KR100558325B1 - The method and device for 3D inspection by moire and stereo vision - Google Patents

The method and device for 3D inspection by moire and stereo vision Download PDF

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KR100558325B1
KR100558325B1 KR1020030067590A KR20030067590A KR100558325B1 KR 100558325 B1 KR100558325 B1 KR 100558325B1 KR 1020030067590 A KR1020030067590 A KR 1020030067590A KR 20030067590 A KR20030067590 A KR 20030067590A KR 100558325 B1 KR100558325 B1 KR 100558325B1
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measurement
obtaining
height
moire
measurement object
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KR20050031328A (en
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이현민
강민구
최이배
이상윤
임쌍근
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(주) 인텍플러스
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Abstract

본 발명은 스테레오비전과 모아레를 이용한 3차원 검사 방법 및 장치에 관한 것으로, 보다 상세하게는 칩의 사전 불량검사시 모아레 3차원형상 측정이 지니는

Figure 112003036304081-pat00001
모호성의 한계로 검출되지 않는 180도 이상의 큰 휨 정도 및 위상값을 갖는 패캐지의 리드에 대한 불량 검출이 가능하여 상기
Figure 112003036304081-pat00002
모호성의 한계를 극복할 수 있도록 한 모아레 3차원형상 측정에 의한 스테레오 칩 검사방법에 관한 것으로서, 이는 측정물에 모아레 무늬를 주사하여 이동시키면서 여러개의 모아레 무늬를 얻은 후, 이들 정보로부터 패캐지의 각 리드 높이를 구하는 제1 단계와; 스테레오 비젼으로부터 패캐지의 각 리드 높이를 구하는 제2 단계와; 두 측정결과에 대해 각각 이웃하는 측정값 사이의 차이를 구하는 제3 단계와; 격자무늬가 형성하는 한 주기(
Figure 112003036304081-pat00003
)에 해당하는 높이 값을 파장(
Figure 112003036304081-pat00004
)라고 할때, 측정값들의 실제 차수를 구하는 제4 단계와; 상기 제4 단계에 의해 구한 차수를 이용하여 최종적인 측정값을 구하는 제5 단계;와로 이루어지고, 광원(21)으로부터 발생한 광을 집광렌즈(22)로 집광하여 투영격자(23)와 투영렌즈(24)를 통해 측정대상물(1)에 투영시키는 광투영부(2)와; 상기 측정대상물(1)로부터 결상렌즈(31) 및 CCD 카메라(32)를 통해 변형된 격자 줄무늬 형태의 영상을 획득하는 제1 수광부(3)와; 상기 측정대상물(1)로부터 결상렌즈(41) 및 스테레오 비젼용 카메라(42)를 통해 측정대상물(1)의 영상을 획득하는 제2 수광부(4)와;로 구성됨으로써 칩의 사전 불량검사시 모아레 3차원 형상 측정이 지니는
Figure 112003036304081-pat00005
모호성의 한계로 검출되지 않는 180도 이상의 큰 휨 정도 및 위상값을 갖는 패캐지의 리드에 대한 불량 검출이 가능하여 상기
Figure 112003036304081-pat00006
모호성의 한계를 극복할 수 있고, 이로인해 칩의 사전 불량검사의 정확성을 확보할 수 있는 효과를 갖게 된다.The present invention relates to a three-dimensional inspection method and apparatus using stereo vision and moire, and more particularly, to measure the three-dimensional shape of the moire during the prior defect inspection of the chip
Figure 112003036304081-pat00001
It is possible to detect defects on leads of packages having a large degree of warpage and a phase value of 180 degrees or more, which are not detected due to the ambiguity limit.
Figure 112003036304081-pat00002
The present invention relates to a stereo chip inspection method by moiré three-dimensional shape measurement that overcomes the limitation of ambiguity. This method obtains several moiré patterns while scanning and moving moiré patterns on the workpiece, and then obtains each lead of the package from these information. Obtaining a height; Obtaining a height of each lead of the package from the stereo vision; Obtaining a difference between neighboring measurement values for each of the two measurement results; One cycle of the lattice pattern
Figure 112003036304081-pat00003
), The height value corresponding to the wavelength (
Figure 112003036304081-pat00004
A fourth step of obtaining the actual order of the measured values; A fifth step of obtaining a final measurement value by using the order obtained by the fourth step; and comprising the projection grid 23 and the projection lens by condensing the light generated from the light source 21 with the condenser lens 22. A light projecting portion 2 projecting onto the measurement object 1 through 24; A first light receiver (3) for acquiring an image of a deformed lattice pattern from the measurement object (1) through an imaging lens (31) and a CCD camera (32); And a second light receiving unit 4 for acquiring an image of the measurement object 1 through the imaging lens 41 and the stereo vision camera 42 from the measurement object 1; 3D shape measurement
Figure 112003036304081-pat00005
It is possible to detect defects on leads of packages having a large degree of warpage and a phase value of 180 degrees or more, which are not detected due to the ambiguity limit.
Figure 112003036304081-pat00006
The limitation of ambiguity can be overcome, and this has the effect of ensuring the accuracy of the pre-failure inspection of the chip.

모아레, 스테레오Moire, stereo

Description

스테레오비전과 모아레를 이용한 3차원 검사 방법 및 장치{The method and device for 3D inspection by moire and stereo vision}The method and device for 3D inspection by moire and stereo vision}

도 1은 본 발명의 장치 구성을 보인 개략 구성도.1 is a schematic configuration diagram showing a device configuration of the present invention.

도 2는 본원인이 기출원한 칩 마운팅 장치를 보인 개략 구성도.Figure 2 is a schematic block diagram showing a chip mounting apparatus of the present application.

도 3은 도 2의 "A"부 확대사시도.3 is an enlarged perspective view of part “A” of FIG. 2;

*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1:측정대상물1: measuring object

11:구동모터 12:이송테이블  11: Drive motor 12: Transfer table

2:광투영부2: light projection

21:광원 22:집광렌즈  21: light source 22: condenser lens

23:투영격자 23A:구동부  23: projection grating 23A: driving part

24:투영렌즈  24: projection lens

3:제1 수광부3: first light receiver

31:결상렌즈 32:CCD 카메라  31: imaging lens 32: CCD camera

4:제2 수광부4: second light receiver

41:결상렌즈 42:스테레오 비젼용 카메라  41: imaging lens 42: camera for stereo vision

본 발명은 스테레오비전과 모아레를 이용한 3차원 검사 방법 및 장치에 관한 것으로, 보다 상세하게는 칩의 사전 불량검사시 모아레 3차원형상 측정이 지니는

Figure 112003036304081-pat00007
모호성의 한계로 검출되지 않는 180도 이상의 큰 휨 정도 및 위상값을 갖는 패캐지의 리드에 대한 불량 검출이 가능하여 상기
Figure 112003036304081-pat00008
모호성의 한계를 극복할 수 있도록 한 모아레 3차원형상 측정에 의한 스테레오 칩 검사방법에 관한 것이다.The present invention relates to a three-dimensional inspection method and apparatus using stereo vision and moire, and more particularly, to measure the three-dimensional shape of the moire during the prior defect inspection of the chip
Figure 112003036304081-pat00007
It is possible to detect defects on leads of packages having a large degree of warpage and a phase value of 180 degrees or more, which are not detected due to the ambiguity limit.
Figure 112003036304081-pat00008
The present invention relates to a stereo chip inspection method using moiré three-dimensional shape measurement to overcome the limitation of ambiguity.

본원인이 기출원한 특허출원 제2001-87334호 "칩 마운팅 방법 및 장치"에 의하면, 도 1에 도시된 바와 같이 필름 공급롤(110)의 필름이 필름 회수롤(120) 측으로 스텝운동으로 진입 및 이송되게 하고, 그 이송되는 필름(130)이 3차원형상 측정용 프로브(140)를 통과하는 것에 의해 필름(130)의 칩수용홈(130A)에 탑재된 칩(100)의 검사가 이루어지게 되는 것이며, 검사 및 선별 작업을 마친 필름의 수용홈(130A)을 테이프(150)로 부착하여 밀봉함으로써 일련의 칩 마운팅 작업을 완료하도록 되어 있다.According to the patent application 2001-87334 "chip mounting method and apparatus" which the applicant applied for, the film of the film feed roll 110 enters the step movement toward the film recovery roll 120 as shown in FIG. And the transfer of the film 130 through the three-dimensional shape measuring probe 140 so that the inspection of the chip 100 mounted in the chip accommodation groove 130A of the film 130 is performed. By attaching and sealing the receiving groove 130A of the film, which has been inspected and sorted by the tape 150, a series of chip mounting operations are completed.

그리고 상기 3차원형상 측정용 프로브(140)는 본원인이 선출원한 바 있는 특허출원 제2000-69549호 "모아레무늬 발생기를 적용한 위상천이 영사식 모아레방법 및 장치"에 의한 3차원형상 측정장치로서, 칩(100)의 불량여부, 즉 패캐지의 각 리드의 휨정도를 상기 3차원형상 측정용 프로브(140)와 연결된 모니터(160)의 화면을 통해 판별할 수 있도록 되어 있다.And the three-dimensional shape measurement probe 140 is a three-dimensional shape measurement apparatus according to the patent application No. 2000-69549 "Phase transition projection moire method and apparatus applying a moire pattern generator" that the applicant has previously filed, Whether the chip 100 is defective, that is, the degree of warpage of each lead of the package can be determined through a screen of the monitor 160 connected to the three-dimensional shape measuring probe 140.

여기서, 모아레 무늬는 격자, 즉 밝은 부분의 줄무늬와 어두운 부분의 줄무늬가 교호되게 연속반복적으로 형성된 것을 일컫는 것으로서, 측정물에 모아레 무늬를 주사하여 이동시키면서 여러개의 모아레 무늬를 얻은 후, 이들 정보로부터 3차원 형상정보를 획득하게 되는데, 이때 사용되는 수학식은 다음과 같다.Here, the moiré pattern refers to a lattice, that is, the light part stripes and the dark part stripes are formed repeatedly alternately. The moiré patterns are scanned and moved while scanning the moiré patterns on the measurement object, and then 3 Dimensional shape information is obtained, and the equation used is as follows.

Figure 112003036304081-pat00009
(1)
Figure 112003036304081-pat00009
(One)

Figure 112003036304081-pat00010
(2)
Figure 112003036304081-pat00010
(2)

Figure 112003036304081-pat00011
(3)로서,
Figure 112003036304081-pat00011
As (3),

여기서,

Figure 112003036304081-pat00012
,
Figure 112003036304081-pat00013
,
Figure 112003036304081-pat00014
은, CCD 카메라를 통해 획득된 측정점의 밝기, 즉 측정값이고,here,
Figure 112003036304081-pat00012
,
Figure 112003036304081-pat00013
,
Figure 112003036304081-pat00014
Is the brightness, i.e., the measured value, of the measurement points acquired through the CCD camera,

Figure 112003036304081-pat00015
은, 측정점의 배경 광강도로서, 측정물체의 반사도와 입력되는 빛의 강도를 합친 값으로 결정되고, 평균값이다.
Figure 112003036304081-pat00015
Is the background light intensity of the measurement point, which is determined by the sum of the reflectance of the measurement object and the intensity of the input light, and is an average value.

Figure 112003036304081-pat00016
은, 측정점의 가시도.
Figure 112003036304081-pat00016
Is the visibility of the measuring point.

Figure 112003036304081-pat00017
은, 정수로서 변하지 않는 값이다.
Figure 112003036304081-pat00017
Is a value that does not change as an integer.

Figure 112003036304081-pat00018
,
Figure 112003036304081-pat00019
,
Figure 112003036304081-pat00020
은 변하는 모아레 무늬의 이동값으로서, 상기 수식의 연산으로부터 물체의 높이(
Figure 112003036304081-pat00021
), 즉 패캐지의 리드 높이 및 휨 정도를 구할 수 있게 되는데, 이때 그 높이는 삼각함수를 이용한 위상값으로 나타나게 되는 것이며,
Figure 112003036304081-pat00022
주기로 나타나게 된다.
Figure 112003036304081-pat00018
,
Figure 112003036304081-pat00019
,
Figure 112003036304081-pat00020
Is the moving value of the moiré pattern that changes, and the height of the object (
Figure 112003036304081-pat00021
), That is, the lead height and the degree of warpage of the package can be obtained, and the height is represented by a phase value using a trigonometric function.
Figure 112003036304081-pat00022
Will appear in cycles.

따라서, 패캐지 리드의 휨정도가 큰 경우, 즉 180도를 넘는 위상에 대해서 판별이 어렵게 되는 것으로서, 이를

Figure 112003036304081-pat00023
모호성(Ambiguity)이라 하며, 이러한
Figure 112003036304081-pat00024
모호성(Ambiguity)으로 인한 모아레 3차원형상 측정의 한계로 칩의 사전 불량검사의 정확성이 결여되는 문제점이 있었다.Therefore, when the degree of warpage of the package lead is large, that is, it is difficult to distinguish the phase over 180 degrees.
Figure 112003036304081-pat00023
Called Ambiguity,
Figure 112003036304081-pat00024
Due to the limitation of moiré three-dimensional shape measurement due to ambiguity, there was a problem of lack of accuracy of pre-failure inspection of the chip.

이에 본 발명은 상기한 바와 같은 종래의 제반 문제점을 해소하기 위해 창안된 것으로서, 그 목적은 칩의 사전 불량검사시 모아레 3차원형상 측정이 지니는

Figure 112003036304081-pat00025
모호성의 한계로 검출되지 않는 180도 이상의 큰 휨 정도 및 위상값을 갖는 패캐지의 리드에 대한 불량 검출이 가능하여 상기
Figure 112003036304081-pat00026
모호성의 한계를 극복할 수 있도록 하는데 있다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, the purpose of which is to measure the moire three-dimensional shape during the pre-failure inspection of the chip
Figure 112003036304081-pat00025
It is possible to detect defects on leads of packages having a large degree of warpage and a phase value of 180 degrees or more, which are not detected due to the ambiguity limit.
Figure 112003036304081-pat00026
To overcome the limits of ambiguity.

이러한 본 발명의 목적을 달성하기 위하여 측정물에 모아레 무늬를 주사하여 이동시키면서 여러개의 모아레 무늬를 얻은 후, 이들 정보로부터 패캐지의 각 리드 높이를 구하는 제1 단계와; 스테레오 비젼으로부터 패캐지의 각 리드 높이를 구하는 제2 단계와; 두 측정결과에 대해 각각 이웃하는 측정값 사이의 차이를 구하는 제3 단계와; 격자무늬가 형성하는 한 주기(

Figure 112003036304081-pat00027
)에 해당하는 높이 값을 파장(
Figure 112003036304081-pat00028
)라고 할때, 측정값들의 실제 차수를 구하는 제4 단계와; 상기 제4 단계에 의해 구한 차수를 이용하여 최종적인 측정값을 구하는 제5 단계;와로 이루어진 것을 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사 방법이 제공된다.In order to achieve the object of the present invention, the first step of obtaining a plurality of moire fringes while scanning and moving the moire fringes on the measurement object, and obtaining the height of each lead of the package from these information; Obtaining a height of each lead of the package from the stereo vision; Obtaining a difference between neighboring measurement values for each of the two measurement results; One cycle of the lattice pattern
Figure 112003036304081-pat00027
), The height value corresponding to the wavelength (
Figure 112003036304081-pat00028
A fourth step of obtaining the actual order of the measured values; A fifth step of obtaining a final measurement value by using the order obtained by the fourth step; Provides a three-dimensional inspection method using a stereovision and moiré, characterized in that consisting of.

또한, 본 발명은 광원으로부터 발생한 광을 집광렌즈로 집광하여 투영격자와 투영렌즈를 통해 측정대상물에 투영시키는 광투영부와; 상기 측정대상물로부터 결상렌즈 및 CCD 카메라를 통해 변형된 ,격자 줄무늬 형태의 영상을 획득하는 제1 수광부와; 상기 측정대상물로부터 결상렌즈 및 스테레오 비젼용 카메라를 통해 측정대상물의 영상을 획득하는 제2 수광부와;로 구성된 것을 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사 장치가 제공된다.In addition, the present invention comprises a light projection unit for condensing the light generated from the light source with a condensing lens to project to the measurement object through the projection grid and the projection lens; A first light receiving unit for obtaining a deformed grid-shaped image from the measurement object through an imaging lens and a CCD camera; And a second light receiver configured to acquire an image of the measurement object from the measurement object through an imaging lens and a stereo vision camera.

이하, 본 발명에 의한 칩 검사방법을 상세히 설명하기로 한다.Hereinafter, the chip inspection method according to the present invention will be described in detail.

도 1은 본 발명에 의한 측정장치를 보인 개략 구성도이다.1 is a schematic configuration diagram showing a measuring apparatus according to the present invention.

이에 도시된 바와 같이 본 발명은 측정대상물(1)에 격자 줄무늬를 투영시키는 광투영부(2)와, 측정대상물(1)로부터 변형된 격자 줄무늬 형태의 영상을 획득하는 제1 수광부(3)와, 측정대상물(1)로부터 상기 측정대상물의 영상을 획득하는 제2 수광부(4)로 구성된다.As shown therein, the present invention provides a light projection unit 2 for projecting a lattice stripe on the measurement object 1, a first light receiving unit 3 for obtaining a deformed grid stripe-shaped image from the measurement object 1; The second light receiving unit 4 acquires an image of the measurement object from the measurement object 1.

상기 광투영부(2)는 광축을 따라 상부측에서 광원(21)과 집광렌즈(22) 및 투영격자(23), 투영렌즈(24)의 순으로 광배열을 이루는 것이며, 상기 투영격자(23)는 구동부(23A)에 의해 이동이 가능하게 구성되는 것으로서, 광원(21)에서 발생한 광은 집광렌즈(22)에 의해 집광된 후 투영격자(23) 및 투영렌즈(24)를 거쳐 측정대상물(1)에 격자 무늬형태로 투영된다. 그리고 상기 측정대상물(1)은 구동모터(11)에 의해 구동되는 이송테이블(12) 상에 놓여진다.The light projecting part 2 forms an optical array in the order of the light source 21, the condenser lens 22, the projection lattice 23, and the projection lens 24 on the upper side along the optical axis, and the projection lattice 23. ) Is configured to be movable by the driving unit 23A, and the light generated from the light source 21 is collected by the condenser lens 22 and then passes through the projection grid 23 and the projection lens 24 to measure the object ( 1) is projected in a grid pattern. The measurement object 1 is then placed on the transfer table 12 driven by the drive motor 11.

상기 제1 수광부(3)는 광축을 따라 하부측에서 결상렌즈(31)와 CCD 카메라(32)의 순으로 광배열을 이루는 것으로서, 측정대상물(1)에서 반사된 영상, 즉 변형된 격자 줄무늬는 결상렌즈(31)를 통해 CCD 카메라(32)의 촬상면에 맺힌다.The first light receiving unit 3 forms an optical array in the order of the imaging lens 31 and the CCD camera 32 at the lower side along the optical axis, and the image reflected from the measurement object 1, that is, the deformed lattice stripes It forms on the imaging surface of the CCD camera 32 via the imaging lens 31.

상기 제2 수광부(4)는 광축을 따라 하부측에서 결상렌즈(41)와 스테레오 비젼용 카메라(42)의 순으로 광배열을 이루는 것으로서, 측정대상물(1)로부터 상기 측정대상물의 영상을 획득한다.The second light receiving unit 4 forms an optical array in the order of the imaging lens 41 and the stereo vision camera 42 at the lower side along the optical axis, and acquires an image of the measurement object from the measurement object 1. .

이하, 본 발명에 의한 칩 검사방법을 상세히 설명하기로 한다.Hereinafter, the chip inspection method according to the present invention will be described in detail.

이 모아레 3차원형상 측정용 프로브를 이용한 칩 검사방법은 통상에서와 같이 측정물에 모아레 무늬를 주사하여 이동시키면서 여러개의 모아레 무늬를 얻은 후, 이들 정보로부터 3차원 형상정보를 획득하게 되는 것이며, 여기에 사용되는 수학식은,The chip inspection method using the moiré three-dimensional shape measurement probe is to obtain a three-dimensional shape information from these information after obtaining a plurality of moire patterns while scanning and moving the moiré pattern on the workpiece as usual. The equation used in

Figure 112003036304081-pat00029
(1)
Figure 112003036304081-pat00029
(One)

Figure 112003036304081-pat00030
(2)
Figure 112003036304081-pat00030
(2)

Figure 112003036304081-pat00031
(3)이다.
Figure 112003036304081-pat00031
(3).

이러한 모아레 3차원형상 측정용 프로브를 이용한 침 검사방법에 의해 구한 높이를

Figure 112003036304081-pat00032
(여기서 n은 패키지 측정에 있어서 각 리드를 의미함)라 하고, 스테레오로부터 구한 높이를
Figure 112003036304081-pat00033
라 하면,The height obtained by the needle inspection method using the moiré three-dimensional shape measurement probe
Figure 112003036304081-pat00032
Where n stands for each lead in the package measurement.
Figure 112003036304081-pat00033
Say,

두 측정결과에 대해 각각 이웃하는 측정값 사이의 차이를 구한다.Find the difference between the neighboring measurements for the two measurements.

Figure 112003036304081-pat00034
Figure 112003036304081-pat00034

Figure 112003036304081-pat00035
Figure 112003036304081-pat00035

여기서

Figure 112003036304081-pat00036
,
Figure 112003036304081-pat00037
이다.here
Figure 112003036304081-pat00036
,
Figure 112003036304081-pat00037
to be.

격자무늬가 형성하는 한 주기

Figure 112003036304081-pat00038
에 해당하는 높이 값을
Figure 112003036304081-pat00039
라고 할 때, 측정값들의 실체차수(Fring order)는 아래와 같이 구해진다.One cycle that the grid pattern forms
Figure 112003036304081-pat00038
The height value corresponding to
Figure 112003036304081-pat00039
In this case, the Fring order of the measured values is obtained as follows.

Figure 112003036304081-pat00040
Figure 112003036304081-pat00040

여기서,

Figure 112003036304081-pat00041
이고,
Figure 112003036304081-pat00042
은 가장 가까운 정수값이다.here,
Figure 112003036304081-pat00041
ego,
Figure 112003036304081-pat00042
Is the nearest integer value.

이렇게 구한 차수를 이용하여 모아레 측정 결과값에서

Figure 112003036304081-pat00043
모호성(
Figure 112003036304081-pat00044
ambiguity)문제가 해결된다. 최종적인 측정값은 아래와 같다.From the moiré measurement result using this order
Figure 112003036304081-pat00043
Ambiguity (
Figure 112003036304081-pat00044
ambiguity problems are solved. The final measurement is shown below.

Figure 112003036304081-pat00045
Figure 112003036304081-pat00045

여기서,

Figure 112003036304081-pat00046
here,
Figure 112003036304081-pat00046

상술한 바와 같이 본 발명은 칩의 사전 불량검사시 모아레 3차원형상 측정이 지니는

Figure 112003036304081-pat00047
모호성의 한계로 검출되지 않는 180도 이상의 큰 휨 정도 및 위상값을 갖는 패캐지의 리드에 대한 불량 검출이 가능하여 상기
Figure 112003036304081-pat00048
모호성의 한계를 극복할 수 있도록 함으로써 칩의 사전 불량검사의 정확성을 확보할 수 있는 효과를 갖게 된다.
As described above, the present invention has a moiré three-dimensional shape measurement during the pre-failure inspection of the chip.
Figure 112003036304081-pat00047
It is possible to detect defects on leads of packages having a large degree of warpage and a phase value of 180 degrees or more, which are not detected due to the ambiguity limit.
Figure 112003036304081-pat00048
By overcoming the limitations of ambiguity, it is possible to secure the accuracy of the pre-failure inspection of the chip.

Claims (5)

측정물에 모아레 무늬를 주사하여 이동시키면서 여러개의 모아레 무늬를 얻은 후, 이들 정보로부터 패캐지의 각 리드 높이를 구하는 제1 단계와;A first step of obtaining a plurality of moire fringes by scanning and moving the moire fringes on the measurement object, and then obtaining the height of each lead of the package from these information; 스테레오 비젼으로부터 패캐지의 각 리드 높이를 구하는 제2 단계와;Obtaining a height of each lead of the package from the stereo vision; 두 측정결과에 대해 각각 이웃하는 측정값 사이의 차이를 구하는 제3 단계와;Obtaining a difference between neighboring measurement values for each of the two measurement results; 격자무늬가 형성하는 한 주기(
Figure 112003036304081-pat00049
)에 해당하는 높이 값을 파장(
Figure 112003036304081-pat00050
)라고 할때, 측정값들의 실제 차수를 구하는 제4 단계와;One cycle of the lattice pattern
Figure 112003036304081-pat00049
), The height value corresponding to the wavelength (
Figure 112003036304081-pat00050
A fourth step of obtaining the actual order of the measured values; 상기 제4 단계에 의해 구한 차수를 이용하여 최종적인 측정값을 구하는 제5 단계;와로 이루어진 것을 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사방법.And a fifth step of obtaining a final measurement value using the orders obtained by the fourth step. 3D inspection method using stereovision and moiré, characterized in that consisting of. 제1항에 있어서,The method of claim 1, 상기 제3 단계는 다음 수식에 의해 측정값 사이의 차이를 구한 것을 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사 방법. The third step is a three-dimensional inspection method using the stereovision and moire, characterized in that the difference between the measured values obtained by the following equation.
Figure 112005069412124-pat00051
Figure 112005069412124-pat00051
Figure 112005069412124-pat00052
Figure 112005069412124-pat00052
 여기서
Figure 112005069412124-pat00053
,
Figure 112005069412124-pat00054
이다.here
Figure 112005069412124-pat00053
,
Figure 112005069412124-pat00054
to be.
Figure 112005069412124-pat00063
프로브로부터 구한 높이
Figure 112005069412124-pat00063
Height obtained from probe
Figure 112005069412124-pat00064
스테레오로부터 구한 높이
Figure 112005069412124-pat00064
Height obtained from stereo
Figure 112005069412124-pat00065
패키지 측정에 있어서 각 리드
Figure 112005069412124-pat00065
Each lead in package measurement 제1항에 있어서,The method of claim 1, 상기 제4 단계는 다음 수식에 의해 측정값들의 실제 차수를 구한 것을 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사 방법.The fourth step is a three-dimensional inspection method using a stereo vision and moire characterized in that the actual order of the measured values obtained by the following equation.
Figure 112005069412124-pat00055
Figure 112005069412124-pat00055
 여기서,
Figure 112005069412124-pat00056
이고,
Figure 112005069412124-pat00057
은 가장 가까운 정수값이다.here,
Figure 112005069412124-pat00056
ego,
Figure 112005069412124-pat00057
Is the nearest integer value.
Figure 112005069412124-pat00066
측정값들의 실제차수
Figure 112005069412124-pat00066
Actual order of measurements
Figure 112005069412124-pat00067
프로브로부터 구한 높이
Figure 112005069412124-pat00067
Height obtained from probe
Figure 112005069412124-pat00068
스테레오로부터 구한 높이
Figure 112005069412124-pat00068
Height obtained from stereo
Figure 112005069412124-pat00069
패키지 측정에 있어서 각 리드
Figure 112005069412124-pat00069
Each lead in package measurement
Figure 112005069412124-pat00070
한 주기에 해당하는 높이값
Figure 112005069412124-pat00070
Height value for one cycle 제1항에 있어서,The method of claim 1, 상기 제5 단계는 다음 수식에 의해 측정값을 구한 것을 특징으로 한 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사 방법.The fifth step is a three-dimensional inspection method using the stereovision and moire characterized in that the measurement value is obtained by the following equation.
Figure 112005069412124-pat00058
Figure 112005069412124-pat00058
 여기서,
Figure 112005069412124-pat00059
here,
Figure 112005069412124-pat00059
Figure 112005069412124-pat00071
측정값들의 실제차수
Figure 112005069412124-pat00071
Actual order of measurements
Figure 112005069412124-pat00072
프로브로부터 구한 높이
Figure 112005069412124-pat00072
Height obtained from probe
Figure 112005069412124-pat00073
패키지 측정에 있어서 각 리드
Figure 112005069412124-pat00073
Each lead in package measurement
Figure 112005069412124-pat00074
한 주기에 해당하는 높이값
Figure 112005069412124-pat00074
Height value for one cycle 광원(21)으로부터 발생한 광을 집광렌즈(22)로 집광하여 투영격자(23)와 투영렌즈(24)를 통해 측정대상물(1)에 투영시키는 광투영부(2)와;A light projecting part 2 for condensing the light generated from the light source 21 with the condensing lens 22 and projecting it onto the measurement object 1 through the projection lattice 23 and the projection lens 24; 상기 측정대상물(1)로부터 결상렌즈(31) 및 CCD 카메라(32)를 통해 변형된 격자 줄무늬 형태의 영상을 획득하는 제1 수광부(3)와;A first light receiver (3) for acquiring an image of a deformed lattice pattern from the measurement object (1) through an imaging lens (31) and a CCD camera (32); 상기 측정대상물(1)로부터 결상렌즈(41) 및 스테레오 비젼용 카메라(42)를 통해 측정대상물(1)의 영상을 획득하는 제2 수광부(4)와;로 구성된 것을 특징으로 한 스테레오비전과 모아레를 이용한 3차원 검사 장치.And a second light receiver 4 for acquiring an image of the measurement object 1 through the imaging lens 41 and the stereo vision camera 42 from the measurement object 1; 3D inspection apparatus using the.
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KR100708352B1 (en) 2006-03-07 2007-04-18 한국과학기술원 APPARATUS AND METHOD FOR 3DIMENSION CONFIGURATION MEASUREMENT WITHOUT PHASE SHIFT PROCESS AND 2pi; AMBIGUITY OF MOIRE PRINCIPLE
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KR20160118722A (en) 2015-04-03 2016-10-12 유종재 3D vision inpection system
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