KR100649439B1 - Photocurable resin composition and resin composition for plastics comprising the same - Google Patents

Photocurable resin composition and resin composition for plastics comprising the same Download PDF

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KR100649439B1
KR100649439B1 KR20050065596A KR20050065596A KR100649439B1 KR 100649439 B1 KR100649439 B1 KR 100649439B1 KR 20050065596 A KR20050065596 A KR 20050065596A KR 20050065596 A KR20050065596 A KR 20050065596A KR 100649439 B1 KR100649439 B1 KR 100649439B1
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resin composition
photocurable resin
acrylic resin
weight part
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KR20060053915A (en
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유이치 이토
사토루 스다
야스시 미즈타
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미쓰이 가가쿠 가부시키가이샤
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/043Improving the adhesiveness of the coatings per se, e.g. forming primers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Paints Or Removers (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

본 발명은(A) 양이온 중합성 화합물, (B) 아크릴 수지, (C) 광 양이온 중합개시제를 함유하고, (B) 아크릴 수지가 양이온 중합성 작용기를 가지며, (A)와 (B)의 합계 100중량부 중, (A)가 30 ~ 95중량부, (B)가 5 ~ 70중량부인 것을 특징으로 하는 광경화형 수지 조성물에 관한 것이다. (B) 아크릴 수지의 작용기는 환상 에테르기, 비닐옥시기, 비닐옥시기의 산부가체, 활성수소기 중 어느 1 종류 이상을 함유하는 것이 바람직하고, 활성수소기가 수산기인 것이 더욱 바람직하다.This invention contains (A) cationically polymerizable compound, (B) acrylic resin, (C) photocationic polymerization initiator, (B) acrylic resin has a cationically polymerizable functional group, and sums of (A) and (B) (A) is 30-95 weight part and (B) is 5-70 weight part in 100 weight part, It is related with the photocurable resin composition. The functional group of the acrylic resin (B) preferably contains any one or more of a cyclic ether group, a vinyloxy group, an acid addition product of a vinyloxy group, and an active hydrogen group, and more preferably an active hydrogen group is a hydroxyl group.

본 발명에 의하면, 충분한 광경화성을 갖고, 난접착성인 폴리카보네이트, PET를 대표로 하는 경질 플라스틱에 대하여 충분한 접착성을 갖는 광경화형 수지 조성물을 얻을 수 있다.ADVANTAGE OF THE INVENTION According to this invention, the photocurable resin composition which has sufficient photocurability and has sufficient adhesiveness with respect to the hard plastic represented by polycarbonate and PET which are hard-adhesive can be obtained.

Description

광경화형 수지 조성물 및 그것으로 이루어지는 플라스틱용 수지 조성물 {Photocurable resin composition and resin composition for plastics comprising the same}Photocurable resin composition and resin composition for plastics comprising the same {Photocurable resin composition and resin composition for plastics comprising the same}

본 발명은 광조사에 의해 경화하는 도료, 접착제, 잉크 등에 사용되는 광경화형 수지 조성물에 관한 것이다. 특히, 폴리카보네이트, PET, ABS 수지 등의 난접착성(難接着性)인 경질 플라스틱에 이용된다.This invention relates to the photocurable resin composition used for the coating material, adhesive agent, ink, etc. which are hardened by light irradiation. In particular, it is used for hard-adhesive hard plastics, such as polycarbonate, PET, and ABS resin.

최근에, 플라스틱 소재가 전자 정보 재료 분야에서 많이 이용되고 있다. 예를 들면, 휴대전화나 광 디스크는 경질 플라스틱인 폴리카보네이트가 종종 이용되고 있다. 마찬가지로, 광학용 필름에는 PET 수지가, 또한 가전 정보 기기의 하우징에는 ABS 수지가 이용되고 있다. 이들의 제품화 과정에서, 이들 경질 플라스틱을 광경화에 의해 접착, 도장, 인쇄하는 공정이 있지만, 이들 재료는 어느 것이나 난접착성이다. 게다가, 이용되는 도료, 접착제, 잉크 등에 사용되는 재료에는 기체(基體) 수지에 높은 밀착성을 부여하는 것이 요망된다.Recently, plastic materials have been widely used in the field of electronic information materials. For example, polycarbonates, which are hard plastics, are often used for cellular phones and optical disks. Similarly, PET resin is used for the optical film, and ABS resin is used for the housing | casing of home appliances information equipment. In the process of these products, although there exists a process of bonding, painting, and printing these hard plastics by photocuring, all these materials are hard-adhesive. In addition, it is desired to provide high adhesion to the base resin to materials used for coatings, adhesives, inks and the like.

높은 밀착성을 부여하는 방법의 하나로는, 기체 수지를 경화시킬 때, 낮은 경화 수축에 의해, 접착 계면에 발생하는 잔량 응력을 저감시키는 방법이 유효한 것으로 알려져 있다. 이 낮은 경화 수축을 실현하는 방법으로서, 종래의 아크릴 모노머 등을 이용한 광 라디칼 중합에 의한 부가 중합을 이용한 경화 시스템으로부터, 경화 수축이 작은 에폭시 수지나 옥세탄 수지 등의 환상 에테르의 광 양이온 개환 중합에 의한 경화 시스템이 제창되었다. 그러나, 이 광 양이온 개환 중합을 이용한 경화 시스템은 피착체인 경질 플라스틱과 상호작용할 수 있는 작용기를 도입하는 것이 곤란하여 밀착성을 충분히 부여할 수 없었다.As one of the methods of providing high adhesiveness, when hardening a base resin, the method of reducing the residual stress which generate | occur | produces in an adhesive interface by low hardening shrinkage is known to be effective. As a method of realizing this low cure shrinkage, from the cure system using the addition polymerization by radical photopolymerization using the conventional acrylic monomer, etc., it is used for the photocationic ring-opening polymerization of cyclic ethers, such as epoxy resin and oxetane resin, with small cure shrinkage. Curing system was proposed. However, this curing system using photo cationic ring-opening polymerization is difficult to introduce a functional group capable of interacting with the hard plastic as the adherend and could not sufficiently provide adhesion.

그래서, 에폭시 화합물, 옥세탄 화합물, 광 양이온 중합개시제, 착색제로서의 안료 및 안료 분산제로 이루어지는 광 양이온 개환 중합계에, 안료 분산제로서 앵커가 염기이고, 실온에서 액체인 빗살형(comb) 폴리머를 유효성분으로 첨가함으로써, 피착체와의 밀착성 발현을 시도하여 충분한 밀착성을 발현시켰다(예를 들면, 특허 문헌 1). 그러나, 이 시스템은 광 양이온 개환 중합의 중합 반응에서의 지연제(retarder; 반응 저해)가 될 수 있는 염기성 물질을 포함하고 있기 때문에, 생산성에 필요한 충분한 경화 속도를 발현시킬 수 없는 결점을 갖고 있다.Therefore, in the photocationic ring-opening polymerization system composed of an epoxy compound, an oxetane compound, a photocationic polymerization initiator, a pigment as a colorant and a pigment dispersant, a comb polymer having an anchor as a pigment dispersant and a liquid at room temperature is an active ingredient. By the addition, the adhesive expression with the adherend was attempted to express sufficient adhesiveness (for example, Patent Document 1). However, since this system contains a basic substance which can be a retarder in the polymerization reaction of photo cationic ring-opening polymerization, it has a drawback in that it cannot express a sufficient curing rate necessary for productivity.

[특허 문헌 1][Patent Document 1]

일본국 특개 2003-212965호 공보JP 2003-212965 A

충분한 광경화성을 갖고, 난접착성인 폴리카보네이트, PET를 대표로 하는 경질 플라스틱에 대하여 충분한 접착성을 갖는 광경화형 수지 조성물을 제공하는 것이다.It is providing the photocurable resin composition which has sufficient photocurability, and has sufficient adhesiveness with respect to the hard plastic represented by polycarbonate and PET which are hard-adhesive.

본 발명자들은 예의 검토 결과, 에폭시 화합물, 옥세탄 화합물 등의 양이온 중합성 화합물과 광 양이온 중합개시제로 이루어지는 광 양이온 중합계에, 경화 시에 양이온 중합성 작용기를 부여한 특정의 아크릴 수지를 첨가한 바, 충분한 경화성과 밀착성이 발현되는 것을 알아내어 본 발명을 완성하기에 이르렀다.MEANS TO SOLVE THE PROBLEM As a result of earnest examination, the inventors added the specific acrylic resin which provided the cationically polymerizable functional group to the photocationic polymerization system which consists of cationically polymerizable compounds, such as an epoxy compound and an oxetane compound, and a photocationic polymerization initiator at the time of hardening, It discovered that sufficient hardenability and adhesiveness were expressed, and came to complete this invention.

즉, 본 발명은That is, the present invention

(A) 양이온 중합성 화합물, (B) 아크릴 수지, (C) 광 양이온 중합개시제를 함유하고, (B) 아크릴 수지가 양이온 중합성 작용기를 가지며, (A)와 (B)의 합계 100중량부 중, (A)가 30 ~ 95중량부, (B)가 5 ~ 70중량부인 것을 특징으로 하는 광경화형 수지 조성물이다.(A) Cationically polymerizable compound, (B) Acrylic resin, (C) Photocationic polymerization initiator containing, (B) Acrylic resin has a cationically polymerizable functional group, 100 weight part of total of (A) and (B) (A) is 30-95 weight part and (B) is 5-70 weight part in the photocurable resin composition.

또한, (B) 아크릴 수지의 작용기는 환상 에테르기, 비닐옥시기, 비닐옥시기의 산부가체, 활성수소기 중 어느 1 종류 이상을 함유하는 것이 바람직하고, 활성수소기가 수산기인 것이 더욱 바람직하다. 또한, (B) 아크릴 수지의 중량평균분자량(폴리스티렌 환산)이 1,000 ~ 100,000의 범위인 것이 바람직하다.The functional group of the acrylic resin (B) preferably contains any one or more of cyclic ether groups, vinyloxy groups, acid addition products of vinyloxy groups, and active hydrogen groups, and more preferably the active hydrogen groups are hydroxyl groups. Moreover, it is preferable that the weight average molecular weight (polystyrene conversion) of (B) acrylic resin is the range of 1,000-100,000.

(A) 양이온 중합성 화합물은 환상 에테르기를 함유하고 있는 것이 바람직하고, 에폭시기 및/또는 옥세타닐기를 함유하고 있는 것이 더욱 바람직하다.The cationic polymerizable compound (A) preferably contains a cyclic ether group, and more preferably contains an epoxy group and / or an oxetanyl group.

또한, 본 발명은 상술한 광경화형 수지 조성물을 함유하여 이루어지는 플라스틱용 코팅 조성물, 접착제 조성물, 잉크 조성물이다.Moreover, this invention is a coating composition, adhesive composition, and ink composition for plastics containing the photocurable resin composition mentioned above.

본 발명을 이하에 상세하게 설명한다.This invention is demonstrated in detail below.

[(A) 양이온 중합성 화합물][(A) Cationically Polymerizable Compound]

본 발명에서 사용되는 (A) 양이온 중합성 화합물 성분은 일분자쇄 중에 적어 도 1개의 양이온 중합성 작용기를 갖는다. 구체적으로는, 분자 내에 옥시란환, 옥세탄환, 테트라히드로푸란환 등 환상 에테르를 갖는 화합물류, 환상 포르말, 환상 카보네이트, 환상 에스테르, 비닐옥시류, 환상 티오에테르(티이란(thiirane)), 환상 올레핀, 스티렌류를 말하고, 양이온 중합성을 가지면 특별히 제한은 없다. 이들 중에서, 에폭시기를 갖는 화합물이나, 옥세타닐기를 갖는 화합물이 바람직하다. 이 때, 에폭시기와 옥세타닐기를 동시에 함유하고 있어도 상관없다.The (A) cationically polymerizable compound component used in the present invention has at least one cationically polymerizable functional group in the monomolecular chain. Specifically, compounds having cyclic ethers such as oxirane ring, oxetane ring and tetrahydrofuran ring in the molecule, cyclic formal, cyclic carbonate, cyclic ester, vinyloxy, cyclic thioether (thiirane), The cyclic olefins and styrenes are not particularly limited as long as they have cationically polymerizable properties. Among these, a compound having an epoxy group or a compound having an oxetanyl group is preferable. At this time, you may contain an epoxy group and an oxetanyl group simultaneously.

< 에폭시 화합물 ><Epoxy Compound>

구체적으로 에폭시기를 함유하는 화합물을 예시하면, 에폭시기를 1개 갖는 화합물의 구체적인 예로는, 페닐글리시딜에테르, 부틸글리시딜에테르 등이 있고, 에폭시기를 2개 이상 갖는 화합물로는, 헥산디올디글리시딜에테르, 테트라에틸렌글리콜디글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 비스페놀A디글리시딜에테르, 비스페놀F디글리시딜에테르, 노볼락 글리시딜에테르, 헥사히드로프탈산글리시딜에스테르, 다이머산글리시딜에스테르, 테트라글리시딜아미노디페닐메탄, 3,4-에폭시-6-메틸시클로헥실메틸카복실레이트, 트리글리시딜이소시아누레이트, 3,4-에폭시시클로헥실메틸카복실레이트, 폴리프로필렌디글리시딜에테르, 폴리부타디엔 또는 폴리술피드의 양말단 디글리시딜에테르 변형물 등의 글리시딜에테르 등을 들 수 있다. 또한, 3,4-에폭시시클로헥실메틸-3,4-에폭시시클로헥산카복실레이트, 비스-(3,4-에폭시시클로헥실)아디페이트 등의 지환식 에폭시도 들 수 있다.Specifically, a compound containing an epoxy group is exemplified. Specific examples of the compound having one epoxy group include phenylglycidyl ether and butylglycidyl ether, and the compound having two or more epoxy groups is hexanediol di. Glycidyl ether, tetraethylene glycol diglycidyl ether, trimethylol propane triglycidyl ether, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, novolak glycidyl ether, hexahydrophthalic acid glycine Dyl esters, Dimer acid glycidyl esters, tetraglycidylaminodiphenylmethane, 3,4-epoxy-6-methylcyclohexylmethylcarboxylate, triglycidyl isocyanurate, 3,4-epoxycyclohexylmethyl Glycidyl ethers such as carboxylate, polypropylene diglycidyl ether, polybutadiene or polysulfide sock end diglycidyl ether modifications; and the like can be given. Moreover, alicyclic epoxy, such as 3, 4- epoxycyclohexyl methyl-3, 4- epoxy cyclohexane carboxylate and bis- (3, 4- epoxy cyclohexyl) adipate, is also mentioned.

또한, 에폭시기와 같은 삼원환의 환상 에테르로, 일반식(1)로 표시되는 바와 같은 작용기를 갖는 화합물도 본 발명의 성분(A)로서 제공된다.Moreover, the compound which has a functional group as represented by General formula (1) as a cyclic ether of a three-membered ring like an epoxy group is also provided as component (A) of this invention.

Figure 112005039194601-pat00001
……(1)
Figure 112005039194601-pat00001
… … (One)

일반식(1) 중, R1 및 R2는 탄소원자이고, 또한 그 탄소원자가 포화 또는 불포화이다. R3은 수소원자 또는 탄소원자이고, 또한 그 탄소원자가 포화 또는 불포화이다.In General Formula (1), R 1 And R 2 is a carbon atom, and the carbon atom is saturated or unsaturated. R 3 is a hydrogen atom or a carbon atom, and the carbon atom is saturated or unsaturated.

일분자쇄 중에 적어도 1개의 일반식(1)로 표시되는 옥시란환기를 갖는 화합물은 옥시란환을 이루는 탄소원자 중, 1개의 탄소원자는 적어도 1개의 수소원자로 치환되어 있고, 다른 1개의 탄소원자는 2개의 탄소원자로 치환되어 있으며, 그 치환하고 있는 탄소원자는 포화 결합 또는 불포화 결합인 것을 특징으로 하는 일분자쇄 중에 적어도 1개의 일반식(1)로 표시되는 옥시란환기를 갖는 화합물이다. 또한, 이 탄소원자의 포화 결합 또는 불포화 결합은 임의의 원자단으로 치환되어 있어도 상관없다.Compounds having an oxirane ring group represented by at least one general formula (1) in a single-molecular chain include one carbon atom substituted with at least one hydrogen atom among carbon atoms constituting the oxirane ring, and the other carbon atom is 2 Substituted carbon atoms, and the substituted carbon atom is a compound having at least one oxirane cyclic group represented by the general formula (1) in the one-molecular chain, which is a saturated bond or an unsaturated bond. In addition, the saturated or unsaturated bond of this carbon atom may be substituted by arbitrary atom groups.

구체적으로는, R1 및 R2는 알칸, 알켄, 알킨 중 어느 하나로 이루어지는 탄화수소를 나타내고, 치환기를 갖고 있어도 된다. 그 치환기로는 알킬기, 시클로알칸, 방향족환, 할로겐, 수산기, 에테르, 알데히드, 케톤, 에스테르기, 알킬 치환의 아미드기, 알킬 치환의 아미노기 등을 들 수 있지만, 특별히 제한은 없다. 또한, R3은 수소원자 이외에, 알칸, 알켄, 알킨 중 어느 하나로 이루어지는 탄화수소를 나타내고, 치환기를 갖고 있어도 된다. 그 치환기로는 알킬기, 시클로알칸, 방향족환, 할로겐, 수산기, 에테르, 알데히드, 케톤, 에스테르기 등을 들 수 있지만, 특별히 제한은 없다.Specifically, R 1 and R 2 represent a hydrocarbon composed of any one of alkanes, alkenes, and alkynes and may have a substituent. Examples of the substituent include an alkyl group, a cycloalkane, an aromatic ring, a halogen, a hydroxyl group, an ether, an aldehyde, a ketone, an ester group, an alkyl substituted amide group, and an alkyl substituted amino group, but are not particularly limited. In addition to R 3 , R 3 represents a hydrocarbon composed of any of alkanes, alkenes, and alkynes and may have a substituent. Examples of the substituent include an alkyl group, a cycloalkane, an aromatic ring, a halogen, a hydroxyl group, an ether, an aldehyde, a ketone, and an ester group, but are not particularly limited.

더욱 구체적으로는, 일분자쇄 중에 적어도 1개의 일반식(1)로 표시되는 옥시란환기를 갖는 화합물을 예시하면, 테르피놀렌디옥사이드, 이소부틸렌옥사이드, 이소프렌옥사이드, β-피넨옥사이드, 2-메틸글리시돌, 리모넨디옥사이드, 메틸 2-메틸글리시데이트, 7-옥사-비시클로[4.1.0]헵탄옥시라닐, 2-아세틸-2-메틸옥시란, 2-(벤질옥시메틸)-2-메틸옥시란, 5,6-에폭시-4,7-메타노-1-옥사스피로-(2,5)-옥탄, 2-메틸-1-(2-메틸-옥시라닐)-논-3-엔-1-올, 미르센디옥사이드 등을 들 수 있다. 특히, 테르피놀렌디옥사이드, 리모넨디옥사이드나 7-옥사-비시클로[4.1.0]헵탄옥시라닐, 5,6-에폭시-4,7-메타노-1-옥사스피로-(2,5)-옥탄이나 미르센디옥사이드와 같은, 일반식(1)로 표시되는 특유의 옥시란환 구조를 분자 내에 최저 1개 이상 가지면 되므로, 다른 옥시란환 등의 양이온 중합성을 갖는 구조를 동일 분자 내에 가져도 상관없다.More specifically, examples of the compound having an oxirane ring group represented by at least one general formula (1) in one molecule chain include terpinolene dioxide, isobutylene oxide, isoprene oxide, β-pinene oxide and 2- Methylglycidol, limonene dioxide, methyl 2-methylglycidate, 7-oxa-bicyclo [4.1.0] heptanooxyranyl, 2-acetyl-2-methyloxirane, 2- (benzyloxymethyl) -2 -Methyloxirane, 5,6-epoxy-4,7-methano-1-oxaspiro- (2,5) -octane, 2-methyl-1- (2-methyl-oxyranyl) -non-3- En-1-ol, myrcene dioxide, etc. are mentioned. In particular, terpinolene dioxide, limonene dioxide or 7-oxa-bicyclo [4.1.0] heptaneoxyranyl, 5,6-epoxy-4,7-methano-1-oxaspiro- (2,5) -octane Since at least one or more unique oxirane ring structures represented by the general formula (1), such as or myrcene dioxide, may be present in a molecule, it is also possible to have a structure having cationically polymerizable properties such as other oxirane rings in the same molecule. none.

< 옥세탄 화합물 ><Oxetane compound>

구체적으로 옥세타닐기를 갖는 화합물을 예시하면, 옥세타닐기를 1개 갖는 화합물의 구체적인 예로는, 3-에틸-3-히드록시메틸옥세탄, 3-에틸-3-페녹시메틸옥세탄, 3-에틸-3-(2-에틸헥실옥시메틸)옥세탄, 3-에틸(트리에톡시실릴프로폭시메틸) 옥세탄, 3-시클로헥실옥시메틸-3-에틸-옥세탄 등을 들 수 있다.Specifically, a compound having an oxetanyl group is exemplified. Specific examples of the compound having one oxetanyl group include 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-phenoxymethyloxetane, 3 -Ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl (triethoxysilylpropoxymethyl) oxetane, 3-cyclohexyloxymethyl-3-ethyl-oxetane, etc. are mentioned.

옥세탄환을 2개 갖는 화합물의 구체적인 예로는, 비스(3-에틸-3-옥세타닐메틸)에테르, 1,4-비스{[(3-에틸-3-옥세타닐)메톡시]메틸}벤젠 등을 들 수 있다. 옥세탄환을 3개 이상 갖는 화합물의 구체적인 예로는, 트리메틸올프로판트리스(3-에틸-3-옥세타닐메틸)에테르, 펜타에리스리톨트리스(3-에틸-3-옥세타닐메틸)에테르, 펜타에리스리톨테트라키스(3-에틸-3-옥세타닐메틸)에테르, 디펜타에리스리톨펜타키스(3-에틸-3-옥세타닐메틸)에테르 등을 들 수 있다. 이들 양이온 중합성 화합물은 단독으로 사용해도, 2 종류 이상 조합시켜서 사용해도 상관없지만, 바람직하게는 에폭시기를 함유하는 화합물과 옥세타닐기를 함유하는 화합물을 병용하는 것이 바람직하다.Specific examples of the compound having two oxetane rings include bis (3-ethyl-3-oxetanylmethyl) ether and 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} Benzene and the like. Specific examples of the compound having three or more oxetane rings include trimethylolpropane tris (3-ethyl-3-oxetanylmethyl) ether, pentaerythritoltris (3-ethyl-3-oxetanylmethyl) ether, and pentaerythritol Tetrakis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, and the like. Although these cationically polymerizable compounds may be used individually or in combination of 2 or more types, It is preferable to use together the compound containing an epoxy group, and the compound containing an oxetanyl group preferably.

[(B) 아크릴 수지][(B) Acrylic Resin]

본 발명에 사용되는 (B) 아크릴 수지는 양이온 중합성 작용기를 함유하는 것을 특징으로 한다. 즉, 광 양이온 개환 중합에 의한 경화시에, 성분 (B) 아크릴 수지가 (A) 양이온 중합성 화합물에, 양이온 중합에서의 개시, 성장, 정지, 연쇄 이동 등의 단위 반응 중 어느 하나의 단위 반응에서, 공유 결합에 의해 가교체에 도입되는 것을 특징으로 한다.The acrylic resin (B) used in the present invention is characterized by containing a cationically polymerizable functional group. That is, at the time of hardening by photocationic ring-opening polymerization, the component (B) acrylic resin reacts with unit (A) any one of unit reactions, such as start, growth, stop, and chain transfer in cationic polymerization. In, it is characterized in that it is introduced into the crosslink by covalent bonds.

각 단위 반응에 관해서, 양이온 개환 중합의 개시 반응에 있어서 개시 말단이 될 수 있는 작용기로는 환상 에테르기를 사용할 수 있다. 환상 에테르기는 광 양이온 중합개시제로부터 생성되는 프로톤이 부가됨으로써 개시 말단이 될 수 있는 옥소늄 이온을 생성한다. 또한, 양이온 부가 중합의 개시 말단도 환상 에테르류의 개환 중합에 유용하고, 카르보 양이온을 생성할 수 있는 작용기인 비닐옥시기 및 비닐옥시기에 산이 부가된 구조도 본 발명에 제공된다. 다음에, 연쇄 이동이나 정지 말단으로서 도입될 수 있는 작용기로는 활성수소기를 들 수 있고, 그 활성수소기로는 수산기, 티올기, 아미노를 들 수 있으며, 수산기가 가장 바람직하다. 다음에, 양이온 개환 중합의 성장 반응으로 도입되는 작용기로는 상술한 환상 에테르기를 들 수 있다.About each unit reaction, a cyclic ether group can be used as a functional group which can become an initiation terminal in the initiation reaction of cation ring-opening polymerization. The cyclic ether group is added to the proton generated from the photo cationic polymerization initiator to produce an oxonium ion which can be the starting end. The present invention also provides a structure in which an acid is added to a vinyloxy group and a vinyloxy group, which are functional groups capable of producing carbo cations, also useful for ring-opening polymerization of cyclic ethers. Next, an active hydrogen group can be mentioned as a functional group which can be introduced as a chain transfer or a stop terminal, The hydroxyl group, a thiol group, an amino is mentioned as the active hydrogen group, A hydroxyl group is the most preferable. Next, the cyclic ether group mentioned above is mentioned as a functional group introduce | transduced by the growth reaction of cation ring-opening polymerization.

이하에 각 단위 반응에 있어서의 작용기를 예시하지만, 상기 개시, 성장, 정지, 연쇄 이동 등의 어느 하나의 반응이 가능하면 되고, 이하에 나타내는 작용기만으로 한정되는 것은 아니다. 원료가 일반적으로 시판되고 있어 공업적으로 의미가 있는 작용기로는, 환상 에테르기, 비닐옥시기, 비닐옥시기의 산부가체, 활성수소기 중 어느 1 종류 이상을 함유하는 것이 바람직하다.Although the functional group in each unit reaction is illustrated below, any reaction, such as said start, growth, stoppage, and chain transfer, should just be possible, and is not limited only to the functional group shown below. The raw material is generally commercially available, and it is preferable to contain any one or more of cyclic ether groups, vinyloxy groups, acid addition products of vinyloxy groups, and active hydrogen groups.

활성수소기의 경우, 바람직하게는 카르복실산, 수산기, 티올기, 아미노기이며, 더욱 바람직하게는 수산기이다. 이 수산기로는 알코올성 수산기이어도, 페놀성 수산기이어도 상관없지만, 바람직하게는 알코올성 수산기가 바람직하다. 이하에, 이들 작용기의 도입 방법에 대해서 기술한다.In the case of an active hydrogen group, Preferably it is a carboxylic acid, a hydroxyl group, a thiol group, an amino group, More preferably, it is a hydroxyl group. The hydroxyl group may be either an alcoholic hydroxyl group or a phenolic hydroxyl group, but preferably an alcoholic hydroxyl group is preferable. Below, the introduction method of these functional groups is described.

일반적으로 아크릴 수지에 작용기를 도입하는 방법으로는, 작용기를 갖는 라디칼 중합성 모노머와 다른 라디칼 중합성 모노머를 라디칼 공중합함으로써 폴리머 측쇄에 작용기를 도입하는 방법이나, 2,2'-아조비스(2-히드록시메틸프로피오니트릴) 등의 개시제 절편에 작용기를 갖는 라디칼 중합개시제나 티오디글리콜 등의 작용기를 갖는 연쇄이동제를 라디칼 중합시에 사용함으로써, 폴리머의 분자 말단에 도입할 수 있다. 이하에, 상술한 작용기를 갖는 라디칼 중합성 모노머에 대해서 구체적으로 예시한다.In general, a method of introducing a functional group into an acrylic resin includes a method of introducing a functional group into the polymer side chain by radical copolymerization of a radical polymerizable monomer having a functional group with another radical polymerizable monomer, or 2,2'-azobis (2- A radical polymerization initiator having a functional group in an initiator fragment such as hydroxymethylpropionitrile) or a chain transfer agent having a functional group such as thiodiglycol can be introduced at the molecular end of the polymer. Below, it demonstrates concretely about the radically polymerizable monomer which has a functional group mentioned above.

환상 에테르기를 측쇄에 갖는 라디칼 중합성 모노머로는, 측쇄에 환상 에테르기를 갖는(메타)아크릴레이트 모노머류를 들 수 있고, 더욱 구체적으로는 글리시딜기를 갖는 글리시딜(메타)아크릴레이트, 옥세타닐기를 갖는 3-에틸-3-옥세타닐에틸(메타)아크릴레이트, 지환식 에폭시기를 갖는 3,4-에폭시시클로헥실메틸(메타)아크릴레이트, 글리시딜기에 치환 메틸기가 붙은 메틸글리시딜메타크릴레이트, 테트라히드로푸란환을 갖는 테트라히드로푸르푸릴(메타)아크릴레이트 등을 들 수 있다.As a radically polymerizable monomer which has a cyclic ether group in a side chain, the (meth) acrylate monomers which have a cyclic ether group in a side chain are mentioned, More specifically, glycidyl (meth) acrylate which has a glycidyl group, jade 3-ethyl-3-oxetanylethyl (meth) acrylate having a cetanyl group, 3,4-epoxycyclohexylmethyl (meth) acrylate having an alicyclic epoxy group, methyl glycid having a substituted methyl group in the glycidyl group The dimethacrylate, the tetrahydrofurfuryl (meth) acrylate which has a tetrahydrofuran ring, etc. are mentioned.

비닐옥시기를 측쇄에 갖는 라디칼 중합성 모노머로는, 아크릴로일기와 비닐옥시기를 일분자 내에 갖는 2-(비닐옥시에톡시)에틸(메타)아크릴레이트를 들 수 있다. 또한, 그 비닐옥시기에 아세트산, 트리플루오로아세트산, 염산 등의 산이 부가된 구조도 본 발명에 제공된다. 수산기를 측쇄에 갖는 라디칼 중합성 모노머로는, 2-히드록시에틸(메타)아크릴레이트, 히드록시프로필(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트의 ε-카프로락톤의 개환 부가물, (메타)아크릴산에스테르의 에틸렌옥사이드 및/또는 프로필렌옥사이드의 혼합 및/또는 단독 부가물 등, 측쇄에 수산기가 있으면 되고, 특별히 제한은 없다. 또한, (2-메틸-2-에틸-1,3-디옥솔란-4-일)메틸(메타)아크릴레이트 등의 (헤미)아세탈 구조, 벤질기, tert-부틸기와 같이 산촉매 등에 의해 잠재적으로 수산기를 발생하는 작용기도 본 발명에 제공된다.As a radically polymerizable monomer which has a vinyloxy group in a side chain, 2- (vinyloxyethoxy) ethyl (meth) acrylate which has an acryloyl group and a vinyloxy group in 1 molecule is mentioned. The present invention also provides a structure in which an acid such as acetic acid, trifluoroacetic acid and hydrochloric acid is added to the vinyloxy group. As a radically polymerizable monomer which has a hydroxyl group in a side chain, ring-opening addition of (epsilon) -caprolactone of 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and 2-hydroxyethyl (meth) acrylate A hydroxyl group should just exist in a side chain, such as water, the mixture of ethylene oxide and / or propylene oxide of (meth) acrylic acid ester, and / or a single adduct, and there is no restriction | limiting in particular. Furthermore, it is potentially a hydroxyl group by an acid catalyst or the like such as a (hemi) acetal structure such as (2-methyl-2-ethyl-1,3-dioxolan-4-yl) methyl (meth) acrylate, a benzyl group, and a tert-butyl group. A functional group for generating is also provided in the present invention.

(B) 아크릴 수지는 통상 상술한 작용기를 측쇄에 갖는 라디칼 중합성 모노머 와 다른 라디칼 중합성 모노머와의 공중합체를 말한다. 다른 라디칼 중합성 모노머로는 (메타)아크릴레이트류를 들 수 있다. 이 (메타)아크릴레이트류의 에스테르기로는, 메틸기, 에틸기, 이소프로필기, n-부틸기, 이소부틸기, tert-부틸기, 2-에틸헥실기, 시클로헥실기, 벤질기, 이소보로닐기, 라우릴기, 미리스틸기 등의 직쇄상, 분기 구조에 관계없이, 비작용성 알킬에스테르를 갖는 것이 바람직하다. 또한, 스티렌, α-메틸스티렌, 아세트산비닐 등, (메타)아크릴레이트류와 공중합 가능한 것은 본 발명의 (B)를 구성하는 단량체로서 이용할 수 있다.The acrylic resin (B) generally refers to a copolymer of a radical polymerizable monomer having a functional group in the side chain and another radical polymerizable monomer. (Meth) acrylates are mentioned as another radically polymerizable monomer. As ester groups of these (meth) acrylates, methyl group, ethyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, 2-ethylhexyl group, cyclohexyl group, benzyl group and isoboro It is preferable to have a nonfunctional alkyl ester, regardless of linear or branched structures, such as a silyl group, a lauryl group, and a myristyl group. Moreover, what can be copolymerized with (meth) acrylates, such as styrene, (alpha) -methylstyrene, and vinyl acetate, can be used as a monomer which comprises (B) of this invention.

이상에서 기재한 작용기를 측쇄에 갖는 라디칼 중합성 모노머와 다른 라디칼 중합성 모노머는 유기 과산화물이나 아조 화합물을 라디칼 중합개시제로서 사용하여, 유기 용제 중에서 라디칼 중합함으로써 공중합체로서 얻어지는데, 그대로 사용해도 상관없지만, 이 공중합체를 포함하는 용제를 함유하는 수지액으로부터 용제분을 탈용제함으로써 아크릴 수지로서 얻어지며, (B)로서 사용한다.The radically polymerizable monomer having the functional group described above and the other radically polymerizable monomer are obtained as a copolymer by radical polymerization in an organic solvent using an organic peroxide or an azo compound as a radical polymerization initiator, but may be used as it is. It is obtained as an acrylic resin by desolving a solvent powder from the resin liquid containing the solvent containing this copolymer, and is used as (B).

(B) 아크릴 수지는 양이온 중합성 작용기를 함유하는 것을 특징으로 하지만, 그 함유량은 경화성의 관점에서(B) 중, 통상 1 ~ 50 중량%、 바람직하게는 1 ~ 30 중량%이다. 또한, 본 발명에 사용하는 (B) 아크릴 수지의gPC에 의한 중량평균분자량(폴리스티렌 환산)은 내구성이나 밀착성의 관점에서 통상 1,000 ~ 100,000, 바람직하게는 1,000 ~ 50,000이다.(B) Although acrylic resin contains a cationically polymerizable functional group, the content is 1-50 weight% normally in (B) from a sclerosis | hardenability viewpoint, Preferably it is 1-30 weight%. In addition, the weight average molecular weight (polystyrene conversion) by gPC of the (B) acrylic resin used for this invention is 1,000-100,000 from a viewpoint of durability and adhesiveness, Preferably it is 1,000-50,000.

[(C) 광 양이온 중합개시제][(C) Photo cationic polymerization initiator]

본 발명에 사용되는 (C) 광 양이온 중합 개시제란, 광에 의해 양이온종 또는 루이스산을 발생하는 화합물이다.The (C) photocationic polymerization initiator used for this invention is a compound which generate | occur | produces a cationic species or Lewis acid by light.

활성 에너지선에 의해 양이온종 또는 루이스산을 발생하는 오늄염 화합물로는 디페닐요오도늄, 4-메톡시디페닐요오도늄, 비스(4-메틸페닐)요오도늄, 비스(4-tert-부틸페닐)요오도늄, 비스(도데실페닐)요오도늄, 트리페닐술포늄, 디페닐-4-티오페녹시페닐설포늄, 비스[4-(디페닐술포니오)-페닐]술피드, 비스[4-(디(4-(2-히드록시에틸)페닐)술포니오)-페닐]술피드, η5-2,4-(시클로펜타디에닐)[1,2,3,4,5,6-η-(메틸에틸)벤젠]-철(1+) 등의 오늄 이온과, 테트라플루오로보레이트, 헥사플루오로포스페이트, 헥사플루오로안티모네이트, 헥사플루오로아르세네이트, 헥사클로로안티모네이트 등의 음이온의 조합으로 이루어지는 화합물을 들 수 있다. 또한, 시판되는 활성 에너지선에 의해 양이온종 또는 루이스산을 발생하는 오늄염으로는 Uvacure 1590, 1591(이상, DAICEL-UCB Company, Ltd. 제, 상품명), San-Aid SI-110, SI-180, SI-100L, SI-80L, SI-60L(이상, 산신 화학공업사 제, 상품명), 아데카 옵토머 SP-100, SP-172, SP-170, SP-152(이상, 아사히덴카사 제, 상품명), 2074(Rhodia사 제, 상품명)등을 들 수 있다.Onium salt compounds that generate cationic species or Lewis acids by active energy rays include diphenyliodonium, 4-methoxydiphenyliodonium, bis (4-methylphenyl) iodonium, and bis (4-tert-butyl Phenyl) iodonium, bis (dodecylphenyl) iodonium, triphenylsulfonium, diphenyl-4-thiophenoxyphenylsulfonium, bis [4- (diphenylsulfonio) -phenyl] sulfide , Bis [4- (di (4- (2-hydroxyethyl) phenyl) sulfonio) -phenyl] sulfide, eta 5-2,4- (cyclopentadienyl) [1,2,3,4, Onium ions such as 5,6-η- (methylethyl) benzene] -iron (1+), tetrafluoroborate, hexafluorophosphate, hexafluoroantimonate, hexafluoroarsenate, hexachloro The compound which consists of combinations of anions, such as an antimonate, is mentioned. Further, onium salts which generate cationic species or Lewis acids by commercially available active energy rays include Uvacure 1590, 1591 (above, manufactured by DAICEL-UCB Company, Ltd., trade name), San-Aid SI-110, and SI-180. , SI-100L, SI-80L, SI-60L (above, manufactured by Sanshin Chemical Co., Ltd.), Adeka Optomer SP-100, SP-172, SP-170, SP-152 (above, made by Asahi Denka Co., Ltd., Trade name), 2074 (manufactured by Rhodia, trade name), and the like.

이상의 광 양이온 중합개시제는 단독으로 사용해도, 2 종류 이상 조합시켜 사용해도 상관없다. 티오크산톤이나 2-에틸안트라퀴논 등의 증감제 등을 첨가하여 사용할 수도 있다. 또한, 활성 에너지선과 열을 병용하여 중합하는 것도 가능하다.The above photo cationic polymerization initiators may be used alone or in combination of two or more kinds thereof. A sensitizer, such as thioxanthone and 2-ethyl anthraquinone, can also be added and used. Moreover, it is also possible to superpose | polymerize using an active energy ray and heat together.

이상의 (A), (B), (C)는 특정의 배합비로 더욱 양호한 경화성과 밀착성을 발현한다. 즉, (A)와 (B)의 합계 100중량부 중, (A) 30 ~ 95중량부, (B) 5 ~ 70중량부이며, 바람직하게는 (A) 50 ~ 95중량부, (B) 5 ~ 50중량부이다. (A), (B)의 배합 량이 이 범위에 있으면, 밀착성, 경화성의 관점에서 바람직하다. 또한, (C)의 배합량은 (A)와 (B)의 합계 100중량부에 대하여, 0.5 ~ 10.0중량부이다. (C)의 배합량이 이 범위에 있으면, 경화성, 내수성, 수지의 착색 문제 등의 관점에서 바람직하다.The above (A), (B), and (C) express even more excellent curability and adhesiveness at a specific compounding ratio. That is, in 100 weight part of (A) and (B) in total, it is (A) 30-95 weight part, (B) 5-70 weight part, Preferably (A) 50-95 weight part, (B) 5 to 50 parts by weight. If the compounding quantity of (A) and (B) exists in this range, it is preferable from a viewpoint of adhesiveness and sclerosis | hardenability. In addition, the compounding quantity of (C) is 0.5-10.0 weight part with respect to a total of 100 weight part of (A) and (B). If the compounding quantity of (C) exists in this range, it is preferable from a viewpoint of sclerosis | hardenability, water resistance, the coloring problem of resin, etc.

본 발명의 조성물에는 필요에 따라 그 외의 수지를 사용할 수 있다. 다른 수지 성분으로는, 예를 들면 폴리부타디엔, 폴리클로로프렌, 폴리에테르, 폴리에스테르, 스티렌-부타디엔-스티렌 블록 공중합체, 석유 수지, 크실렌 수지, 케톤 수지, 셀룰로스 수지, 불소계 올리고머, 실리콘계 올리고머, 폴리술피드계 올리고머 등을 들 수 있다. 이들은 단독으로 또는 다수 종을 조합시켜 사용해도 된다.Other resin can be used for the composition of this invention as needed. As other resin components, for example, polybutadiene, polychloroprene, polyether, polyester, styrene-butadiene-styrene block copolymer, petroleum resin, xylene resin, ketone resin, cellulose resin, fluorine oligomer, silicone oligomer, polysulf Feed oligomers, etc. are mentioned. You may use these individually or in combination of many types.

개질제로는, 예를 들면 중합개시조제(광증감제), 노화방지제, 레벨링제, 습윤성 개량제, 밀착 부여제, 계면활성제, 가소제, 광흡수제 등을 들 수 있다. 이들은 1종 단독으로 또는 다수 종을 조합시켜서 사용해도 된다. 희석제는 도포성 부여 또는 그 향상을 위해 사용될 수 있다. 희석제로는 통상의 유기 용제나 상술한 단작용성 환상 에테르가 이용된다.As a modifier, a polymerization initiator (photosensitizer), an anti-aging agent, a leveling agent, a wettability improving agent, an adhesive agent, surfactant, a plasticizer, a light absorbing agent, etc. are mentioned, for example. You may use these individually by 1 type or in combination of many types. Diluents can be used to impart or improve applicability. As a diluent, the usual organic solvent and the above-mentioned monofunctional cyclic ether are used.

본 발명은 충분한 광경화성을 갖고, 난접착성인 폴리카보네이트, PET를 대표로 하는 경질 플라스틱에 대하여 충분한 접착성을 갖는 광경화형 수지 조성물이므로, 이들 플라스틱의 코팅용 조성물에 사용할 수 있다. 또한, 접착제, 잉크용 바인더 등에 사용할 수 있다. 또한, 고정밀도의 접착성, 도공성을 필요로 하는 광 디스크용 재료, 특히, 보호 코팅제나 광 디스크용 접착제에 사용할 수 있다.Since this invention is a photocurable resin composition which has sufficient photocurability, and has sufficient adhesiveness with respect to the hard plastics which are hard-adhesive polycarbonate and PET, it can be used for the coating composition of these plastics. It can also be used for adhesives, ink binders and the like. Moreover, it can use for the material for optical disks which require high precision adhesiveness and coatability, especially a protective coating agent and the adhesive agent for optical disks.

[[ 실시예Example ]]

이하, 실시예와 비교예에 의해 본 발명을 구체적으로 설명한다. 또한, 경화성과 밀착성에 관해서는 이하의 방법으로 실시예 및 비교예에 관해서 평가를 행하였다.Hereinafter, an Example and a comparative example demonstrate this invention concretely. In addition, about curability and adhesiveness, the Example and the comparative example were evaluated with the following method.

(경화성)(Curable)

광경화형 수지 조성물을 폴리카보네이트판 및 폴리에틸렌테레프탈레이트(PET)판(4.5㎝ × 2.0cm × 0.2cm) 위에 애플리케이터를 이용하여 100㎛로 도포하고, 메탈할라이드 램프로 1 J/㎠ 조사하고, 조사 직후의 폴리카보네이트판 표면의 도막의 경화도를 육안으로 평가하였다. 경화도는 경화하여 점착성(tack)이 없는 것을 ○, 표면만 경화한 것, 또는 표면에 점착성이 있는 것을 △, 전혀 경화하지 않은 것을 ×로 하였다.The photocurable resin composition was applied on a polycarbonate plate and a polyethylene terephthalate (PET) plate (4.5 cm × 2.0 cm × 0.2 cm) using an applicator at 100 μm, irradiated with 1 J / cm 2 with a metal halide lamp, and immediately after irradiation The degree of curing of the coating film on the surface of the polycarbonate plate was evaluated visually. The degree of curing was set to x for those having cured and no tack, those having cured only the surface, or those having adhesiveness on the surface, and no cured at all.

(밀착성)(Adhesiveness)

광경화형 수지 조성물을 폴리카보네이트판 및 폴리에틸렌테레프탈레이트(PET)판(4.5cm × 2.0cm ×0.2cm) 위에 애플리케이터를 이용하여 100㎛로 도포하고, 메탈할라이드 램프로 1 J/㎠ 조사하였다. 이 도막을 JIS K5400 8.5.2에 준하여 2㎜ 스퀘어(square)의 25개의 그리드로 밀착성 시험을 행하였다. 또한, 이 시험편을 85℃ × 80%의 항온 항습 시험기에 100시간 보존하고, 다시 밀착성 시험을 행하였다.The photocurable resin composition was applied on a polycarbonate plate and a polyethylene terephthalate (PET) plate (4.5 cm × 2.0 cm × 0.2 cm) at 100 μm using an applicator and irradiated with 1 J / cm 2 with a metal halide lamp. The coating film was subjected to the adhesion test with 25 grids of 2 mm square in accordance with JIS K5400 8.5.2. Moreover, this test piece was preserve | saved for 100 hours in the 85 degreeC x 80% constant temperature and humidity tester, and the adhesive test was done again.

[제조예 1][Production Example 1]

질소하에서, 교반기, 온도계, 환류 냉각기, 적하조 등을 구비한 내용량 2L의 아크릴 수지 조성물 제조장치에, 크실렌 340.0g을 넣은 후, 중합온도 135℃까지 승 온하였다. 여기에, 라디칼 중합성 모노머로서 메틸메타크릴레이트 400g, 스티렌 50g, 2-히드록시에틸메타크릴레이트 50g, 라디칼 개시제로서 tert-부틸2-에틸헥사노에이트 20g을 혼합한 것을 4시간 걸쳐서 적하하였다. 적하 종료후 1시간 동안 135℃에서 교반을 계속하였다. 이어서, 이 제조 장치를 진공으로 함으로써, 크실렌과 잔존 모노머를 증류 제거하여, (B) 아크릴 수지를 얻었다.Under nitrogen, 340.0 g of xylene was placed in a 2L acrylic resin composition production apparatus equipped with a stirrer, a thermometer, a reflux condenser, a dropping tank, and the like, followed by heating up to a polymerization temperature of 135 ° C. To this, a mixture of 400 g of methyl methacrylate, 50 g of styrene, 50 g of 2-hydroxyethyl methacrylate and 20 g of tert-butyl2-ethylhexanoate as a radical initiator was added dropwise over 4 hours. After completion of the dropping, stirring was continued at 135 ° C for 1 hour. Subsequently, xylene and the residual monomer were distilled off by making this manufacturing apparatus into a vacuum, and (B) acrylic resin was obtained.

[제조예 2 ~ 6, 8][Production Examples 2 to 6, 8]

표 1에 나타내는 라디칼 중합성 모노머와 라디칼 개시제의 양을 변경한 것 이외에는 제조예 1과 동일하게 행하였다.It carried out similarly to manufacture example 1 except having changed the quantity of the radically polymerizable monomer and radical initiator shown in Table 1.

[제조예 7][Manufacture example 7]

표 1에 나타내는 라디칼 중합성 모노머와 라디칼 개시제의 양 및 중합온도를 100℃로 변경한 것 이외는 제조예 1과 동일하게 행하였다.It carried out similarly to the manufacture example 1 except having changed the quantity and polymerization temperature of the radically polymerizable monomer and radical initiator shown in Table 1 to 100 degreeC.

[실시예 1]Example 1

차광성 갈색 병에, (B)로서 제조예 1에서 얻은 아크릴 수지를 10중량부, (A)로서 수소첨가 비스페놀 A형 에폭시 수지(아사히덴카사 제, 아데카레진 EP-4080S) 60중량부와 디[1-에틸(3-옥세타닐)]메틸에테르(동아합성사 제, 아론옥세탄 OXT-221) 30중량부를 넣고, 가열 교반하여, (A)와 (B)가 완전하게 균일해진 것을 확인하였다. 이어서, 이 혼합 수지액이 60℃ 이하가 되었을 때, (C) 양이온 중합개시제로서 (톨릴쿠밀)요오도늄테트라키스(펜타플루오로페닐)보레이트(Rhodia사 제, RHODORSIL PHOTOINITIATOR 2074) 3중량부를 혼합 용해하여, 광경화형 수지 조성물을 얻었다.In the light-shielding brown bottle, 10 parts by weight of the acrylic resin obtained in Production Example 1 as (B), 60 parts by weight of hydrogenated bisphenol A-type epoxy resin (manufactured by Asahi Denka Co., Adecar Resin EP-4080S) as (A) 30 parts by weight of di [1-ethyl (3-oxetanyl)] methyl ether (manufactured by Dong-A Synthetic Co., Ltd., Aaron Oxetane OXT-221) was added thereto, followed by heating and stirring to confirm that (A) and (B) became completely uniform. It was. Subsequently, when this mixed resin liquid became 60 degrees C or less, (C) 3 weight part of (tolyl cumyl) iodonium tetrakis (pentafluorophenyl) borate (RHODORSIL PHOTOINITIATOR 2074 made from Rhodia) was mixed as a cationic polymerization initiator. It melt | dissolved and obtained the photocurable resin composition.

이 양이온 중합성 수지 조성물을 상기 평가 방법에 따라 평가한 결과를 표 3에 나타냈다.Table 3 shows the results of evaluating the cationically polymerizable resin composition according to the above evaluation method.

[실시예 2 ~ 11][Examples 2 to 11]

표 2에 나타내는 성분(A), 성분(B) 및 성분(C)의 종류 및 양을 변화시킨 것 이외에는 실시예 1과 동일하게 배합하고, 평가하여, 결과를 표 3에 나타냈다.Except having changed the kind and quantity of component (A), component (B), and component (C) shown in Table 2, it mix | blended similarly to Example 1, evaluated, and the result was shown in Table 3.

또한, 실시예 4에 관해서는 폴리에틸렌테레프탈레이트판과의 밀착성 시험을 하고, 그 결과를 표 4에 나타냈다.In addition, about Example 4, the adhesive test with the polyethylene terephthalate plate was done, and the result was shown in Table 4.

[비교예 1]Comparative Example 1

차광성 갈색 병에, (A)로서 수소첨가 비스페놀 A형 에폭시 수지(아사히덴카사 제, 아데카레진 EP-4080S) 70중량부와 디[1-에틸(3-옥세타닐)]메틸에테르(동아합성사 제, 아론옥세탄 OXT-221) 30중량부, (C) 양이온 중합개시제로서(톨릴쿠밀)요오도늄테트라키스(펜타플루오로페닐)보레이트(Rhodia사 제, RHODORSIL PHOTOINITIATOR 2074) 3중량부를 혼합 용해하여, 광경화형 수지 조성물을 얻었다. 이 광경화형 수지 조성물을 상기 평가 방법을 따라 평가하여, 그 결과를 표 3에 나타냈다.In the light-shielding brown bottle, 70 parts by weight of hydrogenated bisphenol A type epoxy resin (manufactured by Asahi Denka Co., Adecarazine EP-4080S) and di [1-ethyl (3-oxetanyl)] methyl ether (A) 30 parts by weight of Aaroniaxetane OXT-221 manufactured by Dong-A Synthetic Co., Ltd. (C) 3 parts by weight of iodonium tetrakis (pentafluorophenyl) borate (RHODORSIL PHOTOINITIATOR 2074, manufactured by Rhodia) as a cationic polymerization initiator (tolylcumyl) It melt | dissolved and obtained the photocurable resin composition. This photocurable resin composition was evaluated in accordance with the above evaluation method, and the results are shown in Table 3.

또한, 폴리에틸렌테레프탈레이트판과의 밀착성 시험을 행하여, 그 결과를 표 4에 나타냈다.Moreover, the adhesive test with the polyethylene terephthalate plate was done, and the result was shown in Table 4.

[비교예 2]Comparative Example 2

차광성 갈색 병에, (A)로서 수소첨가 비스페놀 A형 에폭시 수지(아사히덴카사 제, 아데카레진 EP-4080S) 68중량부와 디[1-에틸(3-옥세타닐)]메틸에테르(동아 합성사 제, 아론옥세탄 OXT-221) 30중량부, (C) 양이온 중합개시제로서(톨릴쿠밀)요오도늄테트라키스(펜타플루오로페닐)보레이트(Rhodia사 제, RHODORSIL PHOTOINITIATOR 2074) 3중량부를 혼합 용해하였다. 여기에, 일본 공개특허 2003-212965에 개시되어 있는 앵커가 염기이고, 실온에서 액체의 빗살형 폴리머인 폴리(에틸렌이민)-폴리(1,2-히드록시스테아르산) 그라프트 폴리머(Avecia Ltd. 제, Solsperse 28000) 2중량부를 배합하여 광경화형 수지 조성물을 얻었다.68 parts by weight of hydrogenated bisphenol A epoxy resin (manufactured by Asahi Denka Co., Adecarazine EP-4080S) and di [1-ethyl (3-oxetanyl)] methyl ether (A) 3 parts by weight of Aaron Oxetane OXT-221) and 30 parts by weight of (C) cationic polymerization initiator (tolyl cumyl) iodonium tetrakis (pentafluorophenyl) borate (Rhodias, RHODORSIL PHOTOINITIATOR 2074) Mixed and dissolved. Here, the anchor disclosed in Japanese Patent Laid-Open No. 2003-212965 is a base, and a poly (ethyleneimine) -poly (1,2-hydroxystearic acid) graft polymer (Avecia Ltd.) is a comb-like polymer of liquid at room temperature. 2 parts by weight of Solsperse 28000) was prepared to obtain a photocurable resin composition.

이 광경화형 수지 조성물을 상기 평가 방법을 따라 평가한 결과를 표 3에 나타냈다.Table 3 shows the results of evaluating the photocurable resin composition according to the above evaluation method.

[비교예 3]Comparative Example 3

차광성 갈색 병에, 성분(B)로서, 제조예 6에서 얻은 아크릴 수지를 10중량부, 성분(A)로서 수소첨가 비스페놀 A형 에폭시 수지(아사히덴카사 제, 아데카레진 EP-4080S) 60중량부와 디[1-에틸(3-옥세타닐)]메틸에테르(동아합성사 제, 아론옥세탄 OXT-221) 30중량부를 넣고, 가열 교반하여, (A)와 (B)가 완전하게 균일해진 것을 확인했다. 이어서, 이 혼합 수지액이 60℃ 이하가 되었을 때, (C) 양이온 중합개시제로서 (톨릴쿠밀)요오도늄테트라키스(펜타플루오로페닐)보레이트(Rhodia사 제, RHODORSIL PHOTOINITIATOR 2074) 3중량부를 혼합 용해하여, 광경화형 수지 조성물을 얻었다.10 parts by weight of the acrylic resin obtained in Production Example 6 as a component (B) and a hydrogenated bisphenol A type epoxy resin (manufactured by Asahi Denka Co., Adecarazine EP-4080S) as a component (B) in a light-shielding brown bottle 60 Part by weight and 30 parts by weight of di [1-ethyl (3-oxetanyl)] methyl ether (manufactured by Dong-A Synthetic Co., Ltd., Aaron Oxetane OXT-221) were added to the mixture, followed by heating and stirring, so that (A) and (B) were completely uniform. Confirmed Subsequently, when this mixed resin liquid became 60 degrees C or less, (C) 3 weight part of (tolyl cumyl) iodonium tetrakis (pentafluorophenyl) borate (RHODORSIL PHOTOINITIATOR 2074 made from Rhodia) was mixed as a cationic polymerization initiator. It melt | dissolved and obtained the photocurable resin composition.

이 양이온 중합성 수지 조성물을 상기 평가 방법을 따라 평가한 결과를 표 3에 나타냈다.Table 3 shows the results of evaluating the cationically polymerizable resin composition according to the above evaluation method.

제조예 1Preparation Example 1 제조예 2Preparation Example 2 제조예 3Preparation Example 3 제조예 4Preparation Example 4 제조예 5Preparation Example 5 제조예 6Preparation Example 6 제조예 7Preparation Example 7 제조예 8Preparation Example 8 작용기 함유 라디칼 중합성 모노머Functional group containing radically polymerizable monomer 2-히드록시에틸메타크릴레이트2-hydroxyethyl methacrylate 1010 55 1010 1010 글리시딜메타크릴레이트Glycidyl methacrylate 1010 55 3-에틸-3-옥세타닐에틸메타크릴레이트3-ethyl-3-oxetanylethyl methacrylate 1010 메타크릴산2-(비닐옥시에톡시)에테르Methacrylic acid 2- (vinyloxyethoxy) ether 1010 비작용성 라디칼 중합성 모노머Nonfunctional Radical Polymerizable Monomer 메틸메타크릴레이트Methyl methacrylate 8080 8080 8080 8080 8080 8585 8080 8080 스티렌Styrene 1010 1010 1010 1010 1010 1515 1010 1010 라디칼 개시제Radical initiator tert-부틸2-에틸헥사노에이트tert-butyl2-ethylhexanoate 44 44 44 44 44 44 0.050.05 1515 중량평균분자량 (폴리스티렌 환산)Weight average molecular weight (polystyrene equivalent) 1200012000 1300013000 1100011000 2500025000 1300013000 1200012000 200000200000 900900

실시예Example 비교예Comparative example 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 실시예 5Example 5 실시예 6Example 6 실시예 7Example 7 실시예 8Example 8 실시예 9Example 9 실시예 10Example 10 실시예 11Example 11 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 성분(A)Ingredient (A) 아데카레진 EP-4080SAde car resin EP-4080S 6060 6060 6060 6060 6060 3030 3030 6060 6060 1515 6565 7070 6868 6060 에포믹 R140Epoic R140 1010 에피코트 1007Epicoat 1007 1010 아론옥세탄 OXT-221Aaron oxetane OXT-221 3030 3030 3030 3030 3030 3030 2525 3030 3030 1515 3030 3030 3030 3030 아데카레진 KRM2110Ade car resin KRM2110 1010 β-피넨옥사이드β-pinene oxide 55 성분(B)Ingredient (B) 제조예1Preparation Example 1 1010 4040 1010 제조예2Preparation Example 2 1010 7070 55 제조예3Preparation Example 3 1010 제조예4Preparation Example 4 1010 제조예5Preparation Example 5 1010 제조예6Preparation Example 6 1010 제조예7Preparation Example 7 1010 제조예8Preparation Example 8 1010 첨가물additive Solsperse28000Solsperse28000 22 성분(C)Ingredient (C) RHODORSIL PHOTOINITIATOR 2074RHODORSIL PHOTOINITIATOR 2074 33 33 33 33 33 33 33 33 33 33 33 33 33 33

평가 항목 Evaluation item 실시예Example 비교예Comparative example 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 실시예 5Example 5 실 시 예 6Example 6 실시예 7Example 7 실시예 8Example 8 실시예 9Example 9 실시예 10Example 10 실시예 11Example 11 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 경화성Curable ×× 밀착성Adhesion 초기Early 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 20/ 2520/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 0/ 250/25 -- 25/ 2525/25 가속시험후After accelerated test 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 25/ 2525/25 20/ 2520/25 20/ 2520/25 25/ 2525/25 20/ 2520/25 0/ 250/25 -- 0/ 250/25

평가항목Evaluation item 실시예 4Example 4 비교예 1Comparative Example 1 경화성Curable 밀착성Adhesion 초기Early 25/2525/25 20/2520/25 가속 시험후After acceleration test 25/2525/25 15/2515/25

본 발명의 광경화형 수지 조성물은 충분한 경화성을 갖고, 또한 난접착성인 경질 플라스틱인 폴리카보네이트, PET 등에 밀착하고, 가속 시험후에도 동일한 밀착성을 유지할 수 있다. 또한, 본 발명의 광경화형 수지 조성물을 이용하면, 폴리카보네이트, PET 등의 경질 플라스틱을 이용하고 있는 부재의 코팅재, 접착제, 잉크, 각종 실링재 등에 사용가능하다.The photocurable resin composition of this invention has sufficient sclerosis | hardenability, adheres to polycarbonate, PET, etc. which are hard-adhesive hard plastics, and can maintain the same adhesiveness even after an accelerated test. Moreover, when the photocurable resin composition of this invention is used, it can be used for the coating material, adhesive agent, ink, various sealing materials, etc. of members using hard plastics, such as polycarbonate and PET.

Claims (9)

(A) 양이온 중합성 화합물, (B) 아크릴 수지, (C) 광 양이온 중합개시제를 함유하고, (B) 아크릴 수지가 양이온 중합성 작용기를 가지며, (A)와 (B)의 합계 100중량부 중, (A)가 30 ~ 95중량부, (B)가 5 ~ 70중량부인 것을 특징으로 하는 광경화형 수지 조성물.(A) Cationically polymerizable compound, (B) Acrylic resin, (C) Photocationic polymerization initiator containing, (B) Acrylic resin has a cationically polymerizable functional group, 100 weight part of total of (A) and (B) In (A), 30-95 weight part and (B) are 5-70 weight part, The photocurable resin composition characterized by the above-mentioned. 제 1 항에 있어서, (B) 아크릴 수지의 양이온 중합성 작용기가 환상 에테르기, 비닐옥시기, 비닐옥시기의 산부가체, 활성수소기 중 어느 1 종류 이상을 함유하는 것을 특징으로 하는 광경화형 수지 조성물.The photocurable resin according to claim 1, wherein the cationic polymerizable functional group of the acrylic resin (B) contains any one or more of cyclic ether groups, vinyloxy groups, acid addition groups of vinyloxy groups, and active hydrogen groups. Composition. 제 2 항에 있어서, (B) 아크릴 수지의 양이온 중합성 작용기의 활성수소기가 수산기인 것을 특징으로 하는 광경화형 수지 조성물.The photocurable resin composition according to claim 2, wherein the active hydrogen group of the cationic polymerizable functional group of the acrylic resin (B) is a hydroxyl group. 제 1 항에 있어서, (B) 아크릴 수지의 중량평균분자량(폴리스티렌 환산)이 1,000 ~ 100,000의 범위인 것을 특징으로 하는 광경화형 수지 조성물.The photocurable resin composition according to claim 1, wherein the weight average molecular weight (polystyrene equivalent) of the acrylic resin (B) is in the range of 1,000 to 100,000. 제 1 항에 있어서, (A) 양이온 중합성 화합물이 환상 에테르기를 함유하는 것을 특징으로 하는 광경화형 수지 조성물.The photocurable resin composition according to claim 1, wherein the cationic polymerizable compound (A) contains a cyclic ether group. 제 5 항에 있어서, (A) 양이온 중합성 화합물이 에폭시기 및/또는 옥세타닐기를 함유하는 것을 특징으로 하는 광경화형 수지 조성물.The photocurable resin composition according to claim 5, wherein the cationic polymerizable compound (A) contains an epoxy group and / or an oxetanyl group. 제 1 항 내지 제 6 항 중 어느 한 항의 광경화형 수지 조성물을 함유하여 이루어지는 것을 특징으로 하는 플라스틱용 코팅 조성물.The coating composition for plastics containing the photocurable resin composition of any one of Claims 1-6. 제 1 항 내지 제 6 항 중 어느 한 항의 광경화형 수지 조성물을 함유하여 이루어지는 것을 특징으로 하는 플라스틱용 접착제 조성물.The adhesive composition for plastics containing the photocurable resin composition of any one of Claims 1-6. 제 1 항 내지 제 6 항 중 어느 한 항의 광경화형 수지 조성물을 함유하여 이루어지는 것을 특징으로 하는 플라스틱용 잉크 조성물.The ink composition for plastics containing the photocurable resin composition of any one of Claims 1-6.
KR20050065596A 2004-07-22 2005-07-20 Photocurable resin composition and resin composition for plastics comprising the same KR100649439B1 (en)

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