KR100653811B1 - Molding material transfer method and substrate structure - Google Patents

Abstract

An object of the present invention is to reduce the structural defects due to the introduction of bubbles at the time of forming the projection pattern when manufacturing the substrate having a projection pattern, it is possible to improve the reliability and product yield of the product, such as vacuum defoaming off-line It is to provide a new highly reliable substrate manufacturing technology that can improve the production efficiency and simplify the process by eliminating the need for the process.

The paste-shaped molding material is filled in the recesses of the filling recess plate, and the transfer recessed plate in which the predetermined groove pattern is formed is partially contacted with the filling recessed plate to fill the groove of the transfer recessed plate with the molding material, The molding material is transferred from the concave plate onto the substrate as a projection pattern.

Protruding patterns, filling recesses, PDPs, rollers, ribs

Description

Molding material transfer method, substrate structure {MOLDING MATERIAL TRANSFER METHOD AND SUBSTRATE STRUCTURE}

1 is a schematic exploded view of an example of a PDP.

2 is a schematic cross-sectional view of one example of a PDP.

Fig. 3 is a flowchart showing a procedure of forming an address electrode, a dielectric layer, a rib, and a phosphor layer on a back substrate.

4 is a schematic view showing an example of a pattern in the present invention.

5 is a schematic view showing another example of a pattern in the present invention.

Fig. 6 is a schematic diagram showing another example of a pattern in the present invention.

Fig. 7 is a schematic diagram showing a state in which a stripe-like pattern of a recess of a filling recess plate and a stripe pattern of a groove of a transfer recess plate are stacked.

Fig. 8 is another schematic diagram showing a state in which a stripe-like pattern of a recess of the filling recess plate and a stripe pattern of a groove of the transfer recess plate are stacked.

Fig. 9 is another schematic diagram showing a state in which a stripe-like pattern of a recess of a filling recess plate and a stripe pattern of a groove of a transfer recess plate are stacked.

Fig. 10 is another schematic diagram showing a state in which a stripe-like pattern of a recess of a filling recess plate and a stripe pattern of a groove of a transfer recess plate are stacked.

Fig. 11 is another schematic diagram showing a state in which a stripe-like pattern of a recess of a filling recess plate and a stripe pattern of a groove of a transfer recess plate are stacked.

Fig. 12 is a schematic plan view showing a recess of the filling recess plate.

Figure 13 is a cross sectional view of Figure 12;

Fig. 14 is a schematic plan view showing a groove of the transfer recessed plate.

Figure 15 is a cross sectional view of Figure 14;

Fig. 16 is a schematic cross sectional view showing the shape where the recesses of the filling recess plate and the grooves of the transfer recess plate are joined together;

Fig. 17 is a schematic diagram showing a state in which a molding material is printed on a recess of a filling recess plate.

Fig. 18 is a schematic diagram showing how the molding material flows when the molding material is filled in the grooves of the transfer recess plate.

Fig. 19 is a schematic diagram showing the shape in which the transfer recessed plate is cylindrical and attached to the plate body, and the filling recessed plate is placed on a flat table.

Fig. 20 is a schematic diagram showing a state in which a transfer concave plate is bent into a cylindrical surface and attached to a plate body.

Fig. 21 is a schematic diagram showing a state in which a molding material is transferred from a transfer concave plate to a substrate.

Fig. 22 is a flowchart for filling and transferring a molding material according to the present invention.

Fig. 23A is a schematic diagram showing how to fill a concave plate for filling a molding material.

Fig. 23B is a schematic diagram showing a state in which a transfer recess plate is provided opposite a filling recess plate;

Fig. 23C is a schematic diagram showing how the molding material is transferred from the recess of the filling recess plate to the groove of the transfer recess plate.

Fig. 23D is a schematic diagram showing a state in which a substrate is provided to face a transfer concave plate;

Fig. 23E is a schematic diagram showing how to transfer a molding material from a transfer recess to a substrate.

Fig. 24 is a schematic diagram showing an example in which the filling concave plate 191 is itself cylindrical.

Fig. 25 is a schematic diagram showing how to apply the transfer concave plate with an application roll;

Figure 26 is a schematic cross sectional view showing a projection pattern connected by the same face portion formed on the substrate.

Figure 27 is a schematic cross sectional view showing a projection pattern without the same face portion formed on the substrate.

<Explanation of symbols for main parts of the drawings>

1: PDP

2: front substrate

3: back substrate

4: display electrode

5, 8: dielectric layer

6: protective layer

7: address electrode

9: rib

10: phosphor layer

11: discharge space

41: projection pattern

42: parts of land other than projections

71: stripe-shaped pattern of the recessed portion of the filling recessed plate

72: Stripe-shaped pattern of the groove of the transfer recess plate

111: recess

141: groove of the transfer plate

171: molding materials

191: concave plate for charging

192, 195: plate body

193: transfer plate

194: table

196: part in which the filling recess plate partially contacts the transfer recess plate

198: substrate

201: UV irradiator

231: Roller

241: Blade

251: Application Roll

261: same face part

TECHNICAL FIELD This invention relates to the technique of forming a projection pattern, such as a rib in a board | substrate with a rib (bump) used for a plasma display panel (PDP), for example on a board | substrate.

As an example in which a substrate having a projection pattern is required, a description will be given using a PDP. A PDP is a self-luminous display panel in which a pair of substrates (usually glass substrates) are disposed to face each other at minute intervals and are sealed around each other to form a discharge space therein.

Generally, ribs (projections) having a height of about 150 to 250 μm are periodically provided on a substrate so as to partition the discharge space. For example, in the surface discharge type PDP suitable for color display by phosphors, ribs having a pattern that looks like a stripe shape when the PDP is directly viewed are provided on the substrate at equal intervals along the address electrode lines. This rib prevents interference of discharge and crosstalk of color.

The manufacturing method of the PDP board | substrate which has the above-mentioned structure is a process which forms an address electrode pattern on a board | substrate, and forms a rib so that it may match (align) to the electrode pattern. Various methods have been proposed and implemented as a method of forming the ribs, but typical examples thereof include a lamination printing method, a sand blast method, a landfill method, a photolithography method, a transfer method, and the like. Judiciary is expected.

The transfer method is a method of forming a rib on a substrate using a transfer concave plate in which a groove for forming a rib is opened, or a method of simultaneously forming a rib and a dielectric layer. In order, the rib and the dielectric layer are formed by filling a molding material on the transfer concave plate surface and then transferring the cured product of the filled molding material to the substrate (see Patent Documents 1 to 3, for example).

[Patent Document 1]

Japanese Patent No. 3331129 (claims)

[Patent Document 2]

Japanese Patent Laid-Open No. 8-273537 (claims)

[Patent Document 3]

Japanese Patent Laid-Open No. 2001-191345 (claims)

[Non-Patent Document 1]

TJ Chan et al., `` Society For Information Display, '' 03, USA, Society for Information Display, 2003, p.1011

As a failure in filling a transfer material with a molding material, bubbles may be mixed in a groove for filling the molding material on the transfer plate. As a result, there is a problem in that the molding material is not filled in the grooves of the portion, resulting in defects in the ribs after transfer. This is an obstacle that occurs because bubbles are simultaneously wound up when the molding material is filled into the grooves.

When the groove pattern of the transfer recess is straight, for example, when the molding material is elongated in the filling direction during skidding, or when the direction in which the bubbles are released is determined uniquely, the end of the transfer recess is sequentially. Filling the molding material to extrude the bubbles in turn decreases the probability of bubbles remaining, but when the grooves intersect, such as a lattice pattern, the filled bubbles lose their relief position at the intersection and remain as bubble defects as they are. There are many. A method of extruding bubbles by repeating skids several times is also considered but inefficient. In addition, when the transfer recess plate is made of a material that is easily deformed, such as a silicone resin, there is a fear that the transfer recess plate itself may be defective during skidding.

Conventionally, in such a case, after filling a molding material in the transfer concave plate, the bubble was removed by using together the vacuum degassing method which removes a bubble by depressurizing surroundings. This method is very inefficient.

As a method which does not use the vacuum defoaming method together, the method of filling the recessed plate for transcription | transfer into a transcription | transfer recess plate without winding a bubble using the capillary phenomenon of a molding material is reported (refer nonpatent literature 1). This method uses the phenomenon that the molding material is wetted to the wall surface of the groove of the transfer recess plate, but at that time, it is thought that the supply amount of the molding material to the transfer recess plate needs to be made very small. It is not developed. In this method, the molding material is filled by sandwiching the molding material between the substrate and the transfer recess plate. Therefore, when the dielectric layer and the rib in the PDP are simultaneously formed, it is very important to accurately control the thickness of the dielectric layer. It is difficult.

An object of the present invention is to solve the above problems and to provide a new highly reliable technique for producing a substrate having a projection pattern. Still other objects and advantages of the present invention will become apparent from the following description.

According to one aspect of the present invention, a paste-shaped molding material is satisfied in a recess of a filling recess plate, and a transfer recess plate having a predetermined groove pattern is partially contacted with the filling recess plate to form a groove in the transfer recess plate. A molding material transfer method and a substrate manufacturing method comprising filling a molding material and transferring the molding material from the recessed plate for transfer onto the substrate as a projection pattern.

Comprising multi-hardening the molding material in the transfer recess plate by heat, ultraviolet light, or a combination of heat and ultraviolet light, and after filling the molding material in the groove of the transfer recess plate, attaching it to a part other than the groove as necessary. Removing one of the molding materials, and subsequently applying a molding material having a predetermined thickness to the surface of the transfer recess plate, the filling recess plate being flat or cylindrical, and the transfer recess plate being cylindrical or bendable, the filling recess plate A relationship in which the pattern of the recessed portion of the recessed portion and the recessed pattern of the transfer recessed plate correspond to the position, and the length of the recessed portion of the filling recessed plate in the groove width direction of the transfer recessed plate is larger than the groove width of the transfer recessed plate, or The depth of the groove of the used recessed plate is greater than the depth of the recessed portion of the filling recessed plate, or of the filling recessed plate in the groove width direction of the transfer recessed plate. The length of the recess is larger than the groove width of the transfer recess plate, the depth of the groove of the transfer recess plate is larger than the depth of the recess portion of the filling recess plate, the pattern of the recess portion of the filling recess plate is a dot, the recess of the transfer recess plate The pattern is a stripe-shaped pattern, the groove pattern of the transfer recessed plate is a stripe-shaped pattern having ups and downs, the pattern of the recessed portion of the transfer recessed plate is a lattice pattern, and the projection pattern has the same surface portion It is preferable that it is connected, the height of a projection exists in the range of 150-250 micrometers, the width of a projection exists in the range of 50-120 micrometers, and the thickness of the same surface part exists in the range of 10-30 micrometers.

According to another form of this invention, the board | substrate manufactured by the said manufacturing method, and the thin display panel and thin display apparatus which used this board | substrate as a board | substrate which has a rib are provided.

According to the above aspect of the present invention, it is possible to provide a new highly reliable technique for producing a substrate having a projection pattern. It is possible to greatly reduce structural defects due to the inclusion of bubbles at the time of forming the projection pattern, thereby improving product reliability and product yield. Off-line processes such as vacuum degassing are unnecessary, which can improve production efficiency and simplify the process.

According to still another aspect of the present invention, there is provided at least one plate main body, a filling recess plate, a transfer recess plate, a transfer recess plate contact mechanism for partially contacting the filling recess plate and the transfer recess plate, a molding material hardened portion, A molding material transfer device having a film thickness adjusting mechanism of the molding material on the surface of the transfer recess plate and, if necessary, at least one plate body, a filling recess plate, a transfer recess plate, a substrate, a filling recess plate and a transfer recess plate Transfer recess contact mechanism for partially contacting the substrate, a substrate contact mechanism for contacting the transfer recess plate and the substrate, a molding material hardened portion, and a film thickness adjustment mechanism of the molding material on the transfer recess plate surface, if necessary. One substrate manufacturing apparatus is provided.

According to the above aspect of the present invention, a preferred apparatus for realizing the aforementioned molding material transfer method and substrate manufacturing method is provided.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described using drawing, an Example, etc. In addition, description of these drawings, an Example, etc. is illustrative of this invention, and does not limit the scope of the present invention. It goes without saying that other embodiments may fall within the scope of the present invention as long as they are in accordance with the spirit of the present invention. Like reference numerals in the drawings denote like elements.

Fig. 1 shows an exploded view of an example of a conventional PDP and Fig. 2 shows a cross sectional view thereof. 1 and 2, the person sees the panel from the direction following the arrow. The PDP 1 has a structure in which the front substrate 2 and the rear substrate 3 face each other. In this example, the display electrode 4, the dielectric layer 5, and the protective layer 6 for protecting the dielectric layer 5 are in turn on the inner side (the side facing the rear substrate 3) of the front substrate 2. The address electrode 7 and the dielectric layer 8 are laminated in order on the inner side of the back substrate 3 (the side facing the front substrate 2), and the ribs 9 and the phosphor layer 10) There is. As shown in FIG. 2, the dielectric layer 8 may not be provided in the case of applying a voltage between two display electrodes to cause a discharge.

Ultraviolet light emitting gases such as neon gas and xenon gas are enclosed in the discharge space 11 surrounded by the dielectric layer 5, the ribs 9, and the phosphor layer 10. The PDP 1 applies a voltage between two display electrodes to generate a discharge, excites an ultraviolet light emitting gas into a plasma state, and utilizes ultraviolet rays generated when the plasma state is returned from the plasma state to the original state. Display of visible light is realized by emitting a fluorescent material. PDPs are often provided with color filters, electromagnetic shielding sheets, antireflection films, and the like. By providing an interface with a power supply unit and a tuner unit in the PDP, a thin panel display device such as a large television device (plasma television) can be obtained.

Soda-lime glass, high distortion glass, etc. are used for the board | substrate of a PDP. Any metal may be used for the address electrode as long as it is a conductive metal. In current PDPs, silver, copper and aluminum are used as metals having low resistance and hardly reacting with the dielectric layer. A glass plate, low melting glass, etc. are used for a dielectric layer. The rib 9 is formed of low melting glass.

The order of forming the address electrode 7, the dielectric layer 8, the ribs 9, and the phosphor layer 10 inside the back substrate 3 is performed as follows, for example. First, referring to Fig. 3, the same metal layer is formed on the back substrate 3 as in step S31, and then unnecessary portions are removed as in step S32 to form an address electrode 7 having a predetermined pattern. Subsequently, the dielectric layer 8 is formed as in step S33. Then, the same layer of low melting glass is formed like step S34. Thereafter, the low melting glass is cut to form ribs as in step S35, and the phosphor is applied as in step S36.

INDUSTRIAL APPLICABILITY The present invention can be suitably applied to forming ribs as projections on a substrate used in a thin display panel and a thin display device represented by such a PDP. However, it is not limited to these fields, It can use suitably when forming a projection pattern on a board | substrate also in another field. In particular, it is preferable to have high reliability in the case of a projection pattern having a narrow width and a large height. Specifically, the height is in the range of 150 to 250 m, and the width is preferably in the range of 50 to 120 m. The protrusion spacing is not very important, but a range of 150 to 350 mu m is preferred. These dimensions are when formed on a substrate. The projection may be any three-dimensional shape as long as it does not contravene the purpose of the present invention. In the case of a PDP substrate, one having a rectangular parallelepiped shape as shown in Fig. 1 is preferable. In order to facilitate the transfer to the substrate, it may have a slight removal angle.

In addition, in this invention, a "substrate" is not limited to the board | substrate of electronic devices, such as a PDP, and any board may be sufficient as it is a flat plate type. As a material of a board | substrate, you may use any thing, unless it contradicts the meaning of this invention.

In addition, in this invention, "pattern" in a projection pattern, a groove pattern, a recessed part pattern, etc. is a case where the target surface (for example, a substrate surface, a recessed plate surface for a transfer, a recessed plate surface for a charge) is directly faced. It is a shape that can be recognized as including a specific repeating shape. In the case of the groove pattern of the transfer concave plate or the projection pattern on the substrate, the stripe shape as shown in Fig. 4 is repeated when the object surface is directly viewed, and the relief as shown in Fig. 5 is repeated. The case of including the repetition of the stripe shape having and the repetition of the lattice shape as shown in FIG. 6 can be illustrated. 4 to 6, reference numeral 41 denotes a projection pattern, and reference numeral 42 denotes a portion of the ground (object surface) other than the projection.

In addition, although the height of a stripe and a grid | lattice may be the same, several different height may be included. In the case of the pattern of the recessed part of the filling recessed plate, a pattern with less regularity may be sufficient as said example. It may include a repetition of circular, elliptical, triangular, polygonal or polygonal and irregularly shaped recesses. In order to ensure the filling of the molding material to the transfer recess plate, as shown in Fig. 10, it is also a preferable aspect that the pattern of the recess portion of the filling recess plate is a dot shape. In addition, in the case of a recess of the filling concave plate, it may be useful when no pattern exists.

EMBODIMENT OF THE INVENTION Hereinafter, the molding material transfer method of this invention and the manufacturing method of the board | substrate which have a protrusion pattern are demonstrated.

According to the technique of the present invention, instead of filling the molding material directly on the surface of the transfer recess plate, the transfer recess plate is first filled with a paste-shaped molding material in the recess portion of the filling recess plate, and then a predetermined groove pattern is formed. The molding material is directly filled on the surface of the transfer recess plate by partially contacting the filling recess plate and filling the molding material in the groove of the transfer recess plate. Subsequently, the molding material is transferred as a projection pattern from the transfer recess to the substrate. By these operations, the molding material can be transferred to produce a substrate having a projection pattern.

In this way, the paste-shaped molding material is printed to the concave portion of the filling concave plate by skimming or the like until bubbles disappear, and then the capillary phenomenon is caused by partially contacting the transfer concave plate for transferring to the filling concave plate. The molding material can be sufficiently filled in the grooves of the transfer concave plate by using. It is also conceivable that a capillary phenomenon occurred when the molding material shifted from the filling concave plate to the transfer concave plate by partially contacting the transfer concave plate with the filling concave plate.

As the filling concave plate, a glass mold produced by etching glass can be used, in addition to a metal mold processed by metal processing, laser processing, etching, or the like. The material is preferably of high hardness in order to prevent abrasion when printing of the molding material on the filling concave plate with the metal blade or the ceramic blade. The use of abrasion resistance such as glass or metal that is not easily deformed also eliminates the risk of abrasion and deformation due to skizing or the like, so that it is easy to print the paste-shaped molding material until bubbles are eliminated. Further, as will be described later, since the recesses of the filling recesses can be made shallower or wider than the grooves of the transfer recesses, it is also easy to print the paste-shaped molding material until the bubbles disappear.

On the other hand, it is preferable that the transfer recessed plate be made of a material having excellent soft releasability so as not to destroy the shape of the molding material during transfer. Silicone rubber can be illustrated.

The supply amount of the molding material to the transfer recess groove is determined by the space of the minute recess formed on the filling recess plate. Therefore, it is possible to supply a very small amount, and to prevent the filling of bubbles generated due to excessive supply of the molding material before the groove wall surface of the transfer concave plate is completely wetted when filling the grooves of the transfer concave plate by the capillary phenomenon. Can be. For this reason, the capillary phenomenon can be used reproducibly, and it becomes possible to omit the vacuum defoaming process of the transfer concave plate. In this way, it is possible to prevent the transfer material from adhering to other than the groove of the filling recess or the groove of the transfer recess.

In addition, the part once filled without bubbles in the grooves of the transfer concave plate becomes very wet, and even if additionally filled molding material thereafter, bubbles rarely enter the grooves. Therefore, it is the first filling, and even if the filling amount is insufficient, additional filling can be easily performed by using the filling concave plate filling the molding material. You may actively charge several times. When the filling amount is too large, the molding material attached to the portions other than the grooves may be removed as necessary.

It is also possible to apply a molding material having a predetermined thickness to the transfer concave plate surface by using a roll coating method, a slit coating method, or the like, and in this way, a projection pattern connected by the same surface portion can be obtained. If the projections are used as ribs and the same surface portion is considered to be a dielectric layer, it is equivalent to simultaneously forming ribs and dielectric layers in the case of a PDP substrate. This method is preferable because the thickness of the same surface portion can be arbitrarily adjusted. In addition, in order to easily control the thickness of the same surface portion, after filling the molding material into the groove of the transfer recess plate, the molding material attached to the portion other than the groove is removed as necessary, and then the molding material is applied. It is also preferable. In the case of a PDP board | substrate etc., it is preferable that the thickness of the same surface part formed on the board | substrate exists in the range which is 10-30 micrometers.

FIG. 26 is a schematic cross sectional view showing the projection pattern 41 connected by the same surface portion 261 formed on the substrate. 27 is a schematic cross sectional view showing the projection pattern 41 without the same face portion formed on the substrate.

The molding material according to the present invention can be arbitrarily selected from known materials in accordance with the actual requirements for the projections formed on the substrate. It is preferable that a raw material paste contains low melting glass powder, a binder, etc. from the objective of providing a rib on a PDP board | substrate. Moreover, heat resistant oxide etc. can also be added as a filler. Since the viscosity of a raw material paste is easy to handle, 50-100 P (poise) is preferable at room temperature. The binder includes an organic resin or a solvent or both. Acrylic resin can be illustrated as organic resin. The organic resin is preferably cured by an active energy ray such as heat or ultraviolet ray or a combination of heat and active energy ray. You may make reaction initiator coexist. If the molding material is cured after being filled in the grooves of the transfer recess plate, the molding material is easily peeled from the grooves of the transfer recess plate at the time of transfer on the substrate (so-called mold release) and the shape integrity is improved. It is possible to prevent the problem of the material being broken and being left in the grooves of some transfer recesses (so-called fall). In addition, when the curing proceeds excessively and the adhesion and adhesion of the molding material to the substrate may be lowered and the transfer probability may be lowered, it is preferable to take measures to make the curing not sufficient but a sufficient curing or semi-curing state. Do. After the molding material is transferred onto the substrate, sufficient curing may be performed. Examples of the solvent include terpineol, BCA (butyl carbitol acetate), and the like. In this case, there is also a method of improving the shape integrity by evaporating the solvent by heating the molding material in the transfer recess plate. Moreover, you may carry out in combination with hardening of a molding material.

The partial contact of the transfer recess plate to the filling recess plate can be achieved by the fact that the filling recess plate is flat or cylindrical and the transfer recess plate is cylindrical or bendable. That is, when the filling recessed plate is flat and the transfer recessed plate is cylindrical, partial contact can be realized by bringing the filling recessed plate into contact with the transfer recessed plate. When the filling concave plate is flat and the transfer concave plate can be bent, partial contact can be realized by bringing the filling concave plate and the transfer concave plate into close proximity and then bending all or part of the transfer concave plate. When the filling concave plate is cylindrical and the transfer concave plate is cylindrical, partial contact can be realized by bringing the filling concave plate into contact with the transfer concave plate. In addition, when the filling concave plate is cylindrical and the transfer concave plate can be bent, partial contact can be realized by contacting the filling concave plate and the bending transfer concave plate.

Partial contact is sufficient if movement of the molding material from the filling concave plate to the transfer concave plate occurs, and it is usually unnecessary to apply more pressure than necessary between the filling concave plate and the transfer concave plate.

Since the substrate according to the present invention is planar, it is usually necessary to partially transfer the transfer recess plate to the substrate and to apply a certain pressure between the transfer recess plate and the substrate in order to transfer the molding material from the transfer recess plate to the substrate. . For this purpose, the transfer concave plate is preferably cylindrical or bendable. The amount of pressure to be applied can be arbitrarily determined in consideration of the actual state of the transfer.

In order to smoothly move the molding material from the filling concave plate to the transfer concave plate, it is preferable that the pattern of the concave portion of the filling concave plate and the groove pattern of the transfer concave plate include a position corresponding to each other. The relation that the pattern of the recess of the filling recess plate and the groove pattern of the transfer recess plate includes a positional correspondence means that when the filling recess and the transfer recess plate are sandwiched, the groove pattern of the transfer recess plate is recessed of the filling recess plate. Substantially overlapping in a negative pattern or vice versa. More specifically, it is preferable that 90% or more of the groove pattern of the transfer recess plate is superimposed on the pattern of the recess portion of the filling recess plate or vice versa.

Fig. 7 shows a state in which the stripe pattern 71 of the concave portion of the filling concave plate and the stripe pattern 72 of the groove of the transfer concave plate are stacked. The overlapping centers do not have to coincide with each other as shown in the drawing, and may be shifted as shown in FIG. As shown in Fig. 9, the plurality of grooves of the transfer recess plate may correspond to one stripe of the recesses of the filling recess plate. As such, even if only a part of the pattern is overlapped, it is within the scope of the present invention. When the pattern of the concave portion of the filling concave plate includes a repetition of a concave portion of a circular, elliptical, triangular, polygonal or more rectangular shape and irregular shape, for example, a dot pattern, a set of these shapes is referred to as a stripe pattern. If it is assumed, the case where these sets of shapes show a state of being overlapped with the groove pattern of the transfer recess plate as a stripe-shaped pattern is also within the scope of the present invention. Fig. 10 shows a state where the dot-shaped concave portion of the filling concave plate overlaps with the stripe-shaped pattern of the groove of the transfer concave plate as a stripe pattern.

In addition, it is preferable that the overlap occurs on the entire surface of the filling concave plate or the transfer concave plate, but it is as described above that a portion not overlapped may be included. Therefore, as a result of circular, elliptical, triangular, polygonal or more irregular shapes and irregular shapes on the front surface of the filling recess plate, the pattern of the recess portion of the filling recess plate and the non-overlapping recess portion are included. The case where the number of stripes of the concave portion is much larger than the number of grooves of the transfer concave plate, and the pattern of the concave portion of the filling concave plate and the concave portion not overlapped is also included in the scope of the present invention.

In addition, when it is predicted that the relative position of a transfer recessed plate and a filling recessed plate is difficult, the gravure plate which is irrelevant to the pattern of the transfer recessed plate may be used as a pattern of a filling recessed plate. A gravure plate is a plate used for gravure printing, and is a metal plate in which rectangular or circular recesses of 50 to several hundred micrometers are arranged. In addition, an opening such as a square of 50 to several hundred micrometers or the like on the surface of a surface plate or a roll and a screen mesh having a thickness of about 50 to several hundred micrometers may be used as the filling concave plate instead.

As the three-dimensional shape of the concave portion of the filling concave plate, the length of the concave portion of the filling concave plate in the groove width direction of the transfer concave plate is preferably larger than the groove width of the transfer concave plate. By doing in this way, the recessed part of a filling recess plate will be easy to contact with the groove | channel of the said transfer recessed plate, and the filling of the molding material by capillary phenomenon will become smooth. In addition, the length of the recessed part of the filling recessed plate in the groove width direction of a transfer recessed plate means the thing of length L of FIG. In the case of a plurality of sets of shapes, it is determined for each recess 111 as shown in FIG.

Moreover, it is preferable that the depth of the groove of the recess for transfer is larger than the depth of the recess of the filler recess. This is because the filling of the molding material by the capillary phenomenon becomes smooth. It is more preferable to satisfy both of these conditions. In addition, although these conditions do not need to be established with respect to the front surface of a filling concave plate and a transfer concave plate, generally, the more parts which hold | maintain, the more preferable.

According to the molding material transfer method and the substrate manufacturing method as described above, it is possible to provide a new highly reliable technology for manufacturing a substrate having a projection pattern, such as a substrate for PDP. The molding material can be reliably filled in the grooves of the transfer concave plate, and it is possible to greatly reduce structural defects due to the inclusion of bubbles at the time of forming the projection pattern. Therefore, the reliability and product yield of a product can be improved. In addition, an off-line process such as vacuum degassing is unnecessary, and the production efficiency can be improved and the process can be simplified. It is preferable to apply such a board | substrate to a gas discharge panel and a gas discharge panel display apparatus which use the board | substrate which has a rib especially.

Moreover, as an apparatus for realizing the above technique, a transfer concave contact mechanism for partially contacting a plate main body, a filling concave plate, a transfer concave plate, a filling concave plate and a transfer concave plate, and a molding material hardened portion And a molding material transfer device and a plate main body, a filling recess plate, a transfer recess plate, a substrate, a filling recess plate and a transfer recess plate, if necessary, including a film thickness adjusting mechanism of the molding material on the transfer recess plate surface. A transfer recess plate contact mechanism for partially contacting, a substrate contact mechanism for contacting the transfer recess plate and the substrate, a molding material hardened portion, and, if necessary, a film thickness adjusting mechanism of the molding material on the transfer recess plate surface. The substrate manufacturing apparatus can be illustrated preferably. The use of such an apparatus satisfies the paste-shaped molding material in the recessed portion of the filling recess plate, and the transfer recessed plate having the predetermined groove pattern is partially contacted with the filling recessed plate to form the molding material in the groove of the transfer recessed plate. Can be easily charged. In addition, by contacting the transfer recess plate with the substrate, the molding material can be easily transferred from the transfer recess plate onto the substrate as a projection pattern.

The plate body may be shared when the molding material is filled from the filling recess plate to the transfer recess plate and when the molding material is transferred from the transfer recess plate onto the substrate as a projection pattern, or a separate plate body may be used. . The transfer recess may be provided on the plate body, but may not be used as described later.

The molding material hardening part is a part having a function of curing the molding material, and any known device such as a hot air blower and an ultraviolet irradiation device may be used as long as it causes curing of the molding material.

The film thickness adjustment mechanism of the molding material is a mechanism for obtaining a projection pattern connected by the same surface portion, and any known device may be used as long as the molding material having a predetermined thickness can be applied to the transfer concave plate surface.

The transfer concave plate contact mechanism for partially contacting the filling concave plate and the transfer concave plate may be any as long as it is the meaning described above and partially contacts the filling concave plate and the transfer concave plate. When both the filling concave plate and the transfer concave plate are provided on the plate main body, or when the filling concave plate is provided on the plate main body and the transfer concave plate is installed on the table, any one or both of the plate bodies or the plate body A mechanism for moving either or both of the table and the table is sufficient. What is necessary is just a mechanism which can deform | transform a part of transfer recessed plate, when the transfer recessed plate can be partially deformed.

The substrate contact mechanism for contacting the transfer recess plate and the substrate may be any of the above-described meanings as long as the transfer recess plate and the substrate are partially contacted. In the case where the transfer recessed plate is provided on the plate main body, a mechanism for moving one or both of the plate main body and the table on which the substrate is provided is sufficient. In the case where the transfer recessed plate may be partially deformed, a mechanism capable of deforming a part of the transfer recessed plate may be used. In addition, the meaning of other elements is as having already demonstrated.

(Example)

Next, the Example of this invention is described in detail. In addition, in the following embodiment, as a recess pattern of a filling recess plate and a groove pattern formed in the transfer recess plate, it is a thing of lattice form and the rectangle (namely trapezoid shape) whose cross section has a removal angle is employ | adopted. In this case, since the concave portion of the filling concave plate is called a groove similarly to the case of the transfer concave plate, there is no problem, so in the embodiment, the concave portion of the filling concave plate may also be referred to as "groove".

[First Embodiment]

In this example, the principle of the present invention will be explained using Figs. Fig. 12 is a schematic plan view showing the recess 111 of the filling concave plate, Fig. 13 is a schematic cross sectional view thereof, Fig. 14 is a schematic plan view showing a groove 141 of the transfer concave plate, Fig. 15 is a schematic cross sectional view thereof, Fig. 16 is a schematic cross-sectional view showing the shape in which the recess 111 of the filling recess plate and the groove 141 of the transfer recess plate are joined together. 12 to 16, all of the groove patterns formed in the filling concave plate and the transfer concave plate are lattice-shaped, and when the filling concave plate and the transfer concave plate are stacked, both shapes are overlapped with each other. The dimension of FIG. 12 and the dimension of FIG. 14 have a 1: 1 relationship, and as can be judged from the comparison between FIGS. 12 and 14, the groove width of the filling recess plate is larger than the groove width of the transfer recess plate. In addition, the dimension of FIG. 13 and the dimension of FIG. 15 have a 1: 1 relationship, and as can be judged from FIG. 16, the groove width of the transfer recess plate is larger than the depth of the groove of the filling recess plate. This reason is as above-mentioned.

When describing the molding material transfer method, first, a paste-shaped molding material is filled in the grooves of the filling concave plate. Specifically, a paste-shaped molding material is printed on a filling recessed plate with a metal blade or the like. You may print in multiple times as needed. Fig. 17 is a schematic diagram showing how the molding material 171 is printed in the grooves of the filling concave plate.

Subsequently, the transfer recessed plate in which the predetermined groove pattern is formed is partially brought into contact with the filling recessed plate slowly. As a result, a capillary phenomenon occurs, and a molding material flows as shown by the arrow in FIG. The capillary phenomenon proceeds to wet the walls of the grooves of the transfer concave plate one by one, thereby preventing the intake of bubbles. As the capillary phenomenon progresses, the gas existing at 141 in FIG. 18 moves to the side where the molding material in the front or the inner side of the figure is not filled, and does not remain as a bubble in that state.

Second Embodiment

In this example, a molding material transfer device, a substrate manufacturing device, and a method of using the same when the filling concave plate is cylindrical and the transfer concave plate can be bent into a cylindrical surface will be described.

Fig. 19 shows a state in which a molding material is filled from a filling concave plate 191 placed in a planar table 194 on a transfer concave plate 193 attached to a plate main body 192 in a cylindrical shape. The groove of the filling concave plate 191 is filled with a molding material in advance. As the plate body 192 rotates in the direction of the arrow, the transfer concave plate 193 and the filling concave plate 191 partially contact each other, and the transfer concave plate (1) is moved from the groove of the filling concave plate 191 by a capillary phenomenon. The molding material shifts to the groove of 193, and the groove of the transfer concave plate 193 is filled with the molding material. Reference numeral 196 denotes a portion where the filling concave plate 191 partially contacts the transfer concave plate 193. A transfer recess plate contact mechanism for partially contacting the filling recess plate 191 and the transfer recess plate 193 is not shown. Further, in practice, the contact portion 196 of the filling concave plate 191 and the transfer concave plate 193 is very small, and when viewed from the direction of Fig. 19, it is preferable that the contact portion is a line contact close to a point.

20 shows a state in which the transfer concave plate 193 is attached to the plate body 195 and the molding material is cured by ultraviolet irradiation from the ultraviolet irradiator 201. The ultraviolet irradiator 201 corresponds to the molding material hardening part which concerns on this invention. As main equipment, such as the plate main body 195 in this process, you may use the equipment similar to FIG. Transfer of the molding material to the substrate 198 is not performed.

Fig. 21 shows a state in which the molding material is transferred from the transfer recessed plate 193 to the substrate 198. Figs. A substrate contact mechanism for contacting the transfer recessed plate 193 and the substrate 198 is not shown.

Third Embodiment

In this example, a molding material transfer device, a substrate manufacturing device, and a method of using the same when the filling concave plate is flat and the transfer concave plate can be bent will be described.

First, according to step S221 of FIG. 22, as shown in FIG. 23A, the filling concave plate 191 is filled with a molding material by skidging.

Subsequently, in accordance with step S222 of FIG. 22, as shown in FIG. 23B, the transfer concave plate 193 is provided opposite the filling concave plate 191.

Subsequently, in accordance with step S223 in FIG. 22, the filling concave plate 191 and the transfer concave plate 193 are partially contacted by bending the transfer concave plate 193 by the roller 231 as shown in FIG. 23C. The molding material is transferred from the groove of the filling concave plate 191 to the groove of the transfer concave plate 193 by a capillary phenomenon, and the groove of the transfer concave plate 193 is filled with the molding material. The roller 231 corresponds to the transfer concave plate contact mechanism.

Subsequently, in accordance with step S224 of FIG. 22, as shown in FIG. 23D, a substrate 198 is provided in place of the filling concave plate 191 of FIG. 23B, and in accordance with step S225 of FIG. As described above, the transfer concave plate 193 and the substrate 198 are partially brought into contact with each other by bending the transfer concave plate 193 by the roller 231, and the substrate 198 is transferred from the transfer concave plate 193 by applying a slight pressure. The molding material is transferred onto the phase. The roller 231 in this case corresponds to the substrate contact mechanism. A hot air blowing or ultraviolet irradiation step may be inserted between step S223 and step S225 of FIG.

[Example 4]

This example relates to a molding material transfer device, a substrate manufacturing apparatus, and a method of using the same when the filling concave plate is cylindrical and the transfer concave plate is bendable into a cylindrical surface. Fig. 24 shows a case where the filling concave plate 191 itself is cylindrical and the transfer concave plate 193 is bent into a cylindrical shape and attached to the plate body. The filling concave plate 191 is provided with a blade 241 for scraping excess molding material. As the filling concave plate, a gravure roll, which is distributed in large quantities industrially, may be used. This combination can be used to move and fill the molding material from the filling concave plate to the transfer concave plate. For example, it can be used instead of the molding material filling process of the second and third embodiments.

[Example 5]

This example relates to a molding material transfer device, a substrate manufacturing device, and a method of using the same in the case of applying a molding material having a predetermined thickness to the surface of the transfer recess plate after filling the molding material to the transfer recess plate using a capillary phenomenon. Fig. 25 shows how the molding material having a predetermined thickness is applied onto the transfer recess plate by the roll coating method by bringing the molding material on the application roll 251 into contact with the transfer recess plate 193. Figs. The application roll 251 corresponds to the film thickness adjustment mechanism of the above-mentioned molding material. Instead of the roll coating method, it is also possible to use a slit coating method or the like in which material is discharged from the slit. In these methods, it is generally easy to adjust the thickness of the molding material.

Moreover, the invention shown in the following appendix can be derived from the content disclosed above.

(Book 1)

A paste-shaped molding material is filled into the recesses of the filling recesses having recesses on the flat surface;

A transfer recessed plate in which grooves of a predetermined pattern are formed is partially brought into contact with the surface of the filling recessed plate, and the molding material in the recessed portion of the filling recessed plate is formed by the capillary phenomenon in this contact state. Fill it in, fill it,

A molding material transfer method, wherein a molding material in a groove of the transfer recessed plate is transferred as a projection onto a substrate to be transferred.

(Supplementary Note 2)

The molding material transfer according to Appendix 1, wherein a transfer material having a desired thickness is applied to the surface of the transfer recess plate after filling the filling material in the recess of the filling recess plate into the groove of the transfer recess plate. Way.

(Supplementary Note 3)

The molding material transfer method according to Supplementary Note 1 or Supplementary Note 2, wherein the filling recessed plate includes a positional relationship in which the pattern of the recessed portion and the groove of the transfer recessed plate correspond to each other.

(Appendix 4)

The depth of the recess of the filling recess plate is shallower than the depth of the groove of the transfer recess plate,

The opening area of the recessed part of the said filling recessed plate is larger than the opening area of the groove | channel of the said transfer recessed plate, The molding material transfer method as described in Supplementary notes 1-3 characterized by the above-mentioned.

(Appendix 5)

Transfer of the molding material according to any one of Supplementary Notes 1 to 4, wherein the concave portion of the filling concave plate is formed in a plurality of dots, and includes a relationship in which the plurality of dots and the pattern of the grooves of the transfer concave plate are positioned correspondingly. Way.

(Supplementary Note 6)

The molding material transfer method according to any one of Supplementary Notes 1 to 5, wherein the filling recessed plate is flat or cylindrical, and the transfer recessed plate is cylindrical or bendable.

(Appendix 7)

A plasma display panel substrate structure, wherein the projection is a rib for partitioning a discharge space, wherein the projection is manufactured by a manufacturing method including the transfer method according to supplementary notes 1 to 6.

(Appendix 8)

With one or more board bodies,

Filling recess plate,

A transfer recess plate provided on the plate body;

A transfer recess plate contact mechanism for partially contacting the filling recess plate and the transfer recess plate;

Molding material curing unit,

The molding material transfer device provided with the film thickness adjustment mechanism of the molding material on the said recessed plate surface as needed.

 According to the present invention, it is possible to provide a new highly reliable technique for producing a substrate having a projection pattern. In addition, the use of the present application has the effect that the transfer material can be transferred without the attachment of the transfer material other than the groove of the filling recess or the recess of the transfer recess.

Claims (5)

A paste-shaped molding material is filled into the recesses of the filling recesses having recesses on the flat surface; The transfer recessed plate in which the groove of a predetermined pattern is formed is brought into contact with the recessed portion of the filling recessed plate and the groove of the transfer recessed plate so as to overlap the surface of the filling recessed plate, and the filling recessed plate is formed by a capillary phenomenon in this contact state. The molding material in the recess of the inflow into the groove of the transfer recess plate, A molding material transfer method, wherein a molding material in a groove of the transfer recessed plate is transferred as a projection onto a substrate to be transferred. 2. The molding according to claim 1, wherein after the molding material in the recess of the filling recess is filled into the groove of the transfer recess, the transfer material having a desired thickness is applied to the surface of the transfer recess. Material transfer method. The molding material transfer method according to claim 1 or 2, wherein the pattern of the recessed portion of the filling recess plate and the pattern of the groove of the transfer recess plate include a position corresponding to each other. The depth of the recessed part of the said filling recessed plate is shallower than the depth of the groove | channel of the said recessed recessed plate, The opening area of the recessed part of the said filling recessed plate is larger than the opening area of the groove | channel of the said transfer recessed plate, The molding material transfer method characterized by the above-mentioned. The molding material according to claim 1 or 2, wherein the concave portion of the filling concave plate is formed of a plurality of dots, and includes a relationship in which the plurality of dots and the pattern of the grooves of the transfer concave plate correspond to positions. Transcription method.

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