KR100658572B1 - 위치결정장치 및 그것을 포함하는 노광장치 - Google Patents

위치결정장치 및 그것을 포함하는 노광장치 Download PDF

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Publication number
KR100658572B1
KR100658572B1 KR1020050058982A KR20050058982A KR100658572B1 KR 100658572 B1 KR100658572 B1 KR 100658572B1 KR 1020050058982 A KR1020050058982 A KR 1020050058982A KR 20050058982 A KR20050058982 A KR 20050058982A KR 100658572 B1 KR100658572 B1 KR 100658572B1
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KR
South Korea
Prior art keywords
stage
light
light reflecting
disposed
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050058982A
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English (en)
Korean (ko)
Other versions
KR20060049732A (ko
Inventor
히데오 다나까
Original Assignee
캐논 가부시끼가이샤
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Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20060049732A publication Critical patent/KR20060049732A/ko
Application granted granted Critical
Publication of KR100658572B1 publication Critical patent/KR100658572B1/ko
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020050058982A 2004-07-02 2005-07-01 위치결정장치 및 그것을 포함하는 노광장치 Expired - Fee Related KR100658572B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004196455A JP4262153B2 (ja) 2004-07-02 2004-07-02 位置決め装置およびそれを用いた露光装置
JPJP-P-2004-00196455 2004-07-02

Publications (2)

Publication Number Publication Date
KR20060049732A KR20060049732A (ko) 2006-05-19
KR100658572B1 true KR100658572B1 (ko) 2006-12-19

Family

ID=34941792

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050058982A Expired - Fee Related KR100658572B1 (ko) 2004-07-02 2005-07-01 위치결정장치 및 그것을 포함하는 노광장치

Country Status (4)

Country Link
US (1) US7193723B2 (enExample)
EP (1) EP1612608A3 (enExample)
JP (1) JP4262153B2 (enExample)
KR (1) KR100658572B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009025977A1 (de) 2009-06-16 2010-12-23 Q-Cells Se Solarzelle und Herstellungsverfahren einer Solarzelle
DE102011006055A1 (de) * 2011-03-24 2012-09-27 Carl Zeiss Smt Gmbh Positionsmessvorrichtung sowie Positioniersystem für eine Maskeninspektionseinrichtung
CN102998913B (zh) * 2012-12-27 2015-02-04 苏州大学 同步定位光刻曝光装置及方法
CN103309177B (zh) * 2013-06-19 2015-02-11 清华大学 一种光刻机工件台系统
CN112113509B (zh) * 2019-06-20 2022-06-17 上海微电子装备（集团）股份有限公司 龙门式测量装置及龙门式测量方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3531894B2 (ja) * 1996-09-13 2004-05-31 キヤノン株式会社 投影露光装置
US6020964A (en) * 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
JP3630964B2 (ja) 1997-12-26 2005-03-23 キヤノン株式会社 ステージ装置、およびこれを用いた露光装置ならびにデバイス製造方法
JP2000049066A (ja) * 1998-07-27 2000-02-18 Canon Inc 露光装置およびデバイス製造方法
US6160628A (en) * 1999-06-29 2000-12-12 Nikon Corporation Interferometer system and method for lens column alignment
JP2001160535A (ja) * 1999-09-20 2001-06-12 Nikon Corp 露光装置、及び該装置を用いるデバイス製造方法
JP2001143997A (ja) 1999-11-15 2001-05-25 Canon Inc 位置決め装置、露光装置、及びデバイスの製造方法
JP3762307B2 (ja) 2001-02-15 2006-04-05 キヤノン株式会社 レーザ干渉干渉計システムを含む露光装置
JP2003123832A (ja) 2001-10-11 2003-04-25 Nec Tokin Corp ラミネートフィルム外装蓄電デバイスおよびその製造方法
US7443511B2 (en) * 2003-11-25 2008-10-28 Asml Netherlands B.V. Integrated plane mirror and differential plane mirror interferometer system

Also Published As

Publication number Publication date
US20060001889A1 (en) 2006-01-05
EP1612608A2 (en) 2006-01-04
KR20060049732A (ko) 2006-05-19
EP1612608A3 (en) 2007-10-31
JP4262153B2 (ja) 2009-05-13
US7193723B2 (en) 2007-03-20
JP2006019549A (ja) 2006-01-19

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