KR100640949B1 - 시모스 이미지 센서의 단위화소 회로 - Google Patents
시모스 이미지 센서의 단위화소 회로 Download PDFInfo
- Publication number
- KR100640949B1 KR100640949B1 KR1020040114841A KR20040114841A KR100640949B1 KR 100640949 B1 KR100640949 B1 KR 100640949B1 KR 1020040114841 A KR1020040114841 A KR 1020040114841A KR 20040114841 A KR20040114841 A KR 20040114841A KR 100640949 B1 KR100640949 B1 KR 100640949B1
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- KR
- South Korea
- Prior art keywords
- transistor
- photosensitive device
- image sensor
- cmos image
- charge control
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- 238000009792 diffusion process Methods 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 238000007599 discharging Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001444 catalytic combustion detection Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14654—Blooming suppression
- H01L27/14656—Overflow drain structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/779—Circuitry for scanning or addressing the pixel array
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (2)
- 광감지소자;상기 광감지소자에서 모아진 광전하를 플로팅확산영역으로 운송하기 위한 트랜스퍼 트랜지스터;상기 광감지소자와 연결되며 리셋기능을 하는 리셋 트랜지스터;상기 광감지소자로부터 신호를 인가받아 소오스 팔로워 버퍼 증폭기 역할을 하는 드라이브 트랜지스터;상기 드라이브 트랜지스터와 연결되며, 어드레싱 역할을 하는 셀렉트 트랜지스터;상기 광감지소자와 상기 리셋 트랜지스터 사이에 설치되며, 상기 광감지소자의 과전하를 제거하는 전하조절 트랜지스터를 포함하는 것을 특징으로 하는 시모스 이미지 센서의 단위화소 회로.
- 제 1 항에 있어서, 상기 전하조절 트랜지스터의 일측단자는 상기 트랜스퍼 트랜지스터의 일측단자와 상기 광감지소자의 일측단자와 공유하고, 상기 전하조절 트랜지스터의 타측단자는 상기 리셋 트랜지스터와 상기 드라이브 트랜지스터의 일측단자와 연결되는 것을 특징으로 시모스 이미지 센서의 단위화소 회로.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040114841A KR100640949B1 (ko) | 2004-12-29 | 2004-12-29 | 시모스 이미지 센서의 단위화소 회로 |
US11/318,503 US7211847B2 (en) | 2004-12-29 | 2005-12-28 | CMOS image sensor |
CNB2005101329498A CN100555644C (zh) | 2004-12-29 | 2005-12-29 | 互补金属氧化物硅图像传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040114841A KR100640949B1 (ko) | 2004-12-29 | 2004-12-29 | 시모스 이미지 센서의 단위화소 회로 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060076429A KR20060076429A (ko) | 2006-07-04 |
KR100640949B1 true KR100640949B1 (ko) | 2006-11-02 |
Family
ID=36610393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040114841A KR100640949B1 (ko) | 2004-12-29 | 2004-12-29 | 시모스 이미지 센서의 단위화소 회로 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7211847B2 (ko) |
KR (1) | KR100640949B1 (ko) |
CN (1) | CN100555644C (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100835892B1 (ko) * | 2007-03-26 | 2008-06-09 | (주)실리콘화일 | 칩 적층 이미지센서 |
CN102044548B (zh) | 2009-10-20 | 2013-01-23 | 中芯国际集成电路制造(上海)有限公司 | Cmos图像传感器 |
CN111901540B (zh) * | 2014-12-26 | 2023-05-23 | 松下知识产权经营株式会社 | 摄像装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000092395A (ja) | 1998-09-11 | 2000-03-31 | Nec Corp | 固体撮像装置およびその駆動方法 |
US7381936B2 (en) * | 2004-10-29 | 2008-06-03 | Ess Technology, Inc. | Self-calibrating anti-blooming circuit for CMOS image sensor having a spillover protection performance in response to a spillover condition |
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2004
- 2004-12-29 KR KR1020040114841A patent/KR100640949B1/ko active IP Right Grant
-
2005
- 2005-12-28 US US11/318,503 patent/US7211847B2/en active Active
- 2005-12-29 CN CNB2005101329498A patent/CN100555644C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1819231A (zh) | 2006-08-16 |
CN100555644C (zh) | 2009-10-28 |
KR20060076429A (ko) | 2006-07-04 |
US7211847B2 (en) | 2007-05-01 |
US20060138472A1 (en) | 2006-06-29 |
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