KR100646372B1 - An installing structure of ball grid array type integrated circuit - Google Patents

An installing structure of ball grid array type integrated circuit Download PDF

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Publication number
KR100646372B1
KR100646372B1 KR1020050123241A KR20050123241A KR100646372B1 KR 100646372 B1 KR100646372 B1 KR 100646372B1 KR 1020050123241 A KR1020050123241 A KR 1020050123241A KR 20050123241 A KR20050123241 A KR 20050123241A KR 100646372 B1 KR100646372 B1 KR 100646372B1
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South Korea
Prior art keywords
integrated circuit
mounting
ball grid
grid array
array type
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KR1020050123241A
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Korean (ko)
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나광균
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주식회사 대우일렉트로닉스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A mounting structure of an integrated circuit for a ball lattice arrangement type is provided to recycle an integrated circuit of a ball lattice arrangement type by using an additional component in which an integrated circuit of a ball lattice arrangement type is attached to a PCB without being soldered to the printed circuit board. A mounting part(21) having a mounting groove(22) corresponding to an integrated circuit(30) of a ball lattice arrangement type is formed in a PCB(20). At least one mounting hole(23) is formed in a position adjacent to the mounting part. An installation member(40) attaches the integrated circuit to the mounting part, coupled to the mounting hole by a hook, including a leg(41), a connection unit(42) and a pressurizing part(43). The leg is coupled to the mounting hole by a hook. The connection unit interconnects the upper parts of the legs. The pressurizing part pressurizes the integrated circuit while surrounding the integrated circuit, extended from the connection unit.

Description

볼 격자 배열 방식용 집적회로의 장착 구조{AN INSTALLING STRUCTURE OF BALL GRID ARRAY TYPE INTEGRATED CIRCUIT}INSTALLATION STRUCTURE OF BALL GRID ARRAY TYPE INTEGRATED CIRCUIT}

도 1은 종래 볼 격자 배열 방식의 집적회로와 인쇄회로기판의 결합 관계를 나타내는 도면.1 is a view showing a coupling relationship between a conventional ball grid array integrated circuit and a printed circuit board.

도 2는 본 발명에 따른 설치부재를 통해 집적회로가 인쇄회로기판에 장착되는 상태를 나타내는 분해 사시도.2 is an exploded perspective view showing a state in which an integrated circuit is mounted on a printed circuit board through an installation member according to the present invention.

도 3은 도 2의 결합 단면도.3 is a cross sectional view of FIG. 2.

*도면의 주요부분에 대한 부호의 설명** Explanation of symbols for main parts of drawings *

20 : 인쇄회로기판 21 : 장착부20: printed circuit board 21: mounting portion

22 : 장착홈 23 : 장착홀22: mounting groove 23: mounting hole

30 : 집적회로 40 : 설치부재30: integrated circuit 40: mounting member

41 : 레그 42 : 연결대41: leg 42: connecting rod

43 : 가압부 44 : 가이드판43: press portion 44: guide plate

45 : 가압판 46 : 가압대45: pressure plate 46: pressure plate

본 발명은 볼 격자 배열 방식의 집적회로가 인쇄회로기판의 장착부에 안착된 상태에서, 설치부재가 상기 인쇄회로기판에 고정되면서 집적회로를 가압하여 줌으로써, 집적회로의 납땜 공정이 삭제되고 교환 및 재사용이 가능한 것을 특징으로 하는 볼 격자 배열 방식용 집적회로의 장착 구조에 관한 것이다.According to the present invention, in a state in which a ball grid array integrated circuit is mounted on a mounting portion of a printed circuit board, the mounting member is fixed to the printed circuit board to pressurize the integrated circuit so that the soldering process of the integrated circuit is eliminated and replaced and reused. The present invention relates to a mounting structure of an integrated circuit for a ball grating arrangement method.

일반적으로 집적회로(集積回路;integrated circuit)는 많은 전자회로 소자가 하나의 기판(基板:substrate) 위 또는 기판 자체에 분리가 불가능한 상태로 결합되어 있는 초소형 구조의 기능적인 복합적 전자소자 또는 시스템을 말한다.In general, an integrated circuit refers to a functional complex electronic device or system having a micro structure in which many electronic circuit devices are inseparably coupled onto a substrate or to the substrate itself. .

상기한 집적회로 중에서 볼 격자 배열 방식(Ball Grid Array Type)은 집적회로의 바닥부분에 다수의 볼이 박혀있는 형태로 이루어진 패키지이다.Among the integrated circuits, a ball grid array type is a package in which a plurality of balls are embedded in a bottom portion of the integrated circuit.

이러한 볼 격자 배열 방식의 집적회로(BGA IC)는 인두를 사용하지 않고 별도의 실장장비를 통해 인쇄회로기판과 결합시키게 된다.The ball grid array integrated circuit (BGA IC) is combined with a printed circuit board through a separate mounting device without using a soldering iron.

도 1은 종래 볼 격자 배열 방식의 집적회로와 인쇄회로기판의 결합 관계를 나타내는 도면이다.1 is a view showing a coupling relationship between a conventional ball grid array integrated circuit and a printed circuit board.

도시된 바와 같이, 볼 격자 배열 방식의 집적회로(10)는 바닥부분에 납땜(11) 부분이 다수 돌출 형성된다.As shown, in the ball grid array type integrated circuit 10, a plurality of solder 11 portions protrude from the bottom portion.

상기 볼 격자 배열 방식의 집적회로(10)가 인쇄회로기판(12)에 장착되도록, 상기 인쇄회로기판(12)의 장착부(13)에는 상기 각 납땜(11)에 대응하는 장착홈(14) 이 형성된다.Mounting grooves 14 corresponding to the respective solders 11 are provided in the mounting portion 13 of the printed circuit board 12 so that the ball grid array integrated circuit 10 is mounted on the printed circuit board 12. Is formed.

상기 장착홈(14)에는 전기적 신호가 이동하기 위한 재질로 성형된다.The mounting groove 14 is formed of a material for moving an electrical signal.

따라서, 상기 볼 격자 배열 방식의 집적회로(10) 바닥부분에 형성된 납땜(11) 부분이 장착부(13)의 각 장착홈(14)에 위치하도록 한 다음, 별도의 실장 장비(미도시)를 통해 볼 격자 배열 방식의 집적회로(10)와 인쇄회로기판(12)을 가압하여 열을 가하면, 상기 납땜(11)이 장착홈(14)에서 녹으면서 볼 격자 배열 방식의 집적회로(10)가 인쇄회로기판(12)의 장착홈(14)에 실장된다.Therefore, the solder 11 portion formed on the bottom portion of the ball grid array integrated circuit 10 is positioned in each mounting groove 14 of the mounting portion 13, and then, through a separate mounting device (not shown). When the ball grid array integrated circuit 10 and the printed circuit board 12 are pressed and heated, the solder 11 melts in the mounting groove 14 and the ball grid array integrated circuit 10 is printed. The mounting groove 14 of the circuit board 12 is mounted.

그러나, 상기 실장장비는 가격이 비싸 볼 격자 배열 방식의 집적회로를 장착하기 위한 비용이 증대되는 문제점이 있다.However, the mounting equipment has a problem in that the cost for mounting the ball grid array type integrated circuit is expensive.

그리고, 상기 볼 격자 배열 방식의 집적회로는 한번 인쇄회로기판에 실장된 후에는 인쇄회로기판에서 분리하여 재실장할 수 없기 때문에, 실장 불량이 발생하더라도 볼 격자 배열 방식의 집적회로를 재사용할 수 없는 문제점이 있다.Since the ball grid array integrated circuit cannot be remounted from the printed circuit board after being mounted on the printed circuit board, the ball grid array integrated circuit cannot be reused even if a mounting defect occurs. There is a problem.

특히, 볼 격자 배열 방식의 집적회로에 대한 테스트를 하는 경우, 볼 격자 배열 방식의 집적회로에 대한 재실장이 이루어지지 않아, 많은 비용이 소요되는 문제점이 있다.In particular, when testing a ball grid array integrated circuit, a remounting of the ball grid array integrated circuit is not performed, which leads to a high cost.

이에 본 발명은 상기와 같은 문제점들을 해소하기 위해 안출된 것으로서, 본 발명은 볼 격자 배열 방식의 집적회로가 인쇄회로기판에 납땜되지 않으면서 밀착되는 별도의 부품을 통해, 볼 격자 배열 방식의 집적회로를 재사용 가능하게함을 목 적으로 한다.Accordingly, the present invention has been made to solve the above problems, the present invention is a ball grid array integrated circuit through a separate component in which the ball grid array integrated circuit is in close contact without being soldered to the printed circuit board The goal is to make it reusable.

상기와 같은 목적을 달성하기 위한 본 발명은 볼 격자 배열 방식용 집적회로에 대응하는 장착홈을 갖는 장착부가 형성되며 상기 장착부의 근접한 곳에 하나 이상의 장착홀이 형성되는 인쇄회로기판과; 상기 장착홀에 후크 결합하면서 볼 격자 배열 방식용 집적회로를 장착부에 밀착시키는 설치부재를 포함하는 것을 특징으로 하는 볼 격자 배열 방식용 집적회로의 장착 구조를 제공한다.The present invention for achieving the above object is a printed circuit board having a mounting portion having a mounting groove corresponding to the integrated circuit for the ball grid array method is formed in one or more mounting holes in the vicinity of the mounting portion; It provides a mounting structure of the ball grid array type integrated circuit comprising a mounting member for closely coupling the ball grid array type integrated circuit to the mounting portion while being hooked to the mounting hole.

상기한 장착구조는 설치부재가 볼 격자 배열 방식의 집적회로를 가압하여 장착부에 밀착시켜 줌으로써, 납땜 작업이 생략되더라도 상기 집적회로의 설치가 가능하고, 납땜 작업이 생략되기 때문에 집적회로의 재설치도 가능해진다.In the above mounting structure, the mounting member presses the integrated circuit of the ball grid array type and closely adheres to the mounting part, so that the integrated circuit can be installed even if the soldering work is omitted, and the integrated circuit can be reinstalled because the soldering work is omitted. Become.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

또한, 본 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 단지 예시로 제시된 것이며, 종래 구성과 동일한 부분은 동일한 부호 또는 명칭을 사용한다.In addition, this embodiment is presented by way of example only, not limiting the scope of the present invention, the same parts as the conventional configuration uses the same reference numerals or names.

도 2는 본 발명에 따른 설치부재를 통해 집적회로가 인쇄회로기판에 장착되는 상태를 나타내는 분해 사시도이고, 도 3은 도 2의 결합 단면도이다.2 is an exploded perspective view illustrating a state in which an integrated circuit is mounted on a printed circuit board through an installation member according to the present invention, and FIG. 3 is a cross-sectional view of FIG.

도시한 바와 같이, 인쇄회로기판(20)에는 장착부(21)가 형성되고, 상기 장착부(21)에는 다수의 장착홈(22)이 형성된다.As illustrated, the mounting portion 21 is formed in the printed circuit board 20, and a plurality of mounting grooves 22 are formed in the mounting portion 21.

그리고, 상기 장착부(21)에 근접하여 하나 이상의 장착홀(23)이 형성되는데, 상기 장착홀(23)은 사각형상의 장착부(21) 각 모서리에서 일정간격 떨어져 위치하 는 것이 바람직하다.In addition, one or more mounting holes 23 are formed in close proximity to the mounting portion 21, and the mounting holes 23 are preferably spaced apart from each corner by a rectangular mounting portion 21.

상기 장착부(21)에는 볼 격자 배열 방식용 집적회로(30)이 안착되는데, 상기 집적회로(30)는 도1에 나타난 바와 같이 상기 장착홈(22)에 대응하는 다수의 납땜부분이 바닥에 돌출 형성된다.A ball grid array type integrated circuit 30 is seated in the mounting portion 21. As shown in FIG. 1, a plurality of solder parts corresponding to the mounting groove 22 protrude from the bottom. Is formed.

이때, 상기 집적회로(30)가 인쇄회로기판(20)의 장착부(21)에 설치되도록 설치부재(40)가 상기 장착홀(23)에 후크 결합하게 된다.At this time, the installation member 40 is hooked to the mounting hole 23 so that the integrated circuit 30 is installed in the mounting portion 21 of the printed circuit board 20.

상기 설치부재(40)는 레그(41), 연결대(42) 및 가압부(43)로 이루어지는데, 상기 레그(41)는 끝단의 후크 형상을 통해 각 장착홀(23)에 고정된다.The installation member 40 is composed of a leg 41, the connecting table 42 and the pressing portion 43, the leg 41 is fixed to each mounting hole 23 through the hook shape of the end.

상기 연결대(42)는 각 레그(41)의 상단에서 연장되어 서로 레그(41)를 서로 연결시키게 되는데, 도 2와 같이 일수평선상에 있는 레그(41)를 서로 연결시킬 수 있으며, 일수직선상에 있는 레그(41)를 서로 연결시키거나 일수직선 및 일수평선상에 있는 레그(41)를 동시에 연결시킬 수 있다.The connecting table 42 extends from the upper end of each leg 41 to connect the legs 41 to each other, as shown in Figure 2 can connect the legs 41 on the horizontal line with each other, in a vertical line It is possible to connect the legs 41 on each other or to connect the legs 41 on a straight line and a horizontal line at the same time.

이러한 연결대(42)의 수직 하방으로는 인쇄회로기판(20)의 장착부(21)가 위치하지 않도록 한다.The mounting portion 21 of the printed circuit board 20 is not positioned below the connection table 42.

상기 가압부(43)는 상기 연결대(42)에서 연장되어 볼 격자 배열 방식용 집적회로(30)를 감싸면서 가압하게 된다.The pressing part 43 extends from the connecting table 42 and presses while wrapping the integrated circuit 30 for the ball grid array method.

본 발명에서는 이러한 가압부(43)의 일예로 가이드판(44), 가압판(45), 가압대(46) 및 나사(47)로 이루어진다.In the present invention, as an example of the pressing portion 43, the guide plate 44, the pressing plate 45, the pressing table 46 and the screw 47.

상기 가이드판(44)은 연결대(42)에서 연장 형성되며 볼 격자 배열 방식용 집적회로(30)를 감싸도록 사각형상을 갖는다.The guide plate 44 extends from the connecting table 42 and has a quadrangular shape to surround the integrated circuit 30 for the ball grid array method.

또한, 상기 가이드판(44)은 상기 집적회로(30)의 상하 이동이 원활하도록 상하방이 개방된 형상을 가져, 집적회로(30)를 장착부(21)로 안내하게 된다.In addition, the guide plate 44 has a shape in which the upper and lower sides are opened to smoothly move the integrated circuit 30 up and down, thereby guiding the integrated circuit 30 to the mounting portion 21.

상기 가압대(46)는 가이드판(44)의 상측에서 연장 형상되어 서로 이격된 가이드판(44)을 연결시키고, 상기 가압대(46)의 중간 부분에는 가압홀(46a)이 형성된다.The pressing bar 46 extends from the upper side of the guide plate 44 to connect the guide plates 44 spaced apart from each other, and a pressing hole 46a is formed in the middle portion of the pressing plate 46.

그리고, 상기 나사(47)가 상기 가압홀(46a)에 체결되는데, 상기 나사(47)로 인한 가압력 향상을 위해, 가이드판(44) 내부에는 가압판(45)이 형성되는바, 보다 바람직하게는 집적회로(30)와 나사(47) 사이에 위치한다.In addition, the screw 47 is fastened to the pressure hole 46a. In order to improve the pressing force due to the screw 47, the pressure plate 45 is formed inside the guide plate 44, more preferably. It is located between the integrated circuit 30 and the screw 47.

상기와 같은 구조로 이루어진 본 발명의 작용 및 효과는 다음과 같다.The action and effect of the present invention made of the above structure is as follows.

인쇄회로기판(20)의 장착부(21)에 볼 격자 배열 방식용 집적회로(30)를 안착시키고, 설치부재(40)를 인쇄회로기판(20)에 장착한다.The ball grid array type integrated circuit 30 is mounted on the mounting portion 21 of the printed circuit board 20, and the mounting member 40 is mounted on the printed circuit board 20.

그리하면, 상기 설치부재(40)의 레그(41)가 각 장착홀(23)에 삽입되어 걸림 고정되면서 가압부(43)가 상기 집적회로(30)를 가압함으로써, 상기 집적회로(30)의 바닥부분이 장착부(21)의 장착홈(23)에 밀착된다.Then, the leg 41 of the installation member 40 is inserted into each of the mounting holes 23 and locked, so that the pressing unit 43 presses the integrated circuit 30, thereby preventing the integrated circuit 30. The bottom part is in close contact with the mounting groove 23 of the mounting portion 21.

이로인해 상기 집적회로(30)와 인쇄회로기판(20)은 전기적 신호가 서로 전송 가능해진다.As a result, the integrated circuit 30 and the printed circuit board 20 may transmit electrical signals to each other.

이때, 상기 집적회로(30)는 가압부(43)의 가이드판(44)에 의해 장착부(21)의 상방에 정확하게 위치하게 된다.At this time, the integrated circuit 30 is accurately positioned above the mounting portion 21 by the guide plate 44 of the pressing portion 43.

그리고, 나사(47)가 가압홀(46a)에 체결되면서 하단부분이 집적회로(30)를 눌러줌으로써, 상기 집적회로(30)는 외부 충격이 가해지더라도 인쇄회로기판(20)에 서 이탈되지 않고 안정적으로 설치된 상태를 유지하게 된다.And, as the screw 47 is fastened to the pressing hole 46a, the lower portion presses the integrated circuit 30 so that the integrated circuit 30 is not detached from the printed circuit board 20 even when an external impact is applied. Maintains stable installation.

이때, 상기 집적회로(30)에 손상이 발생하는 것을 방지하고, 집적회로(30)의 상면에 골고루 가압하는 효과를 내기 위해, 상기 집적회로(30)의 상부에 가압판(45)이 올려지고, 상기 나사(47)는 가압판(45)을 매개로 집적회로(30)를 인쇄회로기판(20)의 장착부(21)에 밀착시킨다.At this time, in order to prevent damage to the integrated circuit 30 and to evenly press the upper surface of the integrated circuit 30, the pressing plate 45 is placed on the upper portion of the integrated circuit 30, The screw 47 adheres the integrated circuit 30 to the mounting portion 21 of the printed circuit board 20 via the pressure plate 45.

한편, 상기한 상태에서 집적회로(30)의 교환이 필요한 경우, 상기 나사(47)를 풀어주어 집적회로(30)가 인쇄회로기판(20)에서 이탈되도록 한 다음, 상기 집적회로(30)를 설치부재(40)에서 빼어낸 다음 다른 집적회로를 동일한 곳에 위치시키면 된다.On the other hand, when the integrated circuit 30 needs to be replaced in the above state, the screw 47 is loosened so that the integrated circuit 30 is separated from the printed circuit board 20, and then the integrated circuit 30 is removed. After removing it from the installation member 40, another integrated circuit may be placed in the same place.

상기한 교환 방식 외에, 인쇄회로기판(20)의 장착홀(23)에 후크 결합하는 설치부재(40)의 탈부착을 통해 집적회로(30)를 인쇄회로기판(20)에서 탈부착할 수 있다.In addition to the exchange method described above, the integrated circuit 30 may be detachable from the printed circuit board 20 by attaching and detaching the installation member 40 hooked to the mounting hole 23 of the printed circuit board 20.

상기한 바와 같이 본 발명에 따른 볼 격자 방식용 집적회로의 장착 구조는 설치부재를 통해 집적회로가 인쇄회로기판에 납땜되지 않고서도 결합된 상태를 유지하는 효과가 있다.As described above, the mounting structure of the ball grid type integrated circuit according to the present invention has an effect of maintaining the combined state of the integrated circuit without being soldered to the printed circuit board through the installation member.

이러한 설치부재를 통한 결합을 통해, 종래와 같은 고가인 실장장치에 대한 구매가 사라져 생산비용을 절감하게 되는 효과가 있다.Through the coupling through the installation member, there is an effect that the purchase for the expensive mounting device as described above is lost, thereby reducing the production cost.

또한, 인쇄회로기판에서 집적회로의 지속적인 탈부착이 가능하여, 집적회로 의 테스트 비용을 절감하는 이점이 있다.In addition, since the integrated circuit can be continuously detached from the printed circuit board, there is an advantage in reducing the test cost of the integrated circuit.

Claims (3)

볼 격자 배열 방식용 집적회로에 대응하는 장착홈을 갖는 장착부가 형성되며 상기 장착부의 근접한 곳에 하나 이상의 장착홀이 형성되는 인쇄회로기판과;A printed circuit board having a mounting groove having a mounting groove corresponding to an integrated circuit for a ball grid array type and having at least one mounting hole formed in the vicinity of the mounting portion; 상기 장착홀에 후크 결합하면서 볼 격자 배열 방식용 집적회로를 장착부에 밀착시키는 설치부재를 포함하는 것을 특징으로 하는 볼 격자 배열 방식용 집적회로의 장착 구조.And a mounting member for closely coupling the ball grid array type integrated circuit to the mounting portion while being hooked to the mounting hole. 제 1항에 있어서, 상기 설치부재는 장착홀에 각각 후크 결합하는 레그와;According to claim 1, wherein the installation member is a leg coupled to each of the mounting holes; 상기 레그의 상단을 서로 연결시키는 연결대와;A connecting rod connecting the upper ends of the legs with each other; 상기 연결대에서 연장되어 볼 격자 배열 방식용 집적회로를 감싸면서 가압하는 가압부로 이루어지는 것을 특징으로 하는 볼 격자 배열 방식용 집적회로의 장착 구조.Mounting structure of the ball grid array type integrated circuit, characterized in that consisting of a pressing unit extending from the connecting rod and pressurizing surrounding the ball grid array type integrated circuit. 제 1항에 있어서, 상기 가압부는 상기 연결대에서 연장되고 볼 격자 배열 방식용 집적회로를 감싸 장착부로 안내하는 가이드판과;According to claim 1, wherein the pressing portion extending from the connecting rod and the guide plate for wrapping the integrated circuit for the ball grid array type guides to the mounting portion; 상기 가이드판의 상측에서 연장 형상되며 가압홀이 형성되는 가압대와;A pressing table extending from an upper side of the guide plate and having a pressing hole formed therein; 상기 가압홀에 체결되는 나사와;A screw fastened to the pressure hole; 상기 가이드판의 내부에 위치하여 나사에 눌러지는 가압판을 포함하여 이루어지는 것을 특징으로 하는 볼 격자 배열 방식용 집적회로의 장착 구조.Mounting structure of the ball grid array type integrated circuit, characterized in that it comprises a pressing plate which is located inside the guide plate pressed on the screw.
KR1020050123241A 2005-12-14 2005-12-14 An installing structure of ball grid array type integrated circuit KR100646372B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009061128A2 (en) * 2007-11-06 2009-05-14 Young Seok Jung Thin film connector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030049694A (en) * 2001-12-17 2003-06-25 삼성전자주식회사 Circuit board having groove for protecting delamination and ball grid array package comprising it
JP2003229445A (en) 2002-02-04 2003-08-15 Hitachi Ltd Method of manufacturing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030049694A (en) * 2001-12-17 2003-06-25 삼성전자주식회사 Circuit board having groove for protecting delamination and ball grid array package comprising it
JP2003229445A (en) 2002-02-04 2003-08-15 Hitachi Ltd Method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009061128A2 (en) * 2007-11-06 2009-05-14 Young Seok Jung Thin film connector
WO2009061128A3 (en) * 2007-11-06 2009-07-02 Young Seok Jung Thin film connector

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