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WO2005013359A1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
WO2005013359A1
WO2005013359A1 PCT/JP2003/009729 JP0309729W WO2005013359A1 WO 2005013359 A1 WO2005013359 A1 WO 2005013359A1 JP 0309729 W JP0309729 W JP 0309729W WO 2005013359 A1 WO2005013359 A1 WO 2005013359A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
semiconductor
terminals
connected
device
electrically
Prior art date
Application number
PCT/JP2003/009729
Other languages
French (fr)
Japanese (ja)
Inventor
Teruo Akashi
Katsuhiro Nakai
Tsuyoshi Nanba
Takehisa Hirano
Tomoaki Tezuka
Koji Mukai
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838Geometry or layout
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

A semiconductor device such that the wiring for mounting it on a board is facilitated even if the number of terminals of the semiconductor device is large, the pitches of the terminals are narrow, and the terminals are arranged in a plurality of lines. A semiconductor package body (3) is provided with a plurality of lines of terminals (7) arranged on its back in a matrix, at least two of which are electrically connected to a semiconductor chip (1). The terminals at the same potential, out of the terminals (7) electrically connected to the semiconductor chip (1), are electrically connected a conductive region (9) provided in the center of the back of the semiconductor package body (3). The semiconductor chip (1) can be connected to another element on a printed board (10) on which the semiconductor device is mounted, by using the wiring led out of a land corresponding only to one of the terminals connected to the conductive region (9), thus facilitating the wiring on the printed board (10).
PCT/JP2003/009729 2003-07-31 2003-07-31 Semiconductor device WO2005013359A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/009729 WO2005013359A1 (en) 2003-07-31 2003-07-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/009729 WO2005013359A1 (en) 2003-07-31 2003-07-31 Semiconductor device

Publications (1)

Publication Number Publication Date
WO2005013359A1 true true WO2005013359A1 (en) 2005-02-10

Family

ID=34113471

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/009729 WO2005013359A1 (en) 2003-07-31 2003-07-31 Semiconductor device

Country Status (1)

Country Link
WO (1) WO2005013359A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004651A (en) * 2011-06-15 2013-01-07 Panasonic Corp Print wiring board, and motor or electrical equipment including the same

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104539U (en) * 1982-12-28 1984-07-13
JPH1056093A (en) * 1996-08-07 1998-02-24 Hitachi Ltd Semiconductor device and electronic device where the semiconductor device is incorporated
JPH10335520A (en) * 1997-05-27 1998-12-18 Sony Corp Surface mounting type electronic part, wiring board, mounting board, and mounting method
JP2000022024A (en) * 1998-07-02 2000-01-21 Pfu Ltd Semiconductor surface-mounting part
JP2000091463A (en) * 1998-09-09 2000-03-31 Matsushita Electric Ind Co Ltd Bga package
US6163071A (en) * 1995-11-29 2000-12-19 Hitachi, Ltd. BGA type semiconductor device and electronic equipment using the same
JP2001053185A (en) * 1999-08-09 2001-02-23 Matsushita Electric Ind Co Ltd Semiconductor package
US6225702B1 (en) * 1997-08-29 2001-05-01 Mitsubishi Denki Kabushiki Kaisha Ball grid array to prevent shorting between a power supply and ground terminal
US20010023782A1 (en) * 1999-08-27 2001-09-27 Taisuke Nakamura Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate
JP2002353365A (en) * 2001-05-30 2002-12-06 Hitachi Ltd Semiconductor device
JP2003007750A (en) * 2001-06-19 2003-01-10 Nec Corp Semiconductor device
JP2003100947A (en) * 2001-09-20 2003-04-04 Mitsubishi Electric Corp Semiconductor device and semiconductor device module

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104539U (en) * 1982-12-28 1984-07-13
US6163071A (en) * 1995-11-29 2000-12-19 Hitachi, Ltd. BGA type semiconductor device and electronic equipment using the same
JPH1056093A (en) * 1996-08-07 1998-02-24 Hitachi Ltd Semiconductor device and electronic device where the semiconductor device is incorporated
JPH10335520A (en) * 1997-05-27 1998-12-18 Sony Corp Surface mounting type electronic part, wiring board, mounting board, and mounting method
US6225702B1 (en) * 1997-08-29 2001-05-01 Mitsubishi Denki Kabushiki Kaisha Ball grid array to prevent shorting between a power supply and ground terminal
JP2000022024A (en) * 1998-07-02 2000-01-21 Pfu Ltd Semiconductor surface-mounting part
JP2000091463A (en) * 1998-09-09 2000-03-31 Matsushita Electric Ind Co Ltd Bga package
JP2001053185A (en) * 1999-08-09 2001-02-23 Matsushita Electric Ind Co Ltd Semiconductor package
US20010023782A1 (en) * 1999-08-27 2001-09-27 Taisuke Nakamura Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate
JP2002353365A (en) * 2001-05-30 2002-12-06 Hitachi Ltd Semiconductor device
JP2003007750A (en) * 2001-06-19 2003-01-10 Nec Corp Semiconductor device
JP2003100947A (en) * 2001-09-20 2003-04-04 Mitsubishi Electric Corp Semiconductor device and semiconductor device module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004651A (en) * 2011-06-15 2013-01-07 Panasonic Corp Print wiring board, and motor or electrical equipment including the same

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