KR100572157B1 - Taping device for chip bonding and taping method for chip bonding - Google Patents

Abstract

The present invention relates to a chip bonding taping apparatus and a method for fixing a chip to a substrate using a tape made of an adhesive film and a support film. The tape bonding device for chip bonding includes a tape molding machine for molding a tape into a predetermined shape, a tape attaching machine installed on one side of the tape molding machine, and a tape attaching machine for attaching a tape formed on the tape fixing machine to a chip fixing part of a substrate. And a controller for controlling the tape attacher to attach the adhesive film of the tape onto the chip fixing part of the substrate.

Adhesive Film, Anisotropic Conductive Film, Punching, Vision Camera, Heater, Pressurization

Description

Taping device for chip bonding and taping method for chip bonding {TAPING APPARATUS FOR BONDING A CHIP AND TAPING METHOD FOR THE SAME}

1 is an exploded perspective view illustrating a state in which a chip is inserted into a hole in a substrate by using a tape;

2 is a front view of a taping device for chip bonding according to the present invention;

3 is a cross-sectional view seen from A-A of FIG.

4 is a partial side cross-sectional view seen from B-B of FIG.

5 is a left side view of FIG. 1;

6 is a perspective view of a tape molding machine of a taping device for chip bonding according to the present invention;

7 is a view for explaining that the hole processing of the tape and the cutting of the adhesive film is performed at the same time in the tape molding machine of FIG.

8 is a side view showing a tape width cutting unit of the tape molding machine of the taping device for chip bonding according to the present invention;

9 is a perspective view showing a tape attaching device of a taping device for chip bonding according to the present invention;

FIG. 10 is a view for explaining a process of attaching a tape to a chip fixing part of a substrate by the tape attacher of FIG. 9;

11 is a perspective view showing an index feeder of the taping device for chip bonding according to the present invention;

12 is a flow chart showing an operation procedure of the taping device for chip bonding of FIG.

13 is a flowchart showing a chip bonding taping method according to the present invention.

* Description of the symbols for the main parts of the drawings *

100; Tape feeder 101; Tape reel

110; First reel rotating unit 120; First Tape Sensing Unit

200; Tape forming machine 210; punch

220; Cutting blade 230; die

250; Tape width cutting unit 300; Tape attacher

301; Substrate 310; Gap compensation means

320; A substrate position adjusting unit 322; Board fixing

324; First vision camera 326; X-Wye Table

340; Tape position adjusting unit 342; 2nd Vision Camera

350; Index feeder 352; Fixed hand

356; Hand 370; Attachment Unit

372; Heater 375; Pressurization

380; Cooling nozzle 390; Support Film Separator

400; Tape reclaimer 401; Recovery reel

410; A second reel rotating unit 420; Second Tape Detection Unit

T; Tape T1; Adhesive film

T2; Support film P; Benchmark

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip bonding apparatus and method for attaching a chip to a substrate using tape, the present invention relates to a chip bonding taping apparatus and a chip bonding taping method for attaching a tape to a substrate before the chip is attached to the substrate.

An example of a method of attaching a chip to a substrate using a tape is an anisotropic conductive film (ACF-) to electrically connect an LCD panel (Liquid Crystal Display Panel), TCP (Tape Carrier Package) or PCB (Printed Circuit Board) and TCP. Anisotropic Conductive Film) is used. Alternatively, the tape is used as a connection material such as COG (Chip On Glass) mounting in which a bare chip is mounted on a connected LCD panel. In addition, the chip bonding method using a tape is applied to mounting a chip on film (COF) and a chip on board (COB) in which a bare chip is connected to a flexible printed circuit (FPC) and a PCB. In the following description, everything attached to a chip such as an LCD panel, a PCB, and an FPC will be collectively called a substrate.

Anisotropic conductive film (ACF) used in the chip bonding method using such a tape is a film-like adhesive in which conductive particles such as metal-coated plastic or metal particles are dispersed, and conductivity is obtained between the electrodes by dispersed conductive particles. Adhesive is filled between adjacent electrodes, so that the conductive particles are independent of each other, thereby obtaining high insulation. And mechanical welding between the conductive particles and the electrode is maintained by the high adhesion of the adhesive. In addition, such an anisotropic conductive film is supplied with a non-adhesive support film attached to one surface of the anisotropic conductive film for convenience of storage and use. That is, the tape used for chip bonding consists of an adhesive film having adhesiveness and conductivity for attaching a chip to a substrate and the like and an supporting film for separating and supporting the adhesive film, as in the anisotropic conductive film as described above.

By the way, when a hole is formed in a board | substrate etc., and a chip is inserted in this hole, and a chip is attached to a board | substrate using a tape, it is necessary to process the hole corresponding to the hole formed in the board | substrate etc. in a tape. One example of this is shown in FIG. 1. When the chip is attached to the FPC with holes as shown in FIG. 1 by using a tape, it is common to first attach the tape to the FPC and then remove the tape portion corresponding to the hole of the FPC. However, this work method has a problem that the work is inconvenient and takes a lot of time. In addition, there is a problem that may damage the circuit of the FPC in the process of removing the tape.

Therefore, there is a need for an invention regarding a chip bonding taping apparatus and a chip bonding taping method that can shorten the working time and do not damage the substrate in a process of attaching a chip to a substrate such as an FPC formed with holes or the like using a tape. come.

The present invention has been made in view of the above-described problems, and can be shortened working time by attaching to the substrate after processing the necessary holes, etc. before attaching the tape to the substrate, for chip bonding that does not damage the substrate An object thereof is to provide a taping apparatus and a taping method for chip bonding.

An object of the present invention as described above, in the chip bonding tape for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate, a tape molding machine for molding the tape to a certain shape; A tape attacher installed at one side of the tape molding machine and attaching the tape formed in a predetermined shape on the tape molding machine onto a chip fixing part of the substrate; And a controller for controlling the tape molding machine and the tape attaching device to attach the adhesive film of the tape onto the chip fixing part of the substrate.

Here, the tape molding machine, a punch for punching a predetermined shape hole in the tape; And it is preferable to include a cutting blade for cutting only the adhesive film at regular intervals in the tape. In particular, the cutting blade is preferably integrated with the punch so as to cut the adhesive film at the same time when processing the hole in the tape with the punch. At this time, it is preferable that only the adhesive film is cut from the tape by installing the cutting blade so that the cutting edge has a constant height difference from the cutting edge of the punch.

In addition, the tape molding machine may further include a tape width cutting unit for cutting the width of the tape to a predetermined dimension.

In addition, the tape attaching unit, the substrate position adjusting unit for adjusting the position on the chip fixing of the substrate; A tape position adjusting unit for adjusting the position of the molded portion of the tape with respect to the chip fixing portion of the substrate; And an attachment unit attaching the adhesive film of the molded part of the tape to the chip fixing part of the substrate.

Here, the substrate position adjusting unit, the substrate fixing portion to which the substrate is fixed; A first vision camera installed at an upper side of the substrate fixing part and detecting a position of a chip fixing part of the substrate; And an X-Y table disposed below the substrate fixing part and positioning the chip fixing part of the substrate under the attachment unit according to the position information of the first vision camera. Do.

In addition, the tape position adjustment unit, the second vision camera for detecting the position of the molded portion of the tape; And an index feeder installed at one side of the substrate position adjusting unit and positioning the molded part of the tape under the attachment unit according to the position information of the second vision camera. At this time, the index feeder is a fixed hand for fixing the tape; And a moving hand which fixes the tape and moves the tape in one direction according to the position information of the second vision camera.

In addition, the attachment unit, a heater for heating the molded portion of the tape; A pressing portion for pressing the molded portion of the tape against the chip bonding portion of the substrate; And a cooling unit cooling the molded portion of the tape attached to the chip bonding portion of the substrate. Here, the cooling unit is an air blower (Air Blower) is installed on one side of the pressurizing portion, and sprays cold air of -50 ~ 10 ℃ to the molded portion of the tape, or cold through a cooling tube installed on the lower side of the substrate By circulating the air can be configured to cool the portion where the substrate is placed to -10 ~ 20.

And it is preferable to heat and attach a tape shaping | molding part with the heater heated at 70-120 degreeC.

In addition, the attachment unit may further include a support film separator for separating the support film of the molded portion of the tape from the adhesive film attached to the chip fixing portion of the substrate.

In another embodiment of the present invention for achieving the above object, in the tape bonding device for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate, the tape for supplying the tape feeder; A tape molding machine for molding the tape into a predetermined shape; A tape attacher for attaching the tape formed in a predetermined shape in the tape molding machine onto a chip fixing part of the substrate and separating only the support film; A tape recovery machine rewinding the support film; And a controller for controlling the tape feeder, the tape molding machine, the tape attaching machine, and the tape recovering machine to attach the adhesive film of the tape onto the chip fixing part of the substrate and to recover the supporting film. can do.

Here, the tape forming machine, it is preferable that the cutting blade for cutting only the adhesive film in the tape at regular intervals and a punch for punching a predetermined hole in the tape is integrated.

The tape attaching device may further include a substrate fixing part on which the substrate is fixed, a first vision camera installed on an upper side of the substrate fixing part, and detecting a position on a chip fixing part of the substrate, and a lower side of the substrate fixing part. And an XY table for positioning the chip fixing part of the substrate under the attachment unit according to the positional information of the first vision camera, and defining the position of the chip fixing part of the substrate. A substrate position adjusting unit for adjusting; A second vision camera for detecting the position of the molded portion of the tape, and is installed on one side of the substrate position adjusting unit, the molded portion of the tape in accordance with the position information of the second vision camera to the lower side of the attachment unit A tape position adjusting unit including an index feeder positioned at a position of the tape feeder, the tape position adjusting unit adjusting a position of the molded portion of the tape with respect to the chip fixing portion of the substrate; And a heater for heating the molded portion of the tape, a press portion for pressing the molded portion of the tape against the chip bonding portion of the substrate, and a cooling portion for cooling the molded portion of the tape attached to the chip bonding portion of the substrate. And an attachment unit attaching the adhesive film of the molded part of the tape to the chip fixing part of the substrate.

As another aspect of the present invention the object of the present invention. A chip bonding taping method for attaching only an adhesive film from a tape made of a support film and an adhesive film on a chip fixing part of a substrate, the method comprising: forming the tape to correspond to the shape of the chip fixing part of the substrate; Matching the molded portion of the tape to the chip fixing portion of the substrate; Attaching a molded portion of the tape by applying heat and pressure on the chip fixing portion of the substrate; And separating the support film of the tape from the chip fixing part of the substrate.

Here, in the forming step, it is preferable to cut only the adhesive film of the tape at regular intervals, and to form a predetermined hole penetrating the support film in the center of the cut adhesive film and to perform this in one operation.

In the matching step, it is preferable to match the molded portion of the tape with the chip bonding portion of the substrate using a vision camera.

In addition, in the attaching step, it is preferable to cool the molded part of the tape by spraying cold air of −50 to 10 ° C. after attaching the molded part of the tape by heating the heater heated to 70 to 120 ° C.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

2 and 3 are a front view and a cross-sectional view showing an embodiment of the taping device for chip bonding according to the present invention. Referring to the drawings, the taping apparatus for chip bonding according to the present invention includes a tape feeder 100, a tape molding machine 200, a tape attaching machine 300, a tape recovery machine 400, and a controller 500.

The tape feeder 100 is used to unwind a tape such as ACF, which is supplied while being wound on a reel, and supply the tape feeder 200 to the tape molding machine 200. Referring to FIGS. 2, 3, and 5, the tape feeder 101 rotates the tape reel 101. The first tape detection unit 120 and the tape T which apply tension to the first reel rotating unit 110 and the tape T and control the first reel rotating unit 110 according to the supply state of the tape T. It includes several rollers (131, 132) to form a path. The first reel rotating unit 110 is composed of a rotating shaft 112 to which the tape reel 101 is fixed and a motor 114 for rotating the rotating shaft 112. The first tape detecting unit 120 applies tension to the tape T by its own weight, and moves upward when the tape T is pulled, and moves downward when the tape reel 101 is released from the first reel rotating unit 110. The lifting unit 122 and the lifting unit 122 include a sensor unit 123 or 124 which detects when the elevator unit descends or rises by a predetermined amount and sends a signal to the controller 500. The controller 500 drives the motor 114 of the first reel rotating unit 110 when the lifting unit 122 is lifted to operate the sensor 123 to release the tape T from the tape reel 101. When the tape T is released and the lifting unit 122 descends to operate the sensor 124, the controller 500 stops the motor 114 of the first reel rotating unit 110. As such, the tape supply apparatus 100 supplying the tape T to the tape forming apparatus 200 may be variously known in the art, in addition to the apparatus described above.

The tape molding machine 200 is to mold the tape T into a predetermined shape. Referring to FIGS. 2, 6, and 7, the punch 210 and the tape T, which drill holes of a predetermined shape in the tape T, are formed. In the support film (T2) includes a cutting blade 220 for cutting only the adhesive film (T1) at regular intervals without cutting. The die 230 is provided at an upper portion of the punch 210, and the rising height of the punch 210 that is lifted up and down by the pneumatic cylinder 216 is limited by the stopper 214 formed integrally with the punch 210. . The die 230 is provided with a guide groove for guiding the movement of the tape T and a hole 234 through which the punch blade 212 passes to form a predetermined hole in the tape T. 234 is connected to a hose 240 for removing the scrap T 'cut from the tape (T). Suction air is applied to the hose 240 and the scrap T 'cut from the tape T is sucked into the hose 240. Cutting blades 220 are provided on both sides of the punch blade 212, the cutting interval of the adhesive film (T1) is determined by the interval between the two cutting blades (220). In addition, the distance between the hole formed by the punch blade 212 and the cut portion of the adhesive film T1 is determined by the distance between the punch blade 212 and the cutting blade 220. Since the punch blade 212 and the cutting blade 220 are integrally formed, the adhesive film of the tape T is formed by the cutting blade 220 when the punch 210 is raised to process a hole in the tape T. T1) is also cut at the same time. At this time, the cutting blade 220 to cut only the adhesive film (T1) is possible by installing so that the end of the cutting blade 220 has a constant height difference with the end of the punch blade (212). This will be described in detail with reference to FIG. 7. FIG. 7 illustrates a state in which the stopper 214 installed in the punch 210 contacts the die 230 after the punch blade 212 passes through the tape T so that the punch 210 can no longer be raised. At this time, the interval t between the end of the cutting blade 220 and the surface 231 through which the tape T of the die 230 passes at the position where the punch 210 is stopped by the stopper 214 is the tape T. When the thickness of the support film (T2) of the (T) is only the adhesive film (T1) is cut, the support film (T2) is not cut. Therefore, only the adhesive film T1 of the tape T can be cut | disconnected by managing the height difference of the blade edge | tip of the cutting blade 220, and the height of the punch stopper 214. In addition, since the height of the stopper 214 is determined to be constant with the end of the punch blade 212, a constant height difference is also maintained between the blade edge of the cutting blade 220 and the punch blade 212.

In addition, the tape molding machine 200 may further include a tape width cutting unit 250 for cutting the tape width (W) to a predetermined dimension. 6 and 8, the tape width cutting unit 250 is moved by the pneumatic cylinder 252 to move up and down the blade 254 and the tape T to guide the movement of the blade 254. And a cutting guide portion 256 for supporting the cutting of the tape width. This tape width cutting unit 250 is added to the front end of the tape forming machine 200, as shown in Figure 6, when the width of the tape (T) to be attached to the substrate can not be satisfied with the size of the tape is generally supplied By installing, the tape can be molded to a size desired by the user.

The tape attacher 300 attaches the tape T formed in a predetermined shape in the tape forming machine 200 to the chip fixing part of the substrate. Referring to FIG. 2, the tape attacher 300 adjusts the position of the chip fixing part of the substrate. The substrate position adjusting unit 320, the tape position adjusting unit 340 for adjusting the position of the molded portion of the tape T with respect to the chip fixing portion of the substrate, and the molded portion of the tape are attached to the chip fixing portion of the substrate. Attachment unit 370 is included.

2 to 4 and 9, the substrate position adjusting unit 320 includes a substrate fixing part 322, a first vision camera 324, and an X-Y table 326. The substrate fixing part 322 is installed above the X-Y table 326, and a fixing plate 305 fixing the substrate 301 to the storage part 303 and the storage part 303 on which the substrate 301 is placed. It consists of. The first vision camera 324 is installed above the substrate fixing part 322 and checks the chip fixing part of the substrate 301. The first vision camera 324 is generally used with a CCD camera, it is provided with a vision monitor 325 for outputting the image captured by the first vision camera 324 separately. The X-Y table 326 has two moving axes that are orthogonal to each other on a plane to move the substrate fixing part 322 to an arbitrary position on the same plane according to a command of the controller 500. If the chip fixing position of the substrate 301 does not coincide with the center of the first vision camera 324, the controller 500 moves the X-Y table 326 so that the chip fixing position of the substrate 301 is the first vision. Adjust to position at center of camera 324.

The tape position adjusting unit 340 adjusts the position of the tape T such that the position of the molded portion of the tape T, that is, the hole position coincides with the chip fixing portion of the substrate 301, is the second vision camera ( 342 and the index feeder 350. The second vision camera 342 is installed above the path through which the tape T passes, and a CCD camera is generally used. A vision monitor for outputting an image captured by the second vision camera 342 may be separately provided or the vision monitor 325 of the first vision camera 324 may be jointly used. The index feeder 350 holds the tape T so that it does not move, or the tape T is fixed so that the molded portion of the tape T can be continuously attached when there are a plurality of chip fixing portions of the substrate 301. It includes a fixed hand 352 and a moving hand 356 to move at intervals. The fixed hand 352 is composed of a fixed end (353) and a pneumatic cylinder (354) for lifting up and down relative to the fixed end (353). The moving hand 356 is composed of a fixed end 357 and a pneumatic cylinder 358 similarly to the fixed hand 352, and a moving part 359 to transfer the moving hand 356 to the left and right at the bottom of the moving hand 356. ) Is installed. The moving unit 359 preferably uses a stepping linear motor capable of position control so that the center of the second vision camera 342 and the molded portion of the tape T can be aligned. Two sensors 360 are attached to one side of the moving unit 359 so as to check the left and right movement of the moving hand 356.

The attachment unit 370 attaches the adhesive film T1 of the molded portion of the tape T on the chip fixing part of the substrate 301. Referring to FIG. 9, the heater 372 and the pressurizing part 375 And a cooling unit 380. The heater 372 melts the adhesive film T1 of the tape T, and is preferably molded in a cross section corresponding to an end portion of the tape T to be formed on the tape T to be bonded to the substrate 301. The heating temperature of the heater 372 should be sufficient to melt the adhesive film T1, but if the temperature is too high, it takes a long time to cool and may damage the substrate 301. Therefore, the heater 372 should be heated to an appropriate temperature. It is preferable that the heating temperature of the heater 372 be 70-120 degreeC. The pressurizing part 375 pressurizes the heater 372 so that the heater 372 can pressurize the tape T at the same time. That is, the heater 372 is provided at the end of the rod 376 of the pressurizing part 375 which can set the pressure applied to the end at the time of the lowering within a predetermined range. Therefore, when the pressing unit 375 lowers the rod 376 according to the command of the controller 500, the heater 372 presses the tape T against the substrate 301 at a constant pressure. Therefore, since the adhesive film T1 is melted by the heat of the heater 372 and is pressed at a predetermined pressure by the rod 376 of the pressing unit 375, the adhesive film T1 of the tape is attached to the substrate 301. In this state, the heater 372 is turned off and the cooling unit 380 is operated to cool the adhesive portion between the tape T and the substrate 301.

At this time, the central axis of the heater 372 of the attachment unit 370 and the central axis of the second vision camera 342 of the tape position adjusting unit 340 are installed on the same axis with respect to the tape T hole. Since it is difficult, it is necessary to comprise a mechanism so that it may be in this same state. As a method for this purpose, as shown in FIGS. 9 and 10A, the heater 372 and the second vision camera 342 are installed at regular intervals along the tape feed direction XX, and then the gap compensation means 310 is installed. By moving left and right using the same, the same effect as that of the heater 372 and the second vision camera 342 provided on the same axis can be obtained. That is, when the position of the hole H of the tape T is confirmed by the second vision camera 342, the gap compensation means 310 is operated so that the second vision camera 342 is positioned at the reference line CC as shown in FIG. 10B. To come. When the hole H of the tape T is adjusted by the second vision camera 342 and the index feeder 350, the controller 500 operates the gap compensating means 310 again so that the heater 372 is connected with FIG. 10A. As shown in the reference line CC position. At this time, the gap compensation means 310 is a stopper 316 of both mechanically determine the position of the LN guide 312 and the pneumatic cylinder 314 and the second vision camera 342 and the heater 372 to guide the linear motion. It consists of In addition, when checking the chip fixing position G of the substrate 301 by using the first vision camera 324 as in the present embodiment, the first vision camera 324 is also integrally provided with the interval compensating means 310. It is desirable to install. At this time, the first vision camera 324 and the second vision camera 342 on the YY line perpendicular to the second vision camera 342 to form a perpendicular to the feed direction (XX) of the tape as shown in Figure 10a and It is preferable to install at regular intervals D. At this time, since the distance D between the first vision camera 324 and the second vision camera 342 is stored in the controller 500 at a kind of offset, the controller 500 may use the X-Y table ( The hole of the tape T recognized by the chip fixing part G of the board | substrate 301 recognized by the 1st vision camera 324, and the 2nd vision camera 342 by moving 326 by the offset amount. H) The positions can be matched.

The cooling unit is to fasten the adhesive film T1 of the molten tape T so as to be firmly attached to the substrate 301. As illustrated in FIG. 9, the cooling unit cools the air through the air blower 380. It is configured to spray directly on the adhesive portion of the tape (T). The cooling temperature is relatively determined according to the heating temperature of the heater 372. However, when the heater 372 is heated to the above temperature, the temperature of the cold air injected from the air blower is in the range of -50 to 10 ° C. desirable.

The structure of the cooling unit for cooling the portion where the tape T is attached to the substrate 301 is a substrate fixing part on which the substrate 301 is placed, in addition to the direct cooling method of directly injecting cold air through the air blower 380 as described above. An indirect cooling method of cooling the heating portion of the tape T by cooling the accommodating part 303 of 322 may be applied. In this case, a cooling tube may be installed inside the accommodating part 303 to cool the upper surface of the accommodating part 303 by flowing cold air or cooling water to cool the entire substrate 301. In this case, it is preferable to cool the bottom of the substrate fixing part 322 on which the substrate 301 is placed, that is, the upper surface of the accommodating part 303 to be -10 to 20 ° C.

In addition, the attachment unit 370 may be further provided with a support film separator 390 as shown in FIGS. 4 and 9. The support film separator 390 includes a separation end 392 installed to contact the bottom surface of the tape support film T2 and a transfer end 394 for transferring the separation end 392 to the left and right sides of the tape. The feed end 394 usually consists of a pneumatic cylinder. When the cooling of the tape T is performed by the cooling unit, the controller 500 moves the transfer end 394 of the supporting film separating unit 390 to one side, so that the separating end 392 is supported from the tape bonding portion. ).

The tape recovery machine 400 collects only the supporting film T2 attached to the chip fixing part of the substrate 301 and separates the supporting film T2 and winds it on the recovery reel 401. The structure thereof is illustrated in FIGS. 2 and 3. As shown, the tape feeder 100 is the same. That is, the second reel rotating unit 410 for rotating the recovery reel 401 and the support film (T2) to apply a tension and control the second reel rotation unit 410 according to the supply state of the support film (T2) It comprises a two-tape detection unit 420, and several rollers (431, 432) forming a path of the support film (T2). The second reel rotating unit 410 is composed of a rotating shaft 412 to which the recovery reel 401 is fixed and a motor 414 for rotating the rotating shaft 412. The second tape detecting unit 420 applies tension to the support film T2 by its own weight, and when the support film T2 is transferred by the index feeder 350, the second tape detection unit 420 descends downward and the second reel rotation unit 410. When the recovery reel 401 is wound by the lifting unit 422 and the lifting unit 422 is lowered or raised by a prescribed amount, the sensor unit 423 and 424 detects this and sends a signal to the controller 500. It includes. The controller 500 moves the motor 414 of the second reel rotating unit 410 when the lifting unit 422 descends to operate the sensor 424 so that the recovery reel 401 winds up the support film T2. do. When the support film T2 is wound and the lifting unit 422 is raised to operate the sensor 423, the controller 500 stops the motor 414 of the second reel rotating unit 410. As described above, the tape recoverer 400 capable of recovering the support film T2 discharged from the tape attacher 300 may be variously known in addition to the above-described apparatus.

The controller 500 controls the tape feeder 100, the tape molding machine 200, the tape attaching machine 300, and the tape recovery machine 400 to form the tape T wound on the tape reel 101 to a predetermined shape and to form a substrate ( Attached to the chip fixing part of the 301, and includes a control unit for receiving a signal from various sensors to perform a calculation, a panel unit 502 provided with various switches, and a display unit 504 for outputting various data.

Hereinafter, the operation of the taping device for chip bonding according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings. 12 is a flowchart illustrating an operation flow of the chip bonding taping apparatus.

First, as shown in FIGS. 2 and 3, the tape reel 101 is mounted on the rotating shaft 112 of the first reel rotating unit 110 of the tape feeder 100, and then the tape T is released to release the tape T. ) Is fixed to the recovery reel 401 of the tape recovery machine 400 by passing through the tape molding machine 200 and the tape attaching device 300 (S10). Subsequently, the substrate 301 is loaded into the substrate fixing unit 322 (S20). In this state, when the chip bonding taping device is turned on, the controller 500 first operates the taping forming device 200 to form the tape T into a predetermined shape (S30). In the present embodiment, the tape T is formed into a predetermined width by the tape width cutting unit 250, and a square hole is formed in the tape T by the punch 210 and the cutting blade 220, and the adhesive film T1 is cut at regular intervals. In the tape width cutting unit 250, the pneumatic cylinder 252 is raised by the controller 500, so that the tape T is processed to a constant width. In addition, the tape T entered through the tape width cutting unit 250 and between the punch 210 and the die 230 is a square hole in the tape T by the upward movement of the punch 210 by the pneumatic cylinder 216. This is formed, the adhesive film (T1) is cut at regular intervals by a cutting blade 220 installed integrally with the punch (210). At this time, since the rising height of the punch 210 is limited by the stopper 214, the cutting blade 220 cuts only the adhesive film T1 of the tape T and does not cut the support film T2.

Next, the controller 500 uses the first vision camera 424 and the X-Y table 326 so that the center of the chip fixing part G of the substrate 301 is the reference point (P in FIG. 10A), that is, the heater. It adjusts so that it may come directly below (372) (S40). At this time, the controller 500 operates the gap compensation means 310 to adjust the position of the substrate 301 in a state where the first vision camera 324 is on the C-C line as shown in FIG. 10B. This process is described in detail as follows. The controller 500 measures the deviation of the center of the chip fixing part G of the substrate 301 with the first vision camera 324, and then operates the X-Y table 326 so that the eccentricity is zero. The chip fixing center (G) center of the substrate 301 is aligned with the center of the first vision camera 324. Subsequently, the controller 500 further transfers the X-Y table 326 by the offset amount stored therein. Then, the chip fixing portion G of the substrate 301 is located at the reference point P.

The tape T in which the hole H is processed by the tape forming apparatus 200 has an index feeder such that the hole H of the tape T coincides with the center of the second vision camera 342 at the position of FIG. 10B. It is transferred by the 350 (S50). The controller 500 measures the eccentricity of the center of the second vision camera 342 and the tape T hole H by using the image data of the second vision camera 342, and then outputs a signal corresponding thereto to the index feeder ( It transfers to the transfer part 359 of 350. Then, the moving part 359 of the transfer hand 356, which is a stepping linear motor, moves precisely by the amount of the eccentricity measured by the second vision camera 342 by the signal of the controller 500 so that the hole of the tape T is obtained. (H) coincides with the center of the second vision camera 342. As a result, the hole H of the tape T coincides with the chip fixing portion G of the substrate 301 located below the tape T. FIG. Then, the fixing hand 252 of the index feeder 250 is operated to fix the tape T to prevent the tape T from moving left and right.

Subsequently, the controller 500 operates the pneumatic cylinder 314 of the gap compensation means 310 such that the heater 372 of the attachment unit 370 is positioned above the hole H of the tape T as shown in FIG. 10A. . In the meantime, the controller 500 operates the heater 372 of the attachment unit 370 so that the heater 372 is at a constant temperature. When the heater 372 is raised to a constant temperature, the pressurizing part 375 is operated so that the heater 372 presses the hole H of the tape T against the chip fixing position G of the substrate 301. (S60). Then, the adhesive film T1 of the tape T is melted by the heat of the heater 372, and the adhesive film T1 is applied to the chip fixing part G of the substrate 301 by the pressure of the pressing unit 375. It is attached. When a predetermined time elapses, the controller 500 turns off the heater 372 and operates the cooling unit to cool the air from the air blower 380 to cool the adhesive portion of the tape T (S70). As a result, the adhesive film T1 of the tape T is in a state where the adhesive film T1 is firmly attached to the substrate 301. Then, the controller 500 raises the rod 376 of the pressurizing portion 375 so that the heater 372 is separated from the tape T. In this state, the controller 500 moves the support film separator 390 to the adhesive portion of the tape T (S80). Then, the supporting film T2 of the tape T is separated from the adhesive film T1 attached to the substrate 301 by the separating end 392 of the supporting film separator 390. Thereby, the operation | work which attaches the shaping | molding part of the tape T, ie, the adhesive film T1 in which the hole H was formed, to the chip | tip fixing part G of the board | substrate 301 is completed.

Subsequently, the controller 500 performs the above process again in order to attach the tape T on the other chip fixing part of the substrate 301. That is, after operating the gap compensation means 310 so that the first vision camera 324 is in the position as shown in FIG. 10B, the X-Y table 326 is operated to allow other chip fixing positions of the substrate 301 to be removed. 1 Position it below the vision camera 324. Subsequently, after adjusting the positions of the other chip fixing positions by the above-described method, the X-Y table 326 is moved by the offset amount so that the other chip fixing positions are positioned at the reference point P. Next, the index feeder 350 is operated so that the next hole of the tape T is positioned below the second vision sensor 342. This will be described in detail as follows. The fixing hand 352 of the index feeder 350 holds the tape T while the molded portion of the tape T is attached to the substrate 301. At this time, the moving hand 356 moves by the gap of the hole formed in the tape T in the direction opposite to the conveying direction of the tape T to hold the tape T. Subsequently, the fixing hand 352 releases the tape T, and the moving hand 356 moves by the tape T hole interval in the tape conveying direction. Then, as the tape T is pulled out, the next hole of the tape T is positioned below the second vision camera 342. In this state, after confirming the position of the hole, the second vision camera 342 controls the moving hand 356 so that the hole of the tape T coincides with the center of the second vision camera 342. When the hole coincides with the center of the second vision camera 342, the fixing hand 352 of the index feeder 350 fixes the tape T. In this state, the controller 500 attaches the molded part of the tape T to the chip fixing part of the substrate 301 through the above-described process.

While repeating the above operation, the support film T2 separated from the tape T is wound around the recovery reel 401 of the tape recovery machine 400 and recovered (S90).

As another aspect for achieving the object of the present invention, a tape bonding method for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate as follows.

Referring to FIG. 13, in the taping method for chip bonding according to the present invention, first, a tape is formed into a predetermined shape. That is, the tape is formed into a predetermined shape, such as forming holes in the tape, processing the width of the tape to a predetermined width, or cutting only the adhesive film of the tape at regular intervals (S100).

Subsequently, the molded portion of the tape coincides with the chip fixing portion of the substrate (S200). Various mechanisms can be used for this purpose. One example is to match the molded part of the tape with the chip fixing position of the substrate using a vision camera and an X-Y table as described above.

Next, the molded part of the tape is attached to the chip fixing portion of the substrate (S300). In order to adhere the adhesive film of the tape to the substrate, heat and pressure are generally applied simultaneously. The uniformly heated heater is pressed against the tape at a constant pressure to allow the tape to adhere to the substrate. At this time, the heater is preferably heated to 70 ~ 120 ℃. Subsequently, it is preferable to cool the adhesive site below a predetermined temperature so that the molten adhesive film hardens quickly and adheres firmly to the substrate. When cooling by an air blower, the temperature of the sprayed air is about -50 to 10 ° C, and when the floor on which the substrate is placed is cooled, it is preferable that the temperature of the floor is about -10 to 20 ° C.

When the adhesive film of the tape is firmly attached to the chip fixing of the substrate, the support film of the tape is separated from the adhesive film (S400). It is preferable that the separated support film is automatically wound on a recovery reel.

As described above, according to the taping device for chip bonding and the taping method for chip bonding according to the present invention, since the tape is formed into a predetermined shape corresponding to the shape of the chip fixing part to which the chip is attached, the tape is attached to the substrate. The time can be shortened and damage to the substrate can be prevented.

While the invention has been shown and described with reference to preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as such is shown and described. Rather, those skilled in the art will appreciate that various changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims. Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.

Claims (21)

In the chip bonding taping apparatus for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate, A tape forming machine including a punch for punching a hole having a predetermined shape in the tape, and a cutting blade integral with the punch to simultaneously cut the adhesive film at regular intervals when processing the hole in the tape with the punch; A tape attacher installed at one side of the tape molding machine and attaching the tape formed in a predetermined shape on the tape molding machine onto a chip fixing part of the substrate; And And a controller for controlling the tape former and the tape attacher to attach the adhesive film of the tape onto the chip fixing part of the substrate. delete delete 2. The chip bonding taping apparatus according to claim 1, wherein the end of the cutting blade has a predetermined height difference from the end of the punch so that only the adhesive film is cut from the tape. The tape bonding device of claim 1, wherein the tape molding machine further comprises a tape width cutting unit cutting the width of the tape to a predetermined dimension. In the chip bonding taping apparatus for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate, A tape molding machine for molding the tape into a predetermined shape; A tape attacher installed at one side of the tape molding machine and attaching the tape formed in a predetermined shape on the tape molding machine onto a chip fixing part of the substrate; And And a controller for controlling the tape molding machine and the tape attaching device to attach the adhesive film of the tape onto the chip fixing part of the substrate. The tape attacher, A substrate position adjusting unit for adjusting a position of a chip fixing portion of the substrate; A tape position adjusting unit for adjusting the position of the molded portion of the tape with respect to the chip fixing portion of the substrate; And And an attaching unit for attaching the adhesive film of the molded portion of the tape to the chip fixing part of the substrate. The method of claim 6, wherein the substrate position adjusting unit, A substrate fixing part to which the substrate is fixed; A first vision camera installed at an upper side of the substrate fixing part and detecting a position of a chip fixing part of the substrate; And And an X-Y table installed at a lower side of the substrate fixing part to position the chip fixing part of the substrate at a lower side of the attachment unit according to the positional information of the first vision camera. Taping device for chip bonding. The method of claim 6, wherein the tape position adjusting unit, A second vision camera for detecting the position of the molded portion of the tape; And an index feeder installed at one side of the substrate position adjusting unit and positioning the molded portion of the tape under the attachment unit according to the positional information of the second vision camera. Device. The method of claim 8, wherein the index feeder, A fixing hand for fixing the tape; And And a moving hand which fixes the tape and moves the tape in one direction according to the positional information of the second vision camera. The method of claim 6, wherein the attachment unit, A heater for heating the molded part of the tape; A pressing portion for pressing the molded portion of the tape against the chip bonding portion of the substrate; And And a cooling unit for cooling the molded portion of the tape attached to the chip bonding portion of the substrate. The chip of claim 10, wherein the cooling unit is an air blower installed at one side of the pressurizing unit, and the air blower injects cold air at −50 to 10 ° C. into a molding part of the tape. Taping device for bonding. 11. The chip bonding taping apparatus according to claim 10, wherein the cooling unit cools a portion where the substrate is placed to -10 to 20 ° C by circulating cold air through a cooling tube installed below the substrate. 11. The chip bonding taping apparatus according to claim 10, wherein the heater is heated to 70 to 120 ° C. The tape bonding device for chip bonding according to claim 10, wherein the attachment unit further comprises a support film separator for separating the support film of the molded portion of the tape from the adhesive film attached to the chip fixing part of the substrate. . In the chip bonding taping apparatus for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate, A tape feeder for supplying the tape; A tape molding machine in which a punch for punching a hole of a predetermined shape in the tape and a cutting blade for cutting only the adhesive film from the tape at regular intervals are integrated; A tape attacher for attaching the tape formed in a predetermined shape in the tape molding machine onto a chip fixing part of the substrate and separating only the support film; A tape recovery machine rewinding the support film; And And a controller for controlling the tape feeder, the tape molding machine, the tape attaching machine, and the tape recovering machine to attach the adhesive film of the tape on the chip fixing part of the substrate and to recover the supporting film. Device. delete The method of claim 15, wherein the tape attacher, A substrate fixing part to which the substrate is fixed, a first vision camera installed on an upper side of the substrate fixing part, and detecting a position on a chip fixing part of the substrate, and a lower part of the substrate fixing part; A substrate position adjusting unit including an X-Y table for positioning the chip fixing part of the substrate under the attachment unit according to the position information of the vision camera, and adjusting the position of the chip fixing part of the substrate; A second vision camera for detecting the position of the molded portion of the tape, and is provided on one side of the substrate position adjusting unit, the molded portion of the tape in accordance with the position information of the second vision camera to the lower side of the attachment unit A tape position adjusting unit including an index feeder positioned at a position of the tape feeder, the tape position adjusting unit adjusting a position of the molded portion of the tape with respect to the chip fixing portion of the substrate; And A heater for heating the molded portion of the tape, a press portion for pressing the molded portion of the tape against the chip bonding portion of the substrate, and a cooling portion for cooling the molded portion of the tape attached to the chip bonding portion of the substrate. And an attachment unit for attaching the adhesive film of the molded portion of the tape to the chip fixing part of the substrate. In the chip bonding taping method for attaching only the adhesive film from the tape consisting of the support film and the adhesive film on the chip fixing of the substrate, By cutting only the adhesive film of the tape at a predetermined interval in one operation, and forming a predetermined hole penetrating the support film in the center of the cut adhesive film, forming the tape to correspond to the shape of the chip fixing portion of the substrate step; Matching the molded portion of the tape to the chip fixing portion of the substrate; Attaching a molded portion of the tape by applying heat and pressure on the chip fixing portion of the substrate; And And separating the support film of the tape from the chip fixing part of the substrate. delete 19. The method of claim 18, wherein in the matching step, the molded portion of the tape is aligned with the chip bonding portion of the substrate using a vision camera. 19. The method of claim 18, wherein in the attaching step, the molded part of the tape is heated and attached by a heater heated to 70 to 120 ° C., and then cold air of −50 to 10 ° C. is sprayed to cool the molded part of the tape. Taping method for chip bonding, characterized in that.

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