KR100609127B1 - Soldering apparatus having recovery equipment of recycled lead - Google Patents

Abstract

The present invention relates to a lead recovery apparatus for an automatic soldering machine for soldering a printed board.

The automatic soldering apparatus provided with the regenerated lead collection apparatus of the present invention includes: a solder tank 100 of a rectangular box; A nozzle unit 110 accommodated in the solder bath 100 and installed in parallel in the conveying direction of the printed circuit board; A driving unit 120 coupled to protrude to an upper portion of the solder tank 100 and provided with a power unit 122 for driving an impeller 121 stored in the solder tank 100; A basket 135 having an upper portion open to a basket receiving portion 131 formed on one side of the solder tank 100 and a plurality of through-holes 136 are densely arranged on the bottom surface thereof, and a lower portion of the solder tank 100 mounted thereon. It includes; lead waste regeneration unit 130 consisting of a remanufactured lead receiving box 138 that is receivably coupled to the receiving box fixture 139 mounted on the regeneration lead storage device; It is possible to improve the space use efficiency and to expect an effect that can prevent a huge material loss.

Solder bath, basket receptacle, drain hole, basket, through hole, regenerated solder box, tray fixture, valve

Description

Automatic Soldering Machine with Regenerated Lead Recovery Equipment {SOLDERING APPARATUS HAVING RECOVERY EQUIPMENT OF RECYCLED LEAD}

Figure 1a is an exploded perspective view showing the structure of a nozzle of a soldering apparatus according to the prior art.

1B is a perspective view showing a state in which a nozzle of a soldering apparatus according to the prior art is installed in an automatic soldering apparatus.

FIG. 1C is a front sectional view showing a state in which molten solder is ejected by FIG. 1B; FIG.

2 is an exploded perspective view of an automatic soldering machine according to the present invention.

3A to 3C are a plan view, a front sectional view, and a side sectional view showing a state where a regenerated lead recovery apparatus is installed in an automatic soldering machine according to the present invention;

Figure 4 is a perspective view showing the structure of the regenerated lead is cut in the main portion of the automatic soldering machine according to the present invention.

<Explanation of symbols for the main parts of the drawings>

100. Solder tank 110. Nozzle part

120. Drive unit 130. Wax waste regeneration unit

131. Basket Receptacle 132. Drain Hole

135.Basket 136. Through-hole

138. Recyclable storage box 139. Storage box fixture

140.Valve 141.Through hole

The present invention relates to a lead recovery apparatus of an automatic soldering machine for soldering a printed board, and more particularly, to a solder tank on which one side of the solder tank can be separated from slag and lead by the heat of the solder of the solder bath. An automatic soldering machine having a lead recovery device.

In general, printed circuit boards used in various electronic devices are mounted with various chip components according to the characteristics of the electronic device, and soldered by an automatic soldering machine.

The automatic soldering machine includes a solder processing apparatus including a fluxer, a heater, a soldering tank, and a cooler, and a conveyor serving as a conveying apparatus is provided on the upper portion of the soldering processing apparatus.

The soldering of the printed circuit board by the automatic soldering apparatus will be described briefly. First, when the printed circuit board is fixed to a conveyor and travels on the soldering apparatus, flux is first applied to the soldered surface by a fluxer. do.

Next, the flux-coated printed circuit board is preheated by a heater. If the flux remains on the printed circuit board, there is a risk that the molten solder will be scattered in the next contact process with the molten solder. Contact with the high temperature fusion solder may cause thermal shock on the printed circuit board or the chip components mounted on the printed circuit board. If the printed circuit board at normal temperature contacts the molten solder, the temperature of the molten solder may be lowered and the solderability may deteriorate. Therefore, the heater is preheated.

The printed board preheated by the heater is transferred to a solder bath and subjected to soldering by contact of molten solder.

In general, a solder nozzle of an automatic soldering machine is provided with a primary nozzle and a secondary nozzle, and a printed circuit board is soldered by continuously contacting the primary nozzle and the secondary nozzle. The primary nozzle is formed with a small-segment fractionator, and the molten solder is ejected in the form of an inclined wave, where the molten solder is hard to penetrate. It penetrates through the gap between the through hole and performs soldering.

In addition, the secondary nozzle is formed with a wide nozzle, the ejection of the molten solder is not roughly ejected in the form of a gentle wave so that the bridge or icicle generated in the primary nozzle is removed by contacting the gentle wave of the secondary nozzle The printed board is in a clean soldered state.

The specific configuration of the nozzle for the general automatic soldering apparatus as described above is as shown in FIG.

First, Figure 1a shows an exploded perspective view showing the structure of a nozzle of a soldering apparatus according to the prior art.

That is, the primary nozzle 2 is composed of a solder ejection part 14 and a nozzle plate 20, and the solder ejection part 14 is fixedly installed in the impeller tube 11 installed inside the solder bath 1. do.

The impeller tube 11 is installed inside the solder tank 1, and the impeller 5 is connected to the power unit 4 and rotates inside the impeller tube 11. In addition, an inlet (not shown) is formed on an outer circumferential surface of the impeller tube 11 so that the molten solder 8 contained in the solder tank 1 flows in, and the upper surface 12 has molten solder contained in the solder tank 1. An opening (not shown) of the same size as the lower open portion 16 of the solder ejection portion 14 is formed so that 8 is introduced into the solder ejection portion 14 described later.

The solder ejection portion 14 is formed in a rectangular parallelepiped shape in which upper and lower portions are opened for ejecting the molten solder 8 contained in the solder bath 1, and the upper open portion (8) is formed to effectively eject the molten solder (8). 15 is formed with a smaller area than the lower opening 16, the side wall 17 is formed to be inclined, and a flange having a bolt hole for fixing the nozzle plate 20 at the front and rear ends of the upper opening 15 ( 18 is formed to extend, and the flange opening 19 extending outward and formed with a bolt hole at right angles to each of the side walls 17 is formed on all sides of the lower open portion 16, and the solder ejection portion 14 is formed. It is seated on the impeller tube 11 and is fixed by bolts.

Next, FIG. 1B is a perspective view showing a state in which a nozzle of a soldering apparatus according to the prior art is installed in an automatic soldering apparatus, and FIG. 1C is a front sectional view showing a state in which molten solder is ejected by FIG. 1B.

The nozzle of the soldering apparatus shown in this figure is a state installed in the primary nozzle 2 of the automatic soldering apparatus. Here, the automatic soldering apparatus is a soldering tank (1) having a heater (7) installed at an inner circumference of the solder 7 to apply flux to a portion to be soldered and to solder the printed circuit board 6 transported in a dried state. Inside the 1), the primary nozzle 2 and the secondary nozzle 3 are installed in the conveying direction of the printed circuit board 6, and the molten solder 8 is transferred to the primary nozzle 2 and the secondary nozzle 3. Each power unit 4 and impeller 5 are installed to supply

First, when the impeller 5 is rotated by operating each power unit 4 while the heater 7 installed in the solder tank 1 is operated to melt the solder, the molten solder 8 is the primary nozzle 2. And starting to be ejected into the secondary nozzle 3, the solder wave 9 generated by the primary nozzle 2 is ejected in the form of an abrupt wave, and the molten solder 8 is ejected by the secondary nozzle 3. ) Is ejected in the form of a gentle wave so as to be almost flat, and the printed circuit board 6 coated with flux (fulx) is conveyed by the conveyor to solder the chip component.

On the other hand, in such a prior art, each of the nozzles 2 (3) oxidized and solidified by friction with air at room temperature is caused by the molten solder 8 ejected through the primary nozzles 2 and the secondary nozzles 3 at room temperature. The lead residue is generated on the periphery of the solder tank and on the upper surface of the solder tank 1, and the lead residue generated in this way must be removed from time to time as it causes the failure of soldering.

However, the lead residue exposed to the upper part of the solder tank 1 contains a large amount of lead components including slag, so that the lead residue is separated into slag and molten lead to recover only the lead component. A separate equipment for recycling lead that can be used in lead residues must be installed, and a separate waste container for collecting lead residues in an automatic soldering machine was required.

Therefore, it is pointed out that the work space is unnecessarily enlarged because a space where a device for recovering lead residues is to be installed and a work mounting space for recovering lead residues in an automatic soldering machine are required in addition to the installation space of the automatic soldering machine. The recovery device of lead waste should also be provided with a separate heating means to separate the slag and lead, so that the work efficiency is reduced as more power is consumed and a separate process for regenerating lead from lead waste is added. have.

Therefore, the present invention was devised to solve the above-mentioned disadvantages and problems in the conventional automatic soldering machine, and the solder dregs separated from the soldering surface after soldering the printed circuit board through the automatic soldering machine are integrally coupled to one side of the soldering tank. An object of the present invention is to provide an automatic soldering machine which is accommodated in a basket and separated into slag and lead due to a heater heat for heating a solder bath within the basket.

The object of the present invention is to provide a solder bath, a nozzle unit installed side by side in the conveying direction of a printed circuit board inside the solder tank, a drive unit mounted to protrude upward of the solder tank on one side of the nozzle unit, and on one side of the solder tank. A basket having an open top portion is mounted to the formed basket accommodating portion, and a remanufactured lead receiving box is formed on the lower portion of the basket by an automatic soldering machine including a lead scrap regeneration portion receivably coupled thereto.

The solder tank is coupled to a plurality of heating means to the outer surface of the wall so that the lead in the solder bath is always kept molten, the basket receiving portion formed with a drain hole formed at any point on the bottom surface on one side is integrally formed It is done.

In addition, the basket receiving portion is characterized in that the basket is provided with a plurality of through-holes on the bottom detachably.

In addition, the regeneration lead receiving box receiving the regenerated lead extracted through the drain hole of the basket receiving portion is mounted to the lower side of the basket receiving portion, it characterized in that the drawer-type sliding opening and closing.

Matters relating to the operational effects including the technical configuration for the above object of the automatic soldering machine equipped with the regenerated lead recovery device of the present invention will be clearly understood by the detailed description with reference to the following drawings in which preferred embodiments of the present invention are shown.

First, Figure 2 is an exploded perspective view of the automatic soldering machine according to the present invention, Figures 3a to 3c is a plan view, front cross-sectional view and side cross-sectional view showing a state in which the regeneration lead recovery apparatus according to the present invention is installed in the automatic soldering machine.

As shown in the drawing, the automatic soldering machine equipped with the regenerated lead collection apparatus of the present invention is installed in the solder tank 100 having an open upper side and accommodated inside the solder tank 100 and installed side by side in the conveying direction of the printed circuit board. The driving unit 120 is provided with a nozzle unit 110 and a power unit 122 for driving the impeller 121 which is coupled to protrude to the upper side of the solder tank 100 and stored into the solder tank 100. ) And a basket 135 having an open top at the basket receiving portion 131 formed at one side of the solder bath 100 and a remanufactured receiving box 138 coupled to the bottom of the basket 135. It is configured to include a wax residue regeneration unit (130).

The solder bath 100 is a plurality of heaters 101 are coupled in multiple stages on the outer surface of the wall (100a), except for the open upper portion and the lead filled in the solder bath 100 due to the heat generated from the heater 101 The molten liquid state is maintained.

The nozzle unit 110 installed in the solder tank 100 includes a primary nozzle 111 and a secondary nozzle 115 each having impeller tubes 112 and 116 and solder ejection ports 113 and 117. They are divided and installed side by side in the conveying direction of a printed board (not shown), and solder is performed by ejecting molten solder through the upper portions of the solder ejection ports 113 and 117.

At this time, the molten lead is ejected through the solder ejection openings 113 and 117 by the driving of the impeller 121 mounted on the driving unit 120. In addition, the impeller 121 is rotationally driven by the driving force of the power unit 122 mounted at the vertical upper end thereof.

Accordingly, the upper parts of the solder ejection openings 113 and 117 of the primary nozzle 111 and the secondary nozzle 115 installed so that the impeller tubes 112 and 116 are embedded in the molten solder inside the rectangular solder tank 100. The lower surface of the printed board to be conveyed at is made to be relatively uniform soldering, the bridge or icicles formed in the solder surface of the printed circuit board is peeled off from the solder surface and the melt is ejected from the solder outlet (113) (117) Part of the lead solidified at the room temperature outside the nozzle unit 110 is accumulated on the upper surface of the cover plate of the solder bath (100).

On the other hand, the one side of the solder tank 100 is formed inside the empty space portion and the basket receiving portion 131 is formed in the drain hole 132 is formed at any point of the bottom extending, the space of the basket receiving portion 131 The basket 135 of the box shape with the upper portion opened is inserted.

The basket 135 is detachably mounted on the basket receiving portion 131, and a plurality of through holes 136 are densely formed on the bottom surface of the basket 135. The through hole 136 of the basket 135 is to allow molten lead collected in the basket 135 to be melted and the molten lead from which the slag is removed is discharged to the outside through the through hole 136, in which the The separated slag remains on the bottom surface of the basket 135 in which the through hole 136 is formed.

In addition, the basket 135 is preferably formed with a pair of handles 137 extending upward from both side wall portions so as to be easily removable to the upper portion of the basket receiving portion 131.

Here, the bottom surface of the basket receiving portion 131 which the bottom surface of the basket 135 is in contact with the drain hole 132 is designed to be inclined at a predetermined angle, so that the liquid molten lead separated in the basket 135 is It is preferable to smoothly flow toward the drain hole 132.

In addition, a remanufactured lead receiving box 138 housed in a receiving box fixture 139 is mounted below the solder tank 100 on the side of the basket receiving portion 131, and the regenerated lead receiving box 138 is soldered. It is mounted receivable in the receiving fixture 139 coupled to the lower side of the tank 100, the final recovery of the molten lead extracted through the drain hole 132 of the basket receiving portion 131 is made.

On the other hand, between the lower portion of the solder tank 100 and the regeneration lead receiving box 138 is provided with a valve 140 having a through hole 141 to the insertion end side, the valve 140 is a through hole 141 It is rotatably mounted between the solder bath 100 and the regeneration solder box 138 so as to be located at a point coinciding with the drain hole 132 of the basket accommodation portion 131.

The valve 140 rotates the handle by 90 ° so that the through hole 141 passes through or is blocked by the drain hole 132, depending on the amount of the lead residue 200 collected in the basket 135, or a solder tank. The drain hole 132 is configured to be opened and closed when the regeneration lead box 138 of the lower part 100 is separated.

Looking at the production process of the regenerated lead of the present invention having such a structure as follows.

Figure 4 is a perspective view showing the regeneration structure of the lead residue by cutting the main portion of the automatic soldering machine according to the present invention, as shown in the printed substrate by the molten solder that is ejected through a pair of nozzles (111, 115) When the solder dregs 200 generated after the soldering are accumulated on the upper surface of the cover plate 102 of the solder bath 100, the worker may solder the lead scraps 200 scattered on the cover plate 102. Collect to one side of the) to be accommodated in the basket 135 mounted to the basket receiving portion 131.

Subsequently, a large amount of lead dregs 200 accommodated in the basket 135 are melted in the basket 135 by a heater 101 that heats the solder bath 100 and separated into slag and molten solder. Molten lead flows into the basket receiving portion 131 through the through hole 136 of the basket 135 and is extracted to the outside through the drain hole 132 of the basket receiving portion 131.

In addition, the molten lead discharged to the outside through the drain hole 132 is recovered through the regeneration lead receiving box 138 stored in the solder tank 100 through the through hole 141 of the valve 140. The slag remaining in the basket 135 is discarded.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

As described above, the automatic soldering machine equipped with the regenerated lead collecting device of the present invention is a heater in which a lead scraped off from the soldering surface of the printed board is accommodated in a basket integrally coupled to one side of the soldering tank and heats the soldering tank. By separating the slag and lead from the inside of the basket due to the heat, the recycled lead is recovered through the reclaimed lead receiving box, thereby improving the space use efficiency of the workplace as a separate equipment for regenerating lead from the lead residue is unnecessary. .

In addition, by extracting and recovering approximately 70% or more of lead from lead dregs generated after ordinary printed circuit board soldering, it is possible to expect an effect that can prevent enormous material loss only by the technical configuration of the basket simply attached to the solder bath.

Claims (5)

Solder tank 100 of the rectangular box having an open top; A nozzle unit 110 accommodated in the solder bath 100 and installed in parallel in the conveying direction of the printed circuit board; A driving unit 120 coupled to protrude to an upper portion of the solder tank 100 and provided with a power unit 122 for driving an impeller 121 stored in the solder tank 100; A basket 135 having an upper portion open to a basket receiving portion 131 formed on one side of the solder tank 100 and a plurality of through-holes 136 are densely arranged on the bottom surface thereof, and a lower portion of the solder tank 100 mounted thereon. Automatic lead soldering device with a regeneration lead recovery device comprising a; lead waste regeneration unit 130 consisting of a regeneration lead receiving box (138) receivably coupled to the receiving box fixture (139) mounted on. The method of claim 1, The basket receiving portion (131) is an automatic soldering device provided with a regenerated lead recovery device, characterized in that formed integrally extending on one side of the solder tank (100). The method of claim 1, The basket accommodating part 131 is provided with a drain hole 132 at one side of a bottom thereof, and an automatic soldering machine having a regenerated lead recovery device, characterized in that the bottom surface is inclined downward toward the drain hole 132. The method of claim 1, The basket 135 is an automatic soldering machine having a regenerated lead recovery device, characterized in that a pair of handles (137) extending from the upper side wall portion. The method of claim 1, Between the lower part of the solder tank 100 and the regeneration lead receiving box 138, a regeneration lead recovery device, characterized in that the valve 140 is provided with a through hole 141 is inserted rotatably mounted to the insertion end side. Equipped with automatic soldering machine.

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