KR100612267B1 - Semiconductor device - Google Patents

Abstract

The present invention suppresses the enlargement of the semiconductor device and reduces the occurrence of noise. The semiconductor device of the present invention includes a base 5 provided with surface layers 9 and 11 on both sides of a core layer 7 formed of a printed wiring board, and a semiconductor device 1 mounted on the base 5, and the semiconductor device. (1) is joined by one surface layer 9 and a joining member 3, a plurality of external terminals 55 are arranged in the other surface layer 11, the semiconductor element 1 in the core layer 7 ) And a plurality of through holes 41, 43, 45, 75, 77 for electrically connecting the plurality of external terminals 55, and a plurality of through holes 41, 43, 45, 75, 77 At least one additional through hole 75 provided between the plurality of array through holes 41, 43, 45 and the plurality of array through holes 41, 43, 45 arranged in correspondence with the arrangement of the external terminals 55. 77).

Description

Semiconductor device {SEMICONDUCTOR DEVICE}

The present invention relates to a semiconductor device.

Ball grid array semiconductor device (hereinafter referred to as BGA semiconductor device), lattice-shaped terminals, pin grid array semiconductor device (hereinafter referred to as PGA semiconductor device), and run grid array semiconductor device (hereinafter referred to as LGA semiconductor device) Device scale package semiconductor devices (hereinafter referred to as CSP semiconductor devices) and the like are widely used due to the large number of acceptable signal lines.

In these semiconductor devices, in order to reduce electrical noise, in addition to the first ground through hole electrically connected to the ground layer, such as the semiconductor device described in Japanese Patent Laid-Open No. 7-153869, a ground provided at a predetermined portion of the bottom surface is provided. It is proposed that a plurality of second ground through holes electrically connected to the ground layer may be provided in the pattern. For example, the semiconductor device described in Japanese Patent Laid-Open No. 7-153869 can effectively suppress noise generation by enlarging the area of the ground layer through which current flows effectively.

However, in these semiconductor devices, the ground pattern is provided so as to surround the periphery of each electrode, and the ground pattern is provided with a second ground through hole electrically connected to the ground layer, so as to form the ground pattern. The semiconductor device becomes large in size. When the semiconductor device is enlarged, there are problems such as an increase in the cost of the semiconductor device, an increase in the mounting area of the semiconductor device, and an increase in the cost of the electronic device on which the semiconductor device is mounted.

An object of the present invention is to reduce the size of a semiconductor device and to reduce the occurrence of noise.

The present invention achieves the above object by the following means. That is, the present invention includes a base provided with surface layers on both surfaces of a core layer formed from a printed wiring board, and a semiconductor device mounted on the base, the semiconductor device being bonded to one surface layer among the surface layers by a bonding member, A plurality of external terminals are arranged in the other surface layer, and a plurality of through holes for electrically connecting the semiconductor element and the plurality of external terminals are formed in the core layer, and the plurality of through holes correspond to the arrangement of the plurality of external terminals. A semiconductor device comprising a plurality of array through holes arranged in such a manner and one or more additional through holes provided between the plurality of array through holes.

In this manner, in addition to the arrangement through holes arranged in the core layer of the base corresponding to the arrangement of the external terminals, an additional through hole which does not have a magnetic external terminal, that is, a corresponding external terminal, is provided between the arrangement through hole and the arrangement through hole. In addition, an additional through hole can be provided near the array through hole, and inductance can be reduced. In addition, since the additional through hole does not have a corresponding external terminal, the number of external terminals of the semiconductor device can be reduced, and the semiconductor device can be miniaturized, as compared with forming the external terminal or pattern of the through hole on the base surface. . For this reason, it is possible to avoid the increase in size of the semiconductor device and to reduce the inductance, thereby reducing the occurrence of noise in the semiconductor device.

In the semiconductor device of the present invention, a plurality of external terminals are formed of an external signal terminal, an external power supply terminal, and an external ground terminal, and the plurality of through holes include a signal through hole for electrically connecting the external signal terminal and the semiconductor device. A power through hole electrically connecting the external power supply terminal and the semiconductor device, a ground through hole electrically connecting the external ground terminal and the semiconductor device, and an electrical connection between the external power supply terminal and the semiconductor device or the external ground terminal and the semiconductor device. It can also comprise an additional through-hole. At this time, more through holes may be provided than additional through holes than the number of external terminals.

As such, a signal through hole electrically connecting the external signal terminal and the semiconductor element, a power through hole electrically connecting the external power supply terminal and the semiconductor element, a ground through hole electrically connecting the external ground terminal and the semiconductor element; A plurality of through holes, including additional through holes for electrically connecting the external power supply terminal and the semiconductor element or electrically connecting the external ground terminals and the semiconductor element, are installed by the number of additional through holes more than the number of external terminals. Therefore, the inductance of the ground or the power supply can be reduced when the additional through hole is provided, and noise generation of the semiconductor device can be reduced. In addition, the increase in the size of the semiconductor device can be suppressed when no external terminal is provided.

In the semiconductor device of the present invention, a plurality of through holes in which a plurality of through holes are arranged corresponding to an arrangement of a plurality of external terminals, and one or two or more disposed between the array through holes and the array through holes. It is made from an additional through hole. These plurality of through holes are provided by the number of additional through holes more than the number of external terminals. The plurality of array through holes electrically connect the external signal terminals and the semiconductor elements, and electrically connect the array signal through holes arranged corresponding to the arranged external signal terminals, and electrically connect the external power supply terminals and the semiconductor elements. And an array power supply through hole arranged in correspondence with the external power supply terminal, and an array ground through hole electrically connected to the external ground terminal and the semiconductor terminal and arranged in correspondence with the arranged external ground terminal. The additional through hole may be disposed between the array signal through hole and the array signal through hole arranged in such a manner that the external power supply terminal and the semiconductor element are electrically connected or the external ground terminal and the semiconductor element are electrically connected.

In this way, since more through holes are provided in the core layer of the base by the number of additional through holes than the number of external terminals, the inductance of the ground and the power supply can be reduced by the additional through holes. Further, since the additional through hole is provided between the array signal through hole and the array signal through hole, the additional through hole can be provided in the vicinity of the array signal through hole, thereby reducing the inductance of the ground and the power supply. In addition, since the additional through-hole does not have a magnetic external terminal, the semiconductor device can be miniaturized as compared with the formation of the external terminal and the pattern on the base surface, thereby avoiding the enlargement of the semiconductor device and the electronic apparatus actually mounted thereon, and thus the cost. The increase of can be suppressed. In addition, when the diameter of the external terminal is larger than the diameter of the through hole, the additional through hole has no magnetic external terminal and is closer to the array signal through hole than the array power supply through hole having the magnetic external terminal or the array ground through hole. It can install and can reduce the inductance of ground and a power supply.

In the semiconductor device of the present invention, the base may be divided into a plurality of regions, and array through holes may be provided in the plurality of regions, and additional through holes may be provided between the region where the array through holes are provided.

In this way, since the base is divided into a plurality of regions and additional through holes are provided between the divided regions and the regions, the base terminals corresponding to the external terminals disposed in the center portion are provided in comparison with the ground through holes provided around the base. Since an additional through hole can be provided in the vicinity of the array through hole, the inductance can be reduced. In addition, since the external terminal corresponding to the additional through hole is not provided, the enlargement of the semiconductor device can be suppressed.

In the semiconductor device of the present invention, the additional through hole may be provided in the diagonal vicinity of the base formed in the substantially rectangular shape. Thus, by dividing the base into a plurality of regions diagonally, and providing additional through holes between the divided regions and the regions, the additional through holes can be provided without significantly changing the wiring of the conventional semiconductor device. have. These areas are not limited to areas divided along a diagonal line, but the areas may be divided so that the wiring of the base is not significantly changed. For example, the areas divided by two straight lines orthogonal to the base are substantially rectangular. It may be divided into four so as to be.

In the case where the arrangement through hole of the semiconductor device is composed of a main power through hole provided in the center portion, a signal through hole provided in the periphery thereof, and a power through hole and ground through hole provided between these signal through holes, The additional through hole is provided between the area of the power supply through hole and the area of the signal through hole at the periphery, and between the area of the power supply through hole and the area of the signal through hole. The area of the signal through hole may be further divided into diagonal lines of the base, and additional through holes may be provided between them. In this case, it is preferable to divide the area of each signal through hole so that it is about the same size or the number of array holes that are almost the same.

In addition, the signal through hole is preferably provided in the core layer within four times the number of the sum of the power through hole, the ground through hole, and the additional through hole.

For example, when a plurality of signal through holes are provided and ground through holes are provided in the vicinity of the plurality of signal through holes, when a current flows through the plurality of signal through holes, the ground through is induced by the induction of the plurality of currents. If a current flows through the hole, the current flowing through the ground through hole is not preferable because the current paths overlap and the inductance becomes large. If the number of signal through holes is four times or more than the sum of the additional through holes, the power through holes, and the ground through holes, the increase in inductance of the ground or power supply due to overlapping current paths can be reduced.

Other objects, features and advantages of the invention will be apparent from the following description of the embodiments of the invention with reference to the accompanying drawings.

1 is a vertical sectional view showing a schematic configuration of a semiconductor device in one embodiment of the present invention.

FIG. 2 is a bottom view of the semiconductor device of FIG. 1. FIG.

3 is a horizontal cross-sectional view illustrating a schematic configuration of the semiconductor device of FIG. 1.

4 is a schematic perspective view illustrating an operation of the semiconductor device of FIG. 1.

Fig. 5 is a horizontal cross sectional view showing a schematic configuration of a semiconductor device in one embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described with reference to FIGS.

As shown in FIG. 1, the BGA semiconductor device of this embodiment includes a semiconductor element 1 and a base 5 bonded to the semiconductor element 1 by a bonding member, for example, a solder ball 3. It is configured to include.

In the semiconductor device 1, terminals (not shown) are provided on one surface of the side of the base 5 side, and terminals (not shown) are arranged in a lattice shape.

The base 5 which enlarges the space | interval of each terminal which is not shown in the lattice shape of the semiconductor element 1, ie, the pitch of the terminal which is not shown in the semiconductor element 1, is electrically connected to the motherboard of an electronic device, etc. Is formed of a core layer 7 formed of a printed wiring board and surface layers 9 and 11 capable of high density wiring provided on both surfaces of the core layer 7.

Of the surface layers 9 and 11 provided on both surfaces of the core layer 7, the surface layer 9 provided on the side of the semiconductor element 1 is joined to the semiconductor element 1 by a solder ball 3 which is a joining member, and the semiconductor Between the element 1 and the surface layer 9, an insulator, such as an epoxy resin (not shown), is filled and sealed.

The plurality of terminals (not shown) of the semiconductor device 1 include a signal terminal, a power supply terminal, and a ground terminal, and the plurality of terminals (not shown) are lattice-shaped on the side of the base 5 side of the semiconductor device 1. It is installed.

As for the surface layer 9, the conductor layer 13 which connects with the terminal (not shown) of the semiconductor element 1 is provided in the surface of the surface layer 9, ie, the surface which opposes the semiconductor element 1, Thus, the insulator layer 15, the conductor layer 17 and the insulator layer 19 are formed from the semiconductor element 1 side toward the core layer 7 of the base 5 so that the conductor layer and the insulator layer are laminated to each other. It is.

The conductor layer 13 includes a signal line 20, a signal terminal 21, a power supply terminal 23, a ground terminal 25, and the like. The signal terminal 21, the power terminal 23, and the ground terminal 25 of the conductor layer 13 are provided at positions opposite to the signal terminal, power terminal, and ground terminal (not shown) provided in the semiconductor device 1, respectively. It is connected by the solder ball 3, respectively.

The conductor layer 17 comprises a plane ground conductor layer, a signal conductor layer provided in an opening formed in the plane ground conductor layer, and a power conductor layer.

The core layer 7 is provided with a conductor layer 27 on the surface of the core layer 7, that is, the surface in contact with the heat transfer layer 19 of the surface layer 9, and then the insulator layer 29 and the conductor layer 31. ), The insulator layer 33, the conductor layer 35, the insulator layer 37, and the conductor layer 39 are formed from the surface layer 9 side toward the surface layer 11 side, and the conductor layer and the insulator layer are laminated to each other. It is.

The conductor layer 27 includes a plane power supply conductor layer, a signal conductor layer provided in an opening formed in the plane power supply conductor layer, and a ground conductor layer.

The conductor layer 31 is comprised including the plane ground conductor layer and the power supply conductor layer provided in the opening part formed in this plane ground conductor layer.

The conductor layer 35 is comprised including the plane power supply conductor layer and the ground conductor layer provided in the opening part formed in this plane power supply conductor layer.

The conductor layer 39 includes a plane ground conductor layer, a signal conductor layer provided in an opening formed in the plane ground conductor layer, and a power conductor layer.

The core layer 7 has an array signal through hole 41 for electrically connecting signal conductor layers provided on both sides of the core layer 7, and a plane power supply layer and a power conductor provided in the core layer 7 in the same manner. An array power supply through hole 43 for electrically connecting the layers and an array ground through hole 45 for electrically connecting the plane ground conductor layer and the ground conductor layer provided in the core layer 7 are provided.

The array signal through hole 41, the array power supply through hole 43, the array ground through hole 45, etc. of the core layer 7 form a hole in a conductor layer of a plane which is not connected, for example. It is formed by forming a through hole penetrating through the hole of the conductor and forming copper on the inner surface of the through hole by electroless copper plating. At this time, the copper provided in the conductor layer of the plane and the inner surface of the through hole is separated by an insulator. In addition, through holes are formed in the conductor layer of the plane to be connected without forming holes. At this time, since the end surface of the plane conductor layer is exposed on the inner surface of the through hole, copper is formed on the inner surface of the through hole by electroless copper plating so that the through hole and the conductor layer of the plane are connected. In this way, the through hole of the core layer 7 is formed by drilling a printed wiring board that is the core layer 7 with a drill and plating the hole.

The array signal through hole 41 electrically connects the signal conductor layers provided on both surfaces of the core layer 7, that is, the signal conductor layer of the conductor layer 27 and the signal conductor layer of the conductor layer 39.

The array power supply through hole 43 is a plane power supply conductor layer provided on the surface of the semiconductor element 1 side of the core layer 7, that is, a plane power supply conductor layer of the conductor layer 27, and a plane power supply of the conductor layer 35. The conductor layer and the power conductor layer provided on the surface of the surface layer 11 side of the core layer 7, that is, the power conductor layer of the conductor layer 39 are electrically connected.

The array ground through hole 45 is a ground conductor layer provided on the surface of the semiconductor element 1 side of the core layer 7, that is, a ground conductor layer of the conductor layer 27, and a plane ground conductor layer of the conductor layer 31. And the plane ground conductor layer provided on the bottom of the core layer 7, that is, the plane ground conductor layer of the conductor layer 39 are electrically connected.

As for the surface layer 11, the insulator layer 47 is provided in the surface which contact | connects the core layer 7, among the surfaces of the surface layer 11 similarly to the surface layer 9, Next, the conductor layer 49 ), The insulator layer 51 and the conductor layer 53 are formed from the core layer 7 toward the bottom surface of the base 5, and the conductor layer and the insulator layer are laminated to each other.

The conductor layer 49 is comprised from a plane power supply conductor layer, the signal conductor layer provided in the opening formed in this plane power supply conductor layer, and a ground conductor layer.

The conductor layer 53 is a conductor layer formed by an external terminal 55 such as an external signal terminal 55s, an external power supply terminal 55v, an external ground terminal 55g, and the like. 62) is joined. The solder ball 62 is used to connect a semiconductor device to a substrate of an electronic device (not shown).

In addition, the surface layer 9 has a conductor layer 13 and a conductor layer 17 insulated by the insulator layer 15, and a conductor layer 17 and a core layer 7 insulated by the insulator layer 19. Vias 63 are provided to electrically connect the layers 27, respectively. The conductor layer 39 of the core layer 7 insulated by the insulator layer 47, the conductor layer 49 of the surface layer 11, and the conductor layer 49 insulated by the insulator layer 51 also in the surface layer 11. ) And the conductor layer 53 are respectively provided with a via 63.

Holes are formed in the insulator layer by photolithography or laser, copper is formed on the entire surface by electroless copper plating, and copper is etched by photolithography to form wiring patterns. Holes in the insulator layer create depressions in the surface of the layer formed thereon. Short wirings are formed in the holes of the conductor layer of the plane from the restrictions of photolithography, and the amount of dents is dispersed by shifting the positions of the via to the lower layer and the via to the upper layer.

Here, the signal connection path is a signal conductor layer, a via 63, a conductor of the solder ball 3, the conductor layer 13, the via 63, the conductor layer 17 from a signal terminal (not shown) of the semiconductor device. Signal conductor layer of layer 27, array signal through hole 41, signal conductor layer of conductor layer 39, via 63, signal conductor layer of conductor layer 49, via 63, conductor layer ( 53 are external signal terminals 55s and solder balls 62. Signal terminals (not shown) of the semiconductor element 1 are connected in a one-to-one relationship with the external signal terminals 55s of the conductor layer 53, which are output terminals of the semiconductor device, respectively.

The connection path of the power source is the power supply layer of the solder ball 62, the conductor layer 13, the via 63, the conductor layer 17 from the power supply terminal (not shown) of the semiconductor device, the via 63, the conductor layer ( 27, the plane power conductor layer of the array power supply through-hole 43, the plane power source conductor layer of the conductor layer 35, the array power source through-hole 43, the power source conductor layer of the conductor layer 39, the via 63, The plane power supply conductor layer of the conductor layer 49, the via 63, the external power supply terminal 55v of the conductor layer 53, and the solder ball 62. As shown in FIG.

The connection path of the ground is a plane ground conductor layer, a via 63, a conductor layer of the solder ball 62, the conductor layer 13, the via 63, and the conductor layer 17 from a ground terminal (not shown) of the semiconductor device. (27) power supply layer, array ground through hole 45, plane ground conductor layer of conductor layer 31, array ground through hole 45, plane ground conductor layer of conductor layer 39, via 63 The ground conductor layer of the conductor layer 49, the via 63, the external ground terminal 55g of the conductor layer 53, and the solder ball 62.

In this way, the power source is formed by the via 63 or the array power supply through hole 43. The plane power source conductor layer of the conductor layer 27, the plane power source conductor layer of the conductor layer 35, and the plane of the conductor layer 49. It is connected to the conductor layer of the power supply arrange | positioned at the plane of a power supply conductor layer, and the ground is connected to the plane ground conductor layer of the conductor layer 17, and the conductor layer 31 by the via 63 and the arrangement ground through-hole 45. It is connected to the plane ground conductor layer and the conductor layer of the ground arrange | positioned at the plane of the plane ground conductor layer of the conductor layer 39. As shown in FIG. Moreover, the conductor layer arrange | positioned at the plane has many holes, a conductor is formed in the hole, and a signal line is connected to another layer.

The outer terminals 55 forming the conductor layer 53 of the surface layer 11 are arranged in a lattice shape on the surface of the surface layer 11, that is, the bottom surface 64 of the semiconductor device, as shown in FIG. For example, 121 rows of 11 rows and 11 columns are provided. 2, the solder ball 62 is abbreviate | omitted for description. The bottom surface 64 of the semiconductor device, in which the external terminals 55 are provided in a lattice shape, has an internal power supply region 65 formed in a substantially square at a central portion thereof, and a signal line region 67 formed around the internal power supply region 65. Divided into The signal line region 67 is divided into four in the vicinity of the diagonal of the base 5.

In the internal power supply region 65 formed at the center of the bottom surface 64 of the semiconductor device, a total of 25 external power terminals 55v and external ground terminals 55g are provided in a lattice shape in five rows and five columns, and the external power terminal ( 55v) and the external ground terminal 55g are arranged to be adjacent to each other, and the external ground terminal 55g surrounds the external power supply terminal 55v.

On the other hand, the external power supply terminal 55v is disposed so as to surround the external ground terminal 55g. That is, in the internal power supply region 65, nearly the same number of external power supply terminals 55v and 55g of external ground terminals are alternately arranged.

The signal line region 67 formed around the internal power supply region 65 is divided into four regions by a diagonal of the bottom surface 64 of the semiconductor device, and the external signal terminals 55s are respectively provided in the divided signal line region 67. The external power supply terminal 55v and the external ground terminal 55g are disposed. On the inner circumferential portion adjacent to the internal power supply region 65 of the signal line region 67 and on the diagonal of the bottom surface 64, the outer ground terminals 55g are disposed at substantially equal intervals. That is, an external ground terminal 55g is provided at each part on the side of the internal power supply region 65 of the signal line region 67 and at each outside of the signal line region 67, and the internal power supply region 65 of the signal line region 67 is provided. The outer ground terminal 55 is also provided in the middle portion of each of the outer ground terminals 55g provided on each side of the c) side. For example, two external signal terminals 55s are disposed between the respective external ground terminals 55g on the internal power supply region 65 side of the signal line region 67. In addition, each external ground terminal 55g on the internal power supply region 65 side of the signal line region 67 is disposed adjacent to the external power supply terminal 55v in the internal power supply region 65. The external power supply terminals 55v provided in the signal line region 67 are arranged at substantially equal intervals in the outer peripheral portion of the signal line region 67, and each external power terminal 55v provided in the outer peripheral portion of the signal line region 67 is provided. ), An external signal terminal 55s is disposed. In this manner, almost the same number of external power terminals 55v and 55g of external power terminals 55v are provided in the signal line region 67, and almost three times the total number of these external power terminals 55v and 55g of external ground terminals combined. The number of external signal terminals 55s is provided, and the external signal terminals 55s are provided adjacent to the external power supply terminal 55v and the external ground terminal 55g.

The operation of the semiconductor device of this embodiment and the features of the present invention will be described. 3, the array signal through hole 41 provided in correspondence with the external signal terminal 55s, the array power supply through hole 43 provided in correspondence with the external power supply terminal 55v, Array ground through hole 45 provided corresponding to the external ground terminal 55g, additional ground through hole 75 not having the corresponding external terminal 55, and additional power supply through hole not having the corresponding external terminal 55 77 is provided.

An additional ground through hole 75 for electrically connecting a plurality of ground conductor layers formed in the core layer 7 and an additional power supply through hole electrically connecting a plurality of power conductor layers formed in the core layer 7 ( 77 is formed in the core layer 7 with almost the same number as shown in FIG.

As shown in FIG. 1, the additional ground through hole 75 includes a grade conductor layer of the conductor layer 27 provided on the surface of the core layer 7, and a conductor layer 39 provided on the bottom surface of the core layer 7. At the same time, the plane ground conductor layer of the conductor layer 31 in the core layer 7 is also electrically connected. Further, although the additional ground through hole 75 does not have a corresponding external terminal 55, the array ground through hole 45 and the external ground terminal 55g are formed by the plane ground conductor layers of the conductor layers 31 and 39. It is electrically connected with.

The additional power source through hole 77 electrically connects the plain power conductor layer of the conductor layer 27 provided on the surface of the core layer 7 and the power conductor layer of the conductor layer 39 provided on the bottom surface of the core layer 7. At the same time, the plane power supply conductor layer of the conductor layer 35 layered on the core layer 7 is also electrically connected. The additional power supply through hole 77 does not have a corresponding external terminal 55, but the array power supply through hole 43 and the external power supply terminal 55v are formed by the plane power conductor layer of the conductor layers 27 and 35. It is electrically connected with.

The array signal through hole 41, the array power supply through hole 43, and the array ground through hole 45 are each an external signal terminal 55s, an external power supply terminal 55v, and an external ground terminal 55g shown in FIG. And are arranged almost identically with In addition, the diagonally divided signal line region 67 is provided in the internal power supply region 65 so as to move away from the outer circumferential direction of the bearer 5. At this time, if each interval of the through-holes arranged in the shape of a lattice is set to 1 pitch, the signal line region 67 is provided with the half-pitch outwardly circumferentially arranged, so that between the internal power supply region 65 and the signal line region 67, And a gap is formed between the divided signal line regions 67, and an additional ground through hole 75 and an additional power supply through hole 77 are provided in this gap. The additional ground through hole 75 and the additional power supply through hole 77 do not have a magnetic terminal, that is, a terminal (not shown) of the corresponding semiconductor element 1 or a corresponding external terminal 55, as shown in FIG. Instead, it is formed in the core layer 7.

That is, the array signal through hole 41, the array power supply through hole 43, and the array ground through hole 45 are arranged so that their relative arrangement is substantially the same as that of the external terminal 55 of FIG. The additional ground through hole 75 and the additional power supply through hole 77 are disposed at positions not in the arrangement of the external terminals 55.

The additional ground through hole 75 and the additional power supply through hole 77 are alternately provided between the internal power supply region 65 and the signal line region 67, that is, around the internal power supply region 65. Further, the additional ground through hole 75 and the additional power supply through hole 77 are provided between the signal line region 67 and the signal line region 67, that is, on the diagonal of the base 5, and the additional power supply through hole 77 is provided. The silver base 5 is provided two on the diagonal of the surface, respectively, and the additional ground through holes 75 are provided between these two additional power supply through holes 77, respectively. In addition, the additional ground through holes 75 are provided at substantially equal intervals around the signal line region 67.

Next, the operation of the BGA semiconductor device of the present embodiment will be described with reference to FIG. FIG. 4 is a diagram schematically showing the configuration of the base 5 in order to explain the operation of the BGA semiconductor device, and part of the signal lines 79 and 81 of the conductor layers 13 and 49, and these signal lines 79 and 81. FIG. Array signal through-holes 41 electrically connected to the < RTI ID = 0.0 >), < / RTI > the plane ground conductor layers 83 and 85 of the conductor layers 17 and 39, and the additions electrically connected to these plane ground conductor layers 83 and 85. The ground through hole 75 is shown, and other structural members are omitted.

As shown in FIG. 4, the base 5 includes the signal line 79 of the conductor layer 13, the plane ground conductor layer 83 of the conductor layer 17, and the plane ground conductor layer 85 of the conductor layer 39. ) And a signal line 81 of the conductor layer 49, and an insulator layer (not shown) is provided between these conductor layers. In addition, the signal line 79 of the conductor layer 13 and the signal line 81 of the conductor layer 49 are electrically bonded by the array signal through hole 41, and the plane ground conductor layer 83 of the conductor layer 17 is connected. ) And the plane ground conductor layer 85 of the conductor layer 39 are electrically connected by the additional ground through hole 75. In addition, openings 87 and 89 are formed in the plane ground conductor layers 83 and 85 of the conductor layers 17 and 39, respectively, and array signal through holes 41 are formed in these openings 87 and 89. The array signal through hole 41 and the plane ground conductor layers 83 and 85 are not electrically connected.

In the signal input / output of the semiconductor element 1, for example, when the voltage of the signal is switched from L (Low) to H (High), the semiconductor element 1 in the vicinity of the semiconductor element 1 of the conductor layer 13 connected to the semiconductor element 1 A current flows through the signal line 79, and a reverse feedback current flows by induction into the plane ground conductor layer 83 of the conductor layer 17 opposite to the signal line 79.

In the case where the signal line 79 and the plane ground conductor layer 83 are provided in the vicinity of the signal line 79, when a current flows excessively in the signal line 79, a magnetic field is generated, and the induced current is a plane ground conductor. Flows into layer 83. The induced current flows in the plane ground conductor layer 83 in the direction opposite to the current flowing through the signal line 79 so that the magnetic field caused by the current is minimized. The current in this opposite direction is called the feedback current. The induced current flowing through the additional ground through hole 75 and the plane ground conductor layer 85 is also the same.

The current flowing through the signal line 79 of the conductor layer 13 and the feedback current flowing through the plane ground conductor layer 83 of the conductor layer 17 form a continuous current loop through the capacitance between them. The current at the time of signal switching flows in the vicinity of the semiconductor element 1 and propagates away from the semiconductor element 1 with the passage of time. That is, even in the same signal line, current flows in the portion where the signal propagates, and no current flows in the portion where the signal does not reach. The feedback current flows through the plane ground conductor layer 83 of the conductor layer 17 facing the signal line 79 of the conductor layer 13, so that the current and the feedback current are in pairs. When the current of the signal line 79 reaches the array signal through hole 41, the return current flowing through the opposing plane ground conductor layer 83 is also an opening of the plane ground conductor layer 83 on which the array signal through hole 41 is formed. (87) is reached.

Since the current reaching the array signal through-hole 41 has a current path in the array signal through-hole 41, the array signal through-hole 41 is transmitted as it is, and at the same time, the feedback current reverse to the additional ground through-hole 75 is reversed. Induce. The current flows through the array signal through hole 41 and reaches the signal line 81 of the conductor layer 49. Since the current reaching the signal line 81 has a current path in the signal line 81, the signal line 81 of the conductor layer 49 is transmitted as it is and propagates away from the array signal through hole 41 with time. . The current flowing in the signal line 81 induces a reverse feedback current to the plane ground conductor layer of the conductor layer 39 at the same time. The current flowing through the signal line 81 of the conductor layer 49 and the feedback current flowing through the plane ground conductor layer 85 of the conductor layer 39 form a continuous current loop through the capacitance between them.

Since the feedback current flowing through the plane ground conductor layer 85 flows in the opposite direction to the current flowing in the signal line 81 of the conductor layer 49, it flows toward the array signal through hole 41, but the array signal through hole 41 ) Is provided in the opening 89 of the plane ground conductor layer 85, so the feedback current flowing through the plane ground conductor layer 85 reaching the opening 89 has no place. For this reason, the feedback current which flows through the plane ground conductor layer 85 accumulates around the opening part 89 of the plane ground conductor layer 85, and an electric potential changes, and the uncoupled current is not added to the adjacent ground through hole 75 nearby. Stop by. In addition, since the feedback current flowing through the plane ground conductor layer 83 flows using the capacitance, the potential around the opening 87 of the plane ground conductor layer 83 of the conductive layer 17 decreases, so that the additional ground nearby. In the through hole 75, an unbonded current is supplied around the opening 87 of the plane ground conductor layer 83 of the conductor layer 17.

Here, the potential of the conductor layer of the plane changes as the feedback current flows, and the current generated by the change of the potential is referred to as an uncoupled current.

The feedback current flowing through the plane ground conductor layers 83 and 85 directly below the wiring has a small inductance due to the tight coupling of the signal lines 79 and 81 provided with a thin insulator layer and the magnetic field, but the uncoupled current is the signal lines 79 and 81. Since the coupling of the magnetic field with the current flowing through the wave is small, it was found to have a large inductance. The larger the inductance of the ground, the higher the ground noise. Therefore, it has been newly found that the inductance of the ground can be made small by arranging the additional ground through hole 75 which flows a return current as close as possible to the array signal through hole 41 connected to the signal lines 79 and 81. . In this example, the plane ground conductor layers 83 and 85 are provided to face the signal lines 79 and 81, but the same applies to the plane power supply conductor layer.

In this manner, the additional ground through hole 75 and the additional power supply through hole 77 are provided between the signal line region 67 and the signal line region 67 to thereby provide the additional ground through hole 75 and the additional power supply through hole 77. Can be provided in the vicinity of the array signal through hole 41, and the inductance of the uncoupled current can be reduced, so that the noise can be reduced. In addition, since the external terminal 55 corresponding to the additional ground through hole 75 and the additional power supply through hole 77 is not provided, the through hole of the ground and the power supply can be increased without increasing the external terminal 55. Therefore, the size of the BGA semiconductor device can be suppressed and the inductance of the power supply and the ground can be reduced.

In the core layer 7, the signal region 67 is disposed outside the internal power supply region 65, so that the corner portion, the outer edge portion, the internal power supply region 65, and the signal line region 67 are separated from each other. Since the additional ground through hole 75 and the additional power supply through hole 77 can be arranged at intervals, the wiring design becomes easy.

Moreover, the output circuit of the semiconductor element 1 is comprised including the switch A which connects a signal line and a power supply, and the switch B which connects a signal line and ground, for example. When outputting the signal of L, switch B is connected, the switch A is cut | disconnected, and when outputting the signal of H, it is set as a reverse combination. Therefore, when the current path is H to L, the charge accumulated in the capacitance of the signal line is lost to the ground, and the feedback current generated by the induction of the current flowing through the signal line flows to the ground. On the other hand, when the signal is switched from L to H, the capacitance of the signal line is charged, so that the feedback current due to the induction of the current flowing through the signal line flows in the conductor layer of the power supply. As such, since the signal is transmitted, the feedback current flows in both the ground conductor layer and the power conductor layer. In this way, since the feedback current flows in both the power conductor layer and the ground conductor layer, as in the semiconductor device of this embodiment, if the through holes of the power supply and the through holes of the ground are provided almost equally, the power conductor layer and the ground conductor are provided. In both layers, the inductance of the unbound current can be reduced.

When all the ground conductor layers are used instead of the power conductor layers, a large capacitance is provided between the power supply of the output transistor of the semiconductor element and the ground, so that in the AC operation for switching signals, the power supply and the ground are alternated. You need to shut it down. In this way, it is not necessary to distinguish the power supply from the ground. However, since the semiconductor device is preferably smaller in area, it may not be possible to provide a sufficiently large capacitance in the output circuit of the semiconductor device. In the case where the same base is used for many kinds of semiconductor devices, it is preferable to use semiconductor devices having different design conditions if the number of through holes in the power source and the ground is almost equal.

BGA semiconductor devices are widely used because they have a large number of acceptable signal lines, and a plane-shaped power supply or ground pattern is provided to easily reduce power supply impedance that causes electrical noise.

As the operating frequency increases, electrical noise tends to occur even when using a BGA semiconductor device, and a ring-like ground is used to reduce the electrical noise, such as the semiconductor device described in Japanese Patent Laid-Open No. 7-153869. Providing a large number of ground through holes at the site of the pattern has been proposed.

When a large number of ground through holes are provided, the current flowing to the ground is dispersed, so that the ground inductance that causes noise can be reduced. However, when the operation speeds up, the noise may not be sufficiently reduced. In addition, although the BGA semiconductor device is suitable for accommodating a large number of signal lines, in a large BGA semiconductor device accommodating 1000 signals or more, the BGA semiconductor device is provided by providing a large number of ground through holes and external terminals connected to the ground through holes. Has not been sufficiently considered as to increase the mounting area of an electronic device and to increase the cost of an electronic device having a BGA semiconductor device or a BGA semiconductor device.

The BGA semiconductor device can realize a small size and a low price as long as it can accommodate as many signals as possible at high density in order to complete the function of transmitting signals by connecting the substrates of the semiconductor device and the electronic device. For this purpose, the external terminals of the power supply and the ground may be reduced. However, the external terminals of the power supply and the ground may have a small inductance and the noise may increase.

On the other hand, in the BGA semiconductor device of the present embodiment, the semiconductor device 1 is electrically connected to the base 5 on which the surface layers 9 and 11 are provided on both surfaces of the core layer 7 constituted of the printed wiring board. In addition to the array signal through hole 41, the array power supply through hole 43, and the array ground through hole 45 corresponding to the arrangement of 55, an additional ground through arranged at a position deviated from the arrangement of the external terminals 55; A hole 75 and an additional power supply through hole 77 are provided. In this way, since the additional ground through hole 75 and the additional power supply through hole 77 are disposed between the arrangement of the external terminals 55, the number of through holes electrically connected to the power source and the ground is increased to provide the return current. Inductance can be reduced.

In addition, the array signal through holes 41 connected to the signal lines of the semiconductor are connected to the external signal terminals 55s, respectively, so that the array power supply through holes 43 and the array ground through holes 45 connected to the power supply or the ground of the semiconductor device. ), The additional ground through hole 75 and the additional power supply through hole 77 are provided more than the external power supply terminal 55v and the external ground terminal g connected to the power supply or the ground. In this way, by adding the additional ground through hole 75 and the additional power supply through hole 77, the inductance due to the feedback current flowing to the ground or the power source at the time of signal switching is increased without increasing the number of external terminals 55. Since it can reduce, electrical noise can be reduced. In addition, since the number of external terminals 55 is not increased, it is possible to avoid an increase in size of the semiconductor device and to suppress an increase in the cost of the semiconductor device.

Further, since the additional ground through hole 75 and the additional power supply through hole 77 may be disposed at the diagonal of the base 5, the additional ground through hole 75 and the additional power through hole 77 may be disposed at an interval between the array signal through hole 41 and the array signal through hole 41. Since the through hole 75 and the additional power supply through hole 77 can be arranged, the wiring design becomes easy.

Incidentally, the arrangement of the through holes in the semiconductor device of the present invention may be arranged as shown in FIG. 5 instead of the arrangement of the through holes of the present embodiment. Since the cross-sectional structure and the arrangement of the external terminals 55 are almost the same as those in the embodiment, they are omitted.

The through-holes of the semiconductor device in the embodiment of FIG. 5 are arranged in a lattice shape substantially the same as the arrangement of the external terminals 55. Nearly equal number of additional ground through holes 75 and additional power supply through holes 77 are provided in the signal line region 67 of the through holes provided in the grid shape. An additional power supply through hole 77 is provided at substantially equal intervals at the outer circumference of the array signal through hole 41 provided adjacent to the internal power supply region 65. An additional ground through hole 75 is further provided in the outer peripheral portion of the additional power supply through hole 77 provided in the outer peripheral portion of the array signal through hole 41. At this time, the additional ground through hole 75 and the additional power supply through hole 77 are provided adjacent to the array signal through hole 41, respectively.

That is, when the signal line region 67 surrounding the inner power region 65 is formed in three stages of the inner circumference, the center circumference, and the outer side, the additional power supply through hole 77 is disposed between the inner circumference and the center circumference. The additional ground through hole 75 is provided between the center circumference and the outer circumference.

In other words, an additional ground through is provided between the signal line region 67 and the signal line region 67 in the case where an area provided with a grid-like through hole is divided into three in the longitudinal direction and three in the horizontal direction. The hole 75 and the additional power supply through hole are provided, and one additional ground through hole 75 and one additional power supply through hole 77 are provided between each signal line region.

That is, the additional ground through-hole 75 is one between the fourth row and the fifth row between the first row and the second row of the arranged through holes, and the first ground through hole 75 between the seventh and eighth rows, and the fourth and fifth rows. Between rows 1 and 2, between rows 4 and 5, between rows 10 and 11, between rows 7 and 8, between rows 1 and 2, between rows 7 and 8, between rows 10 and 11, And between the 11th and 11th rows, between the 4th and 5th rows, and between the 10th and 11th rows, between the 7th and 8th rows.

The additional power source through holes 77 are arranged between the second and third rows of the arranged through holes, between the fourth and fifth rows, between the second and third rows, between the seventh and eighth rows, and between the fourth and fifth rows. Between the third row, between the fourth and fifth row, between the ninth and tenth rows, between the seventh and eighth rows, between the second and third rows, between the seventh and eighth rows, between the ninth and tenth rows, and between the ninth and tenth rows. Between the fourth row and the fifth row, and between the ninth and tenth rows, the seventh and eighth rows are provided.

In this way, by providing the additional ground through hole 75 and the additional power supply through hole 77 in the vicinity of the array signal through hole 41, the inductance due to the uncoupled current flowing through the ground or the power source can be reduced. In addition, by adding an additional ground through hole or an additional power supply through hole without increasing the number of external terminals 55, the inductance due to the return current flowing to the ground or the power source during signal switching can be reduced, thereby providing electrical Noise can be reduced. When the pitch of the arrangement of the through holes is limited by the arrangement of the external terminals 55, the arrangement of the array signal through holes 41, the array power supply through holes 43, and the array ground through holes 45 may be arranged. The additional ground through hole and the additional power supply through hole can be provided between the array signal through holes 41 without changing.

Although the semiconductor device of this embodiment is a BGA semiconductor, the present invention is not limited to a BGA package having a printed substrate as a base 5, but is a semiconductor device having a surface lattice terminal or an area terminal such as a PGA semiconductor device or an LGA semiconductor device. You may. The arrangement of the external terminals 55 and the like is not limited to the lattice shape but may be arranged in a zigzag shape.

The external terminal 55 of the semiconductor device can be suitably selected from 1024 pins in 32 rows and 32 columns, 1600 pins in 40 rows and 40 columns, regardless of the number of terminals in the embodiment. Also in this case, the base is divided into the internal power supply region 65 and the signal line region 67, and the signal line region 67 is appropriately divided so that an additional ground through hole (around the divided signal region 67) is provided. 75 and an additional power supply through hole 77 may be provided.

Although the base 5 is formed in multiple layers by the core layer 7 and the surface layers 9 and 11, the semiconductor device of this invention is not limited to the structure of the base 5 of this embodiment, but the BGA semiconductor device is The additional ground through hole 75 and the additional power supply through hole 77 may be provided in a multilayer wiring board such as a carrier wiring board, and the number of layers of the core layer 7 and the surface layers 9 and 11 may be the number of external terminals 55. It can select suitably by wiring of a circuit.

The present invention can be adapted to a base having a multi-layer substrate having a plurality of through holes, and a semiconductor device in which a semiconductor element is mounted on the base.

Although the foregoing description has been made with respect to the embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the spirit and scope of the appended claims.

Claims (4)

A base provided with surface layers on both sides of a core layer formed of a printed wiring board, Having a semiconductor element mounted on the base, The semiconductor device is bonded to one of the surface layers by a bonding member; A plurality of external terminals are arranged in the other surface layer of the surface layer, The core layer has a plurality of power through holes and a plurality of ground through holes respectively corresponding to one of the external terminals for electrically connecting the semiconductor device and the plurality of external terminals. The base includes an internal power supply region located at its center and a signal line region formed around the internal power supply region, The internal power source area includes a grid-like arrangement of a power through hole and a ground through hole equal to the same number of ground through holes, The signal line region includes the same number of power through holes and ground through holes, The signal line region includes a signal through hole corresponding to three times the number of the sum of the power through hole and the ground through hole. The signal through hole is disposed adjacent to the power through hole and the ground through hole, The signal line region further includes at least one additional power supply through hole and at least one additional ground through hole provided between the power supply through hole and the ground through hole. And the additional power supply through hole and the additional ground through hole do not have corresponding external terminals. A base provided with surface layers on both sides of a core layer formed of a printed wiring board, And a semiconductor element mounted on the base, The semiconductor device is bonded to one of the surface layers by a bonding member; A plurality of external terminals are arranged in the other surface layer of the surface layer, The core layer has a plurality of power through holes and a plurality of ground through holes respectively corresponding to one of the external terminals for electrically connecting the semiconductor device and the plurality of external terminals. The base includes an internal power supply region located at its center and a signal line region formed around the internal power supply region, The internal power source area includes a grid-like arrangement of a power through hole and a ground through hole equal to the same number of ground through holes, The signal line region includes the same number of power through holes and ground through holes, The signal line region includes a signal through hole corresponding to three times the number of the sum of the power through hole and the ground through hole. The signal through hole is disposed adjacent to the power through hole and the ground through hole, The signal line region further includes at least one additional power supply through hole and at least one additional ground through hole provided between the internal power supply region and the signal line region. And the additional power supply through hole and the additional ground through hole do not have corresponding external terminals. The method according to claim 1, And the additional power supply through hole and the additional ground through hole are disposed in a diagonal vicinity of the core layer having a rectangular shape. The method according to claim 2, And the additional power supply through hole and the additional ground through hole are disposed in a diagonal vicinity of the core layer having a rectangular shape.

Images