KR100777746B1 - Organic light emitting diode display device - Google Patents

Abstract

An organic light emitting display device is provided to prevent an outgassing by making a partition wall of inorganic material before forming a display unit. An organic light emitting display device(100) includes a substrate(110), a display unit(120), a partition wall(130), and an encapsulation layer(140). The display unit is formed on the substrate. The partition wall is formed outside the display unit while surrounding the display unit, and is made of inorganic material. The encapsulation layer covers the display unit, and is laminated to the inside of the partition wall. The light generated in the display unit is extracted to the outside through the encapsulation layer.

Description

Organic light emitting diode display device

1 is a plan view schematically illustrating an organic light emitting display device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is a plan view schematically illustrating an organic light emitting display device according to another exemplary embodiment of the present invention.

4 is a cross-sectional view taken along line IV-IV of FIG. 3.

5 is a plan view schematically illustrating an organic light emitting display device according to still another embodiment of the present invention.

FIG. 6 is an enlarged cross-sectional view taken along line VI-VI of FIG. 5.

<Description of Symbols for Main Parts of Drawings>

110: substrate 120: display unit

130: partition 140: encapsulation layer

The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device having a thin film encapsulation layer capable of preventing penetration of moisture or oxygen from the outside.

An organic light emitting display device is a display device having a light emitting layer made of an organic material between a pixel electrode and a counter electrode. In the organic light emitting display device, as the anode and cathode voltages are applied to these electrodes, holes injected from the pixel electrode are moved to the light emitting layer via the hole transport layer, and electrons are injected from the opposite electrode to the electron transport layer to the light emitting layer. A display in which electrons and holes are bonded to each other in an emissive layer to extinguish and form an exciton, and the excitons transition from an excited state to a ground state, transferring energy to fluorescent molecules in the emissive layer and emitting an image to form an image. Device.

The organic light emitting display device is a self-luminous device, and has attracted attention as a next generation display device because of its advantages of having a wide viewing angle, excellent contrast, and fast response speed. However, such an organic light emitting display device is vulnerable to moisture and oxygen or moisture from the outside will have a fatal effect on the life of the device.

In the conventional organic light emitting display device, the metal cap or the sealing substrate is sealed with a sealing material to prevent the penetration of oxygen or moisture from the outside, and the oxygen or moisture is blocked by filling a hygroscopic agent such as silicon oil or silica gel in the sealing space. However, this approach complicates the manufacturing process and causes a problem of increasing weight and volume of the display device.

In order to solve this problem, a film encapsulation method for covering and encapsulating the display device with a protective film has been proposed, but this method can effectively prevent the penetration of moisture or oxygen in a direction perpendicular to the substrate, There was a problem in that water or oxygen penetrated from the distal end of the membrane along the interface of the encapsulation layer in the parallel direction.

The present invention is to solve the various problems including the above problems, to provide an organic light emitting display device that can improve the life by forming a partition on the outside of the display area to block the penetration path of moisture or oxygen. The purpose.

In order to achieve the above object and various other objects, the present invention is a substrate; A display unit formed on the substrate; A partition wall formed around the display unit and formed outside the display unit, the barrier rib including an inorganic material; And an encapsulation layer covering the display unit and stacked up to an inner side of the partition wall.

According to another feature of the present invention, the light generated by the display unit may be extracted to the outside through the encapsulation layer.

According to another feature of the invention, the encapsulation layer may have a multilayer film structure.

According to another feature of the invention, the encapsulation layer may be laminated alternately the organic layer and the inorganic layer.

According to another feature of the invention, the partition wall may be formed at the edge on the substrate.

According to another feature of the present invention, the partition wall may be formed of a frit.

In addition, the present invention is a substrate for the above and other purposes; A display unit formed on the substrate and having a pixel defining layer formed of a plurality of pixels and an inorganic material; And an encapsulation layer covering the plurality of pixels and the pixel defining layer and stacked up to an inner side of the pixel defining layer formed at the outermost portion of the display unit.

According to another aspect of the present invention, the organic layer including at least the organic light emitting layer may be disposed from the center of the display unit to the pixel and the pixel defining layer disposed second from the outermost of the display unit.

According to another feature of the present invention, the pixel defining layer may be formed of SiOx or SiNx.

 According to another feature of the invention, the light generated in the display unit may be extracted to the outside through the encapsulation layer.

According to another feature of the invention, the encapsulation layer may have a multilayer film structure.

According to another feature of the invention, the encapsulation layer may be laminated alternately the organic layer and the inorganic layer.

Hereinafter, with reference to the preferred embodiments of the present invention shown in the accompanying drawings will be described in more detail the present invention.

1 is a plan view schematically illustrating an organic light emitting display device 100 according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1.

Referring to the drawings, a partition wall 130 surrounding the display unit 120 is formed on the substrate 110, and the encapsulation layer 140 covering the display unit 120 is stacked to the inside of the partition wall 130. It is. That is, the partition 130 surrounds the encapsulation layer 140 to be in contact with the edge of the encapsulation layer 140.

The substrate 110 may be a transparent glass material containing SiO ₂ as a main component, or a substrate of various materials, such as a plastic substrate or a metal substrate.

The display unit 120 provided on the substrate 110 has a plurality of pixels, each pixel including at least one organic light emitting device. Each organic light emitting diode is configured to have an active matrix (AM) organic light emitting device and a passive matrix (PM) organic light emitting diode depending on whether the light is emitted using a thin film transistor electrically connected to each organic light emitting diode. It can be divided into light emitting elements. The organic light emitting display device according to the present embodiment may be applied to a case in which any one of an active driving organic light emitting element and a passive driving organic light emitting element is provided.

The organic light emitting device includes an intermediate layer including a first electrode and a second electrode which face each other, and at least a light emitting layer interposed between the electrodes.

The first electrode functions as an anode electrode and the second electrode functions as a cathode electrode. Of course, the polarity of the first electrode and the second electrode may be reversed.

The first electrode may be provided as a transparent electrode or a reflective electrode. When provided as a transparent electrode may be provided with ITO, IZO, ZnO or In2O3, when provided as a reflective electrode Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a compound thereof And a transparent film formed of ITO, IZO, ZnO, or In 2 O 3.

The second electrode may also be provided as a transparent electrode or a reflective electrode, and when the transparent electrode is provided, a film formed by depositing Li, Ca, LiF / Ca, LiF / Al, Al, Mg, or a compound thereof toward the intermediate layer And an auxiliary electrode or a bus electrode line formed of a transparent conductive material such as ITO, IZO, ZnO, or In 2 O 3 thereon. And, when provided as a reflective electrode can be formed of the above Li, Ca, LiF / Ca, LiF / Al, Al, Mg and their compounds.

The organic layer provided between the first electrode and the second electrode may be formed of low molecular weight or high molecular weight organic material. In case of using low molecular weight organic material, hole injection layer (HIL), hole transport layer (HTL), organic emission layer (EML), electron transport layer (ETL), electron injection layer (EIL) : electron injection layer, etc. may be formed by stacking a single or a complex structure, and the usable organic materials may be copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N '-Diphenyl-benzidine (N, N'-Di (naphthalene-1-yl) -N, N'-diphenyl-benzidine: NPB), tris-8-hydroxyquinoline aluminum ( Alq3) can be used in various ways. These low molecular weight organics can be formed by the vacuum deposition method using masks.

In the case of the polymer organic material, the structure may include a hole transporting layer (HTL) and a light emitting layer (EML). In this case, PEDOT is used as the hole transporting layer, and PPV (Poly-Phenylenevinylene) and polyfluorene are used as the light emitting layer. Polymer organic materials such as (Polyfluorene) are used.

The encapsulation layer 140 covering the display unit 120 is provided on the display unit 120 having the organic light emitting diode as described above. As described above, the organic light emitting device of the display unit 120 is easily deteriorated due to external factors such as external moisture or oxygen, and the encapsulation layer 140 penetrates the external display unit 120 with oxygen or moisture. Prevent it. In this case, when the encapsulation layer 140 is formed in a single layer structure, external impurities may penetrate through the encapsulation layer 140, so that the encapsulation layer 140 has a multilayer structure. In this case, when the encapsulation layer 140 is formed only by the organic layer or only the inorganic layer, oxygen, moisture, or the like penetrates from the outside through a minute gap formed in the encapsulation layer 140, or a predetermined thickness required for the encapsulation structure is obtained. There is a case where it cannot be formed. Therefore, in order to prevent the micro-paths interconnected from the encapsulation layer 140 to the display unit 120 and to form an appropriate thickness, the encapsulation layer 140 includes a plurality of layers 141 in which an organic layer and an inorganic layer are alternately stacked. It can be prevented by having a composite layer structure having, 142, 143, 144.

Such organic layers include PPX (parylene (poly-p-xylylene), PCPX (poly-2-chloro-p-zylylene), poly [2-methoxy-r- (2'ethyhexylloxy) -1,4-phenylene vinylene] In addition, the inorganic layer may include aluminum oxide (AlO), zinc oxide (ZnO), titanium oxide, tantalum oxide, zirconium oxide (ZrO2), hafnium oxide (HfO2), silicon oxide (SiO2), and silicon knight. And metal nitrides (SiN), aluminum nitride (AlN), aluminum oxynitride (AlON), tantalum nitride (TaN), titanium nitride (TiN), and the like.

On the other hand, when the light generated in the display unit 120 is taken out through the encapsulation layer 140, the encapsulation layer 140 is preferably transparent. However, the present invention is not limited thereto, and even when light generated from the display unit 120 is extracted to the outside through the substrate 110, the penetration of external moisture or oxygen through the terminal where the encapsulation layer 140 is formed is prevented. Of course, the present invention is applied to prevent.

The encapsulation layer 140 extends to the inner side of the partition wall 130 surrounding the display unit 120 while covering the display unit 120. The partition wall 130 is formed of an inorganic material without fear of out gasing, and is formed on the substrate 110 before the display unit 120 is formed. If the partition wall 130 as in the present embodiment is not used, each encapsulation layer 140 may be formed to prevent infiltration of moisture or oxygen from the interface of the encapsulation layer 140 at the end of the encapsulation layer 140. Each time a different size mask should be used. In other words, since the encapsulation layer 142 deposited next to the encapsulation layer 141 deposited first on the display 120 must cover all of the former encapsulation layer 141, the latter encapsulation layer 142 It must be made with a larger mask. In this case, the manufacturing process is complicated because a plurality of masks must be used, thereby increasing the manufacturing cost. In addition, there is a problem that the dead space increases due to the gradually wider encapsulation layer.

However, if the partition wall 130 is formed as in the present embodiment, and the encapsulation layer 140 is laminated using one mask that matches the size of the partition wall 130, the manufacturing process may be simplified and the cost may be reduced. Of course, since the ends of the encapsulation layers 141, 142, 143 and 144 are in contact with the inside of the partition 130, external moisture or oxygen from the encapsulation layer interface at the ends of the encapsulation layers 141, 142, 143 and 144. Of course it prevents the penetration.

In addition, since the barrier rib 130 is formed before the organic layer of the display unit 120 is deposited, the barrier rib 130 may be formed within a temperature range of about 300 ° C. Therefore, since the partition wall 130 can be formed more densely, penetration of moisture, oxygen, or the like from the outside of the partition wall 130 can be prevented more effectively.

At this time, the frit may be used as an inorganic material for forming the partition wall 130. The frit is capable of forming partitions of relatively high thickness as compared to other inorganic materials. The thickness of the partition wall 130 that can be formed as a frit is preferably about 1 μm to 5 μm.

According to the present embodiment described above, the interface of the encapsulation layer 140 at the end of the encapsulation layer 140 covering the display unit 120 is blocked from the outside by the partition wall 130 formed of an inorganic material, the encapsulation by the membrane encapsulation method Even if it is possible to prevent the organic light emitting device from deteriorating due to the penetration of moisture or oxygen from the outside. In addition, since the encapsulation layer 140 is formed inside the partition wall 130 that is already formed, since the encapsulation layer 140 is supported from the side surface, a dense encapsulation layer is possible.

Referring to Figures 3 and 4, another embodiment of the present invention will be described in more detail. 3 is a plan view schematically illustrating an organic light emitting display device 200 according to another exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3. Hereinafter, the organic light emitting diode display 200 according to the present exemplary embodiment will be described in detail with a focus on the difference from the organic light emitting diode display 100 according to the first exemplary embodiment.

Referring to the drawings, the encapsulation layer 240 of the organic light emitting display device 200 covers the display unit 220 and is stacked up to the inner side of the inorganic partition wall 230, and the partition wall 230 is the display unit 220. It is disposed at the edge of the substrate 210 while surrounding the outer edge of the substrate 210.

Various electrode wirings or electrical elements 250 may be formed on the substrate 210 as well as the display unit 220. For example, an electrode wiring portion for connecting a power source to a cathode, which is a common electrode, a circuit portion for transmitting a signal to a source / drain wiring, or a dummy pixel portion for testing an organic light emitting element may be formed. The electrode line or the elements 250 are generally not provided with an organic layer. On the other hand, in the present embodiment, since the inorganic barrier rib 230 is formed at the edge of the substrate 210, the encapsulation layer 240 formed up to the inner side of the barrier rib 230 while covering the display unit 220 has these electrode wirings. However, the elements 250 may be completely covered. Therefore, the encapsulation layer 140 of the present embodiment encapsulates the oil film layer in a wider range. That is, the interface of the encapsulation layer 240 is blocked by the inorganic partition wall 230 to prevent penetration of external moisture or oxygen, and even if such infiltration occurs, the display unit 220 at the end of the encapsulation layer 240. Since the distance to the organic film layer formed in Fig. 3) is long, the path of movement of moisture or oxygen that has penetrated from the outside becomes long, and the degradation rate of the organic light emitting layer can be slowed down.

Another embodiment of the present invention will be described in more detail with reference to FIGS. 5 and 6. FIG. 5 is a plan view schematically illustrating an organic light emitting display device 300 according to another exemplary embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5. Hereinafter, the organic light emitting display device 300 according to the present exemplary embodiment will be described in detail with a focus on the difference from the organic light emitting display device 100 according to the first embodiment.

Referring to the drawings, the display unit 320 according to the present exemplary embodiment includes a plurality of pixels 321a, 321a ', 321b, 321b', etc. and pixel defining layers 322a, 322a ', 322b, and 322b' formed of an inorganic material. Etc.) and the encapsulation layer 340 covering the pixels 321a, 321a ', 321b, 321b', etc., and the pixel defining layers 322a, 322a ', 322b, 322b', etc. ', 321b, 321b', etc.) and pixel defining layers 322a, 322a ', 322b, 322b', etc.) to the inner side of the pixel defining layers 322a, 322a 'formed at the outermost side of the display 320 in a gown. do.

While the encapsulation layer 140 of the organic light emitting display device 100 according to the first embodiment encapsulates the entire display unit 120, in the present exemplary embodiment, a plurality of pixel defining layers 322a, 322a ', 322b, 322b', etc.), the encapsulation layer 340 is stacked up to the inside of the pixel defining layers 322a, 322a '330 disposed at the outermost portion of the display 320. do. The pixel defining films 322a and 322a '330 disposed at the outermost part play the same role as the partition wall 130 in the first embodiment, and are formed at the ends of the encapsulation layer 340 covering the pixels and the pixel defining films. Since the interface is blocked from the inside of the pixel defining films 322a and 322a 'disposed at the outermost side, it is possible to prevent moisture or oxygen from outside from penetrating into the organic film layer 323.

The pixel defining layers 322a and 322a '330 disposed at the outermost sides of the display unit 320 as described above are formed of an inorganic material without fear of out gasing, and preferably formed of SiOx or SiNx. do. In addition, since the pixel defining layers 322a, 322a ′, 322b, 322b ′ and the like are formed before the organic layer 323 is deposited, the pixel defining layers 322a, 322a ′, 322b ′, and 322b ′ may be formed within a temperature range up to about 300 ° C. Therefore, since the pixel defining layers 322a, 322a ', 322b, 322b', etc. can be formed more densely, the infiltration of moisture or oxygen from the pixel defining layer 330 disposed at the outermost part can be prevented more effectively. Can be.

Also, in the present exemplary embodiment, the organic layer 323 including at least the organic light emitting layer may include pixels 321b and 321b 'disposed second from the outermost portion of the maximum display unit 320 at the center of the display unit 320. It is preferable to arrange up to the films 322b and 322b '.

The pixel portion constituting the display unit 320 may be divided into a pixel portion for implementing an image and a dummy pixel portion for test. Among these, the test dummy pixel portion may be provided with a display element that actually participates in emission. Only electronic devices such as thin film transistors for controlling the devices may be provided.

When the display unit 320 includes only a pixel unit for implementing an image or a dummy pixel unit including a display element among the dummy pixel units, the organic layer formed on the pixel unit includes a pixel unit or a display element for implementing an image. From the pixel defining layers 322a and 322a 'disposed at the outermost part of the dummy pixel portion to be included, the pixel defining layers 322b and 322b' disposed inside one cell are formed. That is, the maximum formation range of the organic layer 323 is from the outermost to the second disposed pixels 321b and 321b 'and the pixel defining layers 322b and 322b', and the encapsulation layer 340 is formed by the organic layer 340. It is formed beyond the formed range to the inside of the pixel defining layers 322a and 322a 'disposed at the outermost sides. When the organic layer 323 is formed up to the outermost pixel defining layers 322a and 322a 'of the display 320, the distance between the end of the organic layer 323 and the end of the encapsulation layer 340 may be reduced. This is to prevent close formation.

In the above-described organic light emitting display device 300, the encapsulation layer 340 covering the organic layer 323 is stacked up to the inner side of the outermost pixel defining layers 322a and 322a ′ of the display 320 to encapsulate the encapsulation layer 340. The interface at the end is blocked by the pixel defining layers 322a and 322a 'disposed at the outermost side, thereby preventing deterioration of the organic layer 323 from penetration of moisture or oxygen from the outside.

According to the organic light emitting display device of the present invention made as described above, the following effects can be obtained.

First, the end of the encapsulation layer is blocked from the outside to prevent the penetration of moisture or oxygen from the outside to improve the life of the organic light emitting display device.

Second, the partition wall formed of the inorganic material can prevent the problem of out-gassing.

Third, a dense inorganic partition wall can be formed by manufacturing the inorganic partition wall before forming the display unit.

Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (12)

Board; A display unit formed on the substrate; A partition wall formed around the display unit and formed outside the display unit, the barrier rib including an inorganic material; And And an encapsulation layer covering the display unit and stacked up to an inner side of the partition wall. The method of claim 1, The light emitted from the display unit is emitted to the outside through the encapsulation layer. The method of claim 1, The encapsulation layer has an organic light emitting display device. The method of claim 3, wherein The encapsulation layer is an organic light emitting display device having a structure in which an organic layer and an inorganic layer are alternately stacked. The method of claim 1, The partition wall is an organic light emitting display device formed on the edge of the substrate. The method of claim 1, The barrier rib is formed of a frit. Board; A display unit formed on the substrate and having a pixel defining layer formed of a plurality of pixels and an inorganic material; And And an encapsulation layer covering the plurality of pixels and the pixel defining layer and stacked up to an inner side of the pixel defining layer formed at the outermost part of the display unit. The method of claim 7, wherein And an organic layer including at least an organic light emitting layer is disposed from a center of the display unit to a pixel disposed at a second pixel and a pixel defining layer at an outermost portion of the display unit. The method of claim 7, wherein The pixel defining layer is formed of SiOx or SiNx. The method of claim 7, wherein The light emitted from the display unit is emitted to the outside through the encapsulation layer. The method of claim 7, wherein The encapsulation layer has an organic light emitting display device. The method of claim 11, The encapsulation layer is an organic light emitting display device having a structure in which an organic layer and an inorganic layer are alternately stacked.

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