KR100222338B1 - Manufacturing method of an electric conduction fiber - Google Patents
Manufacturing method of an electric conduction fiber Download PDFInfo
- Publication number
- KR100222338B1 KR100222338B1 KR1019950047260A KR19950047260A KR100222338B1 KR 100222338 B1 KR100222338 B1 KR 100222338B1 KR 1019950047260 A KR1019950047260 A KR 1019950047260A KR 19950047260 A KR19950047260 A KR 19950047260A KR 100222338 B1 KR100222338 B1 KR 100222338B1
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- South Korea
- Prior art keywords
- minutes
- water
- caustic soda
- solution
- washing
- Prior art date
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- 239000000835 fiber Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 14
- 235000011121 sodium hydroxide Nutrition 0.000 claims abstract description 14
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000243 solution Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000005406 washing Methods 0.000 claims abstract description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 239000002657 fibrous material Substances 0.000 claims abstract description 6
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000011259 mixed solution Substances 0.000 claims abstract description 5
- 229920002972 Acrylic fiber Polymers 0.000 claims abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims abstract description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 4
- 229920000728 polyester Polymers 0.000 claims abstract description 4
- 150000003839 salts Chemical class 0.000 claims abstract description 4
- 239000001488 sodium phosphate Substances 0.000 claims abstract description 4
- 229910000162 sodium phosphate Inorganic materials 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims abstract description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims abstract description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 3
- 238000007598 dipping method Methods 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910001960 metal nitrate Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- QPFYXYFORQJZEC-FOCLMDBBSA-N Phenazopyridine Chemical compound NC1=NC(N)=CC=C1\N=N\C1=CC=CC=C1 QPFYXYFORQJZEC-FOCLMDBBSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940070891 pyridium Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 208000011580 syndromic disease Diseases 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/32—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond
- D06M11/36—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond with oxides, hydroxides or mixed oxides; with salts derived from anions with an amphoteric element-oxygen bond
- D06M11/38—Oxides or hydroxides of elements of Groups 1 or 11 of the Periodic Table
- D06M11/42—Oxides or hydroxides of copper, silver or gold
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
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- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Textile Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
본 발명은 전도성섬유의 제조방법에 관한 것으로서, 전도성섬유의 제조 방법에 있어서, 폴리에스터 또는 아크릴계 섬유소재로 직조한 기재섬유체를 가성소다 2 -3 g/1 와 비이온계의 계면활성체를 이용하여 30 - 40 도 섭씨에서 5분 정도 처리(10), 다시, 60 -70섭씨의 온탕에서 충분히 수세(11), 염산 50m/1 와 질산 10 m/1를 혼합한 액제에서 실온으로 약 30분간 에칭처리(12), 처리된 기재섬유체는 수세하여 염화피라듐 2g/1와 염화주석 2g/1의 혼용액에서 같은 비율의 염산을 첨가한 용액에 20 -50도 섭씨에서 약 10분간 침적(13), 수세 후 주석을 제거한 다음, 잔류한 주석은 가성소다 50g/1 용액에서 실온에서 침적시켜 제거(14), 황산동 20g/1, 가성소다 40g/1, 롯셀염 160g/1 37의 포르말린을 혼용한 용액에서 40 - 50 도 섭씨로 유지하면서 10 - 15분간 침적(16), 수세후 황산니켈20g/1, 구연산 15g/1, 치아인산소다 30g/1의 용액에 30 - 40 도 섭씨의 온도에서 10분 정도(니켈금속이약 0.2정도형성) 침적(18);하는 공정을 가지는 것을 특징으로 하는 전도성 섬유의 제조방법에 관한 것이다.The present invention relates to a method for producing a conductive fiber, in the method for producing a conductive fiber, a base fiber body woven from a polyester or acrylic fiber material using a caustic soda 2-3 g / 1 and a nonionic surfactant Treatment (10) for 5 minutes at 30-40 degrees Celsius, and then washed with water (11) sufficiently in a hot water bath of 60 -70 degrees Celsius, about 30 to room temperature in a liquid mixture of hydrochloric acid 50m / 1 and nitric acid 10m / 1 The etching treatment for 12 minutes and the treated substrate fibers were washed with water and immersed for about 10 minutes at 20 -50 degrees Celsius in a solution containing the same ratio of hydrochloric acid in a mixed solution of 2g / 1 of pyramid chloride and 2g / 1 of tin chloride. (13) After removing the tin after washing with water, the remaining tin was removed by dipping at room temperature in a caustic soda 50g / 1 solution (14), copper sulfate 20g / 1, caustic soda 40g / 1, lotel salt 160g / 1 37 Immersed in a mixture of formalin at 40-50 degrees Celsius for 10-15 minutes, 16-20 hours after washing, nickel sulfate 20g / 1, citric acid 15g / 1, sodium phosphate 30g / 1 30-40 degrees 10 minutes at temperature Celsius (nickel metal about 0.2 Precision forming) 18 and to a method for producing a conductive fiber, characterized in that it has a process to.
Description
제1도는 본 발명의 전도성섬유의 제조방법의 공정도.1 is a process chart of the manufacturing method of the conductive fiber of the present invention.
제2도는 본 발명의 전도성섬유의 제조방법의 다른 실시예.2 is another embodiment of a method for producing a conductive fiber of the present invention.
본 발명은 전도성섬유의 제조방법에 관한 것으로서, 더욱 상세히는 전자기파 등을 흡수, 차폐할 수 있는 기능을 섬유체에 부여하게 하는 제조방법에 관한 것이다.The present invention relates to a method for producing a conductive fiber, and more particularly, to a manufacturing method for imparting a function to absorb and shield electromagnetic waves and the like to the fiber body.
각종의 전자 기기 등에서 발생되는 전자기파의 입자와 파동을 유도, 차폐하기 위한 것으로서는 도전성의 판체로서 막는 등, 정전차폐(Electro-Shield)하는 방법이 가장 효과적이다.Electromagnetic shielding is most effective for inducing and shielding particles and waves of electromagnetic waves generated by various electronic devices, such as conductive plates.
그러나, 인간이 접촉하는 기계, 단말기, 전자 의료기 등과 같이 인간-기계의 인터페이스를 가지는 제품에서는 이러한 차폐판을 사용하는 방식이 현실적으로 불가능하다는 문제점이 있어, 작업자가 전자기파에 직접 노출됨으로서 각종 증후군을 유발하는 문제점을 가지고 있다.However, in a product having a human-machine interface such as a machine, a terminal, or an electronic medical device, which is in contact with humans, there is a problem in that the method of using such a shielding plate is practically impossible, which causes various syndromes due to direct exposure to electromagnetic waves. I have a problem.
따라서 인간-기계 인터페이스의 가장 유용한 접근방법은 섬유체를 이용하여 의복, 에이프런, 안경 등을 제조하는 방법이 안출될 수 있으나, 종래에는 섬유를 직조하는 과정에서 직경이 극히 가는 극세선의 동선을 같이 직조하는 등의 방법으로 이를 적용하였으나, 이러한 구성의 섬유체는 강도가 있고 인체에 접촉시에 불쾌감을 유발하며 유연하지 못하여 현실적으로 특정한 경우가 아니면 사용을 기피하는 경향이 있다.Therefore, the most useful approach of the human-machine interface may be a method of manufacturing clothes, aprons, glasses, etc. by using a fiber body, but in the conventional weaving process of weaving fibers together with ultra-fine copper wires However, the present invention has been applied in such a way as, but the fiber of such a configuration has strength, causes discomfort when in contact with the human body, is inflexible, and tends to avoid use unless it is practical in a specific case.
[발명이 이루고자하는 기술적 과제][Technical problem to be achieved]
상기와 같은 문제점을 감안하여 본 발명의 전도성섬유의 제조방법은 통상적인 섬유체와 그 유연성 및 적응성을 동일하게 하는 제조방법을 제공하는 것을 목적으로 한다.In view of the above problems, a method for producing a conductive fiber of the present invention is to provide a method for producing the same flexibility and adaptability as the conventional fiber body.
[발명의 기술구성 및 작용][Technology Composition and Action of the Invention]
상기한 본 발명의 목적으로 달성하기 위하여, 본 발명은 폴리에스터 또는 아크릴계 섬유소재로 직조한 기재 섬유체를 가성소다 2-3 g/와 비이온계의 계면활성제를 이용하여 30-40도 섭씨에서 5분 정도처리, 다시, 60-70도 섭씨의 온탕에서 충분히 수세, 염산 50m/와 질산 10m/를 혼합한 액제에서 실온으로 약 30분간 에칭처리, 처리된 기제섬유체는 수세하여 염화피라미듐 2g/와 염화주석 2g/의 혼용액에서 같은 비율의 염산(Hcl)을 첨가한 용액에 20-50도 섭씨에서 약 10분간 침적, 수세 후 주석을 제거한 다음, 잔류한 주석은 가성소다 50g/용액에서 실온에서 침적시켜 제거, 황산 등 20g/, 가성소다 40g/, 롯셀염 160g/37의 포르말린을 혼용한 용액에서 40-50도 섭씨로 유지하면서 10-15분간 침적, 수세 후 황산니켈 20g/, 구연산 15g/, 치아인산소다 30g/의 용액에서 30-40도 섭씨의 온도에서 10분 정도(니켈금속이 약 0.2정도형성)침적하는 제조공정을 가진다.In order to achieve the above object of the present invention, the present invention is caustic soda 2-3 g / base fiber body woven from polyester or acrylic fiber material Using a nonionic surfactant for 5 minutes at 30-40 degrees Celsius, and then rinsed sufficiently in hot water at 60-70 degrees Celsius, 50m / And nitric acid 10m / Etched and treated base fiber body at room temperature for about 30 minutes in a liquid solution mixed with water and washed with 2 g / of pyramidium chloride. Tin chloride with 2g / In a mixture of hydrochloric acid (Hcl) added to the same mixture at 20-50 degrees Celsius for about 10 minutes, the tin was removed after washing, and the remaining tin was caustic soda 50g / Removed by dipping at room temperature in solution, sulfuric acid, etc. 20 g / Caustic Soda 40g / , Lotel salt 160g / 37 In a mixture of formalin at 40-50 degrees Celsius, while immersed for 10-15 minutes, washed with nickel sulfate 20g / , Citric acid 15g / Sodium phosphate 30g / 10 minutes at a temperature of 30-40 degrees Celsius in a solution of Degree of formation)
상기 본 발명에 의한 전도성섬유의 제조방법은 섬유체 자체의 특성을 변화시키지 않고 전도성을 부여함으로서 다양한 용도로서 사용될 수 있게 하는 유용성을 가지며, 그러한 적용의 대표적인 것은, 반도체조립작업실에서의 정전차폐용 의복, 에이프런, 메쉬체의 모니터 작업자의 안경, 벽지로서 도포하여 정전 차폐시키는 것 각종 E.M.I 공정용의 개스킷 등에 사용되는 것을 생각할 수 있고 그 용도는 무궁무진한 것으로 생각된다. 이하의 부수된 도면과 함께 본 발명의 전도성섬유의 제조방법을 더욱 상세하게 설명한다.The manufacturing method of the conductive fiber according to the present invention has the usefulness that can be used for a variety of uses by imparting conductivity without changing the properties of the fiber itself, typical of such applications, electrostatic shielding clothing in a semiconductor assembly workshop And electrostatic shielding by applying as aprons, eyeglasses or wallpaper of a monitor operator of a mesh body. It is conceivable to be used in gaskets for various EMI processes and the like. With reference to the accompanying drawings will be described in more detail the manufacturing method of the conductive fiber of the present invention.
제1도는 본 발명의 전도성섬유의 제조방법의 공정도, 제2도는 본 발명의 전도성섬유의 제조방법의 다른 실시예를 도시하였다.1 is a process chart of the manufacturing method of the conductive fiber of the present invention, Figure 2 shows another embodiment of the manufacturing method of the conductive fiber of the present invention.
[실시예 1]Example 1
본 발명의 전도성섬유의 제조방법에서는, 폴리에스터 또는 아크릴계 섬유 소재로 직조한 기재섬유체를 가성소다 2-3g/와 비이온계의 계면 활성체를 이용하여 30-40도 섭씨에서 5분 정도 처리(10)하여, 기재섬유체의 불순물을 제거하고 순화시킨다.In the method for producing a conductive fiber of the present invention, the base fiber body woven from polyester or acrylic fiber material is caustic soda 2-3g / The nonionic surfactant is treated with 10 minutes at 30-40 degrees Celsius for about 5 minutes to remove impurities from the substrate fiber body and to purify it.
다시, 60-70도 섭씨의 온탕에서 충분히 수세(11)한 다음, 염산 50m/를 혼합한 액제에서 실온으로 약 30분간 에칭처리(12)를 실시한다.Again, wash thoroughly (11) in a hot water of 60-70 degrees Celsius, and then hydrochloric acid 50m / The etching treatment 12 is performed at room temperature for about 30 minutes in the mixed solution.
처리된 기제 섬유체는 수세하여 염화피라듐 2g/와 염화주석 g/의 혼용액에다 같은 비율의 염산을 첨가한 용액에 20-50 도 섭씨에서 약 10분간 침적(13)한다.The treated base fibers are washed with water and 2 g / of pyridium chloride. And tin chloride g / The solution was added (13) for 20 minutes at 20-50 degrees Celsius.
이후 수세 후 주석을 제거한 다음, 잔류한 주석은 가성소다 50g/용액에서 실온에서 침적시켜 제거(14)하면 촉매인 파라듐만 핵을 형성(15)한다.After washing off the tin, the remaining tin is caustic soda 50g / The solution is deposited and removed at room temperature (14) to form nuclei (15), only the catalyst, paradium.
상기에 황산동 20g/, 가성소다 40g/, 롯셀염 160g/37의 포르말린을 혼용한 용액에서 40-50도 섭씨로 유지하면서 10-15분간 침적(16)하면 동 금속이 1정도 형성되고 순도가 높은 등의 코팅(17)이 이루어진다.Copper sulfate 20 g / above Caustic Soda 40g / , Lotel salt 160g / 37 In a mixture of formalin at 40-50 degrees Celsius while immersing (16) for 10-15 minutes (16) The coating 17 is formed to a degree and is of high purity.
순동을 공기 중에 노출하면 급격히 산화되므로 수세 후 황산니켈 20g/, 구연산 15g/, 치아인산소다 30g/의 용액에서 30-40도 섭씨의 온도에서 10분 정도(니켈금속이 약 0.2정도형성)침적(18)하면 얇은 피막이 동 위에 석출된다(19).When copper copper is exposed to air, it oxidizes rapidly. After washing with water, nickel sulfate 20g / , Citric acid 15g / Sodium phosphate 30g / 10 minutes at a temperature of 30-40 degrees Celsius in a solution of When deposited (18), a thin film is deposited on the copper (19).
다시 수세 후 열품건조(20)하여 얻어진 제품의 전기 저항치는 0.5~1Ωm이하이며 금속피막의 두께는 0.8~1.2정도 형성되어 기재 섬유체상에 미세한 피막층을 얻을 수 있게 되고 전기 전도성을 가지는 섬유를 얻게 되는 것이다.After washing with water again, the electric resistance of the product obtained by hot-drying (20) is 0.5 ~ 1Ωm or less and the thickness of metal film is 0.8 ~ 1.2 It is formed to such an extent that a fine coating layer can be obtained on the base fiber body and a fiber having electrical conductivity is obtained.
이후 필요에 따라서 은 및 금 코팅을 전해 혹은 무전해로 실시하여 피막층을 더욱 보강하고 전도성을 증대할 수 있다.Then, if necessary, silver and gold coatings may be electrolytically or electrolessly applied to further reinforce the coating layer and increase conductivity.
[실시예 2]Example 2
나일론 섬유소재를 직조한 기재 섬유체를 가성소다 2~3g/와 비이온계 계면활성제를 이용하여 처리(30)하여 기재 섬유체의 불순물을 제거하고 순화시킨다.Caustic soda 2 ~ 3g / in the base fiber body woven of nylon fiber material And (30) using a nonionic surfactant to remove impurities and purify the substrate fiber.
다시 60~70의 온탕에서 충분히 수세한(31)다음, 염산 20m/를 혼합한 액제에서 40~50에서 약 20~30분간 에칭처리(32)를 실시한다.60-70 again 20 ml / of hydrochloric acid, followed by sufficiently washed with hot water (31) 40-50 in mixed solution The etching treatment 32 is performed at about 20-30 minutes.
다시 수세하여 염산 100m/의 용액에서 실용에서 5분 정도 침적하여 2차 에칭(33)을 실시하고, 이후 공정은 실시예1과 동일하다.Again washed with hydrochloric acid 100m / The secondary etching 33 was performed by submerging about 5 minutes in practical use in the solution of, and the process after that is the same as that of Example 1.
[발명의 효과][Effects of the Invention]
상기와 같이 제조하여 얻어지는 본 발명의 전도성 섬유의 제조방법은 통상적인 섬유상에 극소피막의 전도층을 형성하고 이러한 전도층은 비전도체인 섬유체상의 핵을 중심으로 피막을 형성하게 함으로서 통상적인 섬유체의 특성을 상실하지 않고도 전도성을 부여함으로서 다양한 용도로서 사용하게 하는 유용한 발명인 것이다.The method for producing a conductive fiber of the present invention obtained by manufacturing as described above forms a conductive layer of a microcoat on a conventional fiber, and the conductive layer forms a coating around a nucleus on a non-conductive fiber body. It is a useful invention to be used for various purposes by giving conductivity without losing the properties of.
Claims (2)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950047260A KR100222338B1 (en) | 1995-12-04 | 1995-12-04 | Manufacturing method of an electric conduction fiber |
| PCT/KR1996/000233 WO1997020973A1 (en) | 1995-12-04 | 1996-12-04 | Method for producing electro-conductive fibers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950047260A KR100222338B1 (en) | 1995-12-04 | 1995-12-04 | Manufacturing method of an electric conduction fiber |
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| KR970043551A KR970043551A (en) | 1997-07-26 |
| KR100222338B1 true KR100222338B1 (en) | 1999-10-01 |
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| KR1019950047260A KR100222338B1 (en) | 1995-12-04 | 1995-12-04 | Manufacturing method of an electric conduction fiber |
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| KR (1) | KR100222338B1 (en) |
| WO (1) | WO1997020973A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990073268A (en) * | 1999-06-29 | 1999-10-05 | 박남일 | The method preparing for textiles of conductivity |
| WO2007089053A1 (en) * | 2006-02-03 | 2007-08-09 | Keuk-Jun Kim | Treatment method of inorganic antibacterial agent for textile |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010026385A (en) * | 1999-09-06 | 2001-04-06 | 홍영석 | Conducting fibers to screen electromagnetic wave and method to make them |
| KR100307710B1 (en) * | 1999-09-06 | 2001-09-24 | 김상렬 | Method of pigmentation in manufacturing conducting fibers |
| WO2002002861A1 (en) * | 2000-07-03 | 2002-01-10 | Expan Elec., Co., Ltd | Gold layer-laminated fabric and method for fabricating the same |
| CN106835086B (en) * | 2016-12-12 | 2019-06-21 | 东莞市佳乾新材料科技有限公司 | A kind of plating nickel on surface method of artificial diamond |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132705A (en) * | 1988-11-11 | 1990-05-22 | Fukuoka Cloth Kogyo Kk | Conductive water-stopping tape for cable |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61194272A (en) * | 1985-02-18 | 1986-08-28 | 旭化成株式会社 | Production of metal plated fiber |
| JPS62162075A (en) * | 1986-01-13 | 1987-07-17 | 三菱レイヨン株式会社 | Production of conductive polyester fiber |
| JPH05186967A (en) * | 1992-01-07 | 1993-07-27 | Mitsubishi Paper Mills Ltd | Fiber, knit or woven fabric and nonwoven fabric having electric conductivity and their production |
-
1995
- 1995-12-04 KR KR1019950047260A patent/KR100222338B1/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132705A (en) * | 1988-11-11 | 1990-05-22 | Fukuoka Cloth Kogyo Kk | Conductive water-stopping tape for cable |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990073268A (en) * | 1999-06-29 | 1999-10-05 | 박남일 | The method preparing for textiles of conductivity |
| WO2007089053A1 (en) * | 2006-02-03 | 2007-08-09 | Keuk-Jun Kim | Treatment method of inorganic antibacterial agent for textile |
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| WO1997020973A1 (en) | 1997-06-12 |
| KR970043551A (en) | 1997-07-26 |
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