KR100554444B1 - Intray laser marking system - Google Patents

Abstract

The present invention sequentially transfers one by one from the lowermost tray in the on-loader stacker in which a plurality of trays in which a plurality of semiconductor packages are stacked are stacked, and IDs of a plurality of semiconductor packages placed in a tray through a prevision (OCR) camera. Check mark hole and lot number to check if the semiconductor package is placed in the correct direction and other kinds of semiconductor package are placed in the tray, and then transferred to the vibrator installed at the lower part of the laser marking device. After being clamped and fixed through the provided clamping device, a plurality of semiconductor packages tilted diagonally and placed in the tray by vibration are aligned to one side of the tray, and then a specific word is marked on the surface of the semiconductor package by the laser marking device. After that, the marking is passed through the debris removal unit where the air nozzle and dust collector are installed. After the foreign substances generated at the time of removal are removed, the marking status of the semiconductor package is checked through a post vision camera, and then the sorting device is used to sort the semiconductor packages of the marking defects detected by the post vision camera. A tray transfer type semiconductor package marking method and system configured to be replaced with a good good quality semiconductor package and then stacked in an unloader stacker.

Tray, Semiconductor Package, Marking

Description

Tray transfer semiconductor package marking method and system {Intray laser marking system}

1 is a front detail view showing the appearance of the present invention;

Figure 2 is a left side detailed view showing the appearance of the present invention;

Figure 3 is a detailed view of the right side showing the appearance of the present invention.

Figure 4 is a plan view showing the appearance of the present invention

5 is a plan detail view of the marking system according to the invention.

6 is a front detail view of the marking system according to the invention;

7 is a right side detail view of the marking system according to the invention.

8 is a left side detail view of the marking system according to the invention.

9 is a detailed plan view of the on-loader stacker according to the present invention.

10 is a front detail view of the on-loader stacker according to the present invention.

Figure 11 is a detailed side view of the on-loader stacker according to the present invention

12 is a detailed plan view of a tray elevator according to the present invention.

13 is a front detail view of the tray elevator according to the present invention;

Figure 14 is a plan view detail of the tray first transfer means according to the present invention;

Figure 15 is a front detail view of the tray first transfer means according to the present invention;

Figure 16 is a detailed side view of the tray first transfer means according to the present invention;

Fig. 17 is a plan detail view of an orientation device according to the present invention;

18 is a front detail view of an orientation device according to the present invention;

19 is a detailed side view of an orientation device according to the present invention;

20 is a detailed view of a drawer plane according to the present invention.

Figure 21 is a detailed view of the drawer (Drawer) side according to the present invention (equipment basis)

Figure 22 is a detailed view of the drawer (Drawer) according to the present invention (equipment basis)

Figure 23 is a detailed plan view of the tray second conveying means according to the present invention;

24 is a detailed front view of the tray 2 conveying means according to the present invention (equipment basis)

Figure 25 is a detailed side view of the tray 2 conveying means according to the present invention (equipment basis)

Figure 26 is a detailed plan view of the lifter according to the present invention.

Figure 27 is a side detail view of the lifter according to the present invention.

Figure 28 is a front detail view of the lifter according to the present invention.

29 is a plan detail view of a vibrator according to the present invention.

30 is a detailed side view of a vibrator according to the present invention.

Figure 31 is a plan view detail of the clamping device according to the present invention

32 is a detailed side view of the clamping device according to the present invention;

33 is a detailed plan view of the foreign matter removing apparatus according to the present invention

34 is a detailed side view of the foreign matter removing apparatus according to the present invention;

35 is a front detail view of the foreign matter removing apparatus according to the present invention;

36 is a detailed view of the mesh provided in the foreign matter removing apparatus according to the present invention

Figure 37 is a detailed plan view of the tray third transfer means according to the present invention;

Figure 38 is a side elevational view of a third transfer means of a tray according to the present invention;

Figure 39 is a detailed plan view of the sorter according to the present invention.

40 is a front detail view of a sorter according to the present invention;

Figure 41 is a side detail view of a sorter according to the present invention;

Figure 42 is a detailed view of the unloader stacker plane of the tray recovery unit according to the present invention

Figure 43 is a plan detail view of the sorter table according to the present invention.

44 is a front detail view of the sorter table according to the present invention.

Figure 45 is a detailed side view of a sorter table according to the present invention.

46 is a plan view detail of the conveying means of the sorter table according to the present invention;

Fig. 47 is a side detailed view of a conveying means of the sorter table according to the present invention;

Description of the main parts of the drawing

Semiconductor Package 1, Tray 2, Onloader Stacker 10, Tray Stacker 11, Separator Cylinder 13, Tray Fixture 13 ', Tray Fixture ( 13a), tray elevator 20, cylinder 21, shaft 22, first rail 30, first tray feeder 40, motor 41, screw shaft 42, Tray Support 43, Latch Type Fixture 44, Cylinder 45, Clamping Fixture 46, Robot 50, Vision (OCR) Camera 51, Light 52, Motor ( 60), robot 61, upper and lower cylinder 62, tray cover panel 63, tray guide 64, second rail 70, first and third lifters 80 and 90, LM guide 71 ), LM block 72, motor 73, walking beam 74, walking beam tray guide 75, up-down cylinders 81 and 91, tray guides 82 and 92, guides 83 and 93 , Vibrator 100, clamping device 110, laser marking device 120, debris removal device 130, air nozzle 131, dust collector 132, mesh 133, cylinder 134, lifter ( 140), 3 rail 150, the second tray feeder 160, the third tray feeder 170, the robot 180, the motor 181, the vacuum suction port 182, the tray feeder (A), the first feed Means (B), orientation device (C), first drawer (D), second transfer means (E), laser marking part (F), foreign substance removal part (G), second drawer ( H), third transfer means (I), marking inspection apparatus (J), sorter (K), tray recovery portion (L), sorter table (M), table transfer means (N), control device (O) )

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tray transfer type semiconductor package marking method and system configured to transfer a tray in which a plurality of semiconductor packages are placed, and to mark a specific phrase on a surface of the semiconductor package placed in the tray, and more particularly, to a plurality of semiconductors. The on-loader stacker, in which a number of trays with packages are stacked, is sequentially transferred from the lowest tray one by one, and the ID mark holes and lot numbers of the plurality of semiconductor packages placed in the trays are pre-visioned by the Prevision (OCR) camera. Check that the semiconductor package is placed in the correct direction and the other type of semiconductor package is placed in the tray. Then, the clamping device provided in the vibrator is transferred to a vibrator installed under the laser marking device. Clamped through and fixed, then tilted diagonally by vibration A plurality of semiconductor packages placed in the ray are aligned to one side of the tray, and then a specific text is marked on the surface of the semiconductor package by the laser marking device, and then passed through the foreign material removing unit where the air nozzle and the dust collector are installed. After the foreign matter is removed, the marking status of the semiconductor package is checked through a post vision camera, and then the sorted semiconductor package detected by the post vision camera is sorted by a sorting device to obtain a good marking condition. It is a tray transfer semiconductor package marking method and system configured to be replaced with a semiconductor package, and then stacked on an unloader stacker.

In general, in the semiconductor package manufacturing field, marking means that specific symbols, numbers, and letters are displayed on the upper or rear surface of the semiconductor package by using ink or laser beam, so that the user can easily obtain the information necessary for managing and using the semiconductor package. have. Therefore, the marking can identify not only the function of the semiconductor package but also the company which manufactured the semiconductor chip, the packaged company, and the inspected company.

As an example of a conventional marking apparatus and method for performing a marking process of a semiconductor package as described above, Korean Patent Laid-Open Publication No. 1999-0033220 includes a plurality of mirrors that can reflect and transmit in front of a laser light source. And a method of and a device for marking a semiconductor package using a laser beam configured to mark a plurality of semiconductor package units at the same time by arranging one surface of the semiconductor package unit so that a laser beam reflected from each of the mirrors arrives. It is

Korean Patent Publication No. 1995-0026721 discloses a package surface that is heated to an appropriate temperature to remove foreign substances or wrong markings on the surface of a semiconductor package made of a synthetic resin material and to improve adhesion of coating ink. After coating an appropriate amount of coating ink on the coating ink, the coated ink is dried for a predetermined time, and then the surface of the coated ink can be marked with a laser or ink, thereby increasing the sharpness of marked characters and figures, and incorrect marking during marking. A method of marking a semiconductor package can be easily performed, and a marking method of a semiconductor package that can improve the appearance quality of a semiconductor package product is described.

In Korean Patent Publication No. 10-0462239, a laser beam of a predetermined wavelength is provided by a laser oscillator to capture a marking area of a semiconductor in real time and to capture a wider area without spherical aberration. And a galvo meter positioned between the laser oscillator and the laser head and reflecting the incident laser beam at a predetermined angle so that a predetermined area of the semiconductor package is marked, and located between the galvo meter and the laser oscillator. An optional earth reflection mirror, which passes the laser beam as it is and is reflected from the marking area of the semiconductor package through the lens, is reflected at one side, and is positioned at a rear end of the selective transmission reflection mirror to mark the semiconductor package. Image for the area A laser marking apparatus for semiconductors comprising a plano convex lens for enlarging and passing through a wide area without spherical aberration, and a camera for photographing a work area of the semiconductor package to be marked in proximity to the plano convex lens,

Korean Patent Publication No. 0125958 discloses a semiconductor package marking apparatus and method configured to facilitate the operation of a semiconductor marking apparatus by installing a sensor on both rails and an index plate of an index portion to perform marking according to the sensed data of the sensor. Described,

Publication No. 10-0235754 discloses a marking printing unit which moves up and down with a step motor to a marking head provided in a marking system for applying UV marking to a package of semiconductor package material, and a step for applying ink to the marking printing unit. A printing marking method and apparatus thereof for a semiconductor packaging marking system having an ink coating unit which is moved back and forth by a motor, and an ink uniform coating unit for maintaining the ink applied to the ink coating unit uniformly,

The Utility Model Publication No.1993-0004640 regulates the distance between the marking die and the marking head according to the width and thickness of various packages having different specifications, and also adjusts the distance between the pair of width guiders. BACKGROUND OF THE INVENTION A semiconductor package marking apparatus is described that enables a package to be marked in a good state.

However, in the conventional marking apparatus as described above, the semiconductor package is individually transported to make the marking, and the sorting process and the collection process for sorting out defective products that are not markedly automated are not automated, which requires a lot of manpower and time, resulting in reduced productivity. There is a problem.

In order to solve the above problems, the present invention transfers a tray in which a plurality of semiconductor packages are placed, it is possible to quickly perform a marking process for marking a specific phrase or number on a plurality of semiconductor packages, the marking state It is a technical object of the present invention to provide a tray transfer type semiconductor package marking method and apparatus for selecting and recovering defective products by selecting and recovering defective products.

In order to achieve the above object, the present invention sequentially transfers one by one from the lowermost tray in an onloader stacker in which a plurality of trays in which a plurality of semiconductor packages are stacked are stacked, and thus prevision (OCR). Check the ID mark hole and LOT number of many semiconductor packages placed in the tray through the camera to check whether the semiconductor packages are placed in the correct direction and other kinds of semiconductor packages are placed in the tray. After transported to the vibrator installed under the marking device and clamped and clamped through the clamping device provided in the vibrator, a plurality of semiconductor packages tilted diagonally and placed in the tray by vibration are aligned to one side of the tray, and then Specific markings are marked on the surface of the semiconductor package by the marking device, and then air nozzles and dust collection. After the foreign matter generated during marking is removed by passing through the foreign material removal unit installed, the marking state of the semiconductor package is checked through a post vision camera, and then the marking defect detected by the post vision camera through a sorting device is sorted. Classify the semiconductor packages and replace them with good quality semiconductor packages. Then, the semiconductor packages are stacked on the unloader stacker. As the above operation is performed continuously, the marking operation is performed on the unloader stacker. The tray on which the completed semiconductor package is placed is stacked.

When a semiconductor package having a different direction and type from among a plurality of semiconductor packages placed in a tray is recognized by the prevision (OCR) camera, the location information of the semiconductor package is transmitted to a control device so that the semiconductor package has a wrong direction or a different type. There will be no marking on the

In addition, when the semiconductor package having a poor marking state of the semiconductor package is detected by the post vision camera, the location information is transmitted to the control device, and the sorting semiconductor package is collected and sorted by a sorting device. Will be replaced with the semiconductor package.

"또는 반대와 같이 이동하여 상기의 공정이 수행되도록 각 장치를 배치하여 장치의 규모를 최소화하였다.According to the present invention, a tray is moved according to the above-described operation procedure, and a system is constructed such that specific phrases and numbers are marked on a plurality of semiconductor packages placed in the tray.

"Or, each device was placed in such a way that the above process was performed to move in reverse, minimizing the scale of the device.

"와 같이 설치하였으며, 상기 레일(Rail)은 3개의 레일로 구성되며, 트레이공급부의 일측에 전후로 길게 설치된 레일을 제1레일이라 하며, 상기 제1레일의 후방 끝단부에 일정간격 이격되어 가로로 길게 설치된 레일을 제2레일이라 하며, 상기 제1레일과 대향되는 상기 제2레일의 끝단부에 제1레일과 평행하게 설치된 레일을 제3레일이라 한다.The present invention is a rail (Rail) to move the tray as described above "

"The rail (Rail) is composed of three rails, the rail is installed long in front and back on one side of the tray supply unit is called the first rail, the rear end of the first rail is spaced at a predetermined interval spaced horizontally A long rail is called a second rail, and a rail provided in parallel with the first rail at an end portion of the second rail opposite to the first rail is called a third rail.

Each of the rails is provided with a conveying means for conveying the tray, the tray supplied from the tray supply unit by the conveying means is conveyed along the first, second, and third rails and all the above processes are performed.

In addition, the first rail and the second rail, the second rail and the third rail, the current rail to which the tray is transported is different from each other rail (first rail-> second rail, second rail-> first Drawer to transfer by 3 rails) is installed,

The drawer has a space formed between the first rail and the second rail, the second rail and the third rail, and a plurality of drawers placed in the tray by shaking caused when the tray changes rails. The semiconductor package is configured so that the semiconductor package does not move by wrapping the entire upper part of the tray so that the semiconductor package does not move or break away. The cover surrounding the upper part of the tray surrounds the tray by moving up and down by an up-down cylinder. When the cover surrounds the tray, the tray is changed from the current rail to the next rail by a robot moving from side to side by a motor.

Looking at the arrangement of each device configured in the present invention, a plurality of trays are stacked, the on-loader stacker and tray elevator configured to supply sequentially from the tray located at the bottom of the stacked trays Is installed on the upper front end of the first rail,

Check the ID mark hole and the LOT number of the semiconductor package placed in the tray transported along the rail in the upper part of the center of the first rail, the semiconductor package is placed in the correct direction and the other type of semiconductor package Is equipped with a vision (OCR) camera to check

A first drawer is installed at one side of the first rail and the second rail in contact with the first rail to transfer the tray located on the first rail to the second rail.

Between the second rail, the first lifter, the semiconductor package aligning and tray clamping device, the second lifter and the third lifter are sequentially installed at a predetermined interval from right to left,

The laser marking device for marking a specific phrase and number on the semiconductor package is installed on the semiconductor package alignment and tray clamping device,

The upper part of the second lifter is provided with a foreign material removal device for removing foreign substances on the surface of the semiconductor package and foreign substances generated during laser marking.

A second drawer is installed at one side of the second rail and the third rail in contact with the tray to transfer the tray located at the second rail to the third rail.

The vision camera for checking the marking state of the semiconductor package placed in the tray transported along the rail is installed at the center upper portion of the third rail,

One side of the vision camera is provided with a sorter (Sorter) to remove the defective semiconductor package is not properly marked, to replace the semiconductor package of good quality,

An unloader stacker and a tray elevator in which a tray on which a marked semiconductor package is stacked are stacked are installed on an upper end of the front end of the third rail.

The lower side of the unloader stacker is provided with a sorter table for collecting a defective semiconductor package by the sorter and supplying a tray for supplying a good semiconductor package.

The sorter table receives a tray in which good semiconductor packages are placed from an unloader stacker, and an empty tray for collecting a defective semiconductor package is supplied manually, and a tray installed between the first rail and the third rail. By the transfer (Tray Transfer) to move to the bottom of the sorter (Sorter).

The control device for controlling all the above devices is installed on one side or both sides of the main body to monitor the operation state.

The present invention is designed to be automatically operated by the operation of the control device installed on the outside of the main body, the control program installed in the control device is manufactured in advance so that each device can operate in accordance with the process sequence core technology of the present invention Since this is not the specific description.

Hereinafter, the technical configuration of the present invention with reference to the drawings in more detail.

Figure 1 is a front detail view showing the appearance of the present invention, Figure 2 is a left side detail view showing the appearance of the present invention, Figure 3 is a right side detailed view showing the appearance of the present invention, Figure 4 is a plan view showing the appearance of the present invention 5 is a detailed plan view of the marking system according to the present invention, FIG. 6 is a front detail view of the marking system according to the present invention, FIG. 7 is a right side detailed view of the marking system according to the present invention, and FIG. Left detailed view of the marking system according to the present invention, FIG. 9 is a detailed plan view of the on-loader stacker according to the present invention, FIG. 10 is a detailed front view of the on-loader stacker according to the present invention, and FIG. 12 is a detailed plan view of the tray elevator according to the present invention, FIG. 13 is a front detail view of the tray elevator according to the present invention, and FIG. 14 is a plan view of the tray first transport means according to the present invention. Figure 15 shows a tray according to the present invention. 16 is a front detail view of the first transport means, FIG. 16 is a side detail view of the tray first transport means according to the present invention, FIG. 17 is a plan detail view of an orientation device according to the present invention, and FIG. 19 is a front detail view of an orientation device according to the present invention, FIG. 19 is a side detail view of an orientation device according to the present invention, FIG. 20 is a detailed view of a drawer plane according to the present invention, and FIG. Drawer front detail view according to the invention, Figure 22 is a drawer side detail view according to the present invention, Figure 23 is a detailed plan view of the second tray transport means according to the present invention, Figure 24 is the present invention A detailed side view of the second transport means of the tray according to the present invention, FIG. 25 is a detailed front view of the second transport means of the tray according to the present invention, FIG. 26 is a detailed plan view of the lifter according to the present invention, and FIG. Side detail view of the lifter, FIG. 28 is a front detail view of the lifter according to the present invention, FIG. 29 shows the foot 30 is a detailed plan view of the vibrator according to the present invention, FIG. 30 is a detailed side view of the vibrator according to the present invention, FIG. 31 is a detailed plan view of the clamping device according to the present invention, and FIG. 32 is a detailed side view of the clamping device according to the present invention. 33 is a detailed plan view of the foreign material removing apparatus according to the present invention, FIG. 34 is a side detail view of the foreign material removing apparatus according to the present invention, FIG. 35 is a front detail view of the foreign material removing apparatus according to the present invention, and FIG. Detailed view of the mesh provided in the foreign matter removing apparatus according to the present invention, FIG. 37 is a detailed plan view of the tray third transfer means according to the present invention, FIG. 38 is a detailed side view of the third transfer means of the tray according to the present invention, and FIG. A detailed plan view of the sorter according to the present invention, FIG. 40 is a front detail view of the sorter according to the present invention, FIG. 41 is a detailed side view of the sorter according to the present invention, and FIG. Detail view of the unloader stacker plane of the tray collection part, Figure 43 is a detailed plan view of the sorter table according to the present invention, Figure 44 is a front detail view of the sorter table according to the present invention, Figure 45 is a detailed side view of the sorter table according to the present invention, and Figure 46 is a sorter according to the present invention. Fig. 47 shows a detailed side view of the conveying means of the sorter table according to the present invention, and FIG. 47 shows a semiconductor package 1, a tray 2, an onloader stacker ( 10), tray stacking unit 11, separator cylinder 13, tray fixture 13 ', tray fixture 13a, tray elevator 20, cylinder 21, shaft 22), the first rail 30, the first tray feeder 40, the motor 41, the screw shaft 42, the tray support 43, the latch type fixture 44, the cylinder ( 45, clamping fixture 46, robot 50, vision (OCR) camera 51, light 52, motor 60, robot 61, upper and lower cylinder 62, tray cover panel 63 ), Tray Guide (64), Article 2 rail 70, first and third lifters 80 and 90, LM guide 71, LM block 72, motor 73, walking beam 74, walking beam tray guide 75, up-down Cylinder (81,91), Tray Support (82,92), Guide (83,93), Vibrator (100), Clamping Device (110), Laser Marking Device (120), Debris Removal Device (130), Air Nozzle 131, dust collector 132, mesh 133, cylinder 134, lifter 140, third rail 150, second tray feeder 160, third tray feeder 170, Robot 180, motor 181, vacuum suction port 182, tray supply unit (A), the first transfer means (B), the orientation device (C), the first drawer (D), 2 Transfer means (E), laser marking part (F), foreign substance removal part (G), second drawer (H), third transfer means (I), marking inspection device (J), sorter (K) ), A tray recovery portion L, a sorter table M, a table transfer means N, and a control device O. FIG.

1 to 4 show the appearance of the present invention, as shown, the control device (O) is installed on both sides or one side outside the main body, and a plurality of brigade transplant doors are installed.

In the tray transfer type semiconductor package marking system according to the present invention, as shown in FIGS. 5 to 8, a tray supply part A for supplying a tray 2 in which a plurality of semiconductor packages 1 are placed, and the tray supply part ID mark hole of the semiconductor package 1 placed in the first transfer means (B) for transferring the tray (2) supplied from (A) and the tray (2) transferred through the first transfer means (B) And an orientation device (C) for checking whether the semiconductor package 1 is placed in the correct direction and the other type of semiconductor package by checking the and LOT number, and the first transfer means. A first drawer (D) and a second conveying means (E) for conveying the tray (2) passing through the positioning device (C) through the (B) to the laser marking portion (F), and the second conveying means; After clamping and fixing the tray 2 conveyed by (E), the plurality of semiconductor packages 1 placed therein are aligned, and then the semiconductor package Laser marking portion (F) for marking a specific phrase on the surface of the paper (1), and installed behind the laser marking portion (F) passing through the laser marking portion (F) through the second transfer means (E) Marking the tray 2 passing through the foreign matter removing unit G and the foreign matter removing unit G for removing the foreign matter on the semiconductor package 1 on the tray 2 and the second transfer means E. Of the second drawer H and the third transfer means I to be transferred to the inspection apparatus J, and the semiconductor package 1 placed in the tray 2 transferred by the third transfer means I. A sorter for checking a marking state (J) and a sorting semiconductor device (1) installed on one side of the marking inspection device (J) to classify and replace the semiconductor package (1) with a good quality semiconductor package (1). A tray recovery portion L in which a sorter K and a tray 2 passing through the third transfer means I through a sorter K are stacked, and a lower portion of the tray recovery portion L. Installed on one side Er, a sorter table (M) for supplying an empty tray in which defective products classified by the sorter (K) are placed, a tray in which a semiconductor package of good quality supplied from the tray recovery unit (L) is placed; It consists of a table feed means (N) for transferring the sorter table (M) to the lower portion of the sorter (Sorter) (K), and a control device (O) for controlling the respective devices,

The tray supply unit (A) is installed on the on-loader stacker (10) stacking the tray (2) in which a plurality of semiconductor packages (1) are stacked, and the lower part of the on-loader stacker (10) It consists of a tray elevator (20) for supplying a tray located in the lowermost of the trays stacked on the on-loader stacker (10) to the transfer device.

9 to 11, the on-loader stacker 10 is provided with two tray stacking portions 11 in which a plurality of trays 2 are stacked on the left and right sides, and the tray stacking portion 11 is provided. A plurality of trays are to be stacked in, and is configured to move left and right by a cylinder 12 installed in a horizontal direction on one front side,

Each of the tray stacking units 11 is provided with two separator cylinders 13, and a tray tray 13a of the separator cylinder 13 is disposed at the lowermost part when a plurality of trays 2 are stacked. The plurality of trays 2 are configured to be stacked by being fitted in the grooves 2a formed on the left and right sides of (2).

The tray elevator 20 is configured such that the shaft 22 moves up and down by two cylinders 21 as shown in FIGS. 12 and 13, and the shaft 22 is raised when the tray is supplied. To support the stacked tray on the on-loader stacker (10),

When the tray fixing tool 13a of the separator cylinder 13 is removed from the groove of the lowermost tray 2, the shaft 22 is lowered at a predetermined interval so that the next lower tray 2 is the tray of the separator cylinder 13. It is comprised so that it may be fixed by the fixture 13a, and then it will continue to descend and take over the lowermost tray 2 to the 1st conveyance means B. As shown in FIG.

As shown in FIGS. 14 to 16, the first transfer means B includes a first rail 30 extending from a lower portion of the tray supply part A to a lower portion of the first drawer D, and the first transfer means. The tray 2 formed between the rails 30 and supplied by the tray elevator 20 is transferred to the orientation device C, and then transferred to the lower part of the first drawer D. Consists of the first tray feeder 40,

The first tray feeder 40 includes a motor 41 installed at one end of the first rail 30, a screw shaft 42 which is rotated forward and backward by the motor 41, and the screw shaft 42. A tray set 43 coupled to the tray settled, a latch type fastener 44 formed on one side of the set 43, and a cylinder on the tile side on which the fastener 44 is formed. 45) and a clamping fixture 46 for clamping the tray.

When the tray is settled in the first tray feeder 40, the screw shaft 42 and the first by the operation of the motor 41 in the state of being fixed by the latch-type fixture 44 and the clamping fixture 46, One rail 30 is moved toward the orientation device C. As shown in FIG.

As illustrated in FIGS. 17 to 19, the orientation device C is installed on the center of the first rail 30 and is transferred to the tray 2 through the first transfer means B. FIG. Check the ID mark hole and LOT number of the semiconductor package 1 placed in the package) to check whether the semiconductor package 1 is placed in the correct direction and the other type of semiconductor package is placed in the tray 2. To transmit the position information of the abnormal semiconductor package to the control device (O),

Looking at the structure, the robot 50 is moved left and right by the servo motor, connected to the robot 50 and moved to the left and right together with the robot 50, the ID mark hole and LOT number of the semiconductor package 1 By checking, it is checked whether the semiconductor package 1 is placed in the correct direction in the tray 2, and whether other types of semiconductor packages are placed, and the position information of the abnormal semiconductor package is sent to the control device O. It consists of a vision (OCR) camera 51 to transmit, and the light 52 formed in the lower part of the said vision (OCR) camera 51.

The first drawer (D) is a device for transferring the tray 2 from the first transfer means (B) to the second transfer means (E), as shown in Figs. 20 to 22, the motor 60 The robot 61 moving to the left and right by, the upper and lower cylinders 62 connected to the robot 61, the tray cover panel 63 and the tray cover panel 63 connected to the upper and lower cylinders 62, Consists of the tray guide 64 formed on the corners on both sides, the inner surface of the tray cover panel 63 is sanded to form a projection.

The tray cover panel 63 is sanded on the inner surface of the tray cover panel 63 to be in contact with the semiconductor package placed in the tray, so that the tray cover panel 63 is not attached to the tray cover panel 63 or static electricity is generated.

As shown in FIGS. 23 to 25, the second transfer means E transfers the tray 2 transferred through the first drawer D to the laser marking part F and the foreign matter removing part G. To serve as

Looking at the technical configuration, the first rail 30 is installed at the front and rear ends of the second rail 70 and the longitudinally spaced apart at regular intervals on the right end of the first rail 30, the second rail 70 is installed in the first drawer First and third lifters 80 and 90 positioned under the lower portion D and the second drawer H, the LM guide 71 provided inside the second rail 70, and the LM guide. Composed by the LM block 72 to the 71 and consists of a working beam 74 is moved back and forth along the LM guide 71 by the operation of the motor 73,

The working beam 74 is formed to extend from the first lifter 80 to the foreign matter removing unit G, and three pairs of the walking beam tray guides 75 are formed on the upper part and spaced apart from each other by a predetermined interval.

As illustrated in FIGS. 26 and 28, the first and third lifters 80 and 90 are configured such that tray trays 82 and 92 in which trays are placed by the up and down cylinders 81 and 91 are moved up and down. Guides 83 and 93 are provided on both sides of the tray set.

The tray placed in the first lifter 80, the laser marking part F and the foreign matter removing part G is placed in the working beam tray guide 75 of the working beam 74, and thus, the first lifter 80. In the tray placed in the laser marking portion (F), the tray located in the laser marking portion (F) is transferred to the foreign matter removing portion (G), the tray placed in the foreign matter removing portion (G) is transferred to the second lifter (90). Will be.

The laser marking unit F is installed at a rear of the first lifter 80 at a predetermined interval, and includes a vibrator 100 having a clamping device 110 for clamping and fixing a tray, and the vibrator 100. Is installed on the upper portion of the semiconductor package is placed on the surface of the laser marking device 120 for marking a specific phrase on the surface of the package,

The vibrator 100 is installed on a diagonal line as shown in FIGS. 29 to 32, and is coupled to two screw shafts 103 and 104 rotated by the motors 101 and 102 and the two screw shafts 103 and 104. A plate 105 and a clamping device 110 installed below the plate 105 and configured to clamp a tray placed on the plate 105 by operating the clamp member 112 by the clamp cylinder 111. The plate 105 is rotated by one side hingedly coupled to the screw shaft 103, the other side is fixed to the screw shaft 104.

The vibrator 100 operates the motors 101 and 102 to control the heights of the two screw shafts 103 and 104 so that the plate 105 is tilted, and then vibrates to package the semiconductor package of the tray placed on the plate 105. Align it.

The laser marking apparatus 120 uses a conventional laser marking apparatus, and marks a specific word on the surface of the semiconductor package aligned through the vibrator 100.

33 to 36, the foreign matter removing unit G is provided with the same lifter 140 as the first and third lifters 80 and 90 at the lower portion, and the foreign substance of the semiconductor packager at the upper portion thereof. The air nozzle 131 and the dust collector 132 are formed integrally with each other, and the foreign matter removing device 130 is formed. The semiconductor package placed in the tray is provided at the lower portion of the foreign matter removing device 130. Mesh (133) is formed so as not to move or escape when removing the foreign matter by.

The debris removal device 130 is coupled to the cylinder 134 and moved back and forth, and removes debris in the semiconductor package placed in the tray, the mesh 133 is on the upper portion of the tray when the lifter 140 is raised The semiconductor package is fixed.

The second drawer (H) is the same as the technical configuration of the first drawer (D), and transfers the tray 2 from the second transfer means (E) to the third transfer means (I).

As shown in FIGS. 37 and 38, the third transfer means I includes a third rail 150 extending from the lower portion of the second drawer H to the lower portion of the tray recovery portion L, and A second tray feeder 160 formed between the third rails 150 to transfer the tray transferred through the second drawer H to the marking inspection apparatus J, and the second tray feeder ( It is composed of a third tray feeder 170 for transferring the tray passing through the marking inspection device (J) to the sorter (K) and the tray recovery portion (L) through 160,

The second and third tray feeders 160 and 170 have the same technical configuration as the first tray feeder.

The marking inspection apparatus J is installed on the upper portion of the center of the third rail 150 to check the marking state of the marked semiconductor package, and transmit the position information of the defective semiconductor package, which is poorly marked, to the control device O. The structure of the device is the same as the orientation device (C).

39 through 41, the sorter K is installed on one side of the marking inspection apparatus J to classify the semiconductor package 1 having a poor marking state to classify a good semiconductor package ( 1), a device for replacing the robot 180 is moved to the left and right by the motor, and the vacuum suction port 182 is coupled to the robot 180, configured to move up and down by the motor 181 The lower part of the vacuum suction port 182 is formed of a rubber pad.

As shown in FIG. 42, the tray recovery part L is stacked with a tray 2 passing through a sorter K through the third transfer means I. Same as A).

However, the tray loading part on the left side of the loader stack simply latches the tray holder 13 'instead of the separator cylinder 13 because the tray transferred through the third transfer means I is loaded. The tray loading part on the right side is the same as the tray supply part (A).

The sorter table (M) is installed on one side of the lower portion of the tray recovery unit (L), the empty tray in which defective products classified by the sorter (Sorter) (K) is placed, and received from the tray recovery unit (L) It is used as a means to supply a tray containing a good semiconductor package,

As shown in FIGS. 43 and 45, the sorter table M includes a settling unit 190 in which a tray 1 in which a good semiconductor package supplied from the tray collection unit L is placed is placed, and a bin. The settled portion 191 in which the tray is placed is divided, and a plurality of tray fixing devices 192 for fixing the trays settled in the settled portions 190 and 191 are provided.

46 and 47, the table conveying means (N), like the first tray conveying means (A), the motor 200 formed between the rail 200 and the rail 200, It consists of a screw shaft 202 is rotated by the motor 201, the table conveying means (N) is coupled to the screw shaft 202 by a coupling block 203 by the operation of the motor the sorter table ( M) is transferred to the bottom of the sorter (K).

Looking at the operation of the semiconductor package marking system according to the present invention,

When operating the system by operating the control device (O) installed on the outside of the main body, the cylinder 21 of the tray elevator (20) installed in the lower part of the on-loader stacker 10 is operated to the shaft 22 Is raised to support the tray 2 stacked on the on-loader stacker 10, and at the same time, the separator cylinder 13 provided on the on-loader stacker 10 operates to operate the tray fixture 13a. Is removed from the groove of the lowermost tray (2).

At this time, the shaft 22 is lowered at regular intervals so that the next lower tray 2 is fixed by the tray fixing tool 13a of the separator cylinder 13, and then lowered continuously to lower the lower tray 2. The tray 2 is turned over to the tray feeder 40, and the transferred tray 2 is fixed by the latch type fastener 44 and the clamping fixture 46 of the first tray feeder 40. By the operation of the (41) is passed along the screw shaft 42 and the first rail 30 through the orientation device (C) to the lower portion of the first drawer (D).

When the tray passes through the orientation device C by the first tray transport device 40, the prevision camera 51 of the orientation device C moves left and right by the robot 50. The ID mark hole and the LOT number of the semiconductor package 1 placed in the transferred tray 2 are checked to determine whether the semiconductor package 1 is placed in the correct direction in the tray 2. It is checked whether the package is placed, and if an abnormal semiconductor package is found, the position information is transmitted to the control device O.

After the tray has passed through the orientation device C by the first tray feeder 40, the tray is positioned under the tray cover panel 63 of the first drawer D. The upper and lower cylinders 62 of the drawer D are operated to lower the tray cover panel 63 to cover the trays, and then the first lifter 80 of the second transfer means E by the robot 61. After transferring to. The upper and lower cylinders 62 are operated to raise the tray cover panel 63 to take over the tray to the first lifter 80 of the second transfer means E.

The first lifter 80 which has taken over the tray is lowered by the up-down cylinder 81, and when the tray is placed in the working beam tray guide 75 of the working beam 74, the working beam 74 operates. The tray is transferred to the laser marking part (F).

When the tray is transferred to the laser marking part F, the clamping device 110 installed at the lower side is operated to fix the tray, and then the vibrator 100 is operated to incline the tray to one side, and then vibrate so that the semiconductor package is vibrated. After alignment to one side of the tray, the laser marking device 120 is operated to mark a specific phrase on the surface of the semiconductor package placed in the tray.

When the marking operation is completed and the clamping of the tray is released and transferred to the foreign matter removing unit G by the working beam 74, the lifter 140 installed at the lower portion of the foreign matter removing unit G rises. The tray is in contact with the mesh 133 formed on the foreign matter removing apparatus 130. At this time, the debris removal device 130 in which the air nozzle 131 and the dust collecting device 132 are integrally operated is operated, and the debris removing device 130 moves to the left or right by a cylinder or a robot, and removes the debris from the semiconductor package. Remove it.

When the removal of the foreign matter is completed, the lifter 140 is lowered and the tray is placed in the working beam tray guide 75 of the working beam 74 and transferred to the third lifter 90, and then the second drawer H By the second tray feeder 160.

The tray is transferred to the marking inspection apparatus J by the second tray feeder 160, and then the marking state of the semiconductor package is checked by a post vision camera of the marking inspection apparatus J. The location information of a bad semiconductor package, which is wrong, is transmitted to the control device O.

Next, the tray having passed through the marking inspection apparatus J is transferred to the sorter K by the third tray feeder 170, and then the semiconductor package having the incorrect marking is sorted by the sorter K. After vacuum suction by the vacuum suction port 182 of the ()) is transferred to the empty tray placed in the sorter table (M), it is replaced with a good quality semiconductor package placed in the sorter table (M).

The vacuum suction port 182 is moved between the third tray feeder 170 and the sorter table M by the robot 180, and is lowered by the motor 181 when the semiconductor package is vacuum suctioned. .

When the sorting process is completed as described above, the tray is transferred to the lower portion of the tray recovery portion L by the third tray transfer device 170 and then stacked on the unloader stacker of the tray recovery portion L.

As the above process is performed continuously, a quick marking operation is performed.

As described above, the present invention transfers a tray in which a plurality of semiconductor packages are placed, and can quickly perform a marking process for marking a specific phrase or number on a plurality of semiconductor packages, and selects a defective product by checking a marked state. It is possible to provide a semiconductor package of good quality by recovering, thereby increasing the productivity and minimizing the defective rate.

Claims (12)

In a tray transfer type semiconductor package marking system, a tray supply unit (A) for supplying a tray (2) in which a plurality of semiconductor packages (1) is placed, and a tray (2) supplied from the tray supply unit (A) The semiconductor package 1 checks the ID mark hole and the LOT number of the semiconductor package 1 placed in the first transfer means B and the tray 2 transferred through the first transfer means B. Orientation device (C) for inspecting whether the semiconductor package is placed in the correct direction and other types of semiconductor package and the first device (B) through the orientation device (C) Clamping the first drawer (D) and the second conveying means (E) for transferring the tray 2 to the laser marking portion (F), and the tray (2) conveyed by the second conveying means (E) After fixing, the plurality of semiconductor packages 1 placed therein are aligned, and then a label for marking a specific text on the surface of the semiconductor package 1. Buried in the semiconductor package 1 on the tray 2, which is installed behind the laser marking part F and the laser marking part F, and has passed through the laser marking part F through the second transfer means E. The second drawer for transferring the foreign matter removal unit (G) for removing the foreign matter and the tray (2) passing through the foreign matter removal unit (G) through the second transfer means (E) to the marking inspection device (J). (H) and the third transfer means (I), and the marking inspection apparatus (J) for checking the marking state of the semiconductor package (1) placed in the tray (2) conveyed by the third transfer means (I); And a sorter (K) installed on one side of the marking inspection device (J) to classify the semiconductor package 1 having a poor marking state and replace the semiconductor package 1 with a good semiconductor package 1, and the third transfer means. A tray recovery portion L in which the tray 2 passing through I through the sorter K is stacked, and a lower side of the tray recovery portion L is provided, and the sorter K Classified by) A sorter table (M) for supplying an empty tray in which defective products are placed, a tray in which a semiconductor package of good products supplied from the tray recovery unit (L) is placed, and the sorter table (M) are sorted by the sorter (K). Tray transfer type semiconductor package marking system, characterized in that consisting of a table conveying means (N) for conveying to the bottom of the) and a control device (O) for controlling the respective devices. According to claim 1, wherein the tray supply unit (A) is an on-loader stacker (Onloader Stacker) (10) on which a stack of trays 2, a plurality of semiconductor packages (1) are stacked, and the on-loader stacker 10 It is installed in the lower portion of the tray stacked on the on-loader stacker 10 consists of a tray elevator (Tray Elevator) (20) for supplying a transfer device, The on-loader stacker 10 is provided with two tray stacking portions 11 in which a plurality of trays 2 are stacked on the left and right sides thereof, so that a plurality of trays are stacked on the tray stacking portion 11 and one front side thereof. It is configured to move left and right by the cylinder 12 installed in the horizontal direction, and the separator cylinder 13 for fixing the tray is provided on the left and right sides of the tray stacking portion 11, The tray elevator 20 is configured such that the shaft 22 is moved up and down by two cylinders 21, and the shaft 22 is raised when the tray is supplied and stacked on the on-loader stacker 10. When the tray is fixed 13a of the separator cylinder 13 is removed from the groove of the lower tray 2, the shaft 22 is lowered at regular intervals so that the next lower tray 2 The tray transfer type semiconductor, characterized in that configured to be fixed by the tray fixing tool (13a) of the separator cylinder 13, and then continue to descend to take over the lowermost tray (2) to the first transfer means (B). Package marking system. The method of claim 1, wherein the first transfer means (B) is a first rail 30 formed to extend from the lower portion of the tray supply portion (A) to the lower portion of the first drawer (D), and the first rail (30) A first tray feed formed between the trays 2 and the trays 2 supplied by the tray elevator 20 to the orientation device C, and then to the lower part of the first drawer D; Device 40, The first tray feeder 40 includes a motor 41 installed at one end of the first rail 30, a screw shaft 42 which is rotated forward and backward by the motor 41, and the screw shaft 42. A tray set 43 coupled to the tray settled, a latch type fastener 44 formed on one side of the set 43, and a cylinder on the tile side on which the fastener 44 is formed. A tray conveying semiconductor package marking system, characterized in that it comprises a clamping fixture (46) for clamping the tray by means of (45). According to claim 1, wherein the orientation device (C) is connected to the robot 50 and the robot 50, which is moved left and right by a servo motor is moved to the left and right together with the robot 50, By checking the ID mark hole and the LOT number of the semiconductor package 1, it is checked whether the semiconductor package 1 is placed in the correct direction in the tray 2 and whether there are other kinds of semiconductor packages. Vision (OCR) camera 51 for transmitting the position information of the semiconductor package to the control device (O), and the light (52) formed in the lower portion of the vision (OCR) camera 51 Tray transfer semiconductor package marking system. According to claim 1, The first drawer (D) is a device for transferring the tray 2 from the first transfer means (B) to the second transfer means (E), which is moved left and right by the motor (60) The robot 61, the upper and lower cylinders 62 connected to the robot 61, and the upper and lower cylinders 62 are connected to the tray cover panel 63 and the tray cover panel 63 at edges on both sides of the tray cover panel 63. The tray guide 64 is formed, the inner surface of the tray cover panel 63 is a tray transfer type semiconductor package marking system, characterized in that the projection is formed by sanding process. According to claim 1, The second conveying means (E) is a second rail (70) which is installed long before and after spaced apart at regular intervals on the right end of the first rail 30, and the front and rear of the second rail (70) First and third lifters 80 and 90 which are installed at an end portion and are disposed below the first drawer D and the second drawer H, and are installed inside the second rail 70. LM guide 71 and the working beam 74 is coupled to the LM guide 71 by the LM block 72 and moved back and forth along the LM guide 71 by the operation of the motor 73 , The working beam 74 is formed to extend from the first lifter 80 to the foreign matter removing unit G, and three pairs of the walking beam tray guides 75 are formed on the upper part and spaced apart from each other by a predetermined interval. The first and third lifters 80 and 90 are configured to move up and down the tray supports 82 and 92 in which the trays are placed by the up-down cylinders 81 and 91. Tray transfer semiconductor package marking system characterized in that the 83,93) is installed. The vibrator 100 of claim 1, wherein the laser marking part F is installed at a predetermined interval behind the first lifter 80, and has a clamping device 110 for clamping and fixing a tray. Is composed of a conventional laser marking device 120 is installed on top of the vibrator 100 to mark a specific phrase on the surface of the semiconductor package placed in the tray, The vibrator 100 is installed on a diagonal line, two screw shafts 103 and 104 rotated by the motors 101 and 102, a plate 105 coupled to the two screw shafts 103 and 104, and the plate 105. It is installed in the lower portion of the clamp member 111 by the clamp cylinder 111 is composed of a clamping device 110 for clamping the tray placed in the plate 105, the plate 105 is one side The screw shaft 103 is rotated by a hinge coupled to the link, the other side is a tray transfer type semiconductor package marking system, characterized in that fixed to the screw shaft (104). According to claim 1, The foreign material removing unit (G) is the same as the first, the third lifter (80, 90) lifter 140 is installed in the lower, the upper air nozzle for removing the foreign matter of the semiconductor package 131 and the dust collecting device 132 is formed integrally with the foreign material removing device 130 is installed, the lower portion of the foreign material removing device 130, the semiconductor package placed in the tray to remove the foreign matter by the air nozzle 131 Mesh 133 is formed so as not to move or break during The foreign material removal device 130 is coupled to the cylinder 134 is moved back and forth, tray transport type semiconductor package marking system, characterized in that configured to remove the foreign matter of the semiconductor package placed in the tray. The method of claim 1, wherein the third transfer means (I) is a third rail 150 formed to extend from the lower portion of the second drawer (H) to the lower portion of the tray recovery portion (L), and the third rail ( 150 formed between the second tray feeder 160 for transferring the tray conveyed through the second drawer (H) to the marking inspection device (J), and through the second tray feeder 160 Tray transfer type semiconductor package, characterized in that consisting of a third tray transfer device 170 for transferring the tray passing through the marking inspection device (J) to the sorter (K) and the tray recovery portion (L) Marking system. According to claim 1, wherein the sorter (Sorter) (K) is installed on one side of the marking inspection device (J) to classify the semiconductor package (1) of poor marking state to replace with a good semiconductor package (1) An apparatus, comprising: a robot 180 moved left and right by a motor, and a vacuum suction port 182 coupled to the robot 180 and configured to move up and down by a motor 181, wherein the vacuum suction port The lower portion of the (182) is a tray transfer type semiconductor package marking system, characterized in that formed by a rubber pad. The sorter of claim 1, wherein the sorter table (M) includes a settling portion (190) on which a tray (1) on which a semiconductor package of good quality supplied from a tray collection portion (L) is placed, and a settling portion on which an empty tray is placed 191 is divided, the tray transfer type semiconductor package marking system, characterized in that a plurality of tray fixing device 192 for fixing the tray is placed in the settled portion (190,191). In the tray transfer type semiconductor package marking method, an Onloader Stacker, in which a plurality of trays in which a plurality of semiconductor packages are stacked, is sequentially transferred from the lowermost tray one by one to prevision (OCR). Check the ID mark hole and LOT number of the many semiconductor packages placed in the tray through the camera, and check whether the semiconductor packages are placed in the correct direction and other kinds of semiconductor packages are placed in the tray. After being transferred to the vibrator installed under the laser marking device and clamped and clamped through the clamping device provided in the vibrator, the plurality of semiconductor packages tilted diagonally and placed in the tray by vibration are aligned to one side of the tray. Specific words are marked on the surface of the semiconductor package by the laser marking device, and then After removing the foreign substances generated during marking by passing through the foreign substance removing unit equipped with the nozzle and the dust collector, the marking state of the semiconductor package is checked through a post vision camera, and then detected by the post vision camera through a sorting device. Classify the semiconductor package of the defective marking and replace it with a good quality semiconductor package, and then stack it on an unloader stacker. The above operation is continuously performed to the unloader stacker. A tray transfer type semiconductor package marking method, characterized in that the marking operation is completed so that the tray on which the semiconductor package is placed.

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