KR100620286B1 - Ink jetting apparatus and a method for manufacturing a nozzle part of the same - Google Patents

Ink jetting apparatus and a method for manufacturing a nozzle part of the same Download PDF

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Publication number
KR100620286B1
KR100620286B1 KR1019990048555A KR19990048555A KR100620286B1 KR 100620286 B1 KR100620286 B1 KR 100620286B1 KR 1019990048555 A KR1019990048555 A KR 1019990048555A KR 19990048555 A KR19990048555 A KR 19990048555A KR 100620286 B1 KR100620286 B1 KR 100620286B1
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South Korea
Prior art keywords
ink
ink chamber
nozzle
plating
chamber barrier
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KR1019990048555A
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Korean (ko)
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KR20010045306A (en
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고희권
박경진
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삼성전자주식회사
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/162Manufacturing of the nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14032Structure of the pressure chamber
    • B41J2/1404Geometrical characteristics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/1433Structure of nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1643Manufacturing processes thin film formation thin film formation by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • B41J2/17503Ink cartridges
    • B41J2/17513Inner structure

Abstract

잉크분사장치의 노즐부는, 웨이퍼상에 노즐공에 대응되는 형상의 감광성폴리머를 적층시키고, 웨이퍼상에 니켈을 도금하고 감광성폴리머를 제거하여 노즐플레이트를 형성하고, 노즐플레이트상에 잉크챔버배리어를 형성을 위한 도금틀을 형성하고, 노즐플레이트상에 도금을 하여 잉크챔버베리어를 형성하고, 도금틀을 제거하고, 잉크챔버베리어의 상면에 폴리머를 도포하여 접착층을 형성함으로써 제조된다. 이와 같이 제조된 노즐부에 구동부를 부착함으로써 잉크분사장치가 제조된다. 잉크챔버베리어가 도금에 의해 금속성 재질로 제조되므로, 잉크챔버 내의 잉크와 잉크챔버베리어간의 반응이 방지되게 된다. 따라서, 잉크분사장치의 잉크토출작동이 안정적으로 수행되게 된다.The nozzle portion of the ink ejection apparatus laminates a photosensitive polymer having a shape corresponding to the nozzle hole on the wafer, forms a nozzle plate by plating nickel on the wafer and removing the photosensitive polymer, and forms an ink chamber barrier on the nozzle plate. It is prepared by forming a plating mold for the metal plate, plating the nozzle plate to form an ink chamber, removing the plating mold, and applying an polymer to the upper surface of the ink chamber barrier to form an adhesive layer. The ink ejecting apparatus is manufactured by attaching the driving portion to the nozzle portion thus produced. Since the ink chamber barrier is made of a metallic material by plating, the reaction between the ink in the ink chamber and the ink chamber barrier is prevented. Thus, the ink ejection operation of the ink ejection apparatus can be performed stably.

잉크, 노즐, 베리어, 도금, 니켈Ink, nozzle, barrier, plating, nickel

Description

잉크분사장치의 노즐부 제작방법 및 잉크분사장치 {Ink jetting apparatus and a method for manufacturing a nozzle part of the same} Ink jetting apparatus and a method for manufacturing a nozzle part of the same}             

도 1은 종래의 잉크분사장치의 단면도,1 is a cross-sectional view of a conventional ink spraying device,

도 2 내지 도 9는 본 발명에 따른 잉크분사장치의 노즐부 제작 과정을 순차적으로 도시한 도면,2 to 9 are views sequentially showing a nozzle manufacturing process of the ink spraying apparatus according to the present invention;

도 10은 본 발명에 따라 제작된 잉크분사장치의 단면도이다.Fig. 10 is a sectional view of the ink jetting device manufactured according to the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

20 : 구동부 27 : 작동유체챔버20: drive unit 27: working fluid chamber

30 : 멤브레인 140 : 노즐부30 membrane 140 nozzle part

143 : 접착층 145 : 잉크챔버베리어143: adhesive layer 145: ink chamber barrier

147 : 노즐플레이트 149 : 노즐공147: nozzle plate 149: nozzle hole

157 : 잉크챔버157: ink chamber

본 발명은 잉크젯 프린터(Inkjet Printer)나 팩시밀리 등의 잉크분사장치에 관한 것으로서, 특히, 잉크분사장치의 노즐부 제작방법 및 이에 의해 제작된 노즐부를 구비한 잉크분사장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jetting device such as an inkjet printer or a facsimile, and more particularly, to a method for producing a nozzle part of an ink jetting device and an ink jetting device having the nozzle part produced thereby.

잉크젯 프린터나 팩시밀리 등과 같은 출력장치의 프린터헤드에 사용되는 잉크분사장치는 잉크가 수용되어 있는 잉크챔버 내부에 물리적인 힘을 가하여 소정량의 잉크를 노즐을 통해 외부로 분사시킨다. 이러한 유체분사장치는 유체에 물리력을 가하는 방식에 따라 가열방식, 압전방식, 및 열압축방식 등으로 구분된다.The ink ejection device used in the printhead of an output device such as an inkjet printer or a facsimile applies a physical force inside the ink chamber containing the ink to eject a predetermined amount of ink to the outside through the nozzle. The fluid injection device is classified into a heating method, a piezoelectric method, and a thermal compression method according to a method of applying a physical force to the fluid.

이 중에서 열압축 방식의 유체분사장치가 도 1에 도시되어 있다. 유체분사장치는 구동부(20), 멤브레인(30) 및 노즐부(40)로 구성되어 있다.Among them, a fluid compression device of a thermal compression method is shown in FIG. 1. The fluid injection device is composed of a drive unit 20, a membrane 30, and a nozzle unit 40.

구동부(20)는 기판(15), 기판(15) 위에 적층되는 산화막(14), 작동유체챔버(27)를 갖는 작동유체배리어(25), 작동유체챔버(27)내에 개재되는 히터(16), 및 히터(16)에 연결되어 있는 도선(17)을 포함하여 구성된다.The driving unit 20 includes a substrate 15, an oxide film 14 stacked on the substrate 15, a working fluid barrier 25 having a working fluid chamber 27, and a heater 16 interposed in the working fluid chamber 27. , And a conductive wire 17 connected to the heater 16.

노즐부(40)는 잉크챔버(57)를 갖는 잉크챔버배리어(45), 및 잉크챔버배리어(45)의 상부에 결합되는 노즐플레이트(47)를 포함하여 구성된다. 노즐플레이트(47)의 상면에는 잉크챔버(57) 내의 잉크를 분사하기 위한 노즐공(49)이 형성되어 있다.The nozzle portion 40 includes an ink chamber barrier 45 having an ink chamber 57 and a nozzle plate 47 coupled to the upper portion of the ink chamber barrier 45. On the upper surface of the nozzle plate 47, a nozzle hole 49 for ejecting ink in the ink chamber 57 is formed.

멤브레인(30)은 잉크챔버배리어(45)와 작동유체배리어(25) 사이에 개재된다. 멤브레인(30)은 작동유체챔버(27)와 잉크챔버(57)를 상호 구획한다.The membrane 30 is interposed between the ink chamber barrier 45 and the working fluid barrier 25. The membrane 30 partitions the working fluid chamber 27 and the ink chamber 57 from each other.

작동유체챔버(27) 내에는 헵테인 등과 같은 작동유체가 충진되며, 잉크챔버(57) 내에는 도시않은 잉크공급원으로부터 잉크가 지속적으로 공급된다.The working fluid chamber 27 is filled with a working fluid such as heptane, and the ink chamber 57 is continuously supplied with ink from an ink supply source (not shown).

도선(17)에 전류가 공급되면 히터(16)에서는 열이 발생되고, 이 열에 의해 작동유체챔버(27) 내의 작동유체가 가열되어 작동유체챔버(27) 내에 버블이 발생된다. 이 버블에 의해 작동유체챔버(27) 내부의 압력이 증가되어 멤브레인(30)이 변형되며, 이에 따라 잉크챔버(57)의 내부가 가압되어 노즐(49)을 통해 잉크가 유출된다.When a current is supplied to the conductive wire 17, heat is generated in the heater 16, and the working fluid in the working fluid chamber 27 is heated by this heat to generate bubbles in the working fluid chamber 27. The bubble increases the pressure inside the working fluid chamber 27 and deforms the membrane 30. As a result, the inside of the ink chamber 57 is pressurized and ink is discharged through the nozzle 49.

히터(16)에 전류 공급이 중단되면, 버블이 소멸하여 멤브레인(30)이 복원된다. 이러한 히터(16)의 가열작동이 반복적으로 행해짐에 따라 잉크의 토출작업이 수행되게 된다.When the current supply to the heater 16 is stopped, bubbles disappear and the membrane 30 is restored. As the heating operation of the heater 16 is repeatedly performed, the ejecting operation of the ink is performed.

상기와 같은 종래의 잉크분사장치에서는, 잉크챔버배리어(45)가 감광성 폴리머로 제조된다. 이 감광성 폴리머는 잉크챔버(57) 내에 있는 잉크와 지속적으로 접한 상태에 놓여 있으며, 또한, 잉크와 화학적 반응을 하는 성질을 가지고 있다. 따라서, 잉크챔버배리어(45)의 강성이 지속적으로 유지되지 못하여 잉크분사장치의 잉크토출 성능이 시간이 지남에 따라 점점 떨어지게 된다는 문제점이 있다. 또한, 잉크와 반응한 감광성 폴리머에 의해 노즐공(49)이 막히거나 노즐공(49)에 이물질이 끼이게 되어 잉크가 노즐공(49)을 통해 원활하게 토출되지 못하게 되는 문제점도 있다.In the conventional ink ejection apparatus as described above, the ink chamber barrier 45 is made of a photosensitive polymer. This photosensitive polymer is in continuous contact with the ink in the ink chamber 57, and has a property of chemically reacting with the ink. Therefore, there is a problem in that the rigidity of the ink chamber barrier 45 is not continuously maintained, so that the ink ejection performance of the ink ejection apparatus gradually decreases over time. In addition, the nozzle hole 49 is blocked by the photosensitive polymer reacted with the ink, or foreign matter is caught in the nozzle hole 49, so that the ink cannot be smoothly discharged through the nozzle hole 49.

따라서, 본 발명의 목적은, 잉크챔버베리어와 잉크간의 반응이 일어나지 않도록 함으로써 잉크의 토출 성능이 지속적으로 유지될 수 있는 잉크분사장치의 노즐부 제작방법을 제공하는 것이다.
Accordingly, it is an object of the present invention to provide a method of manufacturing a nozzle portion of an ink ejection apparatus in which the ejection performance of the ink can be continuously maintained by preventing the reaction between the ink chamber and the ink.

상기 목적을 달성하기 위한 본 발명에 따른 잉크분사장치의 노즐부 제작방법은, 웨이퍼상에 노즐공에 대응되는 형상의 감광성폴리머를 적층시키는 단계; 상기 웨이퍼상에 니켈을 도금하여 노즐플레이트를 형성하는 단계; 상기 감광성폴리머를 제거하여 상기 노즐공을 구비하는 상기 노즐플레이트를 얻는 단계; 상기 노즐플레이트상에 금속성 재질의 잉크챔버배리어를 형성하는 단계; 및 상기 잉크챔버배리어의 상면에 폴리머를 도포하여 접착층을 형성하는 단계를 포함한다.According to an aspect of the present invention, there is provided a method of manufacturing a nozzle unit of an ink ejection apparatus, the method including: stacking a photosensitive polymer having a shape corresponding to a nozzle hole on a wafer; Plating a nickel on the wafer to form a nozzle plate; Removing the photosensitive polymer to obtain the nozzle plate having the nozzle hole; Forming an ink chamber barrier of a metallic material on the nozzle plate; And forming an adhesive layer by applying a polymer to an upper surface of the ink chamber barrier.

여기서, 상기 잉크챔버배리어를 형성하는 단계는, 상기 노즐플레이트의 상면에 상기 잉크챔버배리어의 형상에 대응하는 도금틀을 형성하는 단계; 상기 노즐플레이트의 상부를 금속성 재질로 도금하는 단계; 및 상기 도금틀을 제거하는 단계를 포함한다. 또한, 상기 도금틀을 형성하는 단계는, 상기 노즐플레이트상에 감광성폴리머 재질의 도금틀층을 적층시키는 단계; 및 상기 잉크챔버베리어의 형상에 대응하는 형상을 갖도록 상기 도금틀층을 식각하는 단계를 포함한다.The forming of the ink chamber barrier may include forming a plating mold corresponding to a shape of the ink chamber barrier on an upper surface of the nozzle plate; Plating an upper portion of the nozzle plate with a metallic material; And removing the plating mold. The forming of the plating mold may include stacking a plating mold layer of a photosensitive polymer material on the nozzle plate; And etching the plating frame layer to have a shape corresponding to the shape of the ink chamber barrier.

한편, 본 발명에 따르면, 잉크가 수용되는 잉크챔버를 형성하는 금속성 재질의 잉크챔버배리어, 및 상기 잉크챔버 내에 수용된 잉크를 분사하기 위한 노즐공 구비한 노즐플레이트를 포함하는 노즐부; 상기 잉크챔버의 일면에 설치된 멤브레 인; 및 상기 멤브레인을 구동하여 상기 노즐공을 통해 상기 잉크챔버 내의 잉크를 외측으로 분사시키는 구동부를 포함하는 것을 특징으로 하는 잉크분사장치가 제공된다.On the other hand, according to the present invention, a nozzle unit including a nozzle chamber having a metallic ink chamber barrier forming an ink chamber containing the ink, and a nozzle hole for ejecting the ink contained in the ink chamber; A membrane installed on one surface of the ink chamber; And a driving unit for driving the membrane to eject the ink in the ink chamber to the outside through the nozzle hole.

본 발명에 따르면, 잉크챔버베리어가 금속성 재질로 형성되어 잉크챔버 내의 잉크와 잉크챔버베리어간의 반응이 방지되므로 잉크분사장치의 잉크토출작동이 안정적으로 수행되게 된다.According to the present invention, since the ink chamber barrier is formed of a metallic material to prevent a reaction between the ink in the ink chamber and the ink chamber barrier, the ink ejection operation of the ink ejection apparatus is stably performed.

이하에서는 첨부도면을 참조하여 본 발명을 보다 상세히 설명한다. 본 발명에 대한 설명에서, 노즐부를 제외한 구동부 및 멤브레인에 대한 구성과 제작방법은 도 1에 도시한 바와 같은 종래의 잉크분사장치와 동일하며, 그 상세한 설명은 생략된다. 또한, 이들 부위에 대해서는 동일한 참조부호를 부여한다.Hereinafter, with reference to the accompanying drawings will be described the present invention in more detail. In the description of the present invention, the configuration and manufacturing method for the drive unit and the membrane except the nozzle unit are the same as the conventional ink spraying apparatus as shown in Fig. 1, and the detailed description thereof is omitted. In addition, the same reference numerals are given to these sites.

도 2 내지 도 9는 본 발명에 따른 잉크분사장치의 노즐부 제작 과정을 순차적으로 도시한 것이다.2 to 9 sequentially illustrate the manufacturing process of the nozzle unit of the ink injection apparatus according to the present invention.

먼저, 산화막(171)이 도포된 웨이퍼(170)의 중앙부에 도 2에 도시된 바와 같이 포토레지스터(PR, photo resistor)등과 같은 감광성폴리머(173)를 소정의 크기로 적층시킨다. 감광성폴리머(173)는 후술되는 바와 같이 노즐공(149)의 크기 및 형상에 대응된다. 이와 같이 원하는 크기와 형상의 감광성폴리머(173)를 얻기 위해서는, 먼저 웨이퍼(170)상에 감광성폴리머(173)의 층을 형성한 후 식각하는 방법이 사용된다. 도면에는 도시되어 있지 아니하나, 추후에 도금하는 공정 및 노즐부(140)와 웨이퍼(170)를 분리하는 공정을 용이하게 하기 위해, 산화막(171) 상에는 감광성폴리머(173)가 적층되기 전에 도전성 재질의 시드레이어(seed layer) 가 먼저 적층된다.First, as shown in FIG. 2, a photosensitive polymer 173 such as a photo resistor (PR) or the like is stacked in a central portion of the wafer 170 coated with the oxide film 171 to a predetermined size. The photosensitive polymer 173 corresponds to the size and shape of the nozzle hole 149, as will be described later. In order to obtain the photosensitive polymer 173 having a desired size and shape as described above, a method of forming a layer of the photosensitive polymer 173 on the wafer 170 and then etching is used. Although not shown in the drawing, in order to facilitate the process of plating later and the process of separating the nozzle unit 140 and the wafer 170, the conductive material before the photosensitive polymer 173 is laminated on the oxide film 171. The seed layer of is laminated first.

감광성폴리머(173)의 적층이 완료되면, 도 3에 도시된 바와 같이 웨이퍼(170)상에 니켈을 도금하여 노즐플레이트(147)를 형성한다. 시드레이어는 도전성 재질이고 감광성폴리머(173)는 절연성 재질이므로, 니켈은 감광성폴리머(173)를 제외한 웨이퍼(170) 상의 나머지 부분에만 도금되게 되며, 도금이 진행됨에 따라 감광성폴리머(173)의 높이보다 높게 도금되면 도 3에 도시된 바와 같이 감광성폴리머(173)의 연부를 조금 덮게 된다.When the stacking of the photosensitive polymer 173 is completed, as illustrated in FIG. 3, nickel is plated on the wafer 170 to form the nozzle plate 147. Since the seed layer is a conductive material and the photosensitive polymer 173 is an insulating material, nickel is plated only on the remaining portion of the wafer 170 except for the photosensitive polymer 173, and as the plating proceeds, the height of the photosensitive polymer 173 is increased. When plated high, as shown in FIG. 3, the edge of the photosensitive polymer 173 is slightly covered.

노즐플레이트(149)의 형성이 완료되면, 감광성폴리머(173)를 제거한다. 이를 위하여 웨이퍼(170) 상에 아세톤과 같은 유기용매를 살포하거나, 또는 웨이퍼(170)를 아세톤에 담그면, 감광성폴리머(173)가 녹아서 제거되게 된다. 이에 따라, 감광성폴리머(173)가 적층되어 있던 위치에 공간이 생겨 도 4에 도시된 바와 같이 노즐공(149)이 형성되게 된다.When the formation of the nozzle plate 149 is completed, the photosensitive polymer 173 is removed. To this end, by spraying an organic solvent such as acetone on the wafer 170, or immersing the wafer 170 in acetone, the photosensitive polymer 173 is melted and removed. As a result, a space is formed at the position where the photosensitive polymer 173 is stacked to form the nozzle hole 149 as shown in FIG. 4.

그리고 나서, 노즐플레이트(147)에 잉크챔버베리어(145)를 형성하는 공정이 수행된다. 잉크챔버베리어(145)의 형성공정은 도 5 내지 도 8에 도시된 바와 같은 과정에 따라 수행된다.Then, a process of forming the ink chamber barrier 145 on the nozzle plate 147 is performed. The process of forming the ink chamber barrier 145 is performed according to the process as shown in Figs.

이를 상세히 설명하면, 먼저 노즐플레이트(147) 상에는 라미네이션(lanination) 공정에 의해 도 5에 도시된 바와 같이 폴리머 재질의 도금틀층(175)이 형성된다. 도금틀층(175)은 판상으로 적층되어 노즐플레이트(147)의 전 범위를 덮는다.In detail, first, a plating frame layer 175 formed of a polymer material is formed on the nozzle plate 147 as shown in FIG. 5 by a lamination process. The plating frame layer 175 is laminated in a plate shape to cover the entire range of the nozzle plate 147.

그리고 나서, 도금틀층(175)의 필요한 부위를 포토매스킹(photomasking)등의 방법으로 식각한다. 이에 따라 잉크챔버베리어(145)에 대응하는 부위만이 식각되어 도 6에 도시된 바와 같이 도금틀(175a)이 얻어지게 된다. 도금틀(175a)이 형성된 노즐플레이트(147)의 상부에 다시 금속성 재질로 도금을 하면 도 7에 도시된 바와 같이 도금틀(175a)에 의해 형성된 공간 내에 금속성 재질이 충진되게 된다. 이때, 도금되는 금속성 재질로는 바람직하게는 노즐플레이트(147)와 같은 니켈이 사용된다.Then, a required portion of the plating frame layer 175 is etched by photomasking or the like. As a result, only the portion corresponding to the ink chamber barrier 145 is etched to obtain the plating mold 175a as shown in FIG. 6. When the plating on the upper portion of the nozzle plate 147 on which the plating mold 175a is formed with the metallic material, the metallic material is filled in the space formed by the plating mold 175a as shown in FIG. 7. At this time, as the metallic material to be plated, preferably nickel such as the nozzle plate 147 is used.

도금틀층(175a)의 공간 내에 금속성 재질이 충진되면, 도금틀층(175a)을 식각 등의 방법으로 제거한다. 이에 따라 도 8에 도시된 바와 같이 잉크챔버(157)를 갖는 잉크챔버베리어(145)가 얻어지게 된다.When the metallic material is filled in the space of the plating frame layer 175a, the plating frame layer 175a is removed by etching or the like. As a result, the ink chamber barrier 145 having the ink chamber 157 is obtained as shown in FIG.

잉크챔버배리어(145)의 상면에는 다시 폴리머가 도포되어 도 9에 도시된 바와 같이 접착층(143)이 형성된다. 접착층(143)의 형성이 완료되면, 시드레이어를 노즐플레이트(147)와 분리함으로써 웨이퍼(170)를 노즐부(140)로부터 분리하며, 이에 따라 도 9에 도시된 바와 같은 완성된 노즐부(140)를 얻게 된다. 그후, 도 1에 도시된 바와 같은 멤브레인(30)이 부착된 구동부(20)를 찹착층(143)의 상부에 압착함으로써 도 10에 도시된 바와 같은 완성된 잉크분사장치가 얻어지게 된다.A polymer is again applied on the top surface of the ink chamber barrier 145 to form an adhesive layer 143 as shown in FIG. 9. When the formation of the adhesive layer 143 is completed, the wafer 170 is separated from the nozzle unit 140 by separating the seed layer from the nozzle plate 147, thereby completing the nozzle unit 140 as shown in FIG. 9. ) Thereafter, the completed ink spraying device as shown in FIG. 10 is obtained by pressing the driving unit 20 to which the membrane 30 as shown in FIG. 1 is attached onto the gluing layer 143.

도선(17)에 전류가 공급됨에 따라 히터(16)의 발열작동이 개시되어 잉크분사장치의 잉크분사작동이 수행되게 된다. 이러한 잉크분사작동은 도 1을 참조하여 설명한 종래의 잉크분사의 작동과 동일하다.As the electric current is supplied to the conductive wire 17, the heating operation of the heater 16 is started to perform the ink injection operation of the ink injection device. This ink injection operation is the same as the conventional ink injection operation described with reference to FIG.

본 발명에서는, 잉크챔버베리어(145)가 금속성 재질로 제조되어 있으므로, 잉크챔버(157)내에 수용된 잉크가 종래의 폴리머 재질의 잉크챔버베리어(45)와 직 접적으로 접촉하지 않게 된다. 따라서, 잉크와 폴리머간의 반응이 일어나지 않게 되어, 잉크챔버(157) 내에 이물질이 생성되지 않게 되고, 또한 이물질에 의한 노즐공(149)의 막힘이 발생하지 않게 된다. 따라서, 잉크의 토출작동이 원활하게 이루어지게 된다.In the present invention, since the ink chamber 145 is made of a metallic material, the ink contained in the ink chamber 157 does not directly contact the ink chamber barrier 45 of a conventional polymer material. Therefore, the reaction between the ink and the polymer does not occur, and foreign matter is not generated in the ink chamber 157, and clogging of the nozzle hole 149 due to the foreign matter does not occur. Therefore, the ejection operation of the ink is smoothly performed.

또한, 본 발명에 따르면, 잉크챔버베리어(145)와 잉크간의 반응에 의한 잉크챔버베리어(145)의 강성 저하가 방지되게 된다. 따라서, 멤브레인(30)에 의해 잉크챔버(157) 내부가 가압될 때, 잉크챔버(157) 내의 압력이 저하되는 현상이 일어나지 않게 되어 잉크토출작동이 안정적으로 수행되게 된다.Further, according to the present invention, the degradation of the rigidity of the ink chamber barrier 145 due to the reaction between the ink chamber barrier 145 and the ink is prevented. Therefore, when the inside of the ink chamber 157 is pressurized by the membrane 30, the phenomenon in which the pressure in the ink chamber 157 is not lowered does not occur, so that the ink ejection operation is performed stably.

특히, 잉크챔버베리어(145)가 노즐플레이트(147)와 같은 니켈로 제조되므로, 노즐플레이트(147)와 잉크챔버베리어(145)가 실질적으로는 일체로 형성된 구조를 가지며, 또한 잉크챔버베리어(145)의 도금이 보다 원활하게 수행되게 된다.In particular, since the ink chamber barrier 145 is made of nickel such as the nozzle plate 147, the nozzle plate 147 and the ink chamber barrier 145 have a structure which is formed substantially integrally, and also the ink chamber barrier 145. Plating is performed more smoothly.

한편, 잉크챔버베리어(145)가 금속성 재질로 형성되므로 잉크챔버베리어(145)와 멤브레인(30)의 접착불량이 발생할 수 있으나, 잉크챔버베리어(145)의 상부에 폴리머 재질의 접착층(143)이 형성되어 있으므로, 이 접착층(143)에 의해 잉크챔버베리어(145)와 멤브레인(30)이 기밀적으로 접착될 수 있게 된다. 따라서, 잉크챔버베리어(145)와 멤브레인(30)의 접착 공정이 용이하게 수행될 수 있게 된다.On the other hand, since the ink chamber barrier 145 is formed of a metallic material, poor adhesion between the ink chamber barrier 145 and the membrane 30 may occur, but an adhesive layer 143 of a polymer material is formed on the ink chamber barrier 145. Since the adhesive layer 143 is formed, the ink chamber 145 and the membrane 30 can be hermetically bonded. Therefore, the adhesion process of the ink chamber barrier 145 and the membrane 30 can be easily performed.

본 발명에 따르면, 잉크챔버베리어(145)가 금속성 재질로 형성되어 잉크챔버(157) 내의 잉크와 잉크챔버베리어(145)간의 반응이 방지되므로 잉크분사장치의 잉크토출작동이 안정적으로 수행되게 된다.According to the present invention, since the ink chamber 145 is formed of a metallic material, the reaction between the ink in the ink chamber 157 and the ink chamber 145 is prevented, so that the ink ejection operation of the ink ejection apparatus is performed stably.

Claims (7)

잉크분사장치의 노즐부 제작방법에 있어서,In the nozzle manufacturing method of the ink injection device, 웨이퍼상에 노즐공에 대응되는 형상의 감광성폴리머를 적층시키는 단계;Stacking a photosensitive polymer having a shape corresponding to the nozzle hole on the wafer; 상기 웨이퍼상에 니켈을 도금하여 노즐플레이트를 형성하는 단계;Plating a nickel on the wafer to form a nozzle plate; 상기 감광성폴리머를 제거하여 상기 노즐공을 구비하는 상기 노즐플레이트를 얻는 단계;Removing the photosensitive polymer to obtain the nozzle plate having the nozzle hole; 상기 노즐플레이트상에 금속성 재질의 잉크챔버배리어를 형성하는 단계; 및Forming an ink chamber barrier of a metallic material on the nozzle plate; And 상기 잉크챔버배리어의 상면에 폴리머를 도포하여 접착층을 형성하는 단계를 포함하는 것을 특징으로 하는 잉크분사장치의 노즐부 제작방법.And forming an adhesive layer by applying a polymer to an upper surface of the ink chamber barrier. 제 1항에 있어서,The method of claim 1, 상기 잉크챔버배리어를 형성하는 단계는,Forming the ink chamber barrier, 상기 노즐플레이트의 상면에 상기 잉크챔버배리어의 형상에 대응하는 도금틀을 형성하는 단계;Forming a plating mold corresponding to a shape of the ink chamber barrier on an upper surface of the nozzle plate; 상기 노즐플레이트의 상부를 금속성 재질로 도금하는 단계; 및Plating an upper portion of the nozzle plate with a metallic material; And 상기 도금틀을 제거하는 단계를 포함하는 것을 특징으로 하는 잉크분사장치의 노즐부 제작방법Nozzle part manufacturing method of the ink injection device comprising the step of removing the plating mold 제 2항에 있어서,The method of claim 2, 상기 도금틀을 형성하는 단계는,Forming the plating mold, 상기 노즐플레이트상에 감광성폴리머 재질의 도금틀층을 적층시키는 단계; 및Stacking a plating mold layer of photosensitive polymer on the nozzle plate; And 상기 잉크챔버베리어의 형상에 대응하는 형상을 갖도록 상기 도금틀층을 식각하는 단계를 포함하는 것을 특징으로 하는 잉크분사장치의 노즐부 제작방법.And etching the plating frame layer so as to have a shape corresponding to that of the ink chamber barrier. 제 1항에 있어서,The method of claim 1, 상기 잉크챔버배리어는 니켈로 제조되는 것을 특징으로 하는 잉크분사장치의 노즐부 제작방법.And the ink chamber barrier is made of nickel. 삭제delete 삭제delete 삭제delete
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KR19990031921A (en) * 1997-10-15 1999-05-06 윤종용 HEATING DEVICE FOR INKJET PRINTER HEAD AND METHOD FOR MANUFACTURING
KR19990066141A (en) * 1998-01-22 1999-08-16 박호군 Inkjet Printheads and Manufacturing Method Thereof

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KR19980065807A (en) * 1997-01-15 1998-10-15 김광호 Ink ejector structure of the print head
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KR19990031921A (en) * 1997-10-15 1999-05-06 윤종용 HEATING DEVICE FOR INKJET PRINTER HEAD AND METHOD FOR MANUFACTURING
KR19990066141A (en) * 1998-01-22 1999-08-16 박호군 Inkjet Printheads and Manufacturing Method Thereof

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