KR100635223B1 - Plasma processing apparatus - Google Patents

Abstract

A plasma processing apparatus is provided to improve cooling efficiency by using a zigzag type connection structure between circulation lines. A plasma processing apparatus is used for generating predetermined plasma in a vacuum state chamber. The plasma processing apparatus includes a lower electrode and a cooling plate. The lower electrode is installed in a lower portion of the chamber. The lower electrode is used for loading a substrate. The cooling plate(140) is under the lower electrode, so that the cooling plate contacts a lower region of the lower electrode in order to cool the lower electrode. The cooling plate includes an inlet port, an outlet port, a plurality of circulation lines(142) parallel with each other, and a plurality of connection members for connecting the circulation lines with each other and forming the circulating line structure like a zigzag type structure.

Description

Plasma processing apparatus

1 is a cross-sectional view of a process chamber that is a conventional plasma processing apparatus.

2 is a plan sectional view of a cooling plate that is an electrode component of a conventional process chamber.

3 is a cross-sectional plan view of a cooling plate that is an electrode component of a plasma processing apparatus according to an embodiment of the present invention.

4A and 4B are partial exploded perspective views and side cross-sectional views of portion “A” of FIG. 3.

5A and 5B are partially separated perspective views and side cross-sectional views of a cooling plate that is a component of an electrode unit according to another exemplary embodiment of the present invention.

6A and 6B are partial separated perspective views and side cross-sectional views of a cooling plate that is a component of an electrode unit according to still another exemplary embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

140: cold plate 140a of one embodiment: insertion groove

142: circulation line 150: communication member

152: communication line 154: finishing member

O: airtight member

240: cooling plate of another embodiment 240a: insertion hole

242: circulation line 250: communication member

252: communication line 254: finishing member

256: insert O: airtight holding member

340: another embodiment cooling plate 340a: insertion hole

342: circulation line 350: communication member

352: communication line O: airtight member

The present invention relates to a plasma processing apparatus, and more particularly, to a plasma processing apparatus provided on a bottom surface of an electrode provided in a process chamber and provided with a cooling plate to prevent temperature overheating of the electrode during a process process.

Referring to the process of performing plasma processing on the above-described semiconductor wafer or liquid crystal substrate, first, a plurality of semiconductor wafers or liquid crystal substrates (hereinafter referred to as "substrates") stacked in a substrate storage device (hereinafter referred to as "cassette") are transport robots. Carry in or out by means of a load lock chamber, which circulates vacuum and atmospheric pressure, and pumps the inside of the load lock chamber into a vacuum state to make a vacuum, and then transfer means. By moving the substrate to the transfer chamber.

The transfer chamber to which the substrate is transferred is in communication with a plurality of process chambers that maintain a vacuum state, and the transfer chamber carries in and out of each process chamber through transfer means, where each process chamber The substrate brought into is placed on the mounting table positioned on the upper portion of the lower electrode, the process gas is introduced through the micro holes formed in the lower electrode, and the upper and lower electrodes are supplied with external power to the introduced gas. It causes an electrical discharge to perform a plasma process on the surface of the substrate.

Here, as the temperature of the lower electrode on which the substrate is seated during the plasma process is increased in the above-described process chamber, a cooling plate is provided at the lower portion so as to lower the temperature of the lower electrode and keep it constant, and the fluid inside the cooling plate. The cooling line is processed into a gun drill to cool the lower electrode by circulating.

In the conventional plasma processing apparatus, as shown in FIG. 1, a process chamber 10 in which process processing is performed therein, an upper electrode 20 provided above the inside of the process chamber 10, through which process gas flows, and It is provided on the lower side opposite to the upper electrode 20 is loaded with a substrate (not shown in the figure) and the electrode portion 30 is applied power.

The above-described electrode unit 30 includes a base plate 32 positioned at the lowermost part, an insulating plate 34 stacked on the base plate upper region, a cooling plate 40 stacked on the above insulating plate upper region, The lower electrode 36 is mounted on the upper region of the cooling plate 40, and the insulator protecting the plasma from the outer wall and the upper region of the electrode unit 30 is enclosed therein.

Here, the cooling plate 40 according to one embodiment functions to lower the temperature to maintain the lower electrode 36 of the electrode portion 30 at a constant temperature, this cooling plate 40 is shown in FIG. As described above, in the form of a plate, a horizontal cooling line 42 penetrating the edge portions of both side walls, and a plurality of longitudinal cooling lines 44 formed at appropriate intervals in a state orthogonal to the above-described horizontal cooling line 42; , One inlet and one outlet are formed in the lateral cooling line 42 on the other side.

A sealing member 46 is provided at both ends of the penetrating lateral and longitudinal cooling lines 42 and 44 so as to maintain the airtightness inside the lateral and longitudinal cooling lines 42 and 44 and to seal the same.

Therefore, in the above-described lateral and longitudinal cooling lines 42 and 44, the cooling medium flowing through the inlet formed at the center of the lateral cooling line 42 is moved to both sides of the lateral cooling line 42, so that the lateral direction Moving along a plurality of longitudinal cooling lines 44 formed parallel to the cooling lines 42 at right intervals, each longitudinal cooling line 44 is in communication with the spaced apart transverse cooling lines (42) It is discharged through the discharge port formed in the center of the transverse cooling line 42.

Here, when the flow rate of the cooling medium introduced through the above-described inlet is 1, and the total length of the above-described longitudinal cooling line 44 is assumed to be six, the moving to the lateral cooling line 42 perpendicular to the inlet is performed. Since the flow rate of the cooling medium moves to both sides from the inlet thereof, the flow rate decreases to 1/2. When the flow rate reaches the longitudinal cooling line 44 provided at the first position at the center, the longitudinal cooling line 44 and The flow rate decreases to 1/4 while moving the intersection of the lateral cooling line 42, and then moving the intersection of the longitudinal cooling line 44 and the lateral cooling line 42 provided in the second position. The flow rate is reduced to 1/8, the flow rate flowing to the outermost longitudinal cooling line 44 is reduced to 1/16, the cooling medium flowing through each longitudinal cooling line 44 is discharged Merged into the formed lateral cooling line 42 The person flow is discharged through the outlet.

However, the cooling medium with a flow rate of 1 flows in and the cooling medium with a flow rate of 1 is discharged, but the flow rate is distributed in a state in which the flow rate is distributed in the process of moving to each of the longitudinal cooling lines 44 formed in parallel, so that the cooling efficiency is reduced or parallel. There was a problem that the cooling medium in the cooling line 44 of any one of the cooling line 44 is stagnant.

In addition, although not shown in the drawings, the cooling plate of another embodiment includes two cooling plates which are in contact with each other, and forms a zigzag series cooling line by machining and attaches them to each other by contact with each other. There was also a method, but there was a problem that the processing cost increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma processing apparatus capable of increasing the cooling efficiency by forming a plurality of circulation lines parallel to the cooling plate and communicating with each other in series. have.

In order to achieve the above object, the present invention provides a plasma processing apparatus for generating a plasma inside a chamber in a vacuum state to perform a predetermined treatment on a substrate, comprising: a lower electrode provided below the chamber and loaded with a substrate; It is provided in contact with the lower region of the lower electrode, and includes a cooling plate for cooling the lower electrode, wherein the cooling plate, the inlet and outlet are formed at one end and the other end, and formed in a plurality in parallel with the inside By providing a plurality of communication members to communicate the circulation line in series, the communication member is provided at the zigzag position of the adjacent circulation line to have a plurality of circulation lines provided in the horizontal direction in the above-described cooling plate in series. It is preferable to increase the circulation efficiency of the cooling medium.

In addition, the communication member in the present invention, the lateral communication line is formed by a predetermined depth area so as to be located on the concentric line while communicating with the adjacent circulation line of the cooling plate; The longitudinal communication line is formed so as to connect the vertical communication lines; is provided, it is preferable because the circulation line of the adjacent cooling plate to communicate in series by the vertical, horizontal communication line of the communication member.

In addition, the communication member in the present invention, the insertion portion protruding to be inserted into the insertion hole to form an insertion hole that extends the diameter of the adjacent circulation line inlet portion of the cooling plate more than the diameter of the circulation line, the upper region A transverse communication line formed integrally with each other, the transverse communication lines being respectively formed by a predetermined depth region so as to be positioned on the concentric lines while being in communication with a neighboring circulation line when the insertion portions are respectively inserted into the insertion holes; The longitudinal communication line is formed so as to connect the vertical communication lines; is provided, it is preferable because the circulation line of the adjacent cooling plate is communicated in series by the vertical, horizontal communication line of the communication member.

In addition, the communication member in the present invention, the communication line is formed in the upper region by the distance of the circulation line in the upper region so as to communicate the adjacent circulation line of the cooling plate, thereby communicating the circulation line of the neighboring cooling plate. It is preferable to communicate in series by a communication line of.

In addition, the communication member in the present invention is a block shape extending in the longitudinal direction is inserted and fixed in a state where the airtight is maintained in the insertion groove formed in the outer wall of the cooling plate, or the airtight state is maintained on the outer wall of the cooling plate The outer surface of the communicating member coincides with the outer wall of the cooling plate when the communicating member is provided to communicate with the adjacent circulation line, or the communicating member is formed on the outer wall of the cooling plate. It is preferable because it is fixed to protrude.

Hereinafter, embodiments of the plasma processing apparatus of the present invention will be described with reference to the accompanying drawings.

<Example 1>

Although not shown in the drawings, a plasma processing apparatus of a preferred embodiment of the present invention includes a process chamber having the same structure and function as that of the related art, an upper electrode provided in an upper region of the process chamber and injecting a predetermined gas to a substrate; It is formed in the lower region of the upper electrode opposite to the above-described electrode portion on which the substrate is loaded.

Here, the above-described electrode unit is composed of an insulating plate, a cooling plate 140, and a lower electrode sequentially stacked on the base plate positioned at the lowermost portion, and the insulator protecting the plasma from the outer wall and the upper region of the electrode unit, respectively. Detailed description of the structure is omitted.

As described above, the cooling plate 140 penetrates in the transverse direction using a gun drill on both side walls in a plate shape having an appropriate thickness, and thus a circulation line 142 is formed and the circulation line ( Communication members 150 having communication lines 152 formed therein are provided at zigzag positions for each adjacent circulation line 142.

In addition, as shown in FIGS. 4A and 4B, insertion grooves 140a including two adjacent circulation lines 142 may be viewed from both sides of the cooling plate 140 described above in plan view. When provided in zigzag position respectively.

That is, when one end of the upper circulation line 142 of the adjacent circulation line 142 is an inlet of the cooling medium, an insertion groove 140a is formed at the other end of the upper circulation line 142 and the other end of the lower circulation line 142. Is formed, the insertion groove 140a is formed in one end of the lower circulation line 142 and one end of the other circulation line 142 so that the insertion groove 140a is sequentially formed in a zigzag position.

The communication member 150 is connected to the inner surface of the insertion groove 140a which is formed for each of the adjacent circulation lines 142 among the both ends of the plurality of circulation lines 142 formed on the cooling plate 140 as described above. Tighten and fix each.

The communication member 150 is a block shape extending in the longitudinal direction is provided at equal intervals so as to communicate with two neighboring circulation line 142 of the above-described cooling plate 140, two transversely formed at an appropriate depth The communication line 152 which consists of the direction communication line 152a and the longitudinal communication line 152b which communicates each of the above-mentioned horizontal direction communication lines 152a is formed.

Here, the longitudinal communication line 152b for communicating the lateral communication line 152a of the communication member 150 described above is inevitably transverse to the lateral communication by starting the hole processing on one side of the communication member 150. Since the line 152a communicates with another transverse communication line 152a, the closing member 154 is forcibly inserted into the longitudinal communication line 152b to communicate with the outside to maintain the internal airtightness.

The circumferential surface of the transverse communication line 152a of the communication member 150 and the circumferential surface of the circulation line 142 of the insertion groove 140a that the communication member 150 is in contact with each other are O-rings. The airtight holding member O is respectively interposed.

On the other hand, the length of the circulation line 142 of the cooling plate 140 described above is adjustable according to the number of processing of the circulation line 142 described above.

In addition, the aforementioned communication member 150 forms an insertion groove 140a in the cooling plate 140 and inserts and fixes the insertion groove 140a in the cooling plate 140 as in the present embodiment to cool the outer surface of the communication member 150. The outer surfaces of the plate 140 coincide with each other, but on the contrary, the cooling plate 140 is directly communicated with the circulation line 142 of the cooling plate 140 without forming the insertion groove 140a in the cooling plate 140 described above. In the communication member 150 may be provided to protrude.

Therefore, the circulation line formation of the cooling plate provided to prevent overheating of the lower electrode of the plasma processing apparatus according to an embodiment of the present invention is performed by the above-described cooling plate 140 as shown in FIGS. 3, 4A, and 4B. A plurality of circulation lines 142 are formed to have the same distance on both side walls, and insertion grooves 140a are formed in two adjacent circulation lines 142 among the circulation lines 142 formed on one side wall of the cooling plate 140. Each of the insertion grooves (140a) is formed in each of the upper and lower circulation lines 142, respectively, and the insertion groove (140a) of any one of the circulation line 142 formed on one side wall of the cooling plate 140 described above. Insertion grooves 140a are formed in the upper circulation line 142 of the other insertion groove 140a adjacent to the lower circulation line 142 of the adjacent.

Then, the communication member 150 is fastened to the communication member 150 having the “c” shaped communication line 152 provided therein for each insertion groove 140a formed on both side walls of the cooling plate 140 by using a bolt. Since 150 is provided at the zigzag position of the circulation line 142 to communicate with each other, each parallel circulation line 142 communicates in series.

That is, the above-described cooling plate 140 communicates the plurality of circulation lines 142 formed on both side walls thereof with the communication member 150 to have one zig-zag direction so that the cooling medium is external to the circulation line 142 at the front end. The inlet is provided from the inlet and the outlet line is provided in the rear end of the circulation line 142 to cool the lower electrode while the cooling medium introduced through the inlet flows along the circulation line 142 and is discharged to the outlet.

As a result, when communicating with each circulation line 142 is to be communicated in series by the communication member 150 without crossing each other.

<Example 2>

Although not shown in the drawings, the plasma processing apparatus of another embodiment of the present invention includes a process chamber having the same structure and function as that of the embodiment, an upper electrode provided in an upper region of the process chamber, and an upper electrode disposed as described above. It is made of an electrode portion provided in the lower side of the process chamber, a detailed description thereof will be omitted.

The above-described cooling plate 240 is formed in a plate having an appropriate thickness as in the previous embodiment is formed with a circulation line 242 penetrating in the lateral direction on both side walls and the adjacent circulation line (of the above-described circulation line 242 ( Each of the communication members 250 having the communication line 252 formed therein is provided at each of the 242.

In addition, as shown in FIGS. 5A and 5B, an insertion hole is formed at a side surface of the aforementioned cooling plate 240, that is, the inlet portion of the circulation line 242, which is larger than the diameter of the circulation line 242 and has a predetermined depth. 240a) are provided respectively.

Thus, the communication member 250 of the plurality of circulation lines 242 provided in the above-described cooling plate 240 of the communication member 250 protruding at the same interval as the interval of the insertion hole (240a) formed in two adjacent circulation line 242 The insertion unit 256 is provided in the zigzag position when the cooling plate 240 is viewed in plan view, and the plurality of circulation lines 242 are integrally communicated by the respective communication members 250.

That is, when one end of the upper circulation line 242 of the adjacent circulation line 242 is viewed as an inlet of the cooling medium, an insertion hole 240a is formed at each of the other end of the upper circulation line 242 and the other end of the lower circulation line 242. It is formed, and the insertion member 256 of the communication member 250 is inserted into the upper and lower insertion holes 240a, and then the communication member 250 is fastened to the cooling plate 240 by a plurality of bolts.

Thus, each communication member 250 is fixed to the insertion groove 240a formed for each of the adjacent circulation lines 242 among the both ends of the plurality of circulation lines 242 formed on the cooling plate 240 described above.

The above-mentioned communication member 250 is a block shape extending in the longitudinal direction is provided at equal intervals so as to communicate with two adjacent circulation line 242 of the above-described cooling plate 240, but of the above-described cooling plate 240 The two transverse communication lines 252a and the transverse communication lines 252a which protrude from the insertion hole 256a so as to be inserted into the insertion hole 240a and are formed to an appropriate depth for each of the insertion units 256 and the aforementioned transverse communication lines 252a. The communication line 252 is composed of a longitudinal communication line (252b) for communicating each of the).

Here, the longitudinal communication line 252b for communicating the lateral communication line 252a of the communication member 250 described above is inevitably processed in one side of the communication member 250 as in the previous embodiment. Since it must be connected to the adjacent transverse communication line 252a and communicate with another transverse communication line 252a, the closing member 254 is forcibly inserted into the longitudinal communication line 252b which communicates with the outside to maintain internal airtightness. .

In addition, the above-described peripheral surface of the inserting portion 256 of the communication member 250 and the circumferential surface of the insertion hole 240a of the cooling plate 240 in which the inserting portion 256 is in contact with each other are O-rings. Each member O is interposed.

On the other hand, the length of the circulation line 242 of the cooling plate 240 described above can be adjusted according to the number of processing of the circulation line 242 described above.

In addition, the communication member 250 described above forms an insertion hole 240a communicating with the circulation line 242 on the sidewall of the cooling plate 240 as in this embodiment, and the communication member 250 in the insertion hole 240a. In the state in which the insertion portion (256) of the) is inserted into the cooling plate 240 with a plurality of bolts, the communication member 250 is provided in a state protruding from the outer wall of the cooling plate 240, but on the contrary An insertion groove (not shown in the drawing) is formed to allow the communication member 250 to be inserted into the 240, and an insertion hole 240a is formed in the inner surface of the insertion groove to cool the outer surface of the communication member 250. The outer surface of the plate 240 may be matched.

Therefore, the circulation line formation of the cooling plate provided to prevent overheating of the lower electrode of the plasma processing apparatus according to another embodiment of the present invention is formed on both side walls of the cooling plate 240 as shown in FIGS. 5A and 5B. A plurality of circulation lines 242 are formed to have the same distance, and insertion holes 240a are formed in each of two adjacent circulation lines 242 among the circulation lines 242 formed on one side wall of the cooling plate 240. And each of the two insertion holes (240a) to be inserted into each of the communication member 250, the inserting portion 256 is formed on both ends so that the airtight state is maintained, but the upper and lower two circulation lines 242 communicate with each side Fixed and communicated with the member 250 and the other side communication member 250 is inserted into the insertion hole 240a of the adjacent circulation line 242 for each one side communication member 250 to communicate individually from one side of the circulation line 242 Secure in communication.

Here, when the communication member 250, which is provided with a "c" shaped communication line 252 therein for each adjacent insertion hole 240a formed on both side walls of the cooling plate 240, is fastened with a bolt. Since the communication member 250 is provided at the zigzag position of the circulation line 242 to communicate each circulation line 242 as one, each parallel circulation line 242 is in series communication.

That is, the cooling plate 240 described above communicates the plurality of circulation lines 242 formed on both side walls thereof with the communication member 250 so as to have one zig-zag direction, so that the cooling medium is external to the circulation line 242 at the front end. Inlet is provided from the inlet and the outlet line is provided in the rear end of the circulation line 242 is a cooling medium flowing through the inlet flows along the circulation line 242 is discharged to the outlet to cool the lower electrode.

As a result, when communicating each circulation line 242 is to be communicated in series by the communication member 250 without intersecting with each other.

<Example 3>

Although not shown in the drawings, the plasma processing apparatus of another embodiment of the present invention opposes a process chamber having the same structure and function as that of the embodiment, an upper electrode provided in an upper region of the process chamber, and the above-described upper electrode. It is made of an electrode provided on the lower side in the process chamber, the detailed description thereof will be omitted.

As described above, the cooling plate 340 includes a circulation line 342 formed to penetrate in both sides of the side wall in a plate shape having an appropriate thickness, and the neighboring circulation line of the circulation line 342 described above. Each of the communication members 350 having the communication line 352 formed therein is provided at each of the 342.

Also, as shown in FIGS. 6A and 6B, insertion grooves 340a including two adjacent circulation lines 342 may be viewed in plan view on both sides of the above-described cooling plate 340. When provided in zigzag position respectively.

That is, when one end of the upper circulation line 342 of the neighboring circulation line 342 is the inlet of the cooling medium, an insertion groove 340a is formed at the other end of the upper circulation line 342 and the other end of the lower circulation line 342. Is formed, the insertion groove 340a is formed in one end of the lower circulation line 342 and the other circulation line 342 is formed in the insertion groove 340a in a zigzag position sequentially.

The communication member 350 is fastened to the inner surface of the insertion groove 340a which is formed for each of the adjacent circulation lines 342 among the both ends of the plurality of circulation lines 342 formed on the cooling plate 340 as described above. To fix each.

The above-mentioned communication member 350 is provided in the same shape as the above-described circulation line 342 to communicate with two neighboring circulation lines 342 of the above-described cooling plate 340 in a block shape extending in the longitudinal direction. A communication line 352 is formed at one side in contact with the insertion groove 340a to an appropriate depth.

In addition, an elliptic hermetic seal that is an O-ring is formed on the circumferential surface of the communication line 352 of the communication member 350 and the circumferential surface of the circulation line 342 of the insertion groove 340a which the communication member 350 is in contact with. The holding member O is interposed, respectively.

On the other hand, the length of the circulation line 342 of the cooling plate 340 described above is adjustable according to the number of processing of the circulation line 342 described above.

In addition, the aforementioned communication member 350 forms an insertion groove 340a in the cooling plate 340 and inserts and fixes the insertion groove 340a in the cooling plate 340 to cool the outer surface of the communication member 350. The outer surfaces of the plate 340 coincide with each other, but on the contrary, the cooling plate 340 is directly communicated with the circulation line 342 of the cooling plate 340 without forming the insertion groove 340a in the cooling plate 340 described above. In the communication member 350 may be provided to protrude.

Therefore, the circulation line formation of the cooling plate provided to prevent overheating of the lower electrode of the plasma processing apparatus according to an embodiment of the present invention is formed on both side walls of the cooling plate 340 described above as shown in FIGS. 6A and 6B. A plurality of circulation lines 342 are formed to have the same distance, and insertion grooves 340a are formed for each of two adjacent circulation lines 342 among the circulation lines 342 formed on one side wall of the cooling plate 340. Insertion grooves 340a are formed in the upper and lower two circulation lines 342, respectively, and the lower circulation line 342 of one of the insertion grooves 340a of the one side wall circulation line 342 of the cooling plate 340 described above. ) And the insertion grooves 340a are formed on the other side wall of the cooling plate 340 in which the upper circulation line 342 of another insertion groove 340a is adjacent to the outside.

In addition, when the communication member 350 is fastened with a bolt, the communication member 350 formed on the contact surface of each of the insertion grooves 340a formed on both side walls of the cooling plate 340 is bolted. Is provided at the zigzag position of the circulation line 342 to communicate with each other, so that each parallel circulation line 342 is in series communication.

That is, the cooling plate 340 described above communicates the plurality of circulation lines 342 formed on both side walls thereof with the communication member 350 so as to have one zig-zag direction, so that the cooling medium is external to the circulation line 342 at the front end. The inlet is provided from the inlet and the outlet line is provided in the rear end of the circulation line 342 to cool the lower electrode while the cooling medium introduced through the inlet flows along the circulation line 342 is discharged to the outlet.

As a result, when communicating each circulation line 342 is to be communicated in series by the communication member 350 without crossing each other.

Such a plasma processing apparatus of the present invention forms a plurality of circulation lines parallel to each other by a gun drill on both sides of the cooling plate, and the circulation lines adjacent to one side of the cooling plate so that each circulation line can be connected in series. The communication line is fixed to communicate with a communication member formed therein, and the communication line and another circulation line are fixed to the communication member at the other side of the above-mentioned cooling plate to communicate in a zigzag shape from the inlet to the outlet. Since the members communicate with each other, the cooling efficiency is increased by the cooling medium circulating in the series circulation line.

Claims (5)

A plasma processing apparatus for generating a plasma inside a chamber in a vacuum state to perform a predetermined treatment on a substrate. A lower electrode provided under the chamber to load a substrate; It is provided in contact with the lower region of the lower electrode, including a cooling plate for cooling the lower electrode, The cooling plate, the inlet and outlet is formed at one end and the other end, the plasma processing apparatus, characterized in that a plurality of communication members are provided to communicate in series with a plurality of circulation lines formed in a parallel state therein. The method of claim 1, wherein the communication member, A transverse communication line each formed by a predetermined depth region so as to be located on the concentric line while communicating with a neighboring circulation line of the cooling plate; And a longitudinal communication line formed to connect the vertical communication lines. The method of claim 1, wherein the communication member, Insertion portions protruding to form an insertion hole that extends the diameter of the adjacent circulation line inlet portion of the cooling plate more than the diameter of the circulation line, and protrude so as to be inserted into the insertion hole are integrally formed in the upper region, respectively. A transverse communication line each formed by a predetermined depth region so as to be located on the concentric line while being in communication with a neighboring circulation line when inserted into the insertion hole; And a longitudinal communication line formed to connect the vertical communication lines. The method of claim 1, wherein the communication member, And a communication line is formed in the upper region by a distance of the circulation line so as to communicate adjacent circulation lines of the cooling plate. The communication member according to any one of claims 2 to 4, wherein A block shape extending in the longitudinal direction is inserted and fixed in a state in which airtightness is maintained in the insertion groove formed in the outer wall of the cooling plate, or fixed in a protruding state in contact with the airtight state is maintained in the outer wall of the cooling plate. Plasma processing apparatus.

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