KR100640519B1 - Oscillator and method of manufacturing the same - Google Patents

Abstract

An oscillator and a method for manufacturing the same are provided to save the production time and to prevent the contact errors due to a small size of IC terminals and the narrow space between integrated circuits when inputting data. A package for mounting many IC chips is arranged and a package array is formed(S701). The IC chip is mounted on the package for mounting many IC chips(S702). The mounted IC chip is bonded with the package for mounting many IC chips(S703). The package for mounting IC chips is molded(S704). A package for mounting many piezoelectric elements is coupled on the package for mounting many IC chips, many assemblies are formed(S705). The data is inputted into the IC chip mounted in the many assemblies(S706). The many assemblies are disassembled with the respective assembly(S708).

Description

Oscillator and its manufacturing method {OSCILLATOR AND METHOD OF MANUFACTURING THE SAME}

1 is an exploded perspective view of an oscillator according to the prior art

2 is a bottom view of an oscillator according to the prior art

3 is a flowchart illustrating a method of manufacturing an oscillator according to the prior art.

Figure 4 is an exploded perspective view of the oscillator according to the present invention

5 is a bottom view of the oscillator according to the present invention.

6 is a plan view of a package array formed according to the present invention.

7 is a flowchart illustrating a method of manufacturing an oscillator according to the present invention.

<Description of Major Symbols in Drawing>

400: oscillator 410: package with a piezoelectric element (crystal)

411: Package for piezoelectric element (crystal piece) mounting 412: Piezoelectric element (crystal piece)

413 cover 420 IC package

421: IC chip mounting package 421a: first ceramic layer 421b: second ceramic layer 421c: third ceramic layer 422: IC chip 424: package bonding pad 425: IC chip terminal pad 426: wire 427: solder pad 501a: power supply Terminal 501b: Frequency output terminal 501c: Voltage control terminal 501d: Ground terminal

The present invention relates to an oscillator and a method of manufacturing the same, and by performing most of the oscillator manufacturing process in a package array state, not only can reduce the time loss and impact on the package that can occur during the manufacturing process, but also the package By forming IC terminals on the top of the array, process time can be shortened, and contact defects that can occur due to the small size of IC terminals or the gap between IC terminals at the time of data input can be prevented. An oscillator capable of securing a space and a method of manufacturing the same.

In general, the crystal oscillator is small and stable frequency can be obtained against external environment change, so it is used for the character composition and color composition circuit in computer, communication equipment, etc. Products such as crystal oscillators (TCXOs) and constant temperature controlled crystal oscillators (OCXOs) are also used as core components that are the basis for all signals in satellites and measuring instruments in space.

Recently, the development of information communication and digital technology has been used in the high frequency range, the demand for fast data processing and the demand for new materials, components, modules and substrates is increasing, especially in the case of mobile communication components, miniaturization In accordance with the trend of multiband and high frequency, the miniaturization, high integration and high frequency of oscillator are required.

These oscillators are mainly made up of 0.024CC [5.0mm (length) * 3.2mm (width) * 1.5mm (thickness)], but as the miniaturization of parts accelerates, 0.008CC [3.2mm (length) * 2.5mm ( Width * 1.0mm (thickness)] and 0.004CC [2.5mm (length) * 2.0mm (width) * 0.8mm (thickness)] products are expected to be mainstream. For this purpose, miniaturization of oscillator parts, innovation of manufacturing method, and light and small size should be realized.

1 is an exploded perspective view of an oscillator according to the prior art, the conventional oscillator 100, as shown in Figure 1, the package 110 is mounted with a piezoelectric element 112 for causing oscillation, the oscillation circuit, temperature compensation The package 120 including the IC chip 122 in which the circuit, the voltage regulating circuit, and the memory unit such as EEPROM or RAM are integrated is formed in a dual structure in which a vertical structure is combined.

At this time, as the piezoelectric element 112 for generating a frequency, a crystal piece 112 having excellent frequency stability is usually used.

That is, the package 110 on which the crystal piece 112 is mounted includes a first ceramic layer (not shown) having a circuit pattern (not shown) formed on an upper surface thereof, and a second ceramic stacked along the edge of the first ceramic layer. It consists of a crystal piece mounting package 111 made of a layer (not shown), a crystal piece 112 mounted therein and a cover 113 for sealing a space in which the crystal piece 112 is mounted. On the surface of the crystal piece 112, electrodes of a predetermined pattern are formed. At this time, the cover is typically using a lid (lid), thereby protecting the crystal piece 112 in the crystal piece mounting package 111 from the outside.

The crystal piece 112 is horizontally raised by a die bonding method through a metal bump (not shown) once so that power is supplied from the outside to one side of the upper surface of the first ceramic layer, and the other end thereof is provided as a free end. do.

In addition, the package 120 on which the IC chip 122 is mounted includes a first ceramic layer 121a having a circuit pattern (not shown) formed on an upper surface thereof, and a second and third ceramic layer 121b stacked along the edge thereof. And an IC chip mounting package 121 consisting of 121c and an IC chip 122 adhesively fixed onto the first ceramic layer 121a.

In addition, the left and right sides of the IC chip mounting package 121 are electrically connected to the internal circuit parts of the IC chip 122 to input and adjust data into the memory, and to output the adjusted data to the outside. The plurality of IC terminals 123a, 123b, 123c, and 123d is formed.

The IC chip 122 in which various circuit parts and memory parts are integrated is protruded in a step shape inward in a state where it is adhesively fixed to the upper surface of the first ceramic layer 121a, which is the bottom surface of the IC chip mounting package 121. Wire bonding between the plurality of bonding pads 124 mounted on the protrusion of the second ceramic layer 121b and the plurality of terminal pads 125 mounted on the upper surface of the IC chip 122 with wires 126 ( While electrically connecting them to each other by wire bonding, the internal space in which the IC chip 122 is mounted is molded. In this case, epoxy resin is generally used as a molding material.

The package 110 on which the crystal piece 112 formed as described above is mounted, and the package 120 on which the IC chip 112 is mounted, have another package 120 on which the IC chip 112 is mounted. The solder pad 127 and the crystal piece formed on the upper surface of the package 120 on which the IC chip 112 is mounted, the lower part being a package 110 on which the crystal piece 112 is mounted. The package 110 on which the crystal piece 112 is mounted and the IC chip 122 are mounted by being integrally bonded to each other by solder balls interposed between pads formed on the bottom surface of the package 110 on which the 112 is mounted. An oscillator 100 having a dual structure consisting of the package 120 is formed.

2 shows a bottom view of an oscillator according to the prior art.

As shown in FIG. 2, a power supply terminal 201a, a frequency output terminal 201b, and a voltage control terminal are provided at a bottom edge of an IC chip mounting package 121 mounted on an upper surface of a main board (not shown). A plurality of external terminals used as the 201c and the grounding terminal 201d are formed, and they are electrically connected to the terminal pads 125 so as to supply power to the IC chip 122 and output a compensated frequency. Is connected. At this time, the generated oscillation frequency is monitored through the frequency output terminal 201b, thereby adjusting the characteristics of the oscillation frequency.

Reference numerals 123a to 123d denote IC terminals. The IC terminals 123a, 123b, 123c, and 123d are terminal portions formed by recessing conductive materials with a predetermined thickness in grooves formed by recessing the left and right sides of the long side of the package 120 on which the IC chip 122 is mounted. .

3 is a flowchart illustrating a method of manufacturing an oscillator according to the related art shown in FIGS. 1 and 2.

Referring to Figure 3 described in detail the manufacturing method of the oscillator according to the prior art as follows.

First, a package is loaded into a tray (S301).

Next, the IC chip is mounted on the lower portion of the cavity formed in the package (S302).

Next, the IC chip mounted on the package and the package surface are bonded (S303).

Next, the inside of the package in which the IC chip is mounted is molded (S304).

Next, a plurality of assemblies are formed by bonding the package on which the crystal piece is mounted on the package on which the IC chip is mounted (S305).

Then, data is input to the IC chip mounted in the assembly (S306).

Here, in the data input method, the data input / output is moved toward the package on which the IC chip is mounted, and the data is inputted to the IC through the IC terminal while the probe tip and the corresponding IC terminal of the data input / output contact each other. Input into chip

Then, through the frequency output terminal formed on the back of the assembly, the characteristics of the oscillation frequency is adjusted (S307).

At this time, the method for adjusting the oscillation frequency, through the frequency output terminal, and monitors whether the oscillation frequency is the frequency desired by the user (S307a), and if the measurement value corresponds to the frequency desired by the user, a separate correction ( Complete the manufacture of the oscillator without going through the compensation process.

However, if the measured value does not correspond to the frequency desired by the user, the oscillator is completed after a separate correction (compensation) process of inputting new data according to the measured value into the IC chip (S307b).

However, in the conventional method of manufacturing the oscillator as described above, the process of inserting and extracting into the tray must be repeated for each step, so that time loss occurs, and the tray is made of steel or a material of high strength so that the ceramic component When loading the package in the tray, the package is damaged because of the impact is applied to the package.

Meanwhile, as shown in FIG. 1, the oscillator 100 having such a structure is designed to be miniaturized while miniaturization of components mounted on a product and complex modularization between adjacent components, such that the package 120 on which the IC chip 122 is mounted. As the length, width, and thickness of the circuit boards become shorter, narrower, and thinner, the grooves formed on the left and right outer walls of the IC chip mounting package 121 to form the IC terminals 123a, 123b, 123c, and 123d. The space occupied also has a significant meaning, and there is a problem that the IC chip cannot be mounted by the space.

In addition, in accordance with the miniaturization of the oscillator 100, a gap D between the IC terminals 123a, 123b, 123c, and 123d, which is provided in pairs on the left and right outer walls of the package 120 on which the IC chip 122 is mounted. ) Also decreases according to the reduction ratio of the oscillator 100, and accordingly, the size of the IC terminals 123a, 123b, 123c, and 123d formed in via holes on the outer wall of the package 120 on which the IC chip 122 is mounted. In reducing the size, there was a problem that a process limit occurs.

 In addition, the IC terminal 123a of the package 120 in which the data input / output 128 having a pair of probes 129 and 130 is disposed on the left and right sides of the oscillator 100 and the IC chip 122 is mounted. In the operation of inputting / outputting data through the 123b, 123c, and 123d, the space D between the adjacent IC terminals 123a and 123b or between the other IC terminals 123c and 123d is narrow, so that the terminals are adjacent to each other. And / or the possibility of poor contact between the probes 129 and 130 is very high.

In addition, the gap D1 between the probes 129 and 130 used to input and output data by contacting the tip portions of the IC terminals 123a, 123b, 123c, and 123d must be reduced in accordance with the reduced terminal spacing. In order to reduce the gap D1 between the probes 129 and 130 in accordance with the miniaturized design of the oscillator 100 which is miniaturized by the trend, it is not easy to change the structure of the data input / output 128 or to manufacture a new one. Rather, there was a problem in that excessive costs were required for restructuring and remanufacturing.

Accordingly, the present invention has been made to solve the above problems, and by proceeding most of the oscillator fabrication in the package array state, not only can reduce the time loss and impact applied to the package, but also the package By forming IC terminal on the upper surface of G-array, process time can be shortened, and contact defects that can appear due to small size of IC terminal or small gap between IC terminals during data input can be prevented. The present invention provides an oscillator capable of securing a space and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a method of manufacturing an oscillator, comprising: a package array forming step of aligning a plurality of IC chip mounting packages to form a package array; An IC chip mounting step of mounting an IC chip in the plurality of IC chip mounting packages; Bonding the mounted IC chip with the plurality of IC chip mounting packages; A molding step of molding a plurality of IC chip mounting packages on which the IC chip is mounted; An assembly forming step of bonding a plurality of piezoelectric element mounting packages on which the piezoelectric element is mounted to form a plurality of assemblies on the plurality of IC chip mounting packages on which the IC chips are mounted; A data input step of inputting predetermined data into IC chips mounted in the plurality of assemblies; And separating the plurality of assemblies into respective assemblies.

Here, a crystal piece is used as the piezoelectric element.

In the data input step, the data is input through a common IC terminal formed in the package array.

At this time, in the data input step, characterized in that to simultaneously input data to the IC chip mounted in the plurality of assemblies.

In the data input step, in the data input step, data may be selectively input to IC chips mounted in the plurality of assemblies.

The method may further include adjusting a characteristic of the oscillation frequency after the data input step.

In addition, the method of adjusting the characteristics of the oscillation frequency, characterized in that for adjusting while monitoring the oscillation frequency through the frequency output terminal formed on the surface of the IC chip mounting package.

On the other hand, the oscillator according to the present invention for achieving the above object, the IC chip is a predetermined data input via a common IC terminal formed in the package array; An IC chip mounting package on which the IC chip is mounted; And a piezoelectric element mounting package coupled to the IC chip mounting package and mounted with a piezoelectric element.

Here, the oscillator is formed on the IC chip mounting package surface, characterized in that it further comprises a frequency output terminal for outputting the oscillation frequency to adjust the oscillation frequency.

In addition, the piezoelectric element is characterized in that the crystal piece.

In addition, at least one of the IC chip mounting package and the piezoelectric element mounting package may be formed by stacking a plurality of ceramic layers to form an internal space.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 and 5 show an exploded perspective view and a bottom view of the oscillator according to the present invention.

As shown in Figs. 4 and 5, the oscillator 400 according to the present invention inputs data into a storage unit of the IC chip 422 and adjusts it from the storage unit of the IC chip 422 by a manufacturing process to be described later. Miniaturized design is possible as the IC terminal used to output the data to the outside is removed. Such an oscillator 400 is a package 410 on which the crystal piece 412 is mounted and a package 420 on which the IC chip is mounted. The reference numerals 423a to 423d denote positions where the IC terminal and the IC chip are electrically connected in the prior art (see FIG. 1).

In this embodiment, a crystal piece 412 having excellent frequency stability is used as the piezoelectric element 412.

In addition, it is to be understood that the structure of the oscillator 400 constructed by the present invention is selectively applicable to a voltage controlled crystal oscillator (VCXO), a temperature compensated crystal oscillator (TCXO), a constant temperature controlled crystal oscillator (OCXO), and the like.

First, as shown in FIG. 4, the package 410 on which the crystal piece 412 is mounted has a crystal piece mounting package having a concave internal space having a predetermined size so that the rectangular crystal piece 412 is mounted in the internal space. 411 and a cover 413 covering the upper portion. In this case, the cover typically uses a lid so that the quartz crystal piece 412 in the crystal piece mounting package 411 is protected from the outside.

The crystal piece mounting package 411 includes a first ceramic layer (not shown) printed with a circuit pattern on an upper surface thereof, and a second ceramic layer having a rectangular frame shape stacked along an outer edge thereof to form a concave inner space. The cover 413 is bonded to the upper surface of the crystal piece mounting package 411 in a soldering manner so as to completely block the internal space in which the crystal piece 412 is mounted from the outside.

Meanwhile, the package 420 on which the IC chip 422 is mounted is composed of an IC chip mounting package 421 having a concave internal space of a predetermined size so that the IC chip 422 integrated with various circuit parts and storage parts is mounted thereon. The IC chip mounting package 421 may include a first ceramic layer 421a printed with a circuit pattern on an upper surface thereof and at least one second ceramic layer having a rectangular frame shape stacked along an outer edge thereof to form a concave inner space. 421b and a third ceramic layer 421c.

The second ceramic layer 421b has a protrusion extending to an internal space, a plurality of bonding pads 424 are formed on the protrusion, and a plurality of terminal pads are formed on an upper surface of the corresponding IC chip 422. 425 is formed to bond the bonding pads 424 and the terminal pads 425 to be electrically connected. In this case, wire bonding or flip bonding is used.

In the oscillator 400 having the above-described configuration, the crystal piece 412 is mounted on the upper surface of the oscillator 400 with the IC chip 422 of the package 420 on which the IC chip 422 is mounted. The package 410 is stacked on top of the package 410, and the package 410 on which the stacked crystal pieces 412 are mounted and the package 420 on which the IC chip 422 is mounted are formed. Solder balls are inserted between the solder pads formed on the first ceramic layer of the package 410 and the solder pads 427 formed on the third ceramic layer 421c of the package 420 on which the IC chip 422 is mounted. It is joined integrally through the media.

On the other hand, as shown in Figure 5, the bottom edge of the IC chip mounting package 421 mounted on the upper surface of the main board (not shown), the power terminal 501a, the frequency output terminal 501b, voltage A plurality of external terminals used as the control terminal 501c and the ground terminal 501d are formed, and these terminal pads 425 are configured to supply power to the IC chip 422 and output a compensated frequency. Is electrically connected to the At this time, the generated oscillation frequency is monitored through the frequency output terminal 501b, thereby adjusting the characteristics of the oscillation frequency.

In addition, reference numerals 423a to 423d denote the positions where the IC terminal and the IC chip are electrically connected. Conventionally, grooves are formed by recessing the left and right sides of the long side of the package in which the IC chip is mounted, thereby forming the IC terminal in the groove. The space occupied by the home was not available. However, in the case of the present invention, the IC chip mounting package 421 formed by the manufacturing process described later eliminates the space occupied by the grooves as the IC terminal, which is an essential configuration in the prior art, is not required by the manufacturing process. It can be secured.

Here, the speed at which the IC chip 422 is miniaturized with time cannot follow the speed at which the surface of the IC chip mounting package 421 is miniaturized with time, so that the IC chip 422 is mounted accordingly. The space occupied by the grooves of the conventional IC chip mounting package 421 has a significant meaning.

For example, the sizes of the surfaces of the IC chip 422 and the IC chip mounting package 421 which are commonly used at present are 1.6 mm x 1.2 mm and 2.5 mm x 2.0 mm, respectively. In addition, in order to form a conductive material for electrically connecting the IC chip 422 and the IC terminal, a certain amount of space for the IC chip mounting package 421 must be secured, and thus the size of the mounted IC chip 422 is increased. In comparison, the space of the IC chip mounting package 421 becomes relatively small.

Therefore, according to the prior art, there is a considerable difficulty in mounting the IC chip 422 in the IC chip mounting package 421 space.

In addition, although an IC chip mounting package 421 having a size of 2.0 mm x 1.6 mm has been developed, it takes some time to develop an IC chip suitable for mounting in the IC chip mounting package 421.

Therefore, according to the present invention, it is possible to secure the space occupied by the grooves formed for the IC terminal in the prior art, the size of the IC chip 422 is suitable for mounting the IC chip 422 Even if larger than the size of the surface of the package 421, the IC chip 422 can be mounted immediately.

On the other hand, Figure 6 shows a plan view of a package array formed by the present invention.

 As shown in FIG. 6, the package 420 on which the plurality of IC chips 422 are mounted is aligned to form a package array 600, and in the state of the package array 600, the crystal piece 412. ) Mounted package 410 is assembled on the package 420 on which the IC chip 422 is mounted.

Conventionally, there is a problem that the package is damaged and time is lost by performing a process of loading a package in a tray, but in the case of the present invention, the process of loading a tray is performed because the manufacturing process described below is performed in a package array state. This eliminates the need for damage to the package due to impacts on the package, as well as saving time for insertion and extraction into the tray.

 Two terminals 601c and 601d of the IC terminals are formed on the upper surface of the package array 600, and the other two terminals 601a and 601b are formed in each of the plurality of packages 420 on which the IC chip is mounted.

The two terminals 601c and 601d formed on the upper surface of the package array 600 are clock and data input / output terminals, and are commonly connected to the IC chips 422 mounted in the plurality of packages 420, and the other two terminals 601a are provided. , 601b is a terminal for a chip select (CS) and a terminal for a utility (UTIL) and is individually connected to each of a plurality of packages 420 on which the IC chip 422 is mounted. Therefore, since data can be simultaneously input through the two terminals 601c and 601d formed on the package array 600, the overall process time for manufacturing the oscillator can be shortened.

7 is a flowchart illustrating a method of manufacturing an oscillator according to the present invention.

Referring to Figure 7 described in detail the manufacturing method of the oscillator according to the present invention.

First, a package array is formed by aligning the plurality of IC chip mounting packages (S701).

Then, in the package array state, the IC chip is mounted on the lower portion of the cavity formed in each IC chip mounting package (S702).

Then, in the package array state, the IC chip mounted on each IC chip mounting package and the surface of the IC chip mounting package are bonded (S703).

Next, in the package array state, a plurality of IC chip mounting packages on which the IC chip is mounted are molded (S704).

Here, molding is performed for the purpose of preventing deterioration or failure due to moisture or vibration, and is typically molded by filling an epoxy resin in a plurality of packages on which the IC chip is mounted.

Then, in the package array state, a plurality of assemblies are formed by bonding the package on which the crystal piece is mounted on each IC chip mounting package on which the IC chip is mounted (S705).

Then, in the package array state, data is input to the IC chip mounted in the assembly (S706).

Here, in the data input method, the data input / output unit is moved toward a plurality of packages on which the IC chip is mounted, and the data is inputted through the IC terminal while the probe tip of the data input / output unit and the corresponding IC terminal contact each other. Input into the IC chip.

In this case, data is input through two IC terminals 601c and 601d formed on the upper surface of the package array and two IC terminals 601a and 601b formed in each of the plurality of packages on which the IC chip is mounted. Data can be selectively inputted by simultaneously inputting data to a plurality of packages through a terminal or by only operating a power supply voltage of a corresponding package.

In addition, in the related art, as the package on which the IC chip is mounted becomes smaller, the spacing between the IC terminals becomes narrower, and there is a lot of poor contact between the probe and the IC terminal of the data input / output unit. However, in the present invention, the IC is disposed on the upper surface of the package array. By forming the terminals, the spacing between the IC terminals can be widened, thereby preventing contact failure between the probe of the data input / output unit and the IC terminals.

Next, in the package array state, the characteristic of the oscillation frequency is adjusted through the frequency output terminal formed on the rear surface of the assembly (S707).

At this time, the method for adjusting the oscillation frequency, through the frequency output terminal to monitor whether the oscillation frequency is the frequency desired by the user (S707a), and if the measurement value does not correspond to the frequency desired by the user, the IC chip After a separate correction (compensation) process of inputting new data according to the measured value (S707b), the process proceeds to step S708 to be described later.

However, in some cases, if the crystal oscillates at a frequency desired by the user, adjusting the characteristics of the oscillation frequency (S707) may be omitted.

Finally, in the package array state, the manufacture of the oscillator according to the present embodiment is completed by separating the plurality of assemblies into respective assemblies (S708).

In this case, as the plurality of assemblies on the package array are separated into respective assemblies, two IC terminals 601c and 601d formed on the upper surface of the package array and two IC terminals formed on each of the plurality of packages on which the IC chip is mounted ( Since 601a and 601b are removed, the space occupied by the groove formed for the IC terminal in the related art can be secured.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be appreciated that such substitutions, changes, and the like should be considered to be within the scope of the following claims.

As described above, according to the oscillator and the manufacturing method according to the present invention, by proceeding most of the process in the package array state, the process of inserting and extracting the tray every step can be omitted to prevent time loss, In addition, the process of loading the tray is omitted, thereby reducing the impact on the package.

In addition, as the IC terminal is formed on the upper surface of the package array, data can be input to multiple packages at the same time, thereby shortening the process time, and the contact that may appear due to the small size of the IC terminal or a small gap between the IC terminals during data input. Defects can be prevented and the space on the package surface required for mounting the IC chip can be secured.

Claims (11)

A package array forming step of forming a package array by aligning a plurality of IC chip mounting packages; An IC chip mounting step of mounting an IC chip in the plurality of IC chip mounting packages; Bonding the mounted IC chip with the plurality of IC chip mounting packages; A molding step of molding a plurality of IC chip mounting packages on which the IC chip is mounted; An assembly forming step of bonding a plurality of piezoelectric element mounting packages on which the piezoelectric element is mounted to form a plurality of assemblies on the plurality of IC chip mounting packages on which the IC chips are mounted; A data input step of inputting predetermined data into IC chips mounted in the plurality of assemblies; And Separating the plurality of assemblies into respective assemblies; oscillator manufacturing method comprising a The method of claim 1, An oscillator manufacturing method characterized by using a crystal piece as the piezoelectric element. The method of claim 1, In the data input step, the data is input via the common IC terminal formed in the package array, characterized in that the oscillator manufacturing method The method of claim 1, In the data input step, the oscillator manufacturing method characterized in that for simultaneously inputting data to the IC chip mounted in the plurality of assemblies The method of claim 1, In the data input step, the oscillator manufacturing method characterized in that for selectively inputting data to the IC chip mounted in the plurality of assemblies The method of claim 1, After the data input step, the oscillator manufacturing method characterized in that it further comprises the step of adjusting the characteristics of the oscillation frequency The method of claim 6, The method of adjusting the characteristics of the oscillation frequency, Oscillator manufacturing method characterized in that the monitoring by adjusting the oscillation frequency through the frequency output terminal formed on the surface of the IC chip mounting package An IC chip to which predetermined data is input through a common IC terminal formed in the package array; An IC chip mounting package on which the IC chip is mounted; And An oscillator including; a piezoelectric element mounting package coupled to the IC chip mounting package and mounted with a piezoelectric element; The method of claim 8, An oscillator is formed on the surface of the IC chip mounting package, further comprising a frequency output terminal for outputting the oscillation frequency to adjust the oscillation frequency The method of claim 8, The piezoelectric element is an oscillator, characterized in that the crystal piece The method of claim 8, At least one of the IC chip mounting package and the piezoelectric element mounting package is characterized in that the oscillator is formed by stacking a plurality of ceramic layers to form an internal space

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