KR100553194B1 - Lpcvd 장치 및 박막 제조방법 - Google Patents
Lpcvd 장치 및 박막 제조방법 Download PDFInfo
- Publication number
- KR100553194B1 KR100553194B1 KR1020020067651A KR20020067651A KR100553194B1 KR 100553194 B1 KR100553194 B1 KR 100553194B1 KR 1020020067651 A KR1020020067651 A KR 1020020067651A KR 20020067651 A KR20020067651 A KR 20020067651A KR 100553194 B1 KR100553194 B1 KR 100553194B1
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- South Korea
- Prior art keywords
- trap
- reactor
- raw material
- thin film
- pressure
- Prior art date
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- 239000010409 thin film Substances 0.000 title claims abstract description 40
- 238000004518 low pressure chemical vapour deposition Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000002994 raw material Substances 0.000 claims abstract description 52
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims abstract description 5
- 230000008016 vaporization Effects 0.000 claims abstract description 4
- 230000001105 regulatory effect Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 150000002902 organometallic compounds Chemical class 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 abstract description 13
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052707 ruthenium Inorganic materials 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 20
- 239000000945 filler Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000011084 recovery Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- OXJUCLBTTSNHOF-UHFFFAOYSA-N 5-ethylcyclopenta-1,3-diene;ruthenium(2+) Chemical compound [Ru+2].CC[C-]1C=CC=C1.CC[C-]1C=CC=C1 OXJUCLBTTSNHOF-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (8)
- 원료가 되는 유기 금속화합물을 수용하는 용기체(container)와, 상기 용기체를 가열하는 것에 의해 상기 유기 금속화합물을 기화시켜서 원료가스로 하는 가열수단과, 박막을 석출시키는 기판을 수용하는 반응기와, 상기 반응기를 저압분위기로 하기 위한 배기펌프와, 상기 반응기로부터의 사용이 끝난 상기 원료가스를 냉각하는 트랩(trap)을 포함하는 L P C V D 장치에 있어서,상기 트랩은, 사용이 끝난 원료가 흐르는 유로에 설치되고 복수의 구멍이 길이 방향으로 관통되도록 형성되어 벌집 형태로 형성된 통체를 구비하는 것을 특징으로 하는 L P C V D 장치.
- 제 1항에 있어서,상기 통체는, 길이가 사용이 끝난 원료의 흐름방향으로 0.01 ∼ 5.0 m 인 것을 특징으로 하는 L P C V D 장치.
- 제 1항에 있어서,상기 통체는, 구멍의 직경이 0.5 ∼ 50 mm인 것을 특징으로 하는 L P C V D 장치.
- 제 1항에 있어서,상기 트랩은, 그 상류에 설치되어 상기 트랩 내에 있는 사용이 끝난 원료의 역류를 방지하는 역류방지밸브를 구비하는 것을 특징으로 하는 L P C V D 장치.
- 제 1항에 있어서,상기 트랩이 상기 배기펌프의 상류쪽에 위치하고, 상기 트랩과 상기 배기펌프의 사이에, 상기 트랩의 내압을 조절하는 트랩 압력조절밸브를 구비하는 것을 특징으로 하는 L P C V D 장치.
- 제 1항에 있어서,상기 트랩이 상기 배기펌프의 상류쪽에 위치하고, 상기 반응기와 상기 트랩을 접속하는 배관과 상기 트랩과 상기 배기펌프를 접속하는 상기 배관에 접속되고, 상기 트랩을 바이패스하는 바이패스관을 구비하는 것을 특징으로 하는 L P C V D 장치.
- 제 6항에 있어서,상기 바이패스관은, 그 양단에 역류방지밸브를 구비하는 것을 특징으로 하는 L P C V D 장치.
- 제 1항 내지 제 7항 중 어느 한항에 기재한 L P C V D 장치를 사용한 박막 제조방법에 있어서,트랩의 내압을 반응기의 내압 이하로 유지하여 박막을 제조하는 것을 특징으 로 하는 박막 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2001386983 | 2001-12-20 | ||
JPJP-P-2001-00386983 | 2001-12-20 |
Publications (2)
Publication Number | Publication Date |
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KR20030052240A KR20030052240A (ko) | 2003-06-26 |
KR100553194B1 true KR100553194B1 (ko) | 2006-02-22 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020020067651A KR100553194B1 (ko) | 2001-12-20 | 2002-11-02 | Lpcvd 장치 및 박막 제조방법 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5254279B2 (ja) * | 2010-06-29 | 2013-08-07 | 東京エレクトロン株式会社 | トラップ装置及び基板処理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08124863A (ja) * | 1994-10-27 | 1996-05-17 | Hitachi Ltd | 熱反応処理装置 |
KR19980063312A (ko) * | 1996-05-23 | 1998-10-07 | 마에다시게루 | 배출 시스템 |
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2002
- 2002-11-02 KR KR1020020067651A patent/KR100553194B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08124863A (ja) * | 1994-10-27 | 1996-05-17 | Hitachi Ltd | 熱反応処理装置 |
KR19980063312A (ko) * | 1996-05-23 | 1998-10-07 | 마에다시게루 | 배출 시스템 |
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