KR100669473B1 - Organic light emitting display and fabricating method thereof - Google Patents

Abstract

An organic light emitting display and a fabricating method thereof are provided to simplify the fabrication process of the organic light emitting display by depositing a moisture absorbing layer in an encapsulation substrate. An organic light emitting display(100) includes a substrate(10) and an organic light emitting part(20) formed on one plane of the substrate. An encapsulation substrate(30) is sealed with the substrate by intervening the organic light emitting part. A moisture absorbing layer(50) is formed with a thin film deposited on one plane toward the substrate of the encapsulating substrate, and is made of more than one material selected from a group comprising a rare earth metal oxide and a zeolite.

Description

Organic light-emitting display device and manufacturing method therefor {ORGANIC LIGHT EMITTING DISPLAY AND FABRICATING METHOD THEREOF}

1 is a cross-sectional view of an organic light emitting diode display according to an exemplary embodiment of the present invention.

2A to 2C are schematic views illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device and a method of manufacturing the same, which improve efficiency and hygroscopic effect in a manufacturing process by depositing a moisture absorbing layer.

In the organic light emitting diode display, electrons and holes injected into the organic material through an anode and a cathode recombine to form an exciton, and light having a specific wavelength is generated by energy from the exciton formed. It is a self-luminous display device using the phenomenon which occurs.

Therefore, the organic light emitting diode display is attracting attention as a next-generation display device because it does not require a separate light source such as a backlight, and thus has a low power consumption and secures a wide viewing angle and fast response speed compared to the liquid crystal display.

The light emitting device of the organic light emitting diode display includes an anode electrode which is a hole injection electrode, an organic thin film, and a cathode electrode which is an electron injection electrode, and the organic thin film is formed of red (R), green (G; green), and blue (B). Each material is made of organic materials to produce full color.

In addition, the organic thin film has a multilayer structure including an emitting layer (EML), an electron transport layer (ETL), and a hole transport layer (HTL) so as to balance electrons and holes to improve emission efficiency. In some cases, it may further include a separate electron injection layer (EIL) and a hole injection layer (HIL).

The organic light emitting diode display is classified into a passive matrix type and an active matrix type according to a driving method.

Here, the passive driving type organic light emitting display device has a simple manufacturing process and low manufacturing cost, but has a large power consumption and is unsuitable for large area. On the other hand, an active driving type organic light emitting display device has a complicated process and a higher manufacturing cost than a passive driving type organic light emitting display device, but has low power consumption, high definition, fast response speed, and wide viewing angle due to independent driving methods of R, G, and B. And it has the advantage that it can be implemented thinner.

The organic light emitting diode display described above has a property that is degraded by the penetration of moisture. Therefore, a sealing structure is needed to prevent the penetration of moisture.

To do this, process it in the form of a cap so as to have a metal can or a glass substrate groove, and mount a desiccant for absorbing moisture in the groove in powder form or manufacture it in a film form to produce a double-sided tape. The method of bonding is used.

Among them, the method of mounting the desiccant is complicated to increase the material and process cost, the overall thickness of the substrate becomes thick, and the substrate used for encapsulation is not transparent, or due to the part on which the desiccant is mounted, the front light emission or It cannot be used for double-sided light emission.

In addition, the method of encapsulating in the form of a film has a limit in preventing the penetration of moisture, there is a fear of damage when taken during the manufacturing process or use is not suitable for mass production because the durability and reliability is not high.

In addition, these approaches suffer from the need for additional equipment and equipment for the attachment of the desiccant or film.

The present invention is to solve the problems of the prior art as described above, the object of the present invention is a simple organic manufacturing process can have a good hygroscopic effect, it is formed transparent and can be applied to top emission and double-sided light emission A display device and a method of manufacturing the same are provided.

In order to achieve the above object, the organic light emitting diode display according to the present invention includes a substrate, an organic light emitting part formed on one surface of the substrate, an encapsulation substrate encapsulated and opposed to the substrate with the organic light emitting part therebetween, and between the substrate and the encapsulation substrate. And a moisture absorbing layer disposed on the substrate, wherein the moisture absorbing layer is formed of a thin film including at least one of an alkali metal oxide, an alkaline earth metal oxide, a rare earth metal oxide, an aluminum oxide, and a zeolite.

At this time, the alkali metal oxide is lithium oxide (Li ₂ O), sodium oxide (Na ₂ O) or potassium oxide (K ₂ O), the alkaline earth metal oxide is barium oxide (BaO), calcium oxide (CaO), or oxidation Magnesium (MgO).

At this time, the moisture absorption layer may be formed to a thickness of about 100 kPa to 2000 kPa.

In addition, when the organic light emitting diode display is a top emission type or a double-sided emission type, the moisture absorbing layer may be formed to a thickness of 500 kPa or less.

Meanwhile, a method of manufacturing an organic light emitting display device according to the present invention includes preparing a substrate, forming an organic light emitting part on the substrate, depositing and forming a moisture absorbing layer of a thin film on the encapsulation substrate, and sealing the substrate and the encapsulation substrate. It includes.

In this case, the step of depositing and forming the moisture absorbing layer of the thin film on the encapsulation substrate may be performed by any one of chemical vapor deposition, vacuum deposition, electron beam deposition, or sputtering.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of an organic light emitting diode display 100 according to an exemplary embodiment of the present invention. Referring to the drawings, the organic light emitting diode display 100 is formed on the organic light emitting part 20 and the organic light emitting part 20 which are formed on the substrate 10 and one surface of the substrate 10. An encapsulation substrate 30 for sealing is disposed.

In addition, although not shown, a pad region in which wirings for inputting and outputting signals to and from the outside are connected to electrode layers disposed in the organic light emitting unit 20 on an area where the encapsulation substrate 30 is not disposed on the substrate 10. Is formed.

In addition, a sealing material 40 is disposed on one surface of the substrate 10 to seal the substrate 10 and the encapsulation substrate 30 to each other.

The substrate 10 may be made of a transparent insulator such as glass or transparent plastic.

Although not shown, the organic light emitting unit 20 may have a structure in which the first electrode, the organic thin film, and the second electrode are sequentially stacked. In this case, the first electrode may be an anode electrode, and the second electrode may be a cathode electrode.

In addition, the organic thin film may be made of low molecular weight organic material or high molecular weight organic material. When the organic thin film is formed of a low molecular organic material, a multilayer including a hole injection layer (HIL), a hole transport layer (HTL), an emitting layer (EML), and an electron transport layer (ETL) It may be made of a structure.

Meanwhile, when the organic thin film is made of a polymer organic material, it may be formed of a hole transport layer (HTL) and an emitting layer (EML), wherein the HTL is made of a PEDOT material and the EML is made of poly-phenylenevinylene ( It may be made of Poly-Phenylenevinylene (PPV) -based or Polyfluorene-based material.

A TFT layer including a driving thin film transistor and a switching thin film transistor may be further formed between the organic light emitting unit 20 and the substrate 10. That is, the organic light emitting diode display according to the present invention may be configured as an active matrix organic light emitting diode display as well as a passive matrix organic light emitting diode display.

The encapsulation substrate 30 may be made of a material such as a metal cap or a transparent glass material or a transparent plastic material. However, the encapsulation substrate 30 is transparent in the case of a top emission type or a double-sided emission type organic light emitting display device in which an image is realized in the direction of the encapsulation substrate 30 or in both directions of the substrate 10 and the encapsulation substrate 30. It is formed of glass material or transparent plastic material.

In addition, one surface of the organic light emitting part 20 side of the encapsulation substrate 30 is provided with a moisture absorbing layer 50 for absorbing moisture in the space between the substrate 10 and the encapsulation substrate 30. The moisture absorbing layer 50 may be disposed on an inner side of the encapsulation substrate 30 facing the substrate 10.

The moisture absorbing layer 50 may be formed of a material including a material having strong hygroscopicity such as alkali metal oxide, alkaline earth metal oxide, rare earth oxide, aluminum oxide or zeolite, and chemical vapor deposition. It may be formed into a thin film by a method such as vacuum evaporation, e-beam evaporation, or sputtering.

On the other hand, when the organic light emitting diode display 100 is a bottom emission type, since the light transmittance of the moisture absorbing layer 50 is not required, the moisture absorbing layer 50 may be formed to a thickness of 100 GPa or more to have sufficient moisture absorbing power. However, when considering a process time (Tactical Time) for depositing the moisture absorbing layer 50, the moisture absorbing layer 50 is formed to a thickness of less than 2000 kHz.

Meanwhile, when the organic light emitting diode display 100 is a top emission type emitting light toward the encapsulation substrate 30 or a double emission type emitting light toward the encapsulation substrate 30 and the substrate 10, the moisture absorbing layer 50 is transparent. Since it is to be formed, the thickness d is formed to be 500 Å or less. Therefore, in the top emission type organic light emitting diode display 100, the moisture absorbing layer 50 may be formed to have a thickness d of 100 to 500 mW.

In this case, however, the thickness may be less than 100 kPa only when the hygroscopicity of the material for forming the moisture absorbing layer 50 is very excellent.

By forming a thin film with such a thickness, an organic light emitting display device having excellent hygroscopicity and capable of emitting both top and bottom surfaces can be provided.

Hereinafter, a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention will be described.

2A to 2C are flowcharts schematically illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention.

First, as illustrated in FIG. 2A, a substrate 10 on which an organic electroluminescent unit 20 formed by sequentially stacking a first electrode (not shown), an organic thin film (not shown), and a second electrode (not shown) is formed. Prepare.

Next, as shown in FIG. 2B, a moisture absorption layer made of a thin film is formed on the inner surface of the encapsulation substrate 30. The moisture absorbing layer of the thin film may be formed by chemical vapor deposition, vapor deposition, or sputtering. In FIG. 2B, for example, a process of depositing and forming a moisture absorbing material 50a for forming the moisture absorption layer by chemical vapor deposition is illustrated. .

In this case, although not shown, a shadow mask may be used during deposition in order to form a moisture absorbing layer only on the inner surface of the encapsulation substrate 30 and to prevent the moisture absorbing layer from being formed in contact with the sealing material. However, in the case of using a hygroscopic material having excellent adhesion with the sealing material, the moisture absorbing layer may be deposited without using the shadow mask.

Next, as shown in FIG. 2C, the sealant 40 is applied to the outside of the organic light emitting part 20 of the substrate 10, and then, in the case of the back light emitting device, an encapsulation of an atmosphere in which an inert gas and an appropriate amount of oxygen are mixed. In the chamber, in the case of the front light emitting device, the substrate 10 and the encapsulation substrate 30 are bonded together in an encapsulation chamber in an inert gas atmosphere.

According to the method of manufacturing the organic light emitting display device, the moisture absorbing layer can be formed to a desired thickness by a simple process without any additional equipment and facilities.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

As described above, according to the organic light emitting diode display and a method of manufacturing the same, a manufacturing process of the organic light emitting diode display is simplified by depositing a moisture absorbing layer into the encapsulation substrate.

In addition, the thickness of the moisture absorbing layer can be easily adjusted, and thus it can be applied to front and double-sided organic light emitting display devices.

Claims (9)

Board, An organic light emitting part formed on one surface of the substrate, An encapsulation substrate sealingly opposed to the substrate with the organic light emitting portion therebetween, and A moisture absorbing layer formed of a thin film deposited on one surface of the encapsulation substrate facing the substrate side and formed of at least one material selected from the group consisting of rare earth metal oxides and zeolites. An organic light emitting display device comprising a. delete delete According to claim 1, An organic light emitting display device in which the moisture absorbing layer is formed to a thickness of 100 GPa to 2000 GPa. The method of claim 4, wherein The organic light emitting display device wherein the moisture absorbing layer is formed to a thickness of 500 GPa or less. Preparing the substrate, Forming an organic light emitting part on the substrate; Depositing a moisture absorbing layer of a thin film on an encapsulation substrate, and Sealing the substrate and the encapsulation substrate Including, And forming the moisture absorbing layer, wherein the moisture absorbing layer is formed of at least one material selected from the group consisting of metal halides, metal sulfates, metal perchlorates, rare earth metal oxides, and zeolites. The method of claim 6, The method of manufacturing an organic light emitting display device includes depositing a moisture absorbing layer of a thin film on the encapsulation substrate by any one of chemical vapor deposition, vacuum deposition, electron beam deposition, and sputtering. delete delete

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