KR100606240B1 - Sole reforming method - Google Patents

Abstract

The present invention relates to a method of modifying a shoe sole of a shoe sole for modifying a sole (sole, midsole, insole, and upper) and a shoe ornament with a microwave plasma, and more particularly, in the adhesion of the sole and the shoe ornament, A loading step of loading the finished shoe sole and the shoe ornament into a closed chamber of low pressure; A vacuum step of discharging air in the closed chamber to create a vacuum state; Microwave plasma reforming step of applying a microwave in the closed chamber to generate a plasma to modify the surface of the shoe sole and shoe decorations; It relates to a method of modifying a shoe sole and shoe decorations, characterized in that for modifying the sole with a plasma using a microwave.

According to the present invention, a plasma having a uniform density is applied in a state in which an adherent is embedded, and a mechanical reforming operation or a chemical buffing operation, which is a separate reforming operation, is unnecessary, and when charging an adherent into a plasma apparatus, the charging effort is reduced. There is an advantage that a modification method of the sole is provided that shortens the time of the process.

Microwave, Plasma, High Frequency Generator, Electric Field, Planar Electrode, EVA

Description

Sole reforming method

1 is a process flow diagram of a method of modifying a shoe sole according to the present invention

Figure 2 is a schematic diagram showing the microwave electromagnetic wave incident state of the present invention

Figure 3 is a schematic diagram of a plasma generator by a high frequency generator of the prior art method

Figure 4 is a schematic diagram of a plasma generator by a high frequency generator of the prior art method

5 is a process flow diagram of the conventional high frequency plasma generator

* Explanation of symbols on main parts of drawings *

10: loading step 20: feeding step

30: vacuum step 40: plasma reforming step

100: high frequency generator 110: electrode

200: airtight chamber 210: magnetron

220: metal fan 240: tray

250: adherend

The present invention relates to a method of adhering a shoe sole to modify the sole with a microwave plasma, and more particularly, in the method for adhering a shoe sole, the sole of which the molding, washing and application of the release agent is finished is loaded in a low pressure sealed chamber. Loading step; A vacuum step of discharging air in the closed chamber to create a vacuum state; Microwave plasma reforming step of modifying the surface of the shoe sole by generating a plasma by applying a microwave in the closed chamber; It relates to a method of reforming a shoe sole, characterized in that for modifying the sole with a plasma using a microwave.

The shoe industry is a representative handicraft industry, most of the manufacturing process is carried out by human hands, and because it uses a lot of organic solvents that are toxic to the living body, it is not only harmful to the human body at the time of manual work, but also causes problems with environmental pollution.

On the other hand, shoe manufacturing is made of sole manufacturing, upper (upper) manufacturing and assembly, and the sole manufacturing process is composed of the sole manufacturing, midsole manufacturing and bonding again.

After the sole and the midsole are molded, the finished window of the shoe is generally manufactured through a detailed process such as buffing washing, solvent treatment, and bonding.

Pretreatment process for adhesion promotion in the above detailed process is an important process to determine the quality of manufactured shoes, and even in the case of manufacturing shoes for a new use that goes beyond the concept of existing shoes with environmental and human-friendly materials in the future, these processes It will remain a key part of the manufacturing process.

However, in the conventional shoe bonding process, organic solvents harmful to the human body are used during the washing and pretreatment processes, which have a harmful effect on the environment and the human body, and there is a problem that the subsequent bonding process is affected depending on the material of the shoe sole.

In other words, the material of the shoe sole is ethylene vinyl acetate copolymer polymer (EVA), polyurethane (PU), etc., and it is used as a foaming agent, filler, mold releasing agent and natural or synthetic rubber during compression or injection molding. Ethylene vinyl acetate copolymer polymer, which is the most commonly used material for midsole, is composed of copolymer of ethylene and vinyl acetate. The property is changed.

The midsole manufactured by such a molding method exhibits a property of adsorbent compounds or impurities adsorbed from the atmosphere due to deterioration of adhesive strength with the adhesive. The surface impurities must be removed to improve the adhesive strength.

Therefore, in the manufacturing process of the shoe sole has been emerging as a major problem to remove the surface impurities so as to improve the adhesion state of the sole and the midsole so that the failure rate according to the adhesion state does not occur.

On the other hand, in the manufacturing process of the shoe sole as described above to improve the adhesion state of the sole and the middle window to remove the surface impurities such as release agents such that the defect rate according to the adhesion state is deformed or deformed to improve the adhesion efficiency to the surface layer This process is referred to as reforming, and in the following description of the present invention, the process will be referred to as 'reform'.

There is a method for surface treatment of plasma proposed as an alternative to solve the above problems, the technology such as patent 10-0328700 has been developed.

However, the above-mentioned patent does not solve the fundamental problem inherent in the high frequency generator by using a plasma using a known high frequency generator, and in order to compensate for this, mechanical buffing and gas washing using an inert gas have to be accompanied.

Hereinafter, a problem of the plasma generator by the high frequency generator will be described with reference to FIGS. 3 and 4.

3 and 4 are schematic diagrams of a plasma generator by a high frequency generator of the prior art.

As shown in the figure, the high frequency plasma generator is a device that generates plasma by an electric field generated by applying a high frequency voltage to the two planar electrodes 110.

At this time, the electric field V _H generated by the two planar electrodes 110 is always constant between the electrodes regardless of the distance of the planar electrodes.

Therefore, if there is no dielectric material between the two electrodes, the plasma density in the electrode is kept constant.

However, as shown in FIG. 4, when the dielectric material, which is the adherend 250, is interposed between the electrodes, the electric field at each position in the electrode is changed depending on the thickness of the dielectric material.

This has a problem that in the actual shoe manufacturing process, the plasma does not uniformly affect the adherend and the electric field is concentrated or shortage, causing the defect.

Therefore, according to the prior art, since the density of the plasma contacting the surface of the adherend varies according to the physical thickness of the adherend, much effort is required to uniformly load the adherend, and the inherent thickness difference of the sole cannot be overcome. There is a problem that is very difficult to use.

Therefore, in the case of the high-frequency plasma generator, there is a problem in that a preliminary work such as a mechanical buffing operation and a gas washing operation must be performed to compensate for this.

In order to solve the above problems, an object of the present invention is to provide a method of modifying a shoe sole by modifying the sole with plasma using microwaves so that a plasma of uniform density is applied in a state in which the adherend is embedded.

And it is an object of the present invention to provide a method of reforming a shoe sole to modify the sole with a microwave plasma that can shorten the manufacturing process by modifying the sole solely by the plasma without mechanical buffing work or gas washing work, which is a separate modification.

In addition, an object of the present invention is to provide a method of modifying a shoe sole that reduces the loading effort when charging the adherend into the plasma apparatus.

Accordingly, an object of the present invention is to provide a method for reforming a shoe sole having a low process cost through mass production, improvement of manufacturing efficiency, excellent reproducibility, and cost reduction by plasma processing and process simplification and automation.                         

Still another object of the present invention is a homogenization and generalization process that is independent of the material and molding process of the sole and the adhesive by the effect of improving the adhesion by the sputter etching effect, which is a characteristic of the plasma surface modification process. It is an object of the present invention to provide a method of modifying a shoe sole that can modify a surface.

In order to achieve the above object, the present invention provides a method for reforming a shoe sole, the loading step of loading the closed shoe sole in a closed chamber of low pressure; A vacuum step of discharging air in the closed chamber to create a vacuum state; Microwave plasma reforming step of modifying the surface of the shoe sole by generating a plasma by applying a microwave in the closed chamber; It is a technical gist of the shoe sole, characterized in that for modifying the sole with a plasma using a microwave configuration.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a process flow diagram of a shoe sole modification method according to the present invention, Figure 2 is a schematic diagram showing a microwave electromagnetic wave incident state of the present invention.

As shown in FIG. 1, the present invention provides a loading step 10, an input step 20, a vacuum step 30, and a microwave plasma reforming step 40 in a shoe sole that has undergone a manufacturing process of shoe soles and soles, which are prior art steps. Consisting of

For example, molded soles such as ethylene vinyl acetate copolymer polymer (EVA) or polyurethane (PU) (hereinafter referred to as 'adhesive material'; the adherent material of the present invention is a shoe midsole, sole, insole and upper and shoe ornaments And the inside of the sealed chamber, the chamber is vacuumed, and a microwave is applied to continuously process the surface with plasma.

In the present invention, the loading step 10 is a method of generating a plasma by the microwave, and the loading step is different from the method by the high frequency generator.

That is, in the case of using the high frequency generator as described while describing the prior art, since the density of the plasma contacting the surface of the adherend varies according to the physical thickness of the adherend, much effort is required to uniformly deposit the adherend.

However, according to the present invention, the loading operation of the adherend (hereinafter referred to as loading and loading operations) is more freely performed.

Hereinafter, the reason why charging of the adherend will be easy will be described with reference to FIG. 2.

In the case of the microwaves of the present invention, in principle, the microwaves in the chamber are in standing waves, resulting in an uneven electric field.

However, the metal fan 220 is rotated in order to break the standing wave state in the sealed chamber 200 to which the microwave is irradiated, and the adherent material is rotated by using the tray 240 at the bottom, and thus the surface of the adherent material 250 is exposed. The touching electric field becomes rather uniform compared to the high frequency generator.

That is, in the case of the high frequency electric field by the high frequency generator 100 of FIG. 3, the plasma density is uniform by generating a uniform electric field in the absence of the adherent 250, whereas the equilibrium is broken as the adherent 250 is charged. In the case of the microwave according to the present invention, a non-uniform electric field is formed in a standing wave state in the absence of an adherend in the chamber, but after the adherent 250 is loaded, the metal fan 220 is rotated to break the standing wave state. By rotating the tray 240, the electromagnetic waves contacting the surface of the adherend 250 are made uniform.

The reason for such an effect is that as shown in FIG. 4, the electric field of the high frequency generator 100 has a dielectric constant different according to the distance between the electrode 110 and the adherend 250 and the thickness of the adherent 250. While rotating the adherent 250 does not affect the absolute potential of the surface of the adherend because it acts as a variable, the microwave is a spatial concept of the standing wave state, and the metal fan 220 This is because standing waves are formed to form a relatively uniform electric field in the space, and the tray 240 is rotated to allow the adherend 250 to occupy various spaces, thereby eliminating the unevenness of the electric fields remaining in the plurality of standing waves in space. .

Therefore, even when the adherend is charged in any form, the electric field on the surface of the adherend 250 is uniform, so that the adherend can be charged more freely between the electrodes of the high frequency oscillator which breaks the balance of the electric field.

In the present invention, the deposits (10, 20) to be charged is that the molding and washing with water and the application of the release agent is finished, as described above in the present invention does not require a separate charging tray for charging, less loading effort For example, the process time is shortened.

Vacuum step 30 of the present invention is a step to create a vacuum state by discharging the air in the closed chamber (200).

The adherend 250 charged in the airtight chamber 200 is The microwave plasma reforming step 40 is performed for 1 to 600 seconds while maintaining a vacuum degree of 0.01 to 10 Torr.

The microwave plasma reforming step 40 of the present invention is a step of generating a plasma by applying a microwave in the hermetic chamber 200.

The microwave is generated by the magnetron 210 and guided into the chamber through the waveguide 230 and the frequency is 2.45 GHz.

The modification means that the release agent is removed to improve the adhesion state of the sole and the midsole in the manufacturing process of the shoe sole so that a defect rate according to the adhesion state is not generated, and the deformation is applied to the surface of the adherend so that the adhesion efficiency is good. .

Low-temperature plasma is generated in the chamber by the microwave plasma to generate a sputter etching effect to remove surface impurities existing on the sole surface of the adherent 250.

In addition, the adhesion between the sole and the adhesive is enhanced by a surface cleaning effect which removes not only surface compounds produced by the fillers, foaming agents and release agents used in the production of the sole, but also surface impurities caused by exposure to the atmosphere.

In addition, the surface modification process using low-temperature plasma has a buffing property that physically etches the sole surface, which not only increases the adhesion area of the sole surface but also exhibits the anchoring effect. The rear elasticity tightening effect increases the adhesion between the sole and the adhesive.

In addition, compared to the general buffing such as rubber or leather, the plasma surface modification process is uniformly buffed regardless of the shape to the appropriate depth of the surface, and chemicals between the functional groups on the sole surface by the reactive gas injected at the same time as the buffing The bonds do not need to be rebuffed over time due to the reinforcing effect on the buffing surface.

In addition, by cutting the polymer chain present on the surface of the sole by physical etching to convert to a low molecular weight material, by increasing the fluidity of the polymer chain by these to facilitate the mutual diffusion to increase the adhesion.

In addition, the plasma treatment can be performed uniformly regardless of the shape of the shoe.

The surface impurity such as a release agent remaining in the adherend is washed by the plasma surface treatment, and the surface is deformed to facilitate adhesion.

In general, the higher the frequency, the higher the plasma density, thus increasing the plasma voltage.

As the plasma voltage increases, the energy for ion etching increases.

Since the ion etching effect is similar to the physical treatment, the microwave plasma of the present invention does not require physical buffing before the plasma treatment.

When the reforming step 40 is completed, the adhesion of the sole of the shoe sole is taken out of the microplasma apparatus to proceed with the bonding process.

According to the present invention described above, there is an advantage that a method of modifying a shoe sole to modify the sole with a plasma using a microwave to which a plasma of uniform density is applied in a state in which the adherend is embedded.

In addition, there is an advantage of providing a method of reforming a shoe sole to modify the sole with a microwave plasma that can shorten the manufacturing process by modifying the sole only by the plasma without mechanical buffing or chemical buffing work that is a separate modification.

In addition, when charging the deposit into the plasma apparatus, there is an advantage that a method of modifying the sole that is reduced the loading effort to shorten the time of the entire process.

As a result, the present invention has an advantage of providing a shoe sole reforming method having a low process cost through mass production, improvement in manufacturing efficiency, excellent reproducibility, and cost reduction by plasma processing and process simplification and automation.

Another object of the present invention is a homogenization and generalization process that is independent of the material and molding process of the sole and the adhesive by the effect of promoting adhesion by the sputter etching effect, which is a characteristic of the plasma surface modification process, and all kinds of soles by the low temperature plasma device. There is an advantage that a method of modifying a shoe sole that can modify the surface is provided.

Claims (3)

In the modification method of the sole, A loading step of loading the closed shoe sole in a closed chamber of low pressure; A vacuum step of discharging air in the closed chamber to create a vacuum state; Microwave plasma reforming step of modifying the surface of the shoe sole by generating a plasma by applying a microwave in the closed chamber; A method of modifying the sole, characterized in that for modifying the sole with a plasma using a microwave. The method of claim 1, wherein the vacuum step How to modify the sole, characterized in that 0.01 ~ 10 Torr. The method of claim 1 or claim 2 wherein the microwave plasma reforming step Method for modifying the sole, characterized in that for rotating the adherend using a tray for 1 second to 600 seconds.

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