KR100655727B1 - A manufacture method of electroconductive fiber for electron-wave interception - Google Patents

Abstract

A method for manufacturing electroconductive fibers for intercepting electron waves is provided to grant conductivity to various base fiber bodies, realize an antibacterial effect and an aesthetic appreciation effect, and effectively intercept electromagnetic waves. A base fiber body is etched by 50-100g/l of sodium hydroxide or 1%(v/v) of a surfactant at 60-80 deg.C for 5 minutes. The etched base fiber body is washed by water. The washed base fiber body is washed by a 10% hydrochloric acid solution for 20-50 minutes. The washed base fiber body is washed by water. The base fiber body is treated with a preliminary catalyst by a 7-12% hydrochloric acid solution. The base fiber body is deposited in a solution manufactured by adding 3N hydrochloric acid of a normal temperature to a mixture including 0.4 weight% of palladium chloride and tin chloride, at 20-50 deg.C for 10-30 minutes. The base fiber body is washed by water. The base fiber body is activated by a 13% sulphuric acid solution to activate electroless deposition eduction. The base fiber body is washed by water. The base fiber body is coated with a solution having pH 8.0-9.5, consisting of 10g/l of sulphuric acid nickel, 7.5g/l of sodium hypophosphite, 15g/l of sodium citrate, at 40-45 degrees. The coated base fiber body is washed by water. The base fiber body is treated with a pH 11.5-13.0 electroless copper chloride plating solution consisting of 2.3g/l of copper chloride, 9g/l of sodium hydroxide, 4g/l of formalin, and 0.125M of chelate. The treated base fiber body is washed to remove residual chemicals and alien substances. The base fiber body is dried.

Description

A manufacturing method of electroconductive fiber for electron-wave interception

1 is a pretreatment process diagram of a conductive fiber for shielding electromagnetic waves of the present invention

Figure 2 is a process chart of the conductive fiber by copper and nickel plating of the present invention

Figure 3 is a process chart of the conductive fiber by nickel-cobalt alloy plating of the present invention

Figure 4 is a process chart of the conductive fiber by tin plating of the present invention

Figure 5 is a process chart of the processing of the conductive fiber by nickel-tin alloy plating of the present invention

Figure 6 is a process chart of the conductive fiber by the silver plating of the present invention

Figure 7 is a process chart of the processing of the conductive fiber by gold plating of the present invention

8 is a test report of electromagnetic shielding effect of the conductive fiber by copper-nickel plating of the present invention

9 is an electromagnetic shielding effect of the conductive fiber by copper-nickel plating of the present invention

10 is a test report of the electromagnetic wave (field) shielding effect of the conductive fiber by nickel-cobalt alloy plating of the present invention

11 is an electromagnetic wave (field) shielding effect diagram of the conductive fiber by the nickel-cobalt alloy plating of the present invention

12 is an electromagnetic wave (magnetic field) shielding effect of the conductive fiber by nickel-cobalt alloy plating of the present invention

13 is a test report of electromagnetic shielding effect of the conductive fiber by nickel-tin alloy, silver plating, gold plating of the present invention

14 is an electromagnetic shielding effect of the conductive fiber by nickel-tin alloy plating of the present invention

15 is an electromagnetic shielding effect of the conductive fiber by the silver plating of the present invention

16 is an electromagnetic shielding effect of the conductive fiber by gold plating of the present invention

The present invention relates to a method for producing a conductive fiber for shielding electromagnetic waves, in the method for producing a conductive fiber, woven fibers such as polyester and acrylic, cushion foams such as polyurethane and polyolefin, substrate fibers such as polyester film Is etched with caustic soda or a surfactant, it is pickled with hydrochloric acid solution, and then the detection nuclei to be plated with a compound of hydrochloric acid solution added in equal proportions to a mixed solution of palladium chloride and tin chloride is added to the catalyst metal solution. After the catalytic treatment, the method comprising the step of activating with sulfuric acid solution, which is based on a pretreatment process to impart conductivity while preserving the properties of the substrate fiber body, and by adding a separate process Magnetic field shielding and antibacterial that make it more difficult to shield or give better conductivity The present invention relates to a method for manufacturing a conductive fiber for shielding electromagnetic waves, characterized in that it provides a property, improves the resolution of a plasma display panel (PDP), and provides aesthetic effects when used in expensive products as well as blocking electromagnetic waves by gold or silver plating.

 Generally, in the 21st century, with the advent of the knowledge-information society, the rapid development of wireless information communication technology using radio waves is taking place. Electromagnetic waves are a key element of such wireless information and communication technology, and are emerging as essential elements in daily life.

However, although there is no clear evidence that electromagnetic waves are harmful to the human body, some advanced countries continue to debate the hazards, and strive to establish human protection standards.

Electromagnetic waves are emitted from the electromechanical instruments in use around us. Among them, when the human body is exposed to very low and low frequencies for a long time, the body's rhythm is broken along with changes in body temperature. Although it has very weak radio waves, it affects the distribution of ions such as calcium, potassium, sodium, and chlorine that move the cell membranes in the human body, causing hormone secretion. High-frequency microwaves cause water molecules inside the food to fluctuate As it increases, the function of the nervous system is affected by the electrical and chemical changes in the body, so a very high frequency can cause stress, heart disease, chemical changes in the blood, and in severe cases can cause brain tumors. There are many researches on the harmfulness of electromagnetic waves.

In addition, the electromagnetic wave affects the machine, which causes the malfunction of the electronic circuits of other electronic devices, causing malfunctions. To prevent serious medical accidents caused by the electromagnetic waves of the mobile phone, the hospital electronics may malfunction. Has banned cell phones since 1996.

The best way to avoid the harmful effects of electromagnetic waves is to stay away from certain distances.However, mobile phones, electric cars, electric appliances, microwave ovens, computers, etc. are becoming more common and familiar, and the electromagnetic waves emitted by these electromechanical devices are immediately harmful to the human body. Because it does not indicate, it is used without any consciousness.

However, as mentioned above, long-term exposure to electromagnetic waves has harmful effects on the human body, such as VDT syndrome, brain cancer, leukemia, malformed childbirth, muscle weakness, myopia, and dry eyes. There is typically a method of blocking electromagnetic waves with a conductive metal plate, such a method is not effective in the cell phone or electric blanket used in direct contact with or close to the human body as described above.

In addition, PDP (Plasma Display Panel), which is currently developed as a monitor, generates a large amount of electromagnetic waves. In order to block the electromagnetic waves, a composite material in which copper circuits are laminated on an insulating transparent substrate is used. When reflecting light rays, the brightness of the screen is lowered. Therefore, this part is used by surface treatment with black paint, etc., but the surface of this part is likely to get fingerprints or residues such as dust. There is a problem that is thrown away.

In addition, the magnetic field of the electromagnetic wave can be shielded by a metal having a polarity opposite to the magnetic field as described above. This part is not practical and difficult to use in general because a metal such as a very expensive mu metal must be used. The appearance of various electronic products and mechanical devices on the market requires luxury, as well as various additional functions.

The present invention has been made in order to solve the above problems, in the manufacturing method of the conductive fiber, weaving fibers such as polyester, acrylic or the like, cushion foams such as polyurethane and polyolefin, base fiber body such as polyester film Is etched with caustic soda and a surfactant, it is pickled with hydrochloric acid solution, and then the detection nuclei to be plated with a compound of hydrochloric acid solution added in equal proportions to a mixed solution of palladium chloride and tin chloride is added to the catalyst metal solution. After the catalytic treatment, the method comprising the step of activating with sulfuric acid solution, which is based on a pretreatment process to impart conductivity while preserving the properties of the substrate fiber body, and by adding a separate process Magnetic field shielding and antimicrobial properties that impart even greater conductivity or are difficult to shield W, PDP electromagnetic shield by improving resolution, gold or silver plating of (Plasma Display Panel), as well as when used on a high-priced product relates to a process for the preparation of conductive fibers for electromagnetic shielding which comprises also provides aesthetic effect.

Hereinafter, the present invention will be described in detail with reference to the flowchart shown in the accompanying drawings.

1 shows a pretreatment process diagram of a conductive fiber for shielding electromagnetic waves of the present invention, Figure 2 is a process chart of the conductive fiber by copper and nickel plating of the present invention, Figure 3 is a nickel-cobalt alloy plating of the present invention 4 is a process chart of conductive fiber, FIG. 4 is a process chart of conductive fiber by tin plating of the present invention, FIG. 5 is a process chart of conductive fiber by nickel-tin alloy plating of the present invention, and FIG. Process chart of the conductive fiber by silver plating, Figure 7 shows a process chart of the conductive fiber by the gold plating of the present invention.

As shown in FIG. 1, a pretreatment process of electromagnetic wave fibers for shielding electromagnetic waves, as well as polyester or acrylic woven fibers, may be applied to a substrate fiber body that can be variously applied as a cushion foam such as polyurethane or polyolefin, and a polyester film. After the etching treatment (step 1) (step 2) with caustic soda or surfactant to improve the plating speed by improving adhesion and hydrophilicity of the plating, it is washed with tap water to remove chemicals and foreign substances from the residual oil. By removing the impurities on the surface of the base fiber body by 3 step), the processing conditions can be changed according to the thickness and density of the base fiber body, and caustic soda and surfactant in the etching process (step 1) (step 2). The temperature of the solution is preferably 60 to 80 ° C., and the concentration of caustic soda 50 to 100 g / l and the surfactant is preferably 1% (v / v).

After the etching step (step 1) (step 2), pickling treatment (step 4) with 7-12% hydrochloric acid solution at room temperature is carried out to remove the material that interferes with the contact between both interfaces. After the step), it is washed with tap water (5 steps), and then precatalized with 7 to 12% hydrochloric acid solution for about 20 to 50 minutes (6 steps), which stabilizes the catalyst solution used in the next plating process. Is a process for

After the precatalyst treatment (step 6), the detection nuclei to be plated in a mixed solution containing 0.4 wt% of palladium chloride and tin chloride in a room temperature solution of 3 N hydrochloric acid in the same ratio are treated with a catalyst metal solution of 20-50 ° C. ( Tin chloride) for 10 to 30 minutes, followed by catalytic treatment (7 steps) to uniformly attach the fine particles of the catalyst metal to the substrate fiber body, followed by washing with water (8 steps). Activate the metal to activate the electroless plating precipitation with activation of 13% sulfuric acid solution at 50 ~ 60 ℃ (9 steps).

After the activation process (step 9), washing with tap water (step 10) to remove the residual chemicals and foreign matter, and then to obtain a uniform nickel plating on the activated surface, nickel sulfate 10g / L, sodium hypophosphite A nickel metal layer was formed by treating an electroless nickel plating solution (11 steps) at 40 to 45 ° C. in a solution of pH 8.0 to 9.5 at 7.5 g / l and 15 g / l of sodium citrate, followed by washing with tap water (12 steps). and,

The pH of copper chloride 2.3g / ℓ, caustic soda 9g / ℓ, formalin 4g / ℓ, and chelate 0.125M are treated with electroless copper chloride solution (13 steps) at 45 ~ 48 ℃ in 11.5 ~ 13.0 solution. It is to form a good copper metal layer to give a better conductivity, the nickel metal layer is to further increase the plating adhesion of the copper metal layer and if the copper plating is carried out immediately without a nickel metal layer, the adhesion to the base fiber body is reduced, the copper plating is to fall Problems may arise. In addition, since the conductivity can be adjusted according to the plating conditions, various applications are possible depending on the material properties and the plating type.

After the copper chloride solution (13 steps) treatment, it is washed with tap water (14 steps) to remove the chemical residues and foreign matter, and dried (15 steps) to remove the moisture on the fabric to pretreatment process The drying step (step 15) is to complete the natural wind drying rather than hot air drying to prevent deformation of the material.

Through the pretreatment process (steps 1 to 15), a nickel metal layer and a copper metal layer are formed on the base fiber body by about 3 to 4 μm, and the substrate fiber body has conductivity even through the pretreatment process (steps 1 to 15). As described above, by adding a separate plating process to the pretreatment process (steps 1 to 15) for the purpose of imparting more excellent conductivity or providing an antimicrobial function and an aesthetic effect to an expensive product. It can meet various needs.

Hereinafter, the present invention will be described in more detail through embodiments for this purpose.

Example 1 Conductive Fiber by Copper and Nickel Plating

Figure 2 shows a process chart of the conductive fiber by the copper and nickel plating of the present invention, as shown in Figure 2, is prepared by adding a separate plating process after the pretreatment process (steps 1 to 15) of Figure 1 Paper is a method for producing a conductive fiber by copper and nickel plating, which will be described in detail

On the surface of the base fiber body, which has undergone the pretreatment process from step 1 to step 15 of FIG. 1, washing with tap water (step 16) to remove foreign substances and chemical residues, and copper plating is formed on the surface of the base fiber body. The strike process is performed so as to be uniform (step 17), and the strike process is more efficient in subsequent plating with the same plating solution as the copper sulfate plating solution (step 18) in a plating bath smaller than the plating bath plated in step 18. In order to improve the plating in the copper sulphate plating solution (18 steps), which is the main plating step, by performing a little copper plating over a short time, a surface treatment of the plating layer is called a STRIKE treatment, and a STRIKE treatment After the surface of the plating layer was cleaned in (17 steps), electroless copper sulfate plating was performed at 40-45 ° C. in a pH 11.5-13.0 solution of 3.5 g / l copper sulfate, 9 g / l caustic soda, and 4.5 g / l formalin. The copper metal layer is formed through the liquid (18 steps) treatment, and thus has excellent conductivity. After the electroless copper sulfate plating solution 18 is treated, washing with water (step 19) is performed to prevent oxidation of the copper metal layer. Nickel sulfate 30g / l, sodium hypophosphite 22g / l, sodium citrate 45g / l at pH 8.5-9.5 solution at 40-45 ° C after electrolytic nickel plating solution (20 steps), nickel sulfate 15g / l, hypophosphite A nickel metal layer is formed by electroless nickel plating solution (21 steps) at 40-45 ° C. in a pH 8.5-9.5 solution of 10 g / l soda and 20 g / l sodium citrate. The nickel metal layer has a potential difference by electroless plating. Due to this, it is difficult to be deposited on the copper metal layer. More specifically, since the ionization tendency of nickel metal is greater than the ionization tendency of copper metal, it is difficult to form a nickel metal layer on the copper metal layer, thereby forcing the plating using electricity. By forming the nickel metal layer, it is possible to prevent the oxidation of the copper metal layer to become conductive, and then undergoes a process of washing with water (step 22) and drying (step 23).

The metal layer plated in the process (steps 16 to 21) is about 5 to 10 μm, and the thickness of the metal layer generated in the whole process (steps 1 to 21) is about 10 to 15 μm, and the surface resistance thereof is 0.005 kPa. Leads to

Figure 8 shows the electromagnetic wave shielding effect test report of the conductive fiber by copper-nickel plating of the present invention (Korea Research Institute of Standards and Science),

Figure 9 shows the electromagnetic shielding effect of the conductive fiber by the copper-nickel plating of the present invention, compared with Table 1, the electromagnetic shielding performance can be given to the excellent conductivity up to 100dB copper and nickel plating By conferring conductivity while preserving the properties of the base fiber body of the conductive fiber, it can be used as an electromagnetic wave shielding agent in various fields such as industrial, clothing, building, etc.

Table 1. Electromagnetic shielding performance of Korea Research Institute of Standards and Science (ASTM D4935-89 method)

Measure           Shielding effect 0-10 dB   none 10-30 dB   Minimum shielding effect 30 to 60 dB   Average shielding effect 60 to 90 dB   Above average shielding effect More than 90dB   Shielding effect by the best technology

As shown in Table 1, the electromagnetic shielding performance is based on the ASTM D4935-89 method of Korea Research Institute of Standards and Science, with 0 to 10 dB almost no shielding effect, and 10 to 30 dB minimum shielding effect. 30 ~ 60dB is the average shielding effect, 60 ~ 90dB is the average shielding effect, and more than 90dB is the shielding effect by the best technology.

Example 2 Conductive Fiber by Nickel-Cobalt Alloy Plating

Figure 3 is a process chart of the conductive fiber by the nickel-cobalt alloy plating of the present invention, as shown in Figure 3, in the pretreatment process (steps 1 to 15) of Figure 1, steps 1 to 9 As a method for producing a conductive fiber by nickel-cobalt alloy plating, which is prepared by adding a separate plating process after the process of

On the surface of the substrate fiber undergoing the pre-treatment process from step 1 to step 9 of FIG. 1, washing with tap water (24 steps) to remove foreign substances and chemical residues, 29.4 g / L trisodium citrate, PH 8.0-9.0 solution of 34.5 g / l sodium stannate, 33 g / l ammonium sulfate, 1 g / l L-ascorbic acid, 19.7 g / l cobalt sulfate, 7.9 g / l nickel sulfate, 21.2 g / l sodium hypophosphite The nickel-cobalt alloy metal layer was formed on the substrate fiber through the electroless nickel-cobalt alloy plating solution (25 steps) at 60-70 ° C., and then washed with tap water to remove foreign substances and chemical residues. Step) and drying (27 steps).

The conductive fiber by the nickel-cobalt alloy plating is characterized in that it has a good electromagnetic wave (see Fig. 11), especially the magnetic field blocking effect even in the low frequency region lower than 10MHz, such characteristics are nickel and cobalt group 8 of the periodic As described above as a soft magnetic metal, electromagnetic waves are divided into electric waves and magnetic waves, and electric waves can easily be blocked by grounding of a conductive metal, but magnetic fields pass through materials well and are not easily shielded. It can be shielded by an excitation device. Therefore, by forming the magnetic nickel-cobalt alloy metal layer as described above, it is possible to effectively shield magnetic fields that are difficult to shield only with conductive metal, and the addition of a copper metal layer that blocks electric waves completely blocks electromagnetic waves. It is contemplated that this may be possible (see Figure 12).

In addition, the conductive fiber by the nickel-cobalt alloy plating can be plated by electroless plating as well as electroless plating, and in addition to the nickel-cobalt alloy as a magnetic metal, Group 8 metals on the periodic table such as nickel-iron alloy and iron-cobalt alloy It is possible to apply.

Figure 10 shows the electromagnetic wave (electric field) shielding effect test report (Kansai Electronic Industry Development Center) of the conductive fiber by nickel-cobalt alloy plating of the present invention,

Figure 11 shows the electromagnetic shielding (electromagnetic field) shielding effect of the conductive fiber by the nickel-cobalt alloy plating of the present invention, compared with Table 1, the electromagnetic shielding performance is good at 70 ~ 90dB in the low frequency region lower than 10MHz It is characterized in that it has a good electromagnetic wave blocking effect at 80 ~ 100dB at a frequency of more than 10MHz, and because it can give a better conductivity, it is characterized by the base fiber body of the conductive fiber by nickel-cobalt alloy plating It preserves conductivity while preserving conductivity, so it can be used as an electromagnetic wave shield in various fields such as industrial, clothing, and construction.

Figure 12 shows the electromagnetic wave (magnetic field) shielding effect diagram of the conductive fiber by nickel-cobalt alloy plating of the present invention, the magnetic field shielding effect is by the Kansai Electronic Industry Development Center (KEC) method.

Example 3 Conductive Fiber by Tin Plating

Figure 4 is a process chart of the conductive fiber by tin plating of the present invention, as shown in Figure 4, the process from step 1 to step 9 of the pre-treatment process (steps 1 to 15) of Figure 1 As a method for producing a conductive fiber by tin plating, which is prepared by roughening a separate plating process after roughening, which will be described in detail.

On the surface of the base fiber body subjected to the pretreatment process from step 1 to step 9 of FIG. 1, washing with tap water (28 steps) to remove foreign substances and chemical residues, and 3.5 g / L copper sulfate, caustic soda 9g / l, formalin 4.5g / l pH 11.5 ~ 13.0 solution, electrolytic copper sulfate solution treatment (29 steps) at 40 ~ 45 ℃ to form copper metal layer, which is washed with tap water (30 steps) Then, a tin metal layer is formed on the base fiber body through the electroless tin plating solution (step 31) at a pH of 9.0, 60-65 ° C. of 21.5 g / L of less toxic tin to the human body. After the electroless tin plating solution (31 steps), it was washed with tap water (32 steps), and then discolored with 10 g / L solution of sodium triphosphate (33 steps), followed by drying (34 steps). Going through.

The tin has no toxicity to the human body compared to nickel, so it is safe to use for general purposes, such as medical clothing or radiation shielding clothing that is in direct contact with the human body.

Example 4 Conductive Fiber by Nickel-Tin Alloy Plating

5 is a process chart of the conductive fiber by nickel-tin alloy plating of the present invention, as shown in Figure 5, by adding a separate plating process after the pretreatment process (steps 1 to 15) of FIG. As a method for producing a conductive fiber by nickel-tin alloy plating to be produced, it will be described in detail

On the surface of the substrate fiber undergoing the pre-treatment process from step 1 to step 15 of FIG. 1, washing with tap water (35 steps) to remove foreign substances and chemical residues, and 3.5g / L copper sulfate, caustic soda The pH of 9g / l and formalin 4.5g / l is 40 ~ 45 ℃ in 11.5 ~ 13.0 solution to form a copper metal layer by treatment of copper electroless sulfate solution (36 steps) and has excellent conductivity. Step 36) 30 ~ in a solution of pH 8.5-9.5 with 19 g / l of tin chloride, 40 g / l of nickel chloride, 3 g / l of copper pyrophosphate, 215 g / l of potassium pyrophosphate, and 5 g / l of potassium thiocyanate in the treated copper metal layer The nickel-tin alloy plating layer 37 is treated at 40 ° C. to form a conductive nickel-tin alloy metal layer, followed by water washing (38 steps) and drying with tap water to remove foreign substances and chemical residues. 39 steps).

The metal layer of the conductive fiber by the nickel-tin alloy plating has a black phase and is a material for shielding electromagnetic waves of a plasma display panel (PDP) used for wall-mounted TVs, and excludes visible light interference and prevents fingerprint traces from occurring. By solving it, the resolution of the screen can be further improved.

Figure 13 shows the electromagnetic wave shielding effect test report (Korea Research Institute of Standards and Science) of the conductive fiber by nickel-tin alloy, silver plating, gold plating of the present invention, the results are shown in Figure 14 conductive by nickel-tin alloy plating Figure 15 shows the electromagnetic wave shielding effect of the fiber, Figure 15 shows the electromagnetic shielding effect of the conductive fiber by silver plating, Figure 16 shows the electromagnetic shielding effect of the conductive fiber by gold plating.

First, Figure 14 shows the electromagnetic shielding effect of the conductive fiber by the nickel-tin alloy plating of the present invention, compared with Table 1, the electromagnetic shielding performance is 60dB or more, showing a shielding effect of more than the average, good electromagnetic shielding It is characterized by having an effect.

Example 5 Conductive Fiber by Silver Plating

Figure 6 shows a process chart of the conductive fiber by the silver plating of the present invention, as shown in Figure 6, when described in more detail, after passing through the pre-treatment process (steps 1 to 15) of Figure 1 , As a method for producing a conductive fiber by silver plating, which is manufactured by adding a separate plating process after the process of steps 16 to 18 of FIG. 2, and will be described in detail.

On the surface of the base fiber body, which has undergone the pretreatment process of steps 1 to 15 of FIG. 1 and the process of steps 16 to 18 of FIG. 2, water washing with water to remove foreign substances and chemical residues (40) Step), and a silver metal layer is formed on a substrate fiber body or the like by treating an electrolessly substituted silver plating solution (step 41) at room temperature in a solution of 30 g / l potassium cyanide and 50 g / l potassium cyanide at room temperature for 10 to 15 minutes. The metal is plated on the surface of the copper metal layer by a substitution reaction with the copper metal layer which has already been plated. More specifically, silver metal has a lower ionization tendency than the copper metal and has a stronger tendency to return to its original form. After silver ions are deposited on the surface to be plated, silver metal is deposited and washed with tap water (42 steps) to remove foreign substances and chemical residues. Ha In order to form a silver metal layer on the base fiber body by discoloration prevention (step 43) treatment with a solution containing 10 g / ℓ of trisodium phosphate, and then washed with tap water to remove foreign substances and chemical residues (38). Step) and drying (39 steps).

The silver metal of the conductive fiber by the silver plating is known to have conductivity as well as antimicrobial, so that the antimicrobial function in addition to the electromagnetic wave blocking can be applied to medical clothes or machines in places requiring antimicrobial function, such as hospitals and restaurants.

Figure 15 shows the electromagnetic shielding effect of the conductive fiber by the silver plating of the present invention, compared with Table 1, the electromagnetic shielding performance has a good electromagnetic shielding effect to exhibit a shielding effect of 70 ~ 80dB level I am doing it.

Example 6 Conductive Fiber by Gold Plating

Figure 7 shows a process chart of the conductive fiber by the gold plating of the present invention, as shown in Figure 7, when described in more detail, the pretreatment process (step 1 to step 15) of Figure 1 Then, as a method for producing a conductive fiber by gold plating is prepared by adding a separate plating process after the process of step 16 to 23 of FIG.

On the surface of the substrate fiber body after the pre-treatment process of steps 1 to 15 of FIG. 1 and the process of steps 16 to 23 of FIG.

Wash water with tap water (46 steps) to remove foreign substances and chemical residues, 80-95 at pH 4.5-5.5 with 0.4 g / l of potassium cyanide, 8.6 g / l of potassium stannate and 1.5 g / l of potassium cyanide The gold metal layer is formed as the final metal layer on the substrate fiber or the like through the electroless substitution gold plating solution (step 47) at ℃ and then washed with tap water (step 38) and dried (39 steps) to remove foreign substances and chemical residues. Step).

The conductive fiber by gold plating, which forms a gold metal layer as a final metal layer on a substrate fiber or the like through the electroless substitution gold plating process (step 47), has a copper metal layer formed thereon in a preliminary process, and the copper metal layer and The gold metal layer is formed by the substitution reaction of. Here, as in the silver plating process of Example 5, the gold metal has a much lower ionization tendency than the copper metal, and the property to return to the original is stronger than that of the copper metal. Therefore, gold metal is deposited on the surface of the copper metal to be plated. The formation of a highly conductive gold metal layer provides not only the function of electromagnetic shielding but also aesthetic effect such as high-quality in expensive electronic products.

Figure 16 shows the electromagnetic shielding effect of the conductive fiber by the gold plating of the present invention, compared with Table 1, the electromagnetic shielding performance exhibits a good shielding effect of 60 ~ 70dB level, characterized in that it has a good electromagnetic shielding effect I am doing it.

A conductive fiber is a fiber which is used for the purpose of shielding electromagnetic waves by coating a conductive metal on a non-conductive fiber to allow electric current to flow, and it is known that the more conductive metal, the better the electromagnetic shielding effect.

As described above, the present invention provides a method for producing a conductive fiber, the basic process of imparting conductivity to a variety of substrate fibers such as polyester, acrylic woven fiber, polyurethane, polyolefin cushion foam, polyester film, etc. By adding a separate process to the above process to obtain even more excellent conductivity or antibacterial effect and aesthetic effect when used in expensive products, it also gives a function to meet various needs such as building exterior materials and interior materials , Construction materials, computer parts materials, mobile phone parts materials, vests, hats, aprons, maternity clothes, radiation shielding materials, etc. can be used in a variety of applications, such as effective shielding electromagnetic waves effectively protect the health of modern people.

Claims (7)

In the method of manufacturing a conductive fiber for blocking electromagnetic waves, Substrate fiber body made of polyester or acrylic woven fiber, cushion foam such as polyurethane or polyolefin, polyester film, Caustic soda 50 ~ 100g / L or surfactant 1% (v / v) for 5 min at 60 ~ 80 ℃ for 5 min. (1 step) (2 steps), washed with water (3 steps), and then After 20 to 50 minutes pickling treatment with hydrochloric acid solution (4 steps), This was washed with tap water (5 steps), precatalized with 7-12% hydrochloric acid solution (6 steps), and then mixed with 0.4 wt% of palladium chloride and tin chloride at the same ratio of room temperature. After 3N hydrochloric acid was added, the solution was deposited at 20 to 50 ° C for 10 to 30 minutes for catalytic treatment (7 steps), followed by washing with water (8 steps), and 13% sulfuric acid solution for activation of electroless plating precipitation. After activation treatment (step 9) at 50-60 ° C., washing with water again (step 10), nickel sulfate 10g / l, sodium hypophosphite 7.5g / l, to obtain uniform nickel plating on the activated surface Sodium citrate was treated with electroless nickel plating solution (11 steps) at 40-45 ° C. in a solution of pH 8.0-9.5 with 15 g / l of sodium citrate, followed by washing with water again (12 steps), 2.3 g / l of copper chloride, 9 g / of caustic 1 L, formalin 4 g / L, chelate 0.125 M, pH 11.5-13.0, electroless copper chloride solution (13 steps) at 45-48 ° C. A product, and (step 14), washed with tap water to remove this debris and then method of producing a conductive fiber for the removal of the moisture and drying (step 15), electromagnetic shielding, characterized by being a step of. According to claim 1, wherein the surface of the substrate fiber body after the pre-treatment process from step 1 to step 15, To remove foreign substances and chemical residues, wash water with tap water (16 steps), strike (STRIKE) process (17 steps), and then use 3.5 g / l copper sulfate, 9 g / l caustic soda and 4.5 g / l formalin. After electrolytic copper sulfate solution (18 steps) was treated at 40 ~ 45 ℃ in pH 11.5 ~ 13.0 solution, it was washed with tap water (19 steps), nickel sulfate 30g / ℓ, sodium hypophosphite 22g / ℓ, Electrolytic nickel plating solution (20 steps) was treated at 40 ~ 43 ℃ in 45g / l pH 8.5 ~ 9.5 solution of sodium citrate, followed by 15g / l of nickel sulfate, 10g / l of sodium hypophosphite and 20g / l of sodium citrate. After the electroless nickel plating solution (21 steps) is treated at 40 ~ 45 ℃ in the pH 8.5 ~ 9.5 solution, it is washed with tap water (22 steps) to remove chemicals and foreign substances from residual oil. Removing and drying (23 steps) to form a conductive fiber by copper and nickel plating for electromagnetic shielding The method of conducting fibers. According to claim 1, wherein the surface of the substrate fiber body subjected to the pre-treatment process from step 1 to step 9, To remove foreign substances and chemical residues, wash with tap water (24 steps), trisodium citrate 29.4g / l, disodium stannate 34.5g / l, ammonium sulfate 33g / l, L-ascorbic acid 1g / l After treatment with nickel-cobalt alloy plating solution (25 steps) at 60-70 ° C. in a solution of pH 8.0-9.0 with 19.7 g / l cobalt sulfate, 7.9 g / l nickel sulfate and 21.2 g / l sodium hypophosphite, In order to remove the chemicals and foreign substances, it is washed with tap water (26 steps), and then dried and dried (step 27) to form a conductive fiber by nickel-cobalt alloy plating. Method for producing a conductive fiber for shielding electromagnetic waves. According to claim 1, wherein the surface of the substrate fiber body subjected to the pre-treatment process from step 1 to step 9, Wash water with tap water (28 steps) to remove foreign substances and chemical residues, and radio-free at 40 ~ 45 ℃ in pH 11.5 ~ 13.0 solution of copper sulfate 3.5g / ℓ, caustic soda 9g / ℓ, formalin 4.5g / ℓ Treated copper sulfate solution (29 steps), washed with tap water (30 steps), and then electroless tin plating solution (31 steps) at 60 ~ 65 ° C in a pH 9.0 solution of 21.5 g / l tin. After the treatment, it was washed again with tap water (32 steps), and subjected to discoloration prevention treatment (step 33) with a solution of 10 g / l trisodium phosphate at room temperature, followed by drying (34 steps). Method for producing a conductive fiber for electromagnetic shielding, characterized in that to form a conductive fiber by plating. According to claim 1, wherein the surface of the substrate fiber body after the pre-treatment process from step 1 to step 15, In order to remove foreign substances and chemical residues, the water was washed with water (35 stages), and radio-free at 40-45 ℃ in pH 11.5-13.0 solution of 3.5g / l copper sulfate, 9g / l caustic soda and 4.5g / l formalin. After the copper copper sulfate solution (36 steps) was treated, the pH of the tin was 19 g / l, nickel chloride 40 g / l, copper pyrophosphate 3 g / l, potassium pyrophosphate 215 g / l and potassium thiocyanate 5 g / l. After treatment with nickel-tin alloy plating solution (37 steps) at 30 to 40 ℃ in 9.5 solution, it is washed with tap water (38 steps) to remove chemicals and foreign substances from residual oil, and then dried and dried. (39) the method for producing a conductive fiber for electromagnetic shielding, characterized in that to form a conductive fiber by nickel-tin alloy plating by the process. According to claim 2, On the surface of the substrate fiber body subjected to the pre-treatment process from step 1 to 18, To remove foreign substances and chemical residues, wash with tap water (40 steps), and process electrolessly substituted silver plating solution (41 steps) with a solution of room temperature of 30 g / l silver cyanide and 50 g / l potassium cyanide for 10 to 15 minutes. After washing, it was washed with tap water (step 42), and then discolored with a solution of room temperature of 10 g / l trisodium phosphate (step 43) to prevent discoloration of silver, the final metal layer, and then In order to remove chemicals and foreign substances, it is washed with tap water (44 steps), and then the water is removed and dried (45 steps) to form conductive fibers by silver plating. Method for producing conductive fibers.  According to claim 2, On the surface of the substrate fiber body subjected to the pre-treatment step from step 1 to step 23, To remove foreign substances and chemical residues, wash water with tap water (step 46), and use 80 ~ 80 in a solution of pH 4.5 ~ 5.5 with 0.4g / l potassium potassium cyanide, 8.6g / l potassium potassium citrate, 1.5g / l potassium cyanide Process of electroless substitution gold plating solution (47 steps) at 95 ℃, washing with tap water (48 steps) to remove chemicals and foreign substances in residual oil, and then removing water and drying (49 steps) Method for producing a conductive fiber for electromagnetic shielding, characterized in that to form a conductive fiber by gold plating by.

Images