KR100575888B1 - Semiconductor device having pad with change of use - Google Patents

Abstract

The present invention relates to a semiconductor device capable of changing the use of a pad that can reduce the number of pads by using the test pad of the semiconductor device as a normal pad. According to the present invention, there is provided a semiconductor device capable of changing a pad's use by using a test pad as a normal pad, the semiconductor device comprising: a first internal circuit; A second internal circuit; First switching means connected to the first internal circuit; Second switching means connected to the second internal circuit; A first pad connected to the first and second switching means; And a second pad for transmitting an enable signal applied from the outside to the first and second switching means, wherein the first switching means is enabled in the test mode, and the first pad in the normal mode. 2 switching means are enabled.

Description

Semiconductor device having pad with change of use

1 is a view for explaining a semiconductor device capable of changing the use of a pad according to an embodiment of the present invention.

2 is a view for explaining a semiconductor device capable of changing a pad according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

11, 12, 21, 22: internal circuit 13, 14, 23: pad

24,25: fuse

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device capable of changing the use of a pad capable of reducing the number of pads by using a test pad of a semiconductor device as a normal pad.

In general, a semiconductor device includes a test pad for testing the inside of the semiconductor device and a normal pad (data pad, voltage pad, address pad, etc.) for operation of the semiconductor device. The number of such test pads and normal pads increases gradually as miniaturization, high integration, and multifunction of semiconductor devices proceed rapidly. The more test pads, the more accurate the test and fabrication of the inside of the semiconductor device can be improved, the reliability of the semiconductor device can be improved, and the manufacturing time of the semiconductor device can be reduced by shortening the test time of the semiconductor device.

However, the test pads are no longer needed when fabrication of the semiconductor device is completed. That is, test pads become unnecessary elements in the fabricated semiconductor device, and these unnecessary test pads increase the size of the chip. As a result, the conventional semiconductor device has a problem contrary to the trend of miniaturization and high integration.

Therefore, the present invention was created to solve the problems inherent in the semiconductor device according to the prior art as described above, an object of the present invention is to reduce the number of pads by using the test pad of the semiconductor device as a normal pad chip The present invention provides a semiconductor device capable of changing the use of a pad capable of reducing the size of the semiconductor device and miniaturizing and integrating the semiconductor device.

In order to achieve the above object, according to an aspect of the present invention, there is provided a semiconductor device capable of changing the use of the pad by using the test pad as a normal pad, the semiconductor device comprising: a first internal circuit; A second internal circuit; First switching means connected to the first internal circuit; Second switching means connected to the second internal circuit; A first pad connected to the first and second switching means; And a second pad for transmitting an enable signal applied from the outside to the first and second switching means, wherein the first switching means is enabled in the test mode, and the first pad in the normal mode. It is characterized in that the two switching means are enabled.

In the above configuration, when the first switching means is enabled, the first pad and the first internal circuit are connected, and when the second switching means are enabled, the first pad and the second internal circuit Is connected.

According to another aspect of the invention, there is provided a semiconductor device capable of changing a pad's use by using a test pad as a normal pad, the semiconductor device comprising: a first internal circuit; A second internal circuit; First connecting means connected to the first internal circuit; Second connecting means connected to the second internal circuit; And a pad connected to the first and second connecting means, wherein the first connecting means is enabled in the test mode, and the second connecting means is enabled in the normal mode. .

According to yet another aspect of the present invention, a semiconductor device capable of changing a pad's use by using a test pad as a normal pad is provided, the semiconductor device comprising: a first internal circuit; A second internal circuit; And pads connected to the first and second internal circuits, wherein the first internal circuit and the pad are selected and used in the test mode by a metal option, and the second internal circuit in the normal mode. The pad is selected and used.

(Example)

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining a semiconductor device capable of changing a pad according to an embodiment of the present invention.

The semiconductor device according to the present invention includes first and second internal circuits 11 and 12, first and second switching transistors T1 and T2, and first and second pads 13 and 14. The first and second internal circuits 11 and 12 are internal circuits of the semiconductor device, wherein the first internal circuit 11 is a circuit for testing the semiconductor device and the second internal circuit 12 is for operating the semiconductor device. Circuit. In addition, the first and second internal circuits 11 and 12 are connected to the first pad 13 by the first and second switching transistors T1 and T2. The first and second switching transistors T1 and T2 are enabled by an enable signal applied from the second pad 14, and when enabled, the first pad 13 is first and second. It is connected to the internal circuits 11 and 12, respectively. The enable signal is transmitted to the gate terminals of the first and second switching transistors T1 and T2. The enable signal applied to the second switching transistor T2 is inverted by the inverter IN and applied to the enable signal applied to the first switching transistor T1. The substrate voltage terminals of the first and second switching transistors T1 and T2 are connected to an external voltage VEXT. The second pad 14 receives the enable signal and transmits the enable signal to the first and second switching transistors T1 and T2, and the first pad 13 includes the first and second internal circuits 11. And 12).

Hereinafter, the operation of the semiconductor device according to the present invention will be described with reference to the mode of the semiconductor device.

First, in the test mode for testing the inside of the semiconductor device, when the second pad 14 is connected to the ground terminal, the second pad 14 receives the low level enable signal and the first and second electrodes. It transfers to the switching transistors T1 and T2. The first switching transistor T1 is enabled by the enable signal, and the second switching transistor T2 is disabled. As a result, as the first pad 13 is connected to the first internal circuit 11, the semiconductor device is tested by the first internal circuit 11, and the test signal is input and output through the first pad 13. do. That is, the first pad 13 is used as a test pad of the semiconductor device, and performs a test operation such as measuring an internal voltage of the semiconductor device through the first pad 13.

Next, in the normal mode in which the semiconductor device is normally operated, the second pad 14 receives a high level enable signal and transmits the enable signal to the first and second switching transistors T1 and T2. The first switching transistor T1 is disabled and the second switching transistor T2 is enabled by the enable signal. As a result, as the first pad 13 is connected to the second internal circuit 12, the semiconductor device is operated by the second internal circuit 12, and the operation signal is transmitted through the first pad 13. Input and output That is, the first pad 13 is used as a normal pad of the semiconductor device, and performs normal operations such as data input / output, voltage supply, and address application of the semiconductor device through the first pad 13.

As described above, in the semiconductor device according to the present invention, the first pad 13 is connected to the first internal circuit 11 or the second internal circuit 12 by the first and second switching transistors T1 and T2. Connected. By the switching transistors T1 and T2, the first pad 13 functions as a test pad or a normal pad of the semiconductor device.

2 is a diagram for describing a semiconductor device capable of changing a pad according to another exemplary embodiment of the present disclosure. Hereinafter, only portions different from those of FIG. 1 will be described.

Unlike the above embodiment in which the pad of the semiconductor device according to the present embodiment can be used, the pads 13 and the internal circuits 11 and 12 of the semiconductor device are connected using the switching transistors T1 and T2. The fuses 24 and 25 connect the internal circuits 21 and 22 to the pads 23. In addition, unlike the embodiment of the present invention, which further includes a pad 14 for receiving an enable signal and enables the switching transistors T1 and T2 through the enable signal, the fuses 24 and 25 are provided. The fuses 24 and 25 are enabled through the connection of. Here, the internal circuits 21 and 22 and the pads 23 may be connected by a metal option method using a mask instead of the fuses 24 and 25.

A semiconductor device capable of changing the use of a pad having such a structure may also implement the same effects as in the previous embodiment.

According to the above-described configuration of the present invention, by using the test pad as a normal pad, the number of pads can be reduced to reduce the chip size of the semiconductor, resulting in miniaturization and high integration of the semiconductor device.

While the invention has been shown and described with reference to specific embodiments, the invention is not so limited, and it is to be understood that the invention is capable of various modifications without departing from the spirit or field of the invention as set forth in the claims below. It will be readily apparent to one of ordinary skill in the art that modifications and variations can be made.

Claims (6)

In a semiconductor device capable of changing the purpose of the pad by using the test pad as a normal pad, A first internal circuit; A second internal circuit; First switching means connected to the first internal circuit; Second switching means connected to the second internal circuit; A first pad connected to the first and second switching means; And And a second pad configured to transmit an enable signal applied from the outside to the first and second switching means. In the test mode, the first switching means is enabled, In the normal mode, the second switching means is enabled, the semiconductor device capable of changing the pad, characterized in that enabled. The method of claim 1, When the first switching means is enabled, the first pad and the first internal circuit are connected, And the first pad and the second internal circuit are connected to each other when the second switching means is enabled. The method of claim 2, And the second switching means inverts and receives the enable signal. In a semiconductor device capable of changing the purpose of the pad by using the test pad as a normal pad, A first internal circuit; A second internal circuit; First connecting means connected to the first internal circuit; Second connecting means connected to the second internal circuit; And A pad connected to the first and second connecting means; In the test mode, the first connecting means is enabled, And the second connection means is enabled in the normal mode. The method of claim 4, wherein The semiconductor device capable of changing the use of the pad, characterized in that the first and second connecting means is composed of a fuse. In a semiconductor device capable of changing the purpose of the pad by using the test pad as a normal pad, A first internal circuit; A second internal circuit; And Pads connected to the first and second internal circuits; In the test mode, the first internal circuit and the pad are selected and used in the test mode, and in the normal mode, the second internal circuit and the pad are selected and used. Semiconductor device.

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