JPH0916101A - Original form used for manufacture, etc. of electronic boardand manufacture of electronic board - Google Patents

Abstract

PURPOSE: To increase the projecting heights, etc., of a solidifying liquid, etc., and to adhere the liquid, etc., to substrate bodies, etc. CONSTITUTION: Ink, the solidifying liquid, etc., are packed into packing grooves B formed by relative movement to the first positions P1 of both plate bodies 1, 2 of an original plate A and are adhered to the surfaces of paper, substrate bodies, etc. Next, both plate bodies 1, 2 are relatively moved to the second positions P2 where the original plate A is parted from the paper, the ink, etc., and the ink, etc., are allowed to solidify. The packing grooves B are formed by the relative movement of the plate bodies 1, 2 and, therefore, the projecting heights of the ink, etc., are made sufficiently high by increasing the depth of the packing grooves B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an original plate suitable for manufacturing an electronic substrate and the like and a method for manufacturing an electronic substrate using the original plate.

[0002]

2. Description of the Related Art Insulating substrates (electronic substrates) have been used in recent years.
For example, a flat panel display (here, LC
It is used as a general term for D, EL, PDP, VF and the like. ) And C
In an image display device such as an RT (Cathode-ray tube), it plays a particularly important role as a factor that influences its performance. The above PDP (plasma panel display) uses an insulating substrate for the light emitting portion, and has the advantages of power consumption efficiency, ease of miniaturization, and no image flicker, jitter, or distortion, and is commercialized. Has been the subject of research towards.

As shown in FIG. 8, a general structure of this PDP is such that a plurality of wire-like positive electrodes 22 are arranged on a rear substrate 21 at regular intervals in parallel with each other, and the positive electrodes 22 are arranged in a direction intersecting with the respective positive electrodes 22. Plate-shaped negative electrodes 23 parallel to each other at regular intervals
It is a multiple arrangement. The rear substrate 21 is a so-called rear glass, and a plurality of electrode grooves 24 having a depth of about 100 to 200 μm for accommodating the positive electrode 22 on the upper surface (upper side in the drawing) are parallel to each other with a width of about 50 μm at regular intervals. Has been formed.

[0004]

By the way, in the PDP, a high-quality image can be obtained by installing the positive electrode 22 and the negative electrode 23 at a high density while maintaining the insulation between the adjacent positive electrodes 22. Since it can be formed, especially the positive electrode 2
In order to improve the installation density of No. 2, the processing technique of the back substrate 21 for forming the electrode grooves 24 with high density is required.

However, the formation of the electrode grooves 24 has generally been conventionally performed by subjecting the surface of the back substrate 21 to processing such as shot blasting or polishing, and it has been difficult to improve the formation density of the electrode grooves 24. . That is, the processing efficiency of glass by the above-mentioned processing method has been conventionally low due to processing defects such as fragility of glass.
Therefore, if the number of the electrode grooves 24 formed on the rear substrate 21 is increased, there is a concern that the manufacturing efficiency of the rear substrate 21 may be significantly reduced and the manufacturing cost may be increased. Therefore, there has been a demand for the development of a method of manufacturing an electronic substrate that is low in cost and has improved manufacturing efficiency.

In view of the above problems, it has been studied to form a partition wall for partitioning the positive electrodes 22 on the surface of the rear substrate 21 by using a printing technique. However, when the partition wall is solidified, the back surface of the ink becomes a partition wall. It was difficult to secure the thickness dimension of the substrate 21 at the time of printing, and the shielding between the positive electrodes 22 was insufficient, so that the above problems could not be solved.

Further, the back substrate 21 is etched by etching.
Although a technique of forming a partition by forming a groove in the groove has been studied, the height of the partition that can be formed is usually about 30 μm at present, and the above problem cannot be solved. This is the same in the application examples other than the PDP of the electronic substrate requiring the formation of the partition wall, and it is difficult to secure the protruding size of the partition wall.

The first object of the present invention is to easily increase the depth of the filling groove for filling the solidifying liquid or the like, and to fill the filling groove with the solidifying liquid or the like to form a high partition wall or the like. It is to provide an original plate capable of forming.

A second object of the present invention is to provide an electronic substrate manufacturing method capable of efficiently manufacturing an electronic substrate having an excellent insulating property between adjacent positive electrodes.

[0010]

In order to achieve the above first object, an original plate used for manufacturing an electronic substrate according to the present invention includes one or more first plate bodies and two or more second plate bodies. Body, first
A first position for forming a filling groove for filling the solidifying filler with the end surface of the plate body and the inner surface of the end portions of the two second plate bodies sandwiching the first plate body; and the end surface of the first plate body The second plate is configured such that the second positions where the end faces of the second plate are substantially coincident with each other are alternately and relatively movable.

An air vent groove may be formed in one or both of the first plate member and the second plate member so as to communicate with the filling groove. In this case, the air vent groove is formed by the first plate member and the second plate member.
It is preferable that the plate body is formed along the relative movement direction of the plate body. The second plate body can be configured to be movable with respect to the first plate body by a movable shaft inserted through the through holes.

In order to achieve the above-mentioned second object, the method of manufacturing an electronic substrate according to the present invention comprises a first step of inserting a solidifying filler into a filling groove of an original plate, and an end face of the second plate body of the original plate. The second step of bringing the solidifying filler in the filling groove into close contact with the substrate body to attach the solidifying filler to the substrate body, the third step of separating the solidifying filler attached to the substrate body and the original plate from the substrate body, and the solidifying property A fourth step of solidifying the filling body attached to the substrate body was adopted.

In the third step, it is preferable to move the second plate member relatively to the second position and then separate the original plate from the solidifying filler. Particles of the same material as the substrate body may be dispersed in the base material of the solidifying filler. Also,
In the fourth step, the particles in the solidifying filler are baked and solidified integrally with the substrate body, or the solidifying filler is irradiated with far infrared rays to solidify the solidifying filler, or the solidifying filling is performed. The body can be irradiated with ultraviolet rays to cure the ultraviolet curable substance contained in the solidifying filler to solidify the solidifying filler.

In another method for manufacturing an electronic substrate according to the present invention, a filling groove of an original plate is filled with a wax or a removable mold material having the same effect as that of the original groove to produce a target electronic substrate mold. After filling the mold groove formed by the second plate body of the mold with the solidifying filler to make the solidifying filler similar to the intended electronic substrate, the solidifying filler is solidified and The die was removed to produce an electronic substrate. Also in this case, the solidifying filler can be solidified by firing particles, far infrared rays, ultraviolet rays, or the like.

[0015]

In the original plate used for manufacturing the electronic substrate, etc., the filling groove is formed by the relative movement of the first plate member and the second plate member to the first position. can do. Further, since the solidifying filling body in the filling groove is pushed out by the relative movement of both plate bodies to the second position, the solidifying filling body is properly ejected from the filling groove no matter how deep the filling groove is. It will be.

When the air vent groove is formed in the plate member, the air in the filling groove is discharged to the outside through the air vent groove when the filling groove is filled with the solidifying filler. When the air vent groove is formed along the relative movement direction of both plate members, the air vent groove has a guiding function. When the second plate body is configured to move with respect to the first plate body by the movable shaft, when the second plate body is separated from the substrate body or the like to which the solidifying filler in the filling groove is attached, the substrate body Etc. can be separated while being fixed together with the first plate body.

Further, in the method for manufacturing an electronic substrate, the above-mentioned original plate is used, and the filling groove of the original plate is filled with the solidifying filling material and attached to the substrate body, so that the projecting height of the solidifying filling material is sufficient. Can be higher. In the third step, after moving the second plate member relatively to the second position and then separating the original plate from the solidifying filling body, the solidifying filling body leaves a part of it in the filling groove or has a shape. Maintains a predetermined adhesion state without breaking.

When particles of the same material as the substrate main body are dispersed in the base material of the solidifying filler, when the solidifying filler is solidified to form partition walls, various properties of the partition walls and the substrate body will be obtained. It will be almost the same. Moreover, the solidifying filler can be solidified by firing the dispersed particles, and in such a case, the partition wall formed of the solidifying filler can be surely integrated with the substrate body.

When the solidifying filler is solidified with far infrared rays,
The surface layer and the inside of the solidifying filler are uniformly and quickly solidified. When the solidifying filler is solidified by curing the ultraviolet curable substance, the heat input to the solidifying filler and the substrate body is small,
No distortion or deformation due to heat input or cooling will occur.

In another method of manufacturing an electronic substrate, a mold such as a wax is made from an original plate and the mold is used to manufacture an electronic substrate with a solidifying filler. In this case, the substrate body and the partition wall can be made of the same material and can be completely integrated. The solidifying filler is solidified by firing, far infrared rays, ultraviolet rays, or the like.

[0021]

1 to 3 show an embodiment of an original plate according to the present invention. The original plate A is used for manufacturing an electronic substrate or the like, and mainly includes a large number of plate bodies 1 and 2. Each plate 1,
2 has through holes 1a and 2a, notches 1b and 2b, and air vent grooves 1c and 2c. The plate bodies 1 and 2 are alternately overlapped with the through holes 1a and 2a and the cutouts 2b and 1b aligned with each other, and the plate bodies 1 are fixed to each other by the fixed shaft 3 inserted into the through hole 1a. The two are integrally coupled by a movable shaft 4 inserted in the through hole 2a.

The fixed shaft 3 penetrates the notch 2b of the plate body 2,
The movable shaft 4 penetrates the notch 1b of the plate body 1. Axis 3,
The outer diameter of 4 (the diameter of the through holes 1a, 2a) and the width of the notches 2b, 1b are the same, and the shafts 3, 4 can relatively move along the notches 2b, 1b. The end faces 1d and 2d of the plate bodies 1 and 2 are formed flat and the notches 1b and 2b are formed.
The air vent grooves 1c and 2c are formed perpendicular to the end faces 1d and 2d. Since the shape and the vertical position of the end faces 1d and 2d are matched with the planar shape of the object to be used of the original A, the end faces 1d and 2d are curved in the length direction or the width direction, or end faces of the same kind have a width. In some cases, the position is shifted stepwise in the direction.

The plate body 2 includes an end face 1d of the plate body 1 and the plate bodies 2 and 2
At the position P where the filling groove B is formed with the inner side surfaces 2e, 2e of the ends of the
1 (solid line position in FIG. 2) and the end faces 1d, 2 of both plate bodies 1, 2.
It is possible to move the movable shaft 4 relative to the plate 1 between positions P2 (positions indicated by two-dot chain lines in FIG. 2) where d substantially coincides. The relative movement direction of the plate body 2 with respect to the plate body 1 is the direction of the air vent grooves 1c, 2c perpendicular to the end faces 1d, 2d, but the notches 1b, 2b are inclined with respect to the end faces 1d, 2d. The relative movement direction of the body 2 can be the above-mentioned inclination direction. If the air vent grooves 1c and 2c are formed along the relative movement direction of the plate body 2, the movement resistance of the plate body 2 is reduced, so that the plate body 2 can be smoothly moved relative to each other. The air vent grooves 1c and 2c may be formed in other directions.

The air bleeding grooves 1c and 2c shown in FIG.
However, it may be formed on both surfaces of one or both of the plate bodies 1 and 2. When the air vent grooves 1c and 2c are formed on the surfaces of the plate members 1 and 2 which are in contact with each other, for example, the groove width and pitch are made different so that the peaks of one air vent groove and the valleys of the other air vent groove do not mesh with each other. Take steps.

Further, the end faces 1d and 2d of the plate bodies 1 and 2 shown in the figure.
Is formed linearly over the entire length of the plate bodies 1 and 2, but a kerf 2f having an arbitrary length and shape may be formed on the end surface 2d of the plate body 2 as shown by the chain double-dashed line in FIG. it can. In this way, the adjacent filling grooves B, B are connected to each other by the cut groove 2f. Needless to say, the cut groove 2f also functions as a filling groove.

Further, in the figure, the plate bodies 1 and the plate bodies 2 are coupled by the fixed shaft 3 and the movable shaft 4, respectively, but they may be coupled by other coupling means. It is also possible to fix the plate body 2 and move the other plate body 1 with respect to the plate body 2. In either case, the plates 1 and 2 do not refuse to move beyond the positions P1 and P2.

The plates 1 and 2 are generally manufactured by laser processing or etching processing a metal plate such as steel rolled to a predetermined thickness. If a rolled material is used, the thickness accuracy of the plates 1 and 2 can be increased to obtain an accurate original plate A, but the material and processing method are not limited to the above and are arbitrary. Although the plate bodies 1 and 2 in the figure have the same thickness, shape and material,
The thickness, shape, material and the like can be made different from each other depending on the purpose of use and the like. Further, one or both of the plate bodies 1 and 2 can be made to be a ferromagnetic body. When increasing the thickness, two or more plate bodies 1 and 2 of the same kind may be stacked. The filling groove B may have a hole shape with one end or both ends closed.

In the original A according to the present invention, the filling groove B
It is easy to increase the depth of. Further, the filling groove B is filled with an arbitrary liquid or powder (solidifying filling body), and the relative movement of the plate bodies 1 and 2 to the second position P2 does not cause the filling liquid or powder to lose its shape, so It can be attached to the surface. When the filling groove B of the original A having at least one of the plates 1 and 2 made of a ferromagnetic material is filled with the powder ink and attached to the surface of the member, the original A is attracted to the surface of the member by a magnet from the back side of the member. The close contact allows the powder ink to be strongly adhered to the surface of the member. When the original plate A is vibrated when the filling body is put into the filling groove B or after the filling body is put into the filling groove B, the filling body is densely and satisfactorily filled in the groove B. It is also possible to bring the plate 1 close to the surface of the member to compress the powder ink.

The solidifying liquid D filled in the filling groove B of the original plate A may be either an insulator or a conductor in the solidified state. Further, the powder ink may be either an insulator or a conductor.

The application of the original plate A according to the present invention includes the production and printing of electronic substrates such as insulating substrates, and can be used in the production process of printed boards and shadow masks of CRTs. When an insulating substrate is manufactured using the original plate A of the present invention, the filling groove B is filled with a solidifying liquid or powder before use. When used for printing, the filling groove B is filled with a solidifying liquid (ink) or powder ink as a printing original plate and printing is performed on the surface of a member such as paper, leather, cloth, or wood.

In order to fill the filling groove B with the solidifying liquid or ink, the filling groove B is usually forced upward by a brush, a roller, a squeegee, or the like. Air is in communication with the filling groove B. Air vent groove 1
It is discharged to the outside through c and 2c. In some cases,
By connecting the air vent grooves 1c and 2c to a required decompression source and setting the filling groove B at a negative pressure, the insulating solidifying liquid or the like can be filled in the filling groove B. In this case, the end face 1 of original A
It is advisable to cover the whole portion except d and 2d with a cover or the like to make the filling groove B a negative pressure.

Next, a method of manufacturing the insulating substrate (back substrate for PDP) according to the present invention will be described with reference to FIGS. The method for producing an insulating substrate of the present invention uses the original plate A having the above-described configuration and uses a printing method to produce a protrusion number of 100
A large number of μm partition walls 11 are formed in parallel with each other at predetermined intervals on the surface of a substrate body 10 made of glass or the like. First, an insulating solidifying liquid (solidifying filler) D is filled in a filling groove B of an original plate A. To fill. The method of filling the insulating solidifying liquid D is as described above. The insulating and solidifying liquid D attached to the end surface 2d of the plate body 2 during filling is removed by an appropriate means.

The insulating and solidifying liquid D referred to here is a liquid that becomes an insulator in a solidified state, and may not have insulating properties when it is not solidified. The insulating and solidifying liquid D includes glass particles Db of the same quality as the substrate body 10 in a base material Da containing protein or the like that can be solidified from a fluid state by temperature or the like.
Is used.

Next, as shown in FIG. 4, the plate end surface 2d of the original plate A is brought into close contact with the surface of the substrate body 10, and the insulating and solidifying liquid D in the filling groove B is attached to the substrate body 10. At this time, when air is sent to the filling groove B through the air bleeding grooves 1c and 2c (FIG. 2) to pressurize the insulating solidifying liquid D, the insulating solidifying liquid D that has entered the air bleeding grooves 1c and 2c during filling is filled in the groove 1c, 2c, and the insulating solidifying liquid D can be pressed against the substrate body 10 to increase the adhesive force.

Next, as shown in FIG. 5, the plate 2 is lifted until its end face 2d is separated from the substrate body 10 and substantially coincides with the end face 1d of the other plate 1, and then the original plate A is placed on the substrate body 1.
The end surface 1d of the plate 1 is lifted relative to 0 to separate it from the insulating and solidifying liquid D. In this case, the plate body 1 is changed from the state of FIG.
The substrate main body 10 may be lowered relative to the plate body 2 in synchronism with each other to obtain the state of FIG. 5, and then the original plate A may be raised or the substrate main body 10 may be lowered. In some cases, the original plate A may be separated from the substrate body 10 and the insulating and solidifying liquid D without raising the plate body 2 as shown in FIG.

The insulating and solidifying liquid D adhered to the substrate body 10 by the above operation is solidified by a method such as drying or sintering. The insulating and solidifying liquid D becomes the partition wall 11 by solidifying.
Since the insulating and solidifying liquid D contains the protein as described above, when it is solidified by sintering, the volume of the insulating and solidifying liquid D shrinks less than that of an organic solvent and the target shape is Maintained.

In the above manufacturing method, by making the depth of the filling groove B of the original plate A deep, the height of the partition wall 11 can be made sufficiently high to improve the insulating property. Further, it becomes possible to easily form the partition wall 11 having a predetermined shape on the surface of the substrate body 10 with high accuracy, and it is possible to improve the manufacturing efficiency and reduce the cost.

All or part of the glass particles Db dispersed in the insulating solidifying liquid D can be replaced with glass of a different type from the substrate body 10 or ceramic particles. Further, as the insulating and solidifying liquid D, a resist material used as a mask for producing a printed circuit board, an uncured resin raw material, or the like can be used.

When the insulating solidifying liquid D which can be solidified by natural drying is used, far infrared rays can be used for drying. In the case of this method, since the surface layer and the inside of the insulating solidifying liquid D are uniformly heated and solidified, the partition wall 11
Stable quality with little residual stress inside. Also,
Since the substrate body 10 is also heated at the same time as the heating of the insulating solidifying liquid D, the components in the insulating solidifying liquid D and the substrate main body 10 are easily and surely integrated with the solidification of the insulating solidifying liquid D, and quickly. Solidify.

The insulating and solidifying liquid D may contain an ultraviolet curable substance. In this case, the ultraviolet curable substance is cured by ultraviolet rays to solidify the insulating solidifying liquid D. According to this solidifying method, the insulating solidifying liquid D and the substrate body 10 are
Heat input is small, there is no fear of distortion or deformation due to heat input or cooling, and the accuracy of forming the partition wall 11 is further improved. Fine powder of a ferromagnetic material is mixed with the insulating and solidifying liquid D, and the insulating and solidifying liquid D can be strongly adhered to the substrate body 10 by pulling the insulating and solidifying liquid D with a magnet across the substrate body 10.

The original A may be separated from the substrate body 10 after the insulating and solidifying liquid D adhered to the substrate body 10 by the original A is appropriately or completely solidified in the filling groove B. In order to improve the detachability of the insulating solidifying liquid D filled in the filling groove B, the inner surface 2e of the end portion of the plate body 2e, 2e
May be slightly inclined in a wedge shape so that the filling groove B is spread outward, or a suitable release agent may be applied to the plate body.

Next, another embodiment of the method of manufacturing the insulating substrate will be described with reference to FIGS. 6 and 7. In this manufacturing method, first, a liquid mold material is filled in the filling groove B of the original plate A as shown in FIG.
The mold 15 is formed by filling and solidifying as described above. In order to separate the mold 15 from the original plate A, the plates 1 and 2 are separated by the procedure described above.
Is relatively moved to the second position P2. The separation time of the original plate A is arbitrary, and may be carried out immediately after filling the mold material or after the mold material is completely solidified. As the mold material, a material which can be removed by heat or a chemical reaction or has the same effect as this is used.

After the mold 15 is formed, the mold groove 1 of the mold 15 is formed.
5a is filled with the insulating solidifying liquid D as shown in FIG. 7 to form a similar shape to the target insulating substrate. As the insulating solidifying liquid D, any of the insulating solidifying liquid D described above can be used. After that, the insulating solidifying liquid D is solidified to form the mold 1.
When 5 is removed by heat or chemical reaction, the substrate body 10
An insulating substrate in which the barrier ribs 11 are integrated is completed.

The solidification of the insulating solidifying liquid D and the removal of the mold 15 may be carried out first or simultaneously. As the method for solidifying the insulating solidifying liquid D, any of the above-described methods can be adopted depending on its type. Depending on the material of the mold material, curing the insulating solidifying liquid D and removing the mold 15 can be performed in the same step. It can be carried out. In some cases, the mold 15 may be formed of a metal that cannot be removed by heat or a chemical reaction.

According to this manufacturing method, the substrate body 10 and the partition wall 11 can be made of the same material and can be completely integrated. It should be noted that a part of the groove 15a of the mold 15 is partially or entirely filled with an appropriate material which is the same as or different from that of the mold 15, or a part of the peaks 15b is partially or entirely removed to form the mold 15. The insulating substrate can be manufactured by modifying (reworking) and using the modified model. In this case, a large number of different types of insulating substrates can be produced in small quantities with the same original plate A. Also, if necessary, the substrate body 10 and the partition wall 11 can be formed of different materials that are not completely the same.

When the filling groove B of the original plate A is filled with the solidifying liquid D or conductor powder which becomes a conductor in the solidified state, the partition wall 11 becomes a conductor and becomes an electronic substrate different from the above.

[0047]

As described above, in the invention according to claim 1, one or more first plate bodies and two or more second plate bodies are provided with an end face of the first plate body and the first plate body. The first position where the filling groove for filling the solidifying filler is formed with the inner surfaces of the end portions of the two second plate bodies sandwiching the first plate body, and the end surface of the first plate body and the end surface of the second plate body are substantially coincident with each other. Since the second positions are alternately movable relative to each other, the filling grooves can be easily deepened. Further, it is possible to fill the filling groove with an arbitrary liquid and attach the liquid onto the surface of the arbitrary member without causing the filling liquid to lose its shape due to the relative movement of the plate body to the second position.

If one or both of the first plate body and the second plate body is formed with an air vent groove communicating with the filling groove, when the filling groove is filled with the solidifying filling material, air in the filling groove is filled. Is discharged through the air bleeding groove, so that the solidifying filler can be accurately and easily filled in the filling groove. Further, when the air vent groove is formed along the relative movement direction of the first plate body and the second plate body, the plate body smoothly moves along the air vent groove. Further, when the second plate body is configured to be movable with respect to the first plate body by the movable shaft inserted through the through holes, the second plate body is moved from the substrate body or the like to which the solidifying filling body in the filling groove is attached to the first plate body. In the case of separating the two plates, the substrate body and the like can be separated while being fixed together with the first plate, and the operation can be simplified.

According to a fifth aspect of the invention, the first step of inserting the solidifying filler into the filling groove of the original plate according to any one of the first to fourth aspects and the end face of the second plate body of the original plate are carried out. Second step of closely adhering to the substrate body to the solidifying filler in the filling groove to the substrate body, third step of separating the solidifying filler attached to the substrate body and the original plate from the substrate body, and solidifying filling Since it has a fourth step of solidifying the body while it is attached to the substrate body, it is possible to efficiently manufacture an electronic substrate which is excellent in accuracy and low in cost.

In the third step, when the second plate is moved to the second position relatively and then the original plate is separated from the solidifying packing, the solidifying packing partially puts it in the filling groove. Since the predetermined adhered state is maintained without leaving or losing the shape, the accuracy of the partition wall is improved.

If the particles of the same material as the substrate main body are dispersed in the base material of the solidifying filler, the properties of the substrate main body and the partition walls are almost the same, and furthermore, the solidifying filler is obtained by firing the dispersed particles. Can be solidified with the substrate body, and the quality of the electronic substrate is improved.

In the fourth step, if the solidifying filler is irradiated with far infrared rays to solidify the solidifying filler,
The surface layer and the interior of the solidifying filler are uniformly and quickly solidified, and the accuracy of the partition wall and the productivity of the electronic substrate are improved.

Further, in the fourth step, when the solidifying filler is irradiated with ultraviolet rays to cure the ultraviolet curable substance contained in the solidifying filler, the heat input to the solidifying filler and the substrate body is reduced. Since the amount is small and distortion or deformation due to heat input or cooling does not occur, the accuracy of the partition wall can be improved.

Further, the invention according to claim 11 is the filling of the original plate according to any one of claims 1 to 4, wherein two or more first plate bodies and three or more second plate bodies are alternately polymerized. The groove is filled with a wax or a removable mold material having the same effect as that of the mold to prepare a mold for an intended electronic substrate, and the mold groove formed by the second plate body of the mold is filled with the solidifying filler. Then, after the solidifying filler is formed into a shape similar to the intended electronic substrate, the solidifying filler is solidified and the mold is removed to produce an electronic substrate. It is possible to efficiently obtain a highly accurate electronic board in which the board main body and the partition wall are completely integrated and have high accuracy and low cost. In addition, by modifying the mold, it is possible to produce a wide variety of electronic boards in small quantities.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of an original plate according to the present invention.

FIG. 2 is an enlarged sectional view of a portion (II-II) in FIG.

FIG. 3 is a front view of a plate body.

FIG. 4 shows a method for manufacturing an electronic substrate according to the present invention,
FIG. 4 is a front view showing a state in which the solidifying filler filled in the filling groove of the original plate is attached to the substrate body.

FIG. 5 is likewise a front view showing a state where the plate body is separated from the substrate body by relative movement.

FIG. 6 is a cross-sectional view showing a molding state of a mold in another method for manufacturing an electronic substrate according to the present invention.

FIG. 7 is likewise a cross-sectional view showing a filled state of a solidifying filling body in a mold.

FIG. 8 is an external view of a conventional plasma display panel.

[Explanation of symbols]

 1 plate 1a through hole 1c air vent groove 1d end face 2 plate 2a through hole 2c air vent groove 2d end face 2e end inner surface 3 fixed shaft 4 movable shaft 10 substrate body 11 partition wall 15 type 15a type groove A original plate B filling groove D solidification property Packing body P1 1st position P2 2nd position

Claims (12)

[Claims] 1. One or more first plate members and two or more second plate members, an end face of the first plate member and two end plate inner surfaces of the second plate member sandwiching the first plate member. And a second position where a filling groove for filling the solidifying filling body is formed and a second position where the end surface of the first plate body and the end surface of the second plate body substantially coincide with each other so as to be relatively movable. An original plate used for the production of electronic substrates characterized by being polymerized. 2. The original plate used for manufacturing an electronic substrate according to claim 1, wherein an air vent groove is formed in one or both of the first plate body and the second plate body so as to communicate with the filling groove. 3. The original plate used for manufacturing an electronic substrate according to claim 2, wherein the air vent groove is formed along a relative moving direction of the first plate body and the second plate body. 4. The electronic board according to claim 1, wherein the second plate body is movable with respect to the first plate body by a movable shaft inserted through the through holes. Original plate used for manufacturing. 5. A first step of inserting a solidifying filler into the filling groove of the original plate according to claim 1, and an end face of the second plate body of the original plate is brought into close contact with the substrate body to fill the groove. The second step of adhering the solidifying filler inside the substrate body to the substrate body, the third step of separating the solidifying filler body attached to the substrate body and the original plate from the substrate body, and the solidifying filler body attached to the substrate body A fourth step of solidifying as it is, the method for producing an electronic substrate. 6. The method of manufacturing an electronic substrate according to claim 5, wherein, in the third step, the second plate is relatively moved to the second position, and then the original plate is separated from the solidifying filling body. . 7. The particles of the same material as the substrate body are dispersed in the base material of the solidifying filler.
A method for manufacturing an electronic substrate as described above. 8. The method for manufacturing an electronic substrate according to claim 5, 6 or 7, wherein in the fourth step, the particles in the solidifying filler are fired to be solidified integrally with the substrate body. 9. The method of manufacturing an electronic substrate according to claim 5, wherein in the fourth step, the solidifying filler is irradiated with far infrared rays to solidify the solidifying filler. 10. The ultraviolet curable substance contained in the solidifying filler is cured by irradiating the solidifying filler with ultraviolet light in the fourth step.
A method for manufacturing an electronic substrate as described above. 11. A two or more first plate body and a three or more second plate body.
A mold for an intended electronic substrate is prepared by filling a filling groove of the original plate according to any one of claims 1 to 4 in which plates are alternately polymerized with a wax or a removable mold material having the same effect. The mold groove formed by the second plate body of the mold is filled with the solidifying filling material to make the solidifying filling material similar to the intended electronic substrate, and then the solidifying filling material is solidified. At the same time, the above-mentioned mold is removed to manufacture an electronic substrate. 12. The solidifying filler as claimed in claim 8, 9, or 1.
The method of manufacturing an electronic substrate according to claim 11, wherein the method is solidified by any of the methods described in 0.