KR100568131B1 - A target device - Google Patents

Abstract

The present invention can reduce the production cost by extending the replacement cycle by rotating the target relative to the magnet, and additionally partitioning the target into multiple regions to mount various materials on the divided regions to form a multilayer film on the substrate. It is an object of the present invention to provide a magnetron sputtering target device capable of deposit coating and preventing the accumulation of plasma heat during sputtering so that a substrate that is susceptible to heat can be used very flexibly.

In order to achieve the above object, the present invention provides a vacuum chamber in which a front side is opened and a closed wall is formed at a rear side, and a side wall is enclosed in all directions so that a space is formed, and a deposition substrate is provided at an edge of the front portion of the side wall. A housing having a flange portion formed to be detachably hermetically coupled to an inlet of the housing; A support member having a predetermined length disposed in the space portion of the side wall and installed through a pair of support shafts whose both ends penetrate the side wall, and in which a magnet is partially embedded in the longitudinal direction; A cylindrical member rotating around the support member while maintaining the gap with the outer surface of the support member and rotatably installed with respect to the support member; A target member of a predetermined material installed on an outer surface of the rotating member; Rotating member driving means connected to the rotating member to allow the rotating member to be driven to rotate; High voltage supply means fixed to an outer side of the housing to supply a high voltage to the magnet to release atoms from the target member; React gas injection port so that the reaction gas is injected into the space portion of the housing.

Magnetron, Sputtering, Magnet, Target

Description

Magnetron Sputtering Target Device {A TARGET DEVICE}

1 is a cross-sectional view schematically showing a state in which a housing of a target device according to the present invention is installed in a vacuum chamber.

2 is a view showing the overall configuration of a target device according to the present invention.

3 is an enlarged view of a leader line "A" shown in FIG. 2;

4 is an enlarged view of a leader line "B" shown in FIG. 2;

Figure 5 is a longitudinal cross-sectional view showing the arrangement of the support member and the rotating member and the target member and the magnet of the configuration of the target device according to the present invention.

Figure 6 is a perspective view showing the appearance of the rotating member of the configuration of the target device according to the present invention.

7 is a perspective view showing a state in which a magnet is installed on the support member of the configuration of the target device according to the present invention.

Figure 8 (a) (b) is a cross-sectional view showing the operating state of the opening and closing plate of the configuration of the target device according to the present invention.

Figure 9 is a cross-sectional view showing another embodiment of the target member of the configuration of the target device according to the present invention.

Figure 10 is a cross-sectional view showing only the cooling water movement passage formed in the housing of the configuration of the target device according to the present invention.

FIG. 11 is a perspective view showing the appearance of the housing shown in FIG. 10; FIG.

12 and 13 is a partial perspective view showing the configuration and operating state of the observation window opening and closing plate of the configuration of the target device according to the present invention.

Figure 14 is an external perspective view of the housing showing the configuration of the reaction gas inlet of the configuration of the target device according to the present invention.

15 is a longitudinal cross-sectional view of FIG. 14;

<Description of Symbols for Main Parts of Drawings>

50: vacuum chamber 51: inlet

52: deposition substrate 100: housing

110: side wall S: space part

111: front 112: flange

116: observation window 117: observation window opening and closing plate

118: hinge axis 119: operation knob

120: closed wall 200: support member

210: support shaft 220: magnet

300: rotating member 115, 310: cooling water moving passage

400: target member 500: rotating member driving means

510: drive motor 520: drive gear

530: driven gear 540: hollow rotating shaft

540: opening and closing plate 550: opening and closing plate driving means

551: hydraulic motor 552: motor shaft

553: drive gear 554: driven gear

555: connecting member 600: high voltage supply means

700: reaction gas inlet 800: assembly

The present invention is directed to a magnetron sputtering target device, and more particularly, by rotating the target relative to the magnet, it is possible to reduce the production cost by extending its replacement cycle, and additionally divide the target into a plurality of areas in this partitioned area. The present invention relates to a magnetron sputtering target device capable of depositing and coating a multilayer film on a substrate by attaching various materials, and making it possible to use a substrate that is susceptible to heat by preventing the accumulation of plasma heat during sputtering.

In general, a thin film forming method by sputtering includes a diode sputtering method, a bias sputtering method, a high frequency sputtering method, a triode sputtering method, a magnetron sputtering method, and the like.

Among the methods listed above, the magnetron sputtering method is the most widely used, and this method is a thin film to be formed in a vacuum chamber in which a magnet is fixedly mounted on the back surface of a flat plate target, and a plate target portion with a magnet is formed at a higher density than other parts during sputtering. Placing a flat plate target made of a material, placing the substrate at a position corresponding to the target, and injecting argon gas, collision particles such as argon particles ionized by plasma formed in the vacuum chamber collide with the negatively charged target surface. As a result, the target particles stick out by the energy and are deposited on the substrate.

In the case of the magnetron sputtering method, a magnet is mounted on the back surface of the flat plate target, and thus, when sputtering, a plate target portion having a magnet is formed at a higher density than other portions, so that more target atoms are released to improve the thin film deposition rate. have.

However, unlike the above advantages, since the plate target is fixed in a fixed installation state mounted on the magnet, as the sputtering proceeds, the plate target erosion rate for a specific part (field in which the magnetic field is formed) is faster, so that the overall use efficiency of the target is increased. This fall, of course, causes unevenness of the thin film thickness formed on the substrate, which has a great adverse effect on the thin film properties.

Therefore, even in the situation where the target of the magnetic field is intensively eroded and the remainder remains unavoidably, it is necessary to exchange not only the target but also all the expensive equipment to which the target is attached before all the flat targets are exhausted. There has been economic losses such as high production costs.

In addition, conventionally, in order to deposit and coat a multilayer film on a substrate, a large amount of targets corresponding to the material to be deposited are mounted on the equipment, and thus, production costs are increased, and maintenance is difficult.

In addition, since the plate target is conventionally fixed to the magnet, there is a problem in that the substrate is heated by the accumulation of plasma heat, thereby producing a defective substrate, and thus a substrate vulnerable to heat cannot be used.

The present invention was devised to solve the above problems, and by rotating the target relative to the magnet, it is possible to reduce the production cost by extending its replacement cycle, and additionally partitioned the target into a plurality of areas in this partitioned area. The purpose of the present invention is to provide a magnetron sputtering target device capable of depositing and coating a multilayer film on a substrate by attaching various materials and making it possible to use a substrate that is susceptible to heat by preventing plasma heat accumulation during sputtering. .

The present invention for achieving the above object, the present invention for achieving the above object, the front side is opened and the side wall is enclosed in all directions so that a closed portion is formed in the rear portion and the side wall, and the side wall A housing having a flange portion formed to be detachably hermetically coupled to an inlet of a vacuum chamber provided with a deposition substrate at an edge of a front portion of the housing; A support member having a predetermined length disposed in the space portion of the side wall and installed through a pair of support shafts whose both ends penetrate the side wall, and in which a magnet is partially embedded in the longitudinal direction; A cylindrical member rotating around the support member while maintaining the gap with the outer surface of the support member and rotatably installed with respect to the support member; A target member of a predetermined material installed on an outer surface of the rotating member; A rotating member driving means connected to the rotating member to rotate the rotating member; High voltage supply means fixed to an outer side of the housing to supply a high voltage to the target member to release atoms from the target member; It characterized in that it comprises a reaction gas inlet so that the reaction gas is injected into the space portion of the housing.

Hereinafter, the configuration and operation of a preferred embodiment of a magnetron sputtering target device according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view schematically showing a state in which a housing of a target device according to the present invention is installed in a vacuum chamber, FIG. 2 is a view showing an overall configuration of a target device according to the present invention, and FIG. 3 is a leader line shown in FIG. 4 is an enlarged view of the "B" part shown in FIG. 2, and FIG. 5 is an arrangement state of the supporting member, the rotating member, the target member, and the magnet in the configuration of the target apparatus according to the present invention. 6 is a perspective view showing the appearance of the rotating member of the configuration of the target device according to the present invention, Figure 7 is a perspective view showing a state in which a magnet is installed on the support member of the configuration of the target device according to the present invention; 8 (a) and (b) are cross-sectional views showing the operation state of the opening and closing plate of the target device according to the present invention, and FIG. 9 shows another embodiment of the target member during the configuration of the target device according to the present invention. Sectional view, FIG. 10 Figure 11 is a cross-sectional view showing only the coolant movement passage formed in the housing of the configuration of the target device according to the present invention, Figure 11 is a perspective view showing the appearance of the housing shown in Figure 10, Figures 12 and 13 of the target device according to the present invention Partial perspective view showing a configuration for driving the observation window opening and closing operation and its operating state, Figure 14 is an external perspective view of the housing showing the configuration for the reaction gas inlet of the configuration of the target device according to the present invention, Figure 15 is a view 14 is a longitudinal cross-sectional view.

Sputtering target device according to the present invention is largely the housing 100, the support member 2000, the rotating member 300, the target member 400, the rotating member driving means 500, the high voltage supply means 600 And, it comprises a reaction gas injection port 700.

The housing 100 has a side wall 110 which is surrounded in all directions so that the front part 111 is opened and a closing wall 120 is formed at the rear part to form a space S. The flange portion 112 is formed to be detachably hermetically coupled to the inlet 51 of the vacuum chamber 50 having the deposition substrate 52 at the edge of the front portion 111.

As shown in FIG. 7, the support member 200 is disposed in the space S of the side wall 110 and is installed through a pair of support shafts 210 having both ends penetrating through the side wall 110. And, the magnet 220 is made of a constant length installed buried so that a portion is exposed in the longitudinal direction.

Here, the shape of the support member 200 was configured in the present invention having a circular cross section.

As shown in FIG. 6, the rotating member 300 surrounds the outer surface of the supporting member 200 while maintaining a predetermined gap, and has a cylindrical shape rotatably installed with respect to the supporting member 200. .

Here, the shape of the rotating member 300 in the present invention was configured in a shape having a circular cross section.

The target member 400 is made of a predetermined material which is installed on the outer surface of the rotating member 300, as shown in FIG.

Here, any one of stainless or copper is used as the material of the target member 400.

In addition, as illustrated in FIG. 9, the target member 400 is installed to separate and surround a plurality of different materials on the outer surface of the rotating member 300.
That is, the target member 400 is formed by separating a plurality of 400a, 400b, 400c, 400d, 400e, 400f, 400g, 400h, 400i, 400j, and the like. It is installed to surround the outer surface, the material is made of a plurality of different materials.

The rotating member driving means 500 is connected to the rotating member 300 serves to rotate the rotating member 300.

As shown in FIG. 3, the rotation member driving means 500 includes a driving motor 510 fixed to the outside of the housing 100 and a motor shaft 511 of the driving motor 510. A drive gear 520 connected to the drive gear 520, a driven gear 530 coupled to the drive gear 520, and a through hole 541 through which both ends penetrate so that the support shaft 210 is slidably inserted. One end is coupled to the center of the driven gear 530 and the other end is made of a hollow rotating shaft 540 is fixedly coupled to one side of the rotating member (300).

Here, the driving sequence of the rotating member driving means 500 is as follows.

First, when power is applied and driven to the driving motor 510, the driving force is transmitted to the driving gear 520 through the motor shaft 511, which causes the driving gear 520 to rotate in a predetermined direction. .

When the drive gear 520 is rotated, the driven gear 530 geared to the gear is also rotated, thereby causing the hollow rotating shaft 540 to rotate, the rotating member 300 coupled thereto rotates. .

Therefore, the target member 400 installed on the outer surface of the rotating member 300 is to rotate with respect to the magnet 220.

The high voltage supply means 600 is fixed to the outside of the housing 100 to supply a high voltage to the magnet 220 to release atoms from the target member 400.

Detailed configuration of the high voltage supply means 600 will be omitted because it is a technical field commonly used.

As shown in FIGS. 14 and 15, the reaction gas inlet 700 allows the reaction gas to be injected into the space S of the housing 100, and the reaction gas inlet 700 is closed. A plurality is formed in a line in the wall 120 to inject the reaction gas at the same time.

In the present invention, argon is used as the reaction gas.

In the present invention, nitrogen is injected between the vacuum chamber 50 and the housing 100 when deposition occurs on the deposition substrate 52.

Here, a high-voltage electric field is formed between the target member 400 and the vacuum chamber 50 by the high voltage applied from the high voltage supply means 600 to the target member 400, and reacts with the reaction gas to generate sputtering.

By supplying the reaction gas evenly through the reaction gas inlet 700 as described above, it is possible to cause the reaction uniformly in the housing 100.

On the other hand, the present invention is a side wall of the housing 100, the assembly 800 consisting of the rotating member 300, the target member 400, the rotating member driving means 500 and the high voltage supply means (600) A plurality of spaces (S) of the 110 can be installed.

By installing a plurality of one assembly 800 as described above, it is possible to mix and deposit two or more materials to obtain special effects such as mixed coating.

In the embodiment of the present invention configured as described above, the opening and closing plate 540 and the opening and closing plate driving means 550 for driving the opening and closing plate 540 spaced apart from the outer surface of the target member 400 to open and close it as necessary. It may be further provided.

The reason why the opening plate 540 is further provided is that when one of the plurality of assemblies 800 is used, the rests are not used, and the target member 400 constituting the assembly 800 currently being used is released. The atom is to prevent the closing end to collide with the target member 400 constituting another neighboring assembly (800).

On the other hand, the present invention is introduced into the support member 200, as shown in Figures 5, 7, 8 and 9, by introducing a cooling water for cooling the high temperature heat generated in the magnet 220 Cooling water movement path 310 that can be discharged may be formed.

Here, a path for supplying the coolant to the coolant moving passage 310 may be easily designed, and thus description thereof will be omitted.

10 and 11, a coolant moving passage 115 may be formed in the sidewall 110 to introduce and discharge coolant for cooling heat. It is possible to surely cool the high temperature heat generated by the magnet 220.

12 and 13, the operator can easily observe the color of the plasma generated in response to the reaction gas, that is, the situation occurring inside the housing 100 on the side wall 111. Observation window 116 is installed to examine the internal situation of the housing 100 so that the observation window opening and closing plate 117 for opening and closing the inner surface of the observation window 116 penetrates the side wall 110 to the outside. It is rotatably installed by a hinge shaft 118 rotatably installed to be hermetically sealed, and the manipulation shaft 119 is installed on the hinge shaft 118 to be operable from the outside of the side wall 110.

That is, when the operator wants to examine the internal situation of the housing 100, when the operator turns the operation knob 119 in a predetermined direction, the opening and closing plate 117 is rotated by the hinge shaft 118 to open the observation window 116. (See Fig. 13).

On the other hand, if you want to end the internal situation observation of the housing 100, when the operator rotates the operation knob 119 in the opposite direction of the opening, the opening and closing plate 117 is rotated by the hinge shaft 118 to observe the observation window 116 Is closed (see Fig. 12).

Here, if the observation window 116 is not closed, atoms emitted from the target member 400 are deposited on the observation window 116, and when the predetermined time elapses, the observation window 116 can no longer be used.

Accordingly, when the observation window 116 is closed by the opening and closing plate 117, atoms emitted from the target member 400 are deposited on the opening and closing plate 117 to protect the observation window 116.

As illustrated in FIG. 4, the opening and closing plate driving means 550 includes a hydraulic motor 551 for forward and reverse rotation of the shaft 552 according to whether air is flowing in or out, and a shaft of the hydraulic motor 551. A drive gear 553 connected to 552, a driven gear 554 geared to the drive gear 553 and rotatably coupled to the support shaft 210, and a center of the driven gear 554. Eccentric, one end is connected and the other end is composed of a connecting member 555 fixedly coupled to the shield plate 540.

Here, the hydraulic motor is a type that can use both the air pressure and fluid pressure, such as oil.

Here, the operation of the opening and closing plate driving means 550 will be described.

First, when the fluid flows into the hydraulic motor 551, the motor shaft 552 is rotated in the forward / reverse direction, thereby driving the drive gear (553), driven driven to the gear (553) gears The gear 554 is also rotated, and the shielding plate 540 is rotated from the state of FIG. 8 (a) to the state of FIG. 8 (b) by the connecting member 555 receiving the rotational force of the driven gear 554. Will be converted.

By rotating the shielding plate 540 as necessary, when not in use, the target member 400 can be protected from foreign substances introduced from the outside, and the target distribution 400 shown in FIG. 8 (a) is not used. If not, it will be able to open the target member 400 shown in Figure 8 (b).

On the other hand, although not shown in the drawings, when the target member 400 of FIG. 8 (b) is not closed and used, the target member 400 shown in FIG. 8 (a) may be opened and used.

 As described above, according to the magnetron sputtering target device according to the present invention, by rotating the target relative to the magnet, it is possible to reduce the production cost by extending its replacement cycle, and additionally by partitioning the target into a plurality of areas, this partitioned area By attaching various materials on the substrate, a multilayer film can be deposited and coated on the substrate. Plasma heat is not accumulated during sputtering, thereby making it possible to use a substrate that is susceptible to heat.

Claims (12)

While the front part 111 is opened and the closing wall 120 is formed at the rear part, the side wall 110 is surrounded in all directions so that the space S is formed, and the front part 111 of the side wall 110 is formed. A housing (100) comprising a flange portion (112) formed to be detachably hermetically coupled to an inlet (51) of a vacuum chamber (50) having an evaporation substrate (52) at an edge thereof; It is disposed in the space S of the side wall 110, and both ends thereof are installed through a pair of support shafts 210 passing through the side wall 110, and the magnet 220 is buried so that a part thereof is exposed in the longitudinal direction. A support member 200 having a predetermined length; A cylindrical shape rotating member 300 wrapped around the support member 200 while maintaining a predetermined gap and rotatably installed with respect to the support member 200; A target member 400 installed on an outer surface of the rotating member 300; A rotation member driving means 500 connected to the rotation member 300 to allow the rotation member 300 to be driven to rotate; High voltage supply means (600) fixed to the outer side of the housing (100) to supply a high voltage to the target member (220) to release atoms from the target member (400); It is provided with a reaction gas inlet 700 so that the reaction gas is injected into the space (S) of the housing 100, The target member 400, the plurality is separated is formed to surround the outer surface of the rotating member 300, the material is a magnetron sputtering target device, characterized in that made of a plurality of different materials. The method of claim 1, A space 800 of the side wall 110 of the housing 100 includes one assembly 800 including the rotating member 300, the target member 400, the rotating member driving means 500, and the high voltage supplying means 600. A magnetron sputtering target device, characterized in that a plurality installed in S). According to claim 1 or 2, Opening and closing plate 540 is spaced apart from the outer surface of the target member 400 to open and close it as necessary; Magnetron sputtering target device, characterized in that the opening and closing plate driving means for driving the opening and closing plate 540 is further provided. The method of claim 3, wherein Magnetron sputtering target device, characterized in that the cooling member moving passage 310 is formed in the rotating member 300 to introduce and discharge the cooling water for cooling the heat generated by the magnet 220. The method of claim 3, wherein The material of the target member 400 is a magnetron sputtering target device, characterized in that any one of stainless or copper. The method of claim 3, wherein The magnetron sputtering target device, characterized in that the coolant movement passage 115 is formed in the side wall 110 to introduce and discharge the cooling water for cooling the heat. The method of claim 6, The side wall 111 is provided with an observation window 116 for looking at the internal situation of the housing, Observation window opening and closing plate 117 for opening and closing the inner surface of the observation window 116 is rotatably installed by a hinge shaft 118 rotatably installed to penetrate the side wall 110 and the outside, The hinge shaft 118 is a magnetron sputtering target device, characterized in that the operation knob 119 is installed to be operable from the outside of the side wall (110). delete The method of claim 1, The rotating member driving means 500, A drive motor (510) fixed to the outside of the housing (100); A drive gear 520 connected to the motor shaft 511 of the drive motor 510; A driven gear 530 coupled to the drive gear 520 and driven; Both ends of the support shaft 210 is provided with a through hole 541 through which both ends are slidably inserted, and one end is coupled to the center of the driven gear 530, and the other end is fixed to one side of the rotating member 300. Magnetron sputtering target device, characterized in that consisting of a hollow rotating shaft 540 is coupled. The method of claim 3, wherein The opening and closing plate driving means 550, A pressure motor 551 for forward and reverse rotation of the motor shaft 552 depending on whether the fluid flows in and out; A drive gear 553 connected to the motor shaft 552 of the hydraulic motor 551; A driven gear 554 coupled to the drive gear 553 and rotatably coupled to the support shaft 210; Magnetron sputtering target device, characterized in that consisting of a connecting member 555 is eccentric from the center of the driven gear 554, the other end is fixedly coupled to the shield plate (540). The method of claim 1, The reaction gas injection hole 700, Magnetron sputtering device, characterized in that a plurality of in a line is formed in the closed wall 120 to inject the reaction gas at the same time. The method according to claim 1 or 11, wherein The reaction gas is a magnetron sputtering apparatus, characterized in that any one of argon or nitrogen.

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