KR100642160B1 - 백, 전자 디바이스용 백 및 패키지 반도체 디바이스용 백 - Google Patents

백, 전자 디바이스용 백 및 패키지 반도체 디바이스용 백 Download PDF

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Publication number
KR100642160B1
KR100642160B1 KR1020047005653A KR20047005653A KR100642160B1 KR 100642160 B1 KR100642160 B1 KR 100642160B1 KR 1020047005653 A KR1020047005653 A KR 1020047005653A KR 20047005653 A KR20047005653 A KR 20047005653A KR 100642160 B1 KR100642160 B1 KR 100642160B1
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KR
South Korea
Prior art keywords
bag
bags
sidewall
moisture
transparent material
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020047005653A
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English (en)
Korean (ko)
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KR20040045852A (ko
Inventor
나지브 칸 수라티
탁 성 쌍
체 핑 베네딕트 로
비 포 크리스틴 엔지
웨이 리안 제니 옹
콕 쳉 베르나드 영
칭 윤 타이
Original Assignee
인피네온 테크놀로지스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20040045852A publication Critical patent/KR20040045852A/ko
Application granted granted Critical
Publication of KR100642160B1 publication Critical patent/KR100642160B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D79/00—Kinds or details of packages, not otherwise provided for
    • B65D79/02—Arrangements or devices for indicating incorrect storage or transport
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • B65D81/267—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants the absorber being in sheet form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Food Science & Technology (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Bag Frames (AREA)
KR1020047005653A 2001-10-19 2001-10-19 백, 전자 디바이스용 백 및 패키지 반도체 디바이스용 백 Expired - Fee Related KR100642160B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Publications (2)

Publication Number Publication Date
KR20040045852A KR20040045852A (ko) 2004-06-02
KR100642160B1 true KR100642160B1 (ko) 2006-11-08

Family

ID=20429001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047005653A Expired - Fee Related KR100642160B1 (ko) 2001-10-19 2001-10-19 백, 전자 디바이스용 백 및 패키지 반도체 디바이스용 백

Country Status (6)

Country Link
US (1) US20050023178A1 (https=)
EP (1) EP1436218B1 (https=)
JP (1) JP2005508815A (https=)
KR (1) KR100642160B1 (https=)
DE (1) DE60122023T2 (https=)
WO (1) WO2003042072A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10351118A1 (de) * 2003-11-03 2005-06-16 Abb Patent Gmbh Elekroinstallationsgerät des Außenbereichs
DK176388B1 (da) * 2004-07-21 2007-10-29 Resq As Emballage til emballering af sikkerheds- og redningsudstyr samt anvendelse af emballagen hertil
JP2008524612A (ja) * 2004-12-22 2008-07-10 ジュート−ヒェミー アクチェンゲゼルシャフト 少なくとも１つの化学成分を検出するための装置
US20070056870A1 (en) * 2005-07-27 2007-03-15 Alps Electric Co., Ld Elastic reusable wrapping product and system
EP1840046A1 (de) * 2006-03-29 2007-10-03 Mondi Packaging AG Verpackung mit Temperaturanzeige
CA2869788C (en) * 2006-07-12 2016-07-05 Genpak Lp Packaging roll stock with windows
US8829634B2 (en) * 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device
US20100327015A1 (en) * 2009-06-25 2010-12-30 Nihon Kim Co., Ltd. Storage container
DE102014215404A1 (de) * 2014-08-05 2016-02-11 Robert Bosch Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Halbleitermaterials
CA3047134A1 (en) * 2016-12-30 2018-07-05 Nuscale Power, Llc Combined shipping protection and impingement detection wrap
DE102022109618A1 (de) 2021-04-28 2022-11-03 Dräger Safety AG & Co. KGaA Anordnung umfassend ein Atemschutzgerät und einen Beutel mit einem Feuchte-Indikator und Verfahren zur Herstellung einer solchen Anordnung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446361A (en) * 1945-07-09 1948-08-03 Herbert B Clibbon Moisture vapor indicator for packaged goods
US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
US3768976A (en) * 1971-05-20 1973-10-30 Us Army Temperature-time integrating indicator
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US5274914A (en) * 1986-11-25 1994-01-04 Hitachi, Ltd. Method of producing surface package type semiconductor package
US4813791A (en) * 1987-09-18 1989-03-21 Multiform Desiccants, Inc. Bag with integral material treating packets
US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
US5318181A (en) * 1992-03-31 1994-06-07 Motorola, Inc. Compartmentalized humidity sensing indicator
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
US5791485A (en) * 1994-10-24 1998-08-11 Raytheon Company Electrostatic discharge protection bag
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator
US6536370B2 (en) * 1998-11-25 2003-03-25 Advanced Micro Devices, Inc. Elapsed time indicator for controlled environments and method of use
US6119853A (en) * 1998-12-18 2000-09-19 Glaxo Wellcome Inc. Method and package for storing a pressurized container containing a drug
US6531197B2 (en) * 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container

Also Published As

Publication number Publication date
JP2005508815A (ja) 2005-04-07
DE60122023D1 (de) 2006-09-14
EP1436218A1 (en) 2004-07-14
US20050023178A1 (en) 2005-02-03
KR20040045852A (ko) 2004-06-02
WO2003042072A1 (en) 2003-05-22
EP1436218B1 (en) 2006-08-02
WO2003042072A8 (en) 2004-05-27
DE60122023T2 (de) 2007-03-08

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