern A2, the disadvantage of the illumination area SA2 is shifted diagonally from the intersection point P1 to the intersection point P2, but the triangular area surrounded by the intersection points P1, P2, P4 is not exposed. Therefore, as shown in FIG. 15, the intersection part K1 shows the triangular-shaped exposure amount distribution in which intersection P3 becomes 100% of exposure amount and intersection P1, P2 becomes 0% of exposure amount. Similarly, the disadvantage of the illumination area SB1 when exposing the dividing pattern B1 is shifted diagonally from the intersection point P1 to the intersection point P2, but the triangular area surrounded by the intersection points P1, P2 and P3 is not exposed. Therefore, as shown in FIG. 16, the intersection part K1 shows the triangular-shaped exposure amount distribution which becomes the exposure amount of 100% of intersection P1, and the exposure amount of 0% of intersection P1 and P2. In addition, even when exposing the dividing pattern B2, the disadvantage of the illumination area SB2 is shifted diagonally from the intersection point P1 to the intersection point P2, and as shown in FIG. The cross-sectional exposure dose distribution is indicated by the intersections P1, P3, and P4 being 0% exposure doses.

The exposure amount irradiated to the intersection portion K1 by the four exposures is 100% in the total area as shown in FIG. 18 and becomes the same as other exposure areas. Since the other intersections move the illumination region in the same manner as the intersection K1, the respective intersections are exposed at an exposure amount of 100%.

In addition, in order to make the exposure amount at the intersection portion 100%, it is not necessary to move the shortcomings of the illumination area from the intersection point P1 to the intersection point P2, and the intersection portion K1 has an exposure distribution of two square weights and an exposure amount of two triangular weights. What is necessary is just to expose 4 times as showing distribution. In other words, among four exposure areas arranged in a rectangle so that two sides overlap each other, a pair of exposure areas (adjacent exposure areas) overlapping one side are constituted of a plurality (two pairs in this embodiment), and each pair When the illumination areas corresponding to the exposure areas are respectively moved along the same direction, the intersection portions K1 in each pair are exposed in the light weight distribution of the square weight and the triangular weight shape, so the exposure dose distribution of the two pairs is equal to the two square weight shapes and two. Triangular vertebral shapes are exposed at 100% exposure.

Therefore, in the diagonal direction, the moving direction of the illumination area may be different for each pair. For example, a pair is formed in an exposure area corresponding to the division patterns A1 and A2 and is paired in an exposure area corresponding to the division patterns B1 and B2. In this case, the disadvantages of the illumination areas SA1 and SA2 corresponding to the division patterns A1 and A2 are moved from the intersection point P1 to the intersection point P2, respectively, and the illumination areas SB1 and SB2 corresponding to the division patterns B1 and B2 respectively. ) May be shifted diagonally from the intersection P3 to the intersection P4, respectively.

In this case, in each pair, there is no need to move in the same direction as long as it is along each diagonal direction. For example, the disadvantages of the lighting area SA1 are moved from the intersection point P1 to the intersection point P2, The shortcomings can also be shifted from the intersection P2 to the intersection P1. Similarly, the shortcomings of the illumination area SB1 may be moved from the intersection P3 to the intersection P4, and the shortcomings of the illumination area SB2 may be moved from the intersection P4 to the intersection P3. In addition, the configuration of the pair is not limited to the above, but if the exposure region overlaps one side, the pair is formed of an exposure area corresponding to the division patterns A1 and B1, and the pair is formed of an exposure area corresponding to the division patterns A2 and B2. It can also be configured.

The above connection fitting exposure is configured to move the illumination area by the blind plates 17a and 17b having the light shielding portion 24 and the transmission portion 25, but the reticle blind 17 shown in Fig. 4 (b) below. The method of exposing the connection fitting using the following will be described. As shown in this figure, the reticle blind 17 is composed of blind plates 17c and 17d formed of rectangular glass materials arranged with the conjugated surface of the reticle R interposed therebetween. Each of the blind plates 17c and 17d is provided with a light shielding portion 24, a transmission portion 25 and a photosensitive portion 26 formed therebetween.

In the photosensitive portion 26, chromium is deposited in the form of a dot having a size equal to or less than the resolution limit of the exposure apparatus 5. The dot-shaped chromium film is set so as to increase gradually from the transmissive portion 25 toward the light shielding portion 24 so that the transmittance of the beam B gradually decreases (changes). Further, the width of the photosensitive portion 26 is set equal to the overlapping length of the exposure areas adjacent in the Y direction, that is, the distance between the straight lines L3 and L4. This photosensitive part 26 is formed in the upper side of the permeation | transmission part 25 in the blind plate 17c, and is formed in the lower side of the permeation | transmission part 25 in the blind plate 17d. The reticle blind 17 is formed by opening the blind plates 17c and 17d so that the permeable portions 25 are combined so that the permeable portions 25 overlap each other, and at the same time the openings S are formed. A photosensitive area is formed on the side with respect to the photosensitive part 26 among the set illumination area | regions.

When exposing using these blind plates 17c and 17d, first, in the reticle A, corresponding to the opening S of the reticle blind 17, as shown in FIG. The rectangular illumination area (first illumination area) SA1 corresponding to the above is set. The division pattern A1 is composed of a part of the common pattern KP, the non-common pattern HP1, and the non-common pattern HP2. Here, the dividing line V14 of the reticle A is virtually set in the dividing line V1 in the glass substrate P. As shown in FIG. At the same time, the dividing line H11 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the right side (side of the + X side) of the illumination area SA1 is offset on the -X side with respect to the virtually divided dividing line V14 in correspondence with the width overlapping when the connection fitting exposure is performed. It is set so as to coincide with the straight line L1 in. Similarly, the lower side (side on the -Y side) of the illumination area SA1 is set to correspond to the straight line L4 by offsetting on the -Y side with respect to the virtually divided dividing line H11, corresponding to the width to be overexposed. At this time, the photosensitive portion 26 of the blind plate 17d exposes the illumination region corresponding to the exposure region surrounded by the straight lines L3, L1, L4 on the glass substrate P among the lower sides of the illumination region SA1. It is set as an area. In addition, the left side (side on the -X side) of the illumination area SA1 is set so as to be exposed to a width equal to or more than the width that the light shielding band 23 overlaps with.

Then, after the glass substrate P moves the substrate stage 9 to a position corresponding to the illumination area SA1, the illumination area SA1 is illuminated when the exposure process is performed in the same manner as described above. The image of the pattern existing in the illumination area SA1 of the reticle A is imaged on the glass substrate P by the projection optical system 8. As a result, the division pattern A1 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SA1. During the exposure process, the blind plates 17c and 17d of the reticle blind 17 are moved in accordance with the instruction of the drive control device 11, so that the illumination area SA1 has the right side glass substrate P as shown in FIG. 20B. ) Moves at a predetermined speed along the longitudinal direction of the photosensitive portion 26 along the longitudinal direction of the photosensitive portion 26 (ie, from left to right in FIG. 20).

Subsequently, the division pattern A2 is exposed as the second pattern. The division pattern A2 is composed of a part of the common pattern KP and the non-common pattern HP1.

As described above, the blind plates 17c and 17d of the reticle blind 17 and the substrate stage 9 are moved by the control of the drive control device 11. Thereby, the reticle A corresponds to the opening S of the reticle blind 17, and as shown in Fig. 21A, a rectangular illumination area corresponding to the dividing pattern A2 as the second pattern (second) Illumination area) SA2 is set. Further, the substrate stage 9 is moved so that the glass substrate P is set at a position corresponding to the illumination area SA2 set as the reticle blind 17. Here, the dividing line V13 of the reticle A is virtually set in the dividing line V2 in the glass substrate P. As shown in FIG. Further, the dividing line V11 of the reticle A is virtually set in the dividing line V1 on the glass substrate P. As shown in FIG. At the same time, the dividing line H11 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the right side of the illumination area SA2 is set to be offset on the -X side with respect to the virtually divided dividing line V13, corresponding to the width to be overexposed. Similarly, the lower side of the illumination area SA2 is set so as to correspond to the straight line L4 on the glass substrate P, offset on the -Y side with respect to the virtually set dividing line H11, corresponding to the width to be overexposed. . Further, the left side is set beyond the dividing line V11 so as to coincide with the position of the right side (that is, the straight line L1 in the glass substrate P) set in the illumination area SA1 before the exposure shown in Fig. 20A. do. At this time, the photosensitive portion 26 of the blind plate 17d includes an illumination region corresponding to the exposure region surrounded by the straight lines L3, L1, L4 on the glass substrate P from the lower side of the illumination region SA2. Set as. In addition, the upper side of the illumination area SA2 is set such that the light shielding band 23 is exposed as described above.

Then, when the exposure treatment is performed in the same manner as above, the image of the pattern illuminated in the illumination area SA2 and present in the illumination area SA2 of the reticle A is imaged on the glass substrate P by the projection optical system 8. Is imaged on. As a result, the division pattern A2 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SA2. During the exposure process, the blind plates 17c and 17d of the reticle blind 17 move in accordance with the instruction of the drive control device 11, so that the illumination area SA2 is left-sided as shown in Fig. 21B. It moves at a predetermined speed along the longitudinal direction of the photosensitive portion 26 (ie, from left to right in FIG. 21) so as to coincide with the straight line L2 in the substrate P. FIG. Thereafter, the division patterns A3 and A4 are sequentially transferred onto the glass substrate P while moving the respective illumination regions toward the + X direction in the same order as the division patterns A1 and A2.

Subsequently, the reticle A is replaced with the reticle B, corresponding to the opening S of the reticle blind 17 in the reticle B, and corresponding to the division pattern B1 as shown in Fig. 22A. A rectangular illumination area SB1 is set. This divided pattern B1 is composed of a part of the common pattern KP, the non-common pattern HP1, and the non-common pattern HP2. Here, the dividing line V18 of the reticle B is virtually set in the dividing line V1 in the glass substrate P. As shown in FIG. At the same time, the dividing line H12 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG. At this time, the right side (side of the + X side) of the illumination area SB1 is offset on the -X side with respect to the virtually set dividing line V18 in correspondence with the overlapping width during the connection fitting exposure, and the glass substrate P ) Is set to coincide with the straight line L1. Similarly, the upper side (side on the + Y side) of the illumination area SB1 is set so as to coincide with the straight line L3 by offsetting on the + Y side with respect to the virtually divided dividing line H12, corresponding to the width for overlapping exposure. At this time, the photosensitive portion 26 of the blind plate 17c exposes the illumination region corresponding to the exposure region surrounded by the straight lines L3, L1, L4 on the glass substrate P from the upper side of the illumination region SB1. It is set as an area. In addition, the left side (side on the -X side) of the illumination region SB1 is set so as to be exposed to a width equal to or more than the width of the light shielding band 23 overlapping exposure.

Then, after the glass substrate P moves the substrate stage 9 to a position corresponding to the illumination region SB1, the illumination region SB1 is illuminated when the exposure treatment is performed in the same manner as above. The image of the pattern existing in the illumination area SB1 of the reticle B is imaged on the glass substrate P by the projection optical system 8. Thereby, the division pattern B1 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SB1. During the exposure process, the blind plates 17c and 17d of the reticle blind 17 move in accordance with the instruction of the drive control device 11, so that the illumination area SB1 is right-sided as shown in Fig. 22B. It moves at a predetermined speed along the longitudinal direction of the photosensitive portion 26 (ie, from left to right in FIG. 22) so as to coincide with the straight line L2 in the substrate P. FIG.

Subsequently, the blind plates 17c and 17d of the reticle blind 17 and the substrate stage 9 are moved by the control of the drive control apparatus 11 as described above. As a result, a rectangular illumination region SB2 corresponding to the division pattern B2 is set in the reticle B, corresponding to the opening S of the reticle blind 17, as shown in Fig. 23A. In addition, the substrate stage 9 moves so that the glass substrate P is set at a position corresponding to the illumination region SB2 set as the reticle blind 17. Here, the dividing line V17 of the reticle B is virtually set in the dividing line V2 in the glass substrate P. As shown in FIG. In addition, the dividing line V15 of the reticle B is virtually set in the dividing line V1 in the glass substrate P. As shown in FIG. At the same time, the dividing line H12 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the right side of the illumination area SB2 is set to be offset to the -X side with respect to the virtually divided dividing line V17 corresponding to the width to be overexposed. Similarly, the upper side of the illumination area SB2 is set to correspond to the straight line L3 on the glass substrate P, offset to the + Y side with respect to the virtually divided dividing line H12, corresponding to the width to be overexposed. Further, the left side is set beyond the dividing line V15 so as to coincide with the position of the right side (that is, the straight line L1 on the glass substrate P) set in the pre-exposure illumination region SB1 shown in Fig. 22A. do. At this time, the photosensitive portion 26 of the blind plate 17c has an illumination area corresponding to the exposure area surrounded by the straight lines L3, L1, L4 on the glass substrate P among the upper sides of the illumination area SB2. It sets as a photosensitive area | region. And the lower side of illumination area SB2 is set so that the light shielding stand 23 may be exposed similarly to the above.

When the exposure process is performed in the same manner as above, the division pattern B2 is transferred to the exposure area on the glass substrate P corresponding to the illumination area SB2. In this exposure process, the blind plates 17c and 17d of the reticle blind 17 move in accordance with the instruction of the drive control device 11, so that the illumination region SB2 is left-sided as shown in Fig. 23B. The film is moved at a predetermined speed along the longitudinal direction of the photosensitive portion 26 (ie, from left to right in FIG. 23) so as to coincide with the straight line L2 in the substrate P. FIG. Thereafter, the division patterns B3 and B4 are sequentially transferred onto the glass substrate P while moving the respective illumination regions toward the + X direction in the same order as the division patterns B1 and B2.

Here, when focusing on the exposure area where the division patterns A1 to A2 and B1 to B2 are arranged in a rectangular shape among the exposure areas of the glass substrate P, the straight lines L3 overlapped when transferring the division patterns A1 and A2 are taken into account. In the exposure area on the side of + Y from +), it is exposed at an exposure dose gradually decreasing from 100% to 0% as it goes from straight line L1 to straight line L2 when transferring the split pattern A1, and the split pattern A2 The exposure is performed at an exposure amount that gradually increases from 0% to 100% as it is directed from the straight line L1 to the straight line L2 at the time of transferring. Therefore, in the exposure areas in which these overlap, the exposures are overlapped and exposed at 100% of the exposure amount in the same manner as in the non-overlapping exposure areas. The same applies to the -Y side from the overlapping straight line L4 when transferring the division patterns B1 and B2.

Further, in the exposure area on the -X side from the overlapping straight line L1 when transferring the divided patterns A1 and B1, when the divided pattern A1 is transferred from the straight line L3 to the straight line L4 when the divided pattern A1 is transferred. It is exposed at an exposure dose that gradually decreases from 100% to 0%, and is exposed at an exposure dose that gradually increases from 0% to 100% as it goes from straight line L3 to straight line L4 when transferring the divided pattern B1. Therefore, in the exposure areas in which these overlap, the exposures are overlapped and exposed at 100% of the exposure amount in the same manner as in the non-overlapping exposure areas. This is the same on the + X side from the straight line L2 overlapped when transferring the division patterns A2 and B2.

On the other hand, as shown in FIG. 19, in the rectangular region surrounded by the intersection portion K1 of the exposure region to which these division patterns A1 to A2 and B1 to B2 are transferred, that is, the straight lines L1 to L4, the straight line L1 is the same as above. The intersection of L3 and L3 is P1, the intersection of straight lines L2 and L4 is P2, the intersection of straight lines L2 and L3 is P3, the intersection of straight lines L1 and L4 is P4, and the distance between straight lines L1 and L2 is S, and the straight lines L3 and L4 are If the distance is set to T and the xy coordinate system whose origin is the intersection point P4 is set, the exposure amount D1 (%) at the time of transferring the division pattern A1 is determined by the following equation.

D1 (%) = (100 × y / T) × (1-x / S) ‥‥‥ (1)

In addition, the exposure amount D2 (%) at the time of transferring the division pattern A2 is obtained by the following equation.

D2 (%) = (100 × y / T) × (x / S) ‥‥‥ (2)

In addition, the exposure amount D3 (%) at the time of transferring the division pattern B1 is obtained by the following equation.

D3 (%) = 100 × (1-y / T) × (1-x / S) ‥‥‥‥ (3)

In addition, the exposure amount D4 (%) at the time of transferring the division pattern B2 is obtained by the following equation.

D4 (%) = 100 × (1-y / T) × (x / S) ‥‥‥‥ (4)

And the exposure amount D in the intersection part K1 becomes the sum total of the exposure amount D1-D4 calculated | required by said formula (1)-(4).

D (%) = D1 + D2 + D3 + D4

      = 100

In this manner, the exposure amount also becomes 100% in the intersection portion K1, and the entire exposure area of the glass substrate P can be set to the same exposure amount by exposing the glass substrate P in the same order.

And when using the reticle blind 17 which has the photosensitive part 26, the photosensitive part 26 is installed in the left side and the right side instead of the upper side and the lower side of the opening S, and the glass substrate P shown in FIG. ), The overlapping exposure area extending in the Y direction may be set as the photosensitive area formed by the photosensitive portion 26, and the illumination area may be moved in the Y direction.

In the exposure method, the exposure apparatus, and the mask of this embodiment, the circuit pattern 1a formed on the reticle A is the common pattern KP commonly used in the plurality of division patterns A1 and A2 during exposure, and Since it is separated into a non-common pattern HP different from the common pattern KP, the first and the second are changed by changing the non-common pattern HP according to the plurality of division patterns by adjusting the illumination region each time the exposure is performed. Various patterns can be arbitrarily selected and set, and the reticle A can be transferred to a plurality of divided regions A1 to A4. Conventionally, when putting the pattern which performs connection fitting exposure into one reticle, it was necessary to form the light shielding band (for example, 1.5 mm), and to isolate each pattern independently. On the other hand, when exposing a part of adjacent patterns overlappingly like this embodiment, the pattern in one reticle can be cut out, without providing a light shielding stand. That is, the common and non-common parts in one reticle can be used repeatedly according to the desired pattern. Therefore, especially when the same pattern is repeatedly transferred, such as a liquid crystal display device or a semiconductor memory, the above-mentioned effect is remarkably achieved by making this repeating pattern a common pattern.

In order to obtain the glass substrate P for a 15-inch liquid crystal display device, compared with the conventional division patterns A-F shown in FIG. 38 and the conventional masks RA-RF shown in FIG. 39, in this embodiment, The exposure time is increased by increasing the number of divisions from 6 to 8, but the reticle used is reduced from 6 to 2, which reduces the time required for changing the reticle, resulting in shorter processing time and throughput. Can be improved. In addition, cost reduction can be realized because the number of expensive reticles used can be reduced.

In addition, in this embodiment, since the non-common pattern HP is formed between the common patterns KP, the distance which moves the reticle blind 17 also when moving the reticle blind 17 and setting a predetermined illumination area | region Can be shortened, and the time required for setting the lighting area can be shortened, thereby further improving throughput.

Further, in the present embodiment, when the plurality of divided patterns are exposed on the glass substrate P, the reticle blind 17 and the substrate stage 9 are connected so that the drive control device 11 exposes the exposed fitting patterns between adjacent divided patterns. ), Even when the circuit pattern 1 is divided, it is possible to prevent a step from occurring in the connecting portion of the pattern, thereby impairing the characteristics of the device, or discontinuously changing the connecting portion, thereby degrading the quality of the device.

On the other hand, in this embodiment, when the reticle blind 17 is comprised by the blind plates 17a and 17b which have the light shielding part 24 and the permeation | transmission part 25, the exposure area | region which a side overlaps an exposure area arranged in a rectangle. By forming pairs with each other and moving the illumination areas corresponding to the exposure areas in each pair in the same direction in the diagonal direction, they are not overexposed even in areas where the exposure areas intersect, and the same exposure amount as other exposure areas. Can be exposed.

In addition, when the reticle blind 17 is composed of the blinds 17c and 17d having the light shield 24, the transmissive portion 25, and the photosensitive portion, the photosensitive portion 26 is provided with an illumination region corresponding to the exposure region arranged in a rectangular shape. Since the light is not overexposed in the areas where the exposure areas intersect by moving in the longitudinal direction, the exposure can be performed at the same exposure amount as other exposure areas. In addition, in this case, since the movement of the blind plates 17c and 17d is one direction, the drive mechanism 20 which drives the blind plates 17c and 17d can be made simple.

24-37 is a figure which shows 2nd Embodiment of the exposure method, exposure apparatus, and mask of this invention.

In these drawings, the same reference numerals are given to the same elements as those in the first embodiment shown in Figs. 1 to 23, and the description thereof is omitted.

A difference between the second embodiment and the first embodiment is a circuit pattern to be transferred to the glass substrate P. FIG.

That is, the glass substrate P shown in FIG. 24 is for manufacturing the 21-inch liquid crystal display device. Of the circuit patterns 4 transferred to the glass substrate P, the peripheral portion 3 is formed at one end of each of the trapezoidal tabs X1 and X2 arranged at both ends of the X direction of the display portion 2 and the Y direction of the display portion 2. It consists of trapezoidal taps (Y1 to Y10, Y11 to Y20) arranged at ten equal intervals on each other.

The circuit pattern 4 is divided by the dividing lines V1 to V3 extending in the Y direction at predetermined intervals in the X direction, and the dividing lines H1 and H2 extending in the X direction at predetermined intervals in the Y direction. It is a structure synthesize | combined by the division | segmentation division pattern A1-A2, B1-B2, and C1-C8. Here, the dividing line V1 is set to pass near the right end of the tab Y3, and the dividing line V3 is set to pass near the left end of the tab Y8. In addition, the dividing line V2 is set to pass between the tab Y5 and the tab Y6.

And the reticle R for transferring this circuit pattern 4 used three sheets of the reticle (A, B) and the reticle (mask) C shown to FIG. 25 (a)-FIG. 25 (c). It is composed. The reticle A is used when transferring the division patterns A1 and A2, and the circuit pattern (pattern) 4a and the light shielding band 23 which consist of the display part 2a and the peripheral part 3a on the surface are glass It is formed at a predetermined projection magnification with the substrate P.

The peripheral part 3a is comprised from the tabs X11 and X12 formed in the X direction both ends of the display part 2a, and the three tabs Y21-Y23 formed in the + Y direction end part of the display part 2a. The tabs X11 and X12 have a range slightly including the -Y direction than the dividing line H1 among the patterns to which the tabs X1 and X2 of the glass substrate P are transferred. Similarly, the tabs Y21 to Y23 have patterns to be transferred to the tabs Y1 to Y10 of the glass substrate P, respectively.

The display portion 2a partially has a pattern of the display portion 2 to be transferred to the glass substrate P. FIG. As for the width | variety of the display part 2a, the X direction becomes length of three parts of the tabs Y21-Y23, and the division direction H1 among the patterns to which the display part 2a is transferred similarly to the said tabs X11 and X12 is carried out. It has a length equivalent to slightly including -Y direction.

In the reticle A, as shown in Fig. 25A, the dividing line V11 passes through the left end of the tab Y21 and the dividing line V12 passes through the right end of the tab Y23. Each is virtually set to be connected in a Y direction. Similarly, the dividing line H11 is virtually set in the X direction at the position corresponding to the dividing line H1.

The reticle B is used to transfer the division patterns B1 and B2. The reticle B has the same configuration as the reticle A. Therefore, the reticle B will be described with a circuit pattern composed of the display portion 2a and the peripheral portion 3a on its surface. 4a) and the light shielding band 23 are formed at a predetermined projection magnification between the glass substrate P. As shown in FIG.

The peripheral portion 3a is composed of tabs X11 and X12 formed at both ends of the X direction of the display portion 2a and three tabs Y24 to Y26 formed at both ends of the -Y direction of the display portion 2a. The tabs X11 and X12 have a range in the -Y direction than the dividing line H2 that slightly includes the + Y direction than the dividing line H2 among the patterns in which the tabs X1 and X2 of the glass substrate P are transferred. Have. Similarly, the tabs Y24 to Y26 have patterns to be transferred to the tabs Y11 to Y20 of the glass substrate P, respectively.

The display portion 2a partially has a pattern of the display portion 2 to be transferred to the glass substrate P. FIG. As for the width | variety of the display part 2a, the X direction becomes length of three parts of the tabs Y24-Y26, and the division direction H2 among the patterns to which the display part 2a is transferred similarly to the said tabs X11 and X12 is carried out. ) Has a length in the -Y direction than the division line H2 which includes the + Y direction slightly.

In the reticle B, as shown in Fig. 25B, the dividing line V13 passes through the left end of the tab Y24 and the dividing line V14 passes through the right end of the tab Y26. Each is virtually set to be connected in a Y direction. Similarly, the dividing line H12 is virtually set in the X direction at a position corresponding to the dividing line H2.

On the other hand, the reticle C is used when transferring the division patterns C1 to C8 as shown in Fig. 25C, and the circuit pattern 4a including the display portion 2a and the peripheral portion 3a on its surface. And light shielding band 23 are formed at a predetermined projection magnification between glass substrate P.

The peripheral portion 3a of the reticle C is composed of tabs X11 and X12 formed at both ends of the X direction of the display portion 2a and tabs Y31 to Y34 and Y35 to Y38 formed at both ends of the Y direction of the display portion 2a. have. The tabs X11 and X12 have a range slightly including the -Y direction than the dividing line H1 among the patterns to which the tabs X1 and X2 of the glass substrate P are transferred. Similarly, the tabs Y31 to Y38 have patterns to be transferred to the tabs Y1 to Y20 of the glass substrate P, respectively.

Among these, the tab Y33 has only the length which can overlap exposure with the tab Y23 of the reticle A. FIG. Moreover, the tab Y34 has only the length which can be connected-fitted exposure between the tab Y21 of the reticle A. FIG. The tabs Y37 and Y38 are also the same.

The width of the display portion 2a is the same as the display portion 2a of the reticle A in the X direction, and the length in which the Y direction is overlapped with the width in the Y direction of the division patterns C5 to C8 is added. .

Moreover, in the reticle C, the division line V21 passing through the tab Y34 is connected in the Y direction so as to match the positional relationship between the tap Y23 of the reticle A and the dividing line V12. Is set. Similarly, the dividing line V22 passing through the tab Y34 is virtually set to be continuous in the Y direction so as to match the positional relationship between the tab Y21 of the reticle A and the dividing line V11. Further, the dividing line V23 passing between the tabs Y31 and Y33 is virtually set so as to be continuous in the Y direction. Then, between the taps Y32 and Y34, the dividing line V24 is virtually set so as to be connected in the Y direction.

In the reticle C, the dividing line H21 extending in the X direction is virtually set at a position offset by a small dimension in the -Y direction with respect to the upper side of the display portion 2a. In addition, the dividing line H22 which continues in the X direction is virtually set at the position offset by a small dimension in the + Y direction with respect to the lower side of the display portion 2a.

The other structure is the same as that of the said 1st Embodiment.

The procedure for transferring the circuit pattern 4 to the glass substrate P using the reticles A, B, and C will be described. Here, the illumination area is set by the reticle blind 17 which consists of the blind plate 17a, 17b shown to Fig.4 (a).

First, when the reticle A is set in the reticle stage 10, the drive control device 11 reads out the data of the exposure data setting unit 21 and blind plate of the blind blind 17 through the drive mechanism 20. Drives 17a and 17b. As a result, a rectangular illumination area SA1 corresponding to the dividing pattern A1 is set in the reticle A, corresponding to the opening S of the reticle blind 17, as shown in Fig. 26A. The division pattern A1 is composed of a common pattern KP and a non-common pattern HP1.

Here, the dividing line V12 of the reticle A shown in FIG. 25A is virtually set in the dividing line V1 in the glass substrate P shown in FIG. At the same time, the dividing line H11 of the reticle A is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

At this time, the left side of the illumination area SA1 is set by offsetting toward the -X side with respect to the virtually divided dividing line V12 in correspondence with the overlapping exposure width. Similarly, the lower side of the illumination area SA1 is set by offsetting to the + Y side with respect to the virtually set dividing line H11. In addition, the left side and the upper side of illumination area | region SA1 are set so that the light shielding stand 23 may be exposed by the width more than the width which overlaps exposure.

While the setting of the illumination area SA1 is completed, the substrate stage 9 moves to the position corresponding to the set illumination area SA1 under the control of the drive control device 11. When the exposure process is performed in this state, the pattern existing in the illumination area SA1 of the reticle A, that is, the division pattern A1, is transferred onto the glass substrate P. Even during this exposure process, the reticle blind 17 moves to the + X direction side and the -Y direction side, so that the illumination area SA1 is moved by the overlapping exposure width as shown in FIG. Gradually decrease the amount by

Subsequently, the reticle blind 17 is driven in the same manner to the above to set the rectangular illumination area SA2 corresponding to the division pattern A2 as shown in Fig. 27A. The division pattern A2 is comprised of the common pattern KP and the non-common pattern HP2. Here, the dividing line V11 of the reticle A is virtually set in the dividing line V3 in the glass substrate P. As shown in FIG. At the same time, the dividing line H11 of the reticle A is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG. After the substrate stage 9 is moved, the exposure process is performed while the reticle blind 17 is moved, so that the divided pattern having the illumination area SA2 moved and having an overlapping exposure portion as shown in Fig. 27B. (A2) is transferred onto the glass substrate P. FIG.

Thereafter, the reticle A is exchanged with the reticle B by the reticle exchanger, and the division patterns B1 and B2 are sequentially transferred onto the glass substrate P in the same order as the reticle A. FIG. Specifically, first, the rectangle corresponding to the dividing pattern B1 corresponds to the opening S of the blind plates 17a and 17b of the reticle blind 17 to the reticle B, as shown in Fig. 28 (a). The illumination area SB1 of the shape is set. This split pattern B1 is composed of a common pattern KP and a non-common pattern HP1. Here, the dividing line V14 of the reticle B is virtually set to the dividing line V1 in the glass substrate P. As shown in FIG. At the same time, the dividing line H12 is virtually set in the dividing line H2 in the glass substrate P. As shown in FIG.

At this time, the right side (side on the + X side) of the illumination area SB1 is set to be offset to the -X side with respect to the virtually divided dividing line V14, corresponding to the overlapping width during the connection fitting exposure. Similarly, the upper side (side on the + Y side) of the illumination area SB1 is set to be offset to the + Y side with respect to the dividing line H12 provisionally set corresponding to the width for overlapping exposure. In addition, the left side (side on the -X side) of the illumination area SB1 has a width equal to or greater than that of the light shielding band 23 overlapping exposure, and the lower side (side on the -Y side) is exposed so that the light shielding band 23 is exposed. Is set.

Then, the glass substrate P moves the substrate stage 9 to a position corresponding to the illumination region SB1, and if the exposure treatment is performed in the same manner as described above, the reticle B present in the illumination region SB1. The image of the pattern of is transferred to the exposure area on the glass substrate P corresponding to the illumination area SB1. Here too, the blind plates 17a and 17b of the reticle blind 17 move in accordance with the instruction of the drive control device 11 during the exposure process, so that the illumination region SB1 has the right side + X as shown in FIG. 28B. The lower side moves toward the -Y direction side (that is, from the upper left to the lower right in FIG. 28) by the width for overlapping exposure at a predetermined speed.

Subsequently, the division pattern B2 set as shown in Figs. 29A and 29B in the same order as described above, and the illumination region SB2 corresponding to the division pattern B2 are + Y, -X. By moving from the side to the -Y and + X side (that is, from the upper left to the upper right in FIG. 29), so that the exposure pattern on the glass substrate P corresponding to the illumination area SB2 is sequentially exposed so as to connect and expose adjacent division patterns. Is warrior. When the exposure process using the reticle (B) is completed, the reticle (B) is replaced with the reticle (C).

When the reticle C is set, the reticle blind 17 is driven, and the reticle C corresponds to the opening S of the blind plates 17a and 17b of the reticle blind 17 as shown in FIG. 30A. The rectangular illumination area | region SC1 (1st illumination area | region) corresponding to the division pattern C1 which is a pattern is set. This divided pattern C1 is composed of a common pattern KP and a non-common pattern HP1. Here, the dividing line V21 of the reticle C is virtually set in the dividing line V1 in the glass substrate P. As shown in FIG. In addition, the dividing line V24 of the reticle C is virtually set in the dividing line V2 in the glass substrate P. As shown in FIG. At the same time, the dividing line H22 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

After the substrate stage 9 is moved, the exposure process is performed while the reticle blind 17 is moved. As shown in Fig. 30B, the illumination pattern SC1 is moved so that the divided pattern C1 having the overlapping exposure portion is glass. It is transferred onto the substrate P. Thereby, the division pattern A1 and the division pattern C1 are exposed to the connection fitting.

Subsequently, the reticle blind 17 is driven to set a rectangular illumination region (second illumination region) SC2 corresponding to the division pattern C2 which is the second pattern as shown in Fig. 31A. This divided pattern C2 is composed of a common pattern KP and a non-common pattern HP2. Here, the dividing line V22 of the reticle C is virtually set in the dividing line V3 in the glass substrate P. As shown in FIG. In addition, the dividing line V23 of the reticle C is virtually set in the dividing line V2 in the glass substrate P. As shown in FIG. At the same time, the dividing line H22 is virtually set in the dividing line H1 in the glass substrate P. As shown in FIG.

After the substrate stage 9 is moved, the exposure process is performed while the reticle blind 17 is moved. As shown in Fig. 31 (b), the illumination region CS2 is moved to have a divided pattern C2 having overlapping exposure portions. ) Is transferred onto the glass substrate P. FIG. As a result, the division pattern C1 and the division pattern C2, and the division pattern A2 and the division pattern C2 are exposed to each other.

Thereafter, the reticle blind 17 is driven so that the division lines of the division patterns C5 to C8 and C3 to C4 are + Y, -X as shown in Figs. 32 (a) to 37 (a). The illumination regions SC5 to SC8 and SC3 to SC4 are sequentially set on the side (upper left in each drawing), and the reticle blind 17 is moved after the substrate stage 9 is moved, and FIG. 32 (b). As shown in Fig. 37 (b), the exposure area is sequentially exposed while moving the illumination areas SC5 to SC8 and SC3 to SC4 to the -Y and + X sides (lower right in each drawing), thereby reticle for each division pattern. By using the common pattern and the non-common pattern of (C), the division patterns C5 to C8 and C3 to C4 can be transferred to the glass substrate P sequentially. As a result, the circuit pattern 4 exposed and connected to the glass substrate P is transferred.

Also in this exposure, in the same manner as in the first embodiment, a plurality of pairs of exposure regions (adjacent exposure regions) overlapping each other with respect to the exposure regions arranged in a rectangle are formed, and each pair corresponds to each exposure region. When the illumination areas are moved in the same direction, the intersections of each pair are exposed with a light weight distribution of square weights and triangular weights, and thus the exposure dose distribution of the two pairs is divided into two square weights and two triangular weights. It can be exposed by the exposure amount of.

In addition, when the blind plates 17c and 17d shown in FIG. 4 (b) are used as the reticle blind 17, as shown in FIG. 24, the division patterns A1 to A2 and C1 in which overlapping exposure areas are set on the lower side. When transferring ˜C2, respectively, the photosensitive portion 26 of the blind plate 17d is positioned on the lower side of the opening S, and the photosensitive region formed by the photosensitive portion 26 is straight line L1, L2. Each illumination area SA1 to SA2 and SC1 to SC2 is set by placing it in the overlapping exposure area between them, and the respective illumination areas SA1 to SA2 and SC1 to SC2 are set in the longitudinal direction (X direction) of the photosensitive part 26 during exposure. Move to). In addition, when transferring the division patterns B1 to B2 and C3 to C4 in which the overlapping exposure areas are set on the image side, the photosensitive portion 26 of the blind plate 17c is positioned on the image side of the opening S, Further, the photosensitive areas formed by the photosensitive section 26 are positioned in overlapping exposure areas between the straight lines L3 and L4 to set the respective illumination areas SB1 to SB2 and SC3 to SC4, and each illumination area SB1 during exposure. SB2 and SC3 to SC4 are moved in the longitudinal direction (X direction) of the photosensitive portion 26. The photosensitive portion 26 of the blind plates 17c and 17d is disposed on the upper side and the lower side of the opening S when transferring the divided patterns C5 to C8 in which the overlapping exposure areas are set on both the upper side and the lower side, respectively. Position, and the photosensitive area formed by the photosensitive portion 26 is placed in both overlapping exposure areas between the straight lines L1 and L2 and between the straight lines L3 and L4 so that each illumination area SC5 to SC8 is positioned. It sets and moves each illumination area SC5-SC8 to the longitudinal direction (X direction) of the photosensitive part 26 during exposure. Thereby, in the overlapping exposure area where the overlapping exposure area overlapping only the sides and the exposure area arranged in a rectangle intersect, it can be exposed at the same exposure amount as 100% as the non-overlapping exposure area as in the first embodiment.

And when using the reticle blind 17 which has the photosensitive part 26, the photosensitive part 26 is formed in the left side and the right side instead of the upper side and the lower side of the opening S, and the glass substrate P shown in FIG. ), An overlapping exposure region extending in the Y direction may be set in the photosensitive region formed by the photosensitive section 26 to move the illumination region in the Y direction.

In the exposure method, the exposure apparatus, and the mask of the present embodiment, the same effects as those in the first embodiment can be obtained. In addition, the larger the circuit pattern, the larger the common pattern. Gets bigger That is, compared with the conventional division patterns A to F2 shown in FIG. 40 and the conventional masks RA to RF shown in FIG. 41, in this embodiment, the number of divisions is reduced from 15 to 12, thereby shortening the exposure time. can do. In addition, since the number of reticles used is reduced from six to three, the time required for reticle replacement can be shortened, and the processing time can be greatly reduced, thereby improving throughput.

The number of reticles, the number of division patterns of glass substrate P, the size, and the like in the above-described embodiments are not limited thereto, but can be applied to various numbers, sizes, and the like.

In addition, in the said embodiment, the structure of the reticle blind 17 is comprised from the blind plates 17a and 17b or the blind plates 17c and 17d, and the two which the permeation | transmission part 25 of one blind plate orthogonally crosses Although the opening S was formed by the combination of the sides and the permeation | transmission part 25 of the other blind plate orthogonal, the some side which comprises the permeation | transmission part 25 without using a blind plate is respectively independent sides. It may be a structure which constitutes a structure (in the case of a rectangular transmission part, consists of four side structures), and forms a moving device which moves each side structure independently.

In such a case, the same action and effect as the case where the blind plates 17a and 17b are used can be obtained by moving the edge member in the same manner as the blind plates 17a and 17b. In addition, by forming a photosensitive portion in at least one of the deformable structures, the same effects and effects as in the case of using the blind plates 17c and 17d can be obtained. In addition, if a photosensitive portion is formed in a part of one edge member and the photosensitive portion is exposed and concealed according to the position of other edge members, both the exposure treatment using the photosensitive portion and the exposure treatment without the photosensitive portion can be appropriately selected. Connection fitting exposure with large versatility can be performed.

As the substrate, not only glass substrate P for liquid crystal display devices, but also semiconductor wafers for semiconductor devices, ceramic wafers for thin film magnetic heads, or original plates of masks or reticles used for exposure apparatus (synthetic quartz, silicon) Wafer) and the like.

The exposure apparatus 5 is a step-and-repeat method in which the pattern of the reticle R is exposed while the reticle R and the glass substrate P are stopped and the glass substrate P is sequentially moved. The projection exposure apparatus (stepper) also applies to a step-and-scan scanning projection exposure apparatus (scanning stepper) in which the reticle R and the photosensitive substrate P are moved synchronously to expose the pattern of the reticle R. Can be.

As the kind of the exposure apparatus 5, not only for the above-mentioned liquid crystal display device manufacture but also for the exposure apparatus for semiconductor manufacture or the exposure apparatus for manufacturing a thin film magnetic head, an imaging element (CCD), a reticle (R), etc., it is widely applicable. Can be.

In addition, as a light source of the illumination optical system 7, bright lines generated from the mercury lamp 6 (g line (436 nm), i line (365 nm), KrF excimer laser (248 nm), ArF excimer laser (193 nm), A F ₂ laser (157 nm), an X-ray, or the like can be used, or a high frequency wave such as a YAG laser or a semiconductor laser can be used.

The magnification of the projection optical system 8 may be any of the equal magnification and the magnification system as well as the reduction system.

As the projection optical system 8, when using far ultraviolet rays such as an excimer laser, a material which transmits far ultraviolet rays such as quartz or fluorite is used as the glass material, and when using an F ₂ laser, a refractometer or refractometer is used. The optical system of

When using a linear motor for the board | substrate stage 9 or the reticle stage 10, any of the air floating type using an air bearing, and the magnetic floating type using a Lorentz force or reactance force can also be used.

In addition, each stage 9 and 10 may be a type which moves along a guide, and may be a guideless type which does not install a guide.

The reaction force generated by the movement of the substrate stage 9 may be mechanically taken out to the bottom (ground) using the frame member.

The reaction force generated by the movement of the reticle stage 10 may be taken out to the bottom (ground) mechanically using a frame member.

An illumination optical system 7 and a projection optical system 8 composed of a plurality of optical elements are respectively formed in the exposure apparatus main body, and the optical adjustment is performed, and at the same time, the reticle stage 10 or the substrate stage 9 composed of a plurality of mechanical parts is provided. ), The exposure apparatus 5 of this embodiment can be manufactured by attaching to the exposure apparatus main body, connecting wiring and piping, and making comprehensive adjustment (electrical adjustment, operation | movement confirmation, etc.) again. In addition, it is preferable to manufacture the exposure apparatus 5 in the clean room in which temperature, cleanliness, etc. were managed.

A device such as a liquid crystal display device or a semiconductor device includes steps for designing the function and performance of each device, steps for producing a reticle R based on this design step, steps for manufacturing a glass substrate P, a wafer, and the like, By the exposure apparatus 5 of embodiment mentioned above, it manufactures through the step of exposing the pattern of the reticle R to a glass substrate and a wafer, the step of assembling each device, an inspection step, etc.

As described above, in the exposure method according to claim 1, the mask has a common pattern and a non-common pattern, and at least a part of the common pattern and the non-common pattern which are continuously formed in this way is selected, and the first pattern and It is a structure which connects and exposes a 2nd pattern.

By doing so, in this exposure method, the mask pattern can be transferred to the plurality of exposure areas in a plurality of patterns with one mask, so that the time required for mask replacement can be shortened and the throughput can be improved. In addition, since the number of expensive masks can be reduced, cost reduction can be realized. This is particularly noticeable when the same pattern is repeatedly transferred, such as a liquid crystal display device or a semiconductor memory.

The exposure method according to claim 2 has a configuration in which a non-common pattern is formed with a common pattern interposed therebetween.

By doing in this way, since the time which takes for selecting a 1st, 2nd pattern can be shortened in this exposure method, the effect which can improve the throughput further can be acquired.

The exposure method according to claim 3 has a different configuration when the selection of the non-common pattern exposes the first pattern and when the second pattern is exposed.

By doing so, in this exposure method, since the first and second patterns having different patterns can be transferred to one mask, the time required for mask replacement can be shortened and the effect of improving throughput can be obtained. Since the number of used masks can be reduced, the cost reduction can be realized.

The exposure method according to claim 4 has a configuration in which the selection of the pattern is set by the illumination area of the mask, and the exposure area on the substrate corresponding to the illumination area is overlapped with the adjacent exposure area.

By doing so, in this exposure method, by setting the illumination region, it is possible to obtain the effect that a plurality of patterns can be transferred to a plurality of exposure regions differently with one mask.

The exposure method according to claim 5 is configured to move the illumination area corresponding to each exposure area along one side where the photosensitive area is formed, when the exposure areas are arranged in a plurality of rectangles so that two sides overlap each other.

By doing so, in this exposure method, it is possible to obtain the effect that the exposure can be performed at the same exposure amount as other exposure areas without over exposure even in the areas where the exposure areas intersect. Further, in this case, since the movement of the illumination area setting device is in one direction, the effect of simplifying the driving mechanism for driving the illumination area setting device can also be obtained.

In the exposure method according to claim 6, when the exposure areas are arranged in a plurality of rectangles so that two sides overlap each other, a plurality of pairs of exposure areas overlapping sides are formed, and in each pair, an illumination area corresponding to the exposure area is the same. Each structure moves along the direction.

By doing in this way, in this exposure method, even if the area | region which an exposure area cross | intersects, it is possible to obtain the effect that it can expose with the same exposure amount as other exposure area | region.                     

The exposure method according to claim 7 has a configuration in which the same direction for moving the illumination region is a diagonal direction of a rectangular array.

By doing so, in this exposure method, even when two orthogonal sides are overlapped with the adjacent exposure area at once, the exposure area is not overexposed even in the area where the exposure areas intersect, and the effect can be exposed at the same exposure amount as other exposure areas. You can get it.

The mask according to claim 8 has a configuration in which a common pattern of a plurality of patterns and a non-common pattern different from the common pattern are formed continuously.

In this mask, since a plurality of patterns can be set in one mask, the number of masks to be used can be reduced and the cost can be realized.

The mask according to claim 9 has a configuration in which a non-common pattern is formed with a common pattern interposed therebetween.

By doing in this way, in this mask, even when setting the pattern containing a common pattern, the time required for setting can be shortened.

In the exposure apparatus according to claim 10, the mask according to claim 8 or 9 is supported by the mask stage, and the illumination region setting apparatus sets the illumination region of the mask in the first and second illumination regions, and the control apparatus is the first, The first and second patterns of the second illumination region are connected to the substrate and fitted together.

By doing so, the exposure area can be set by a lighting area setting device in this exposure apparatus, so that a plurality of patterns can be set by one mask, so that the time required for mask replacement can be shortened, thereby improving the throughput. In addition, since the number of expensive masks can be reduced, cost reduction can be realized.

In the exposure apparatus according to claim 11, the illumination region setting apparatus sets the illumination region of the mask in the first and second illumination regions according to the positions of the transmissive portions formed by the plurality of sides, and the control apparatus first and second illumination. The first and second patterns of the area are connected to each other on the substrate, and the illumination area setting device includes a plurality of side members and a moving device for independently moving the side members.

In this way, in this exposure apparatus, various illumination areas having different sizes and positions can be set depending on the situation, and the exposure and concealment of the photosensitive section can be easily performed, so that a highly versatile connection fitting exposure can be obtained. .

The exposure apparatus according to claim 12 has a configuration in which a photosensitive portion having a gradually reduced transmittance is formed on at least one side of the transmissive portion.

By doing this, in this exposure apparatus, the exposure area can be moved along one side where the photosensitive portion is formed during exposure, so that the exposure area can be exposed at the same exposure amount as other exposure areas without overexposure even in the area where the exposure areas intersect. . Further, in this case, since the movement of the lighting area setting device is one direction, the effect that the driving mechanism for driving the lighting area setting device can be made simple is also obtained.

The exposure apparatus according to claim 13 is characterized in that, when the exposure areas are arranged in a plurality of rectangular arrays so that two sides overlap each other, a moving device for moving the illumination areas corresponding to the exposure areas in which the sides overlap and pairs in the same direction, respectively; It is a structure formed.

By doing in this way, in this exposure apparatus, even if the exposure area | region crosses, it is not overexposed and the effect which can expose with the same exposure amount as other exposure area can be acquired.

The exposure apparatus according to claim 14 has a configuration in which the same direction for moving the exposure area is a diagonal diagonal direction.

By doing so, in this exposure apparatus, even when two orthogonal sides are overlapped with the adjacent exposure area at once, the exposure area is not overexposed even in the area where the exposure areas intersect, and the effect can be obtained at the same exposure amount as other exposure areas. Can be.

The exposure apparatus according to claim 15 is configured such that the controller drives the substrate stage in accordance with the setting of the illumination region setting device.

By doing so, in this exposure apparatus, the substrate stage is driven in accordance with the setting of the illumination region setting apparatus so that a plurality of patterns can be transferred to the substrate with one mask, and the time required for mask replacement can be shortened, thereby improving throughput. In addition to achieving the effect, the number of expensive masks used can be reduced, resulting in cost reduction.

Claims (19)

In the exposure method of connecting and exposing the first pattern and the second pattern on the substrate using a mask having a pattern, The pattern of the mask has a common pattern between the first pattern and the second pattern, and a non-common pattern that is formed in succession with the common pattern and is different from the common pattern, And at least a portion of the common pattern and the non-common pattern to select the exposure. The method of claim 1, The non-common pattern is formed with the common pattern interposed therebetween. The method according to claim 1 or 2, The selection of the non-common pattern is different when exposing the first pattern and exposing the second pattern. The method of claim 1, The selection of the pattern is set by the illumination area of the mask, The exposure method on the said board | substrate corresponding to this illumination area | region is overlapped with the adjacent exposure area | region, and the said exposure method characterized by performing said connection fitting. The method of claim 4, wherein Forming a photosensitive region in which transmittance gradually changes on one side of the illumination region, And the illumination area corresponding to each exposure area is moved along the one side during the exposure, when the exposure areas are arranged so that two sides overlap each other. The method of claim 4, wherein When a plurality of spheres are arranged so that two sides overlap each of the exposure areas, a plurality of pairs are formed among the exposure areas in which the sides overlap, among the plurality of exposure areas, And the illumination area corresponding to the exposure area in each pair is moved in the same direction during the exposure, respectively. The method of claim 6, And said same direction is a diagonal direction of said spherical arrangement. In a mask having a pattern, the pattern is used to connect and expose a plurality of divided patterns to a substrate, The mask includes a common pattern which is commonly transferred when the plurality of divided patterns are exposed; A mask, characterized in that a non-common pattern which is different from the common pattern and which is not transferred in common at the time of exposing the plurality of divided patterns is formed continuously. The method of claim 8, And the non-common pattern is formed so as to be in a positional relationship having the common pattern therebetween. An exposure apparatus comprising a mask stage for holding a mask having a pattern, and an illumination optical system for illuminating the mask, and exposing the pattern of the mask to a substrate. The mask according to claim 8 is held in the mask stage, An illumination region setting device for setting an illumination region of the mask to at least a first illumination region and a second illumination region; And a control device for connecting and fitting the first pattern exposed to the substrate by the first illumination region and the second pattern exposed to the substrate by the second illumination region. An exposure apparatus comprising a mask stage for holding a mask having a pattern, and an illumination optical system for illuminating the mask, and exposing the pattern of the mask to a substrate. An illumination region setting device for setting the illumination region of the mask to at least the first illumination region and the second illumination region according to the position of the transmissive portion formed by the plurality of sides; And a control device for connecting and fitting a first pattern exposed to the substrate by the first illumination region and a second pattern exposed to the substrate by the second illumination region, The illumination area setting device includes a plurality of deformable bodies constituting the plurality of sides, and a moving device for independently moving the deformable members, respectively. The method of claim 10 or 11, And said illumination region setting device has a transmission portion for setting said illumination region, and at least one side of said transmission portion is formed with a photosensitive portion having a gradually changing transmittance. The method of claim 10 or 11, In the illumination area setting device, when the exposure areas on the substrate corresponding to the illumination area are arranged in a plurality of spheres so that two sides overlap each other, the illumination area corresponding to the exposure area where the sides overlap and form a pair is exposed to the exposure area. An exposure apparatus is provided with a moving device for moving in the same direction, respectively. The method of claim 13, And said same direction is a diagonal direction of said spherical arrangement. The method of claim 10 or 11, Having a substrate stage for holding and moving the substrate, And the control device drives the substrate stage in accordance with the setting of the illumination area setting device. In the exposure method which overlaps part of a 1st pattern and a 2nd pattern on a board | substrate using the mask which has a pattern, and connects and exposes a desired pattern to the said board | substrate, The pattern of the said mask has the common pattern of the said 1st pattern and the said 2nd pattern, and has a non-common pattern formed continuously in this common pattern, and different from this common pattern, Selecting at least a portion of the common pattern and the non-common pattern as the first pattern, Selecting at least a portion of the common pattern and the non-common pattern as the second pattern, The exposure method characterized by exposing so that the exposure amount of the said overlapping exposure part of the said 1st pattern and the said 2nd pattern may be equal to the part which has not performed the said overlapping exposure. The mask according to claim 8 or 9, And said common pattern and said non-common pattern are patterns of liquid crystal display devices. The method of claim 17, And said common pattern is a pattern of a display portion of said liquid crystal display device. The method of claim 18, And the non-common pattern includes a pattern of peripheral portions formed to surround the display portion of the liquid crystal display device.

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