KR100665833B1 - Bake apparatus - Google Patents

Abstract

According to the present invention, even though the object to be baked is not seated correctly at the designated position due to an error occurring during the transfer process, the object to be processed is designated by performing a series of subsequent processes for baking the object. It's about a baking device for a wafer that allows the baking process to proceed with its exact position in place. According to the present invention, even if the wafer to be subjected to the baking process is not seated correctly at a designated position due to malfunction of the wafer transfer, it has an effect that the bake failure does not occur.

Description

Bake apparatus             

1 is a conceptual diagram for explaining the configuration of a baking apparatus according to the present invention.

2 is a plan view of the baking apparatus according to the present invention.

3 to 5 are explanatory diagrams for explaining the action of the baking apparatus according to the present invention;

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking apparatus for a wafer, and more particularly, to undergo a series of subsequent processes for baking an object even if the object to be baked is not accurately seated at a designated position due to an error generated during the transfer process. The present invention relates to a wafer baking apparatus, in which a bake process is performed in a state in which a workpiece is correctly seated at a designated position so that position correction is performed.

In general, a photoresist (sometimes referred to as a photoresist), which serves as a resistive thin film, which reacts with light to form a highly precise semiconductor thin film pattern, is widely used in almost all semiconductor thin film processes.

Such photosensitizers are often applied in a droplet form on a very fast rotating wafer and applied to the wafer by a centrifugal force to have a very thin and uniform thickness.

At this time, most of the solvent contained in the photosensitizer is evaporated and the photoresist, which was in a liquid state, is in a semi-dry state.

However, since a predetermined amount of solvent which does not evaporate remains in the photosensitive agent, when the solvent is not completely dried from the photosensitive agent, a fine resistive thin film is difficult to form when exposed to light, and thus, at a predetermined temperature after the photosensitive agent is applied, This process is often referred to as soft baking as it is baked.

In addition, before the etching process is performed, the wafer is once again baked at a predetermined temperature in the developing process, such a process is often called a hard bake.

Such a soft bake process and a hard bake process are performed by a baking apparatus.

Conventional baking apparatus will be described briefly, a heater plate with a built-in heater, a gap spacer formed on the heater plate so that the flat zone portion of the wafer is seated so that the heater plate does not directly contact the wafer, and the wafer is in close contact with or spaced from the gap spacer. It consists of a wafer up-down pin unit.

However, when the transferred wafer is not seated at the designated position of the heater plate, i.e., the heater plate and the wafer are not aligned correctly, after some of the wafers have been baked to finish the preceding process and proceed with the baking process, Another part has a problem that a process failure occurs during the process that proceeds after the baking process because the baking does not proceed.

Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is that the baking process is performed after the wafer position correction is performed in the preparation process of the baking process even if the wafer to be baked is not correctly placed at the designated position of the baking apparatus. To let go.

Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

Baking apparatus according to the present invention for realizing the object of the present invention includes a baking plate including a heating means to seat and bake the wafer, an up-down pin through the bake plate so that the wafer is seated up-down, A wafer up-down unit comprising a drive device for driving an up-down pin, and when the up-down pin operates down to seat the wafer on the bake plate, the wafer is linked to the down operation to move the wafer to a designated position of the bake plate. It includes an alignment unit that aligns to seat.

Hereinafter, with reference to the accompanying drawings, a unique operation and effects according to a more specific configuration and configuration of the baking apparatus according to the present invention will be described.

1 is a cross-sectional view for explaining the overall configuration and internal configuration of the baking apparatus 100 according to the present invention.

The baking apparatus 100 according to the present invention is composed of a baking plate 110, a wafer up-down unit 120, and a wafer alignment unit 130 in which a heater unit 200 is incorporated as a whole.

Specifically, the baking plate 110 has a rectangular parallelepiped shape in one embodiment, as shown in FIG. 2, and has a heater unit 200 that generates heat in a central portion thereof. Meanwhile, reference numeral 210 denotes a power supply device, and 220 denotes a heating wire.
As shown in FIG. 2, four gap spacers 140 are formed on the upper surface of the baking plate 110 to have a 90 ° interval to each other while contacting an edge of the wafer 1 to be placed.

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When the wafer 1 in which the preceding process is completed is transferred to the baking plate 110 by a wafer transfer (not shown), the wafer transfer loads the wafer 1 onto the baking plate 110 or the baking plate 110. Since it is difficult to unload the wafer 1 into the wafer transfer from the wafer transfer, the wafer 1 is normally loaded or baked into the bake plate 110 from the wafer transfer with the aid of the wafer up-down unit 120. From the wafer transfer to the wafer transfer.                     

Wafer up-down unit 120 for implementing this is installed on the back of the baking plate 110, the up-down pin 122 inserted into the through-hole formed in the portion of the baking plate 110 opposite the bottom surface of the wafer To drive the up-down pin 122 up or down.

However, such a wafer up-down unit 120, for example, assumes that the wafer 1 seated on the upper surface of the up-down pin 122 is seated at a predetermined distance from the designated position. As described above, as described above, the baking uniformity is lowered, thereby causing a process failure due to a baking failure in a subsequent process.

In order to overcome this problem, in the present invention, the wafer alignment unit 130 is coupled to the up-down pin 122 of the wafer up-down unit 120 so that the wafer 1 is always placed at a designated position during the baking process. To be.

The wafer alignment unit 130 for implementing this is installed through the groove 131 having a predetermined depth including the up-down pin 122.

The wafer alignment unit 130 includes a rotation lever 133 and a rotation pad 132 that aligns the wafer 1 by being rotated in conjunction with the rotation lever 133.

More specifically, the rotation lever 133 has an overall L-shape as if the overall shape, the slit-shaped opening 133a is formed at one end, the slit-shaped opening 133a is formed rotation lever 133 The end of is hinged to the outer peripheral surface of the up-down unit 122 described above again.

On the other hand, the slit-shaped opening 133a is fitted to the fixed shaft 134 protruding from the groove 131, as shown in Figure 1, such a structure, the up-down pin 122 is a vertical reciprocating movement In this case, the end of the rotation lever 133 means a curved motion having a predetermined path around the fixed shaft 134.

At this time, the end of the rotation lever 133 is rotated about the hinge pad coupled to the rotation pad 132 by pressing the bottom surface of the rotation pad 132 hinged one end while performing a curved movement.

That is, such a rotation pad 132 pushes the wafer 1 into the center portion of the bake plate 110 even if the wafer 1 is located at an arbitrary position. In the lowered state, the center of the baking plate 110 is completely aligned.

Referring to the accompanying drawings, the operation according to the configuration of the baking apparatus according to the present invention having such a configuration is as follows.

Referring to FIG. 3, the wafer up-down unit 122 of the baking apparatus 100 finishes the preceding process and loads up-down pins to load the wafer 1 to the designated place of the baking plate 110 after the baking process is performed. 122 is lifted to the top of the bake plate 110.

Thereafter, the wafer 1 transferred by the wafer transfer is seated on top of the up-down pin 122.

At this time, if it is assumed that the wafer transfer has not seated the wafer 1 in the designated position, in this state, the wafer up-down unit 122 removes the up-down pin 122 as shown in FIG. 4. Transfer downwards.

When the up-down pin 122 is conveyed downward in this manner, the rotation lever 133 of the alignment unit 130 rotated along the fixed shaft 134a is also rotated, and as shown in FIG. 4, the rotation pad 132 is rotated. They also rotate in opposite directions.

At this time, the edge of the wafer 1 raised in the state eccentric to the up-down pin 122 by the rotation of the rotation pad 132 is pushed in the rotation direction of the rotation pad 132.

Thereafter, when the up-down pin 122 is completely transferred downward, the rotation pad 132 is almost vertical, and the edge of the wafer 1 is the baking plate 110 by the rotation pad 132. Is transported to the center specified position.

Thereafter, power is applied to the heater unit 200 installed in the baking plate 110 so that the wafer 1 may be baked at a predetermined temperature for a predetermined time and then transferred to a subsequent process.

As described in detail above, even if the wafer to be baked is not accurately seated at a designated position due to a malfunction of the wafer transfer, there is an effect that the bake failure does not occur.

Claims (3)

A baking plate including heating means for allowing the wafer to be seated and baked; A wafer up-down unit comprising an up-down pin penetrating the bake plate to allow the wafer seated on the bake plate to up-down and a driving device for driving the up-down pin; And an alignment unit for aligning the wafer to be seated at a designated position of the bake plate in conjunction with the down operation when the up-down pin is down operated to seat the wafer on the bake plate. The method of claim 1, wherein the alignment unit One end is hinged to the outer circumferential surface of the up-down pin in an "L" shape in the groove formed in the baking plate so that the up-down unit is included, and is spaced a predetermined distance from the hinged one end. A rotation lever having a slit-shaped opening having a predetermined length from the center; A fixed shaft inserted into the opening of the pivot lever and projecting from the side wall of the groove so that the pivot lever is rotated; And a rotation pad that is in contact with the other end of the rotation lever to rotate to press the edge of the wafer by the operation of the rotation lever. The baking apparatus according to claim 2, wherein the alignment unit presses at least three or more places of the wafer to align the position of the wafer.

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