KR100544324B1 - 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법및 나노 전자소자 - Google Patents
실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법및 나노 전자소자 Download PDFInfo
- Publication number
- KR100544324B1 KR100544324B1 KR1020030046517A KR20030046517A KR100544324B1 KR 100544324 B1 KR100544324 B1 KR 100544324B1 KR 1020030046517 A KR1020030046517 A KR 1020030046517A KR 20030046517 A KR20030046517 A KR 20030046517A KR 100544324 B1 KR100544324 B1 KR 100544324B1
- Authority
- KR
- South Korea
- Prior art keywords
- gate
- oxide
- cylinder
- coated
- forming
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000002070 nanowire Substances 0.000 claims abstract description 44
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 35
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 26
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 11
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
- 229910004140 HfO Inorganic materials 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 229910003465 moissanite Inorganic materials 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000010408 film Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000002071 nanotube Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 238000005329 nanolithography Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02606—Nanotubes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (10)
- 실리콘(Si) 기판 상부에 형성된 전극사이에 연결된 나노선 상부에 원자층 증착방법을 사용하여 균일하게 산화물을 코팅하여 실린더 형태의 게이트 물질을 형성하는 과정; 및상기 산화물이 코팅된 반도체 나노선 상부에 금속을 증착시켜 게이트를 형성하는 과정;으로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법.
- 제 1 항에 있어서, 상기 반도체 나노선은,Si, Ge, GaN, InP, GaAs, GaP, Si3N4, SiO2, SiC, ZnO 및 Ga2O 3 중 어느 하나의 성분으로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법.
- 실리콘(Si) 기판 상부에 형성된 전극사이에 연결된 탄소나노튜브(CNT) 상부에 원자층 증착방법을 사용하여 균일하게 산화물을 코팅하여 실린더 형태의 게이트 물질을 형성하는 과정; 및상기 산화물이 코팅된 탄소나노튜브(CNT) 상부에 금속을 증착시켜 게이트를 형성하는 과정;으로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법.
- 실리콘(Si) 기판 상부에 형성된 전극사이에 연결된 유기튜브 상부에 원자층 증착방법을 사용하여 균일하게 산화물을 코팅하여 실린더 형태의 게이트 물질을 형성하는 과정; 및상기 산화물이 코팅된 유기튜브 상부에 금속을 증착시켜 게이트를 형성하는 과정;으로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법.
- 제 1 항 또는 제 3 항 또는 제 4 항에 있어서, 상기 산화물은,Al2O3, TiO2, HfO2, ZrO2, ZnO, SiO2, Ta2O3 중 하나의 물질로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법.
- 실리콘(Si) 기판 상부에 형성된 복수의 전극과,원자층 증착방법에 의해 산화물이 상부에 균일하게 코팅되어 실린더 형태를 이루며, 상기 복수의 전극을 상호 연결시키는 반도체 나노선과,상기 산화물이 코팅된 반도체 나노선 상부에 금속을 증착시켜 형성된 게이트,로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자.
- 제 6 항에 있어서, 상기 반도체 나노선은,Si, Ge, GaN, InP, GaAs, GaP, Si3N4, SiO2, SiC, ZnO 및 Ga2O3 중 어느 하나의 성분으로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자.
- 실리콘(Si) 기판 상부에 형성된 복수의 전극과,원자층 증착방법에 의해 산화물이 상부에 균일하게 코팅되어 실린더 형태를 이루며, 상기 복수의 전극을 상호 연결시키는 탄소나노튜브(CNT)와,상기 산화물이 코팅된 탄소나노튜브(CNT) 상부에 금속을 증착시켜 형성된 게이트,로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자.
- 실리콘(Si) 기판 상부에 형성된 복수의 전극과,원자층 증착방법에 의해 산화물이 상부에 균일하게 코팅되어 실린더 형태를 이루며, 상기 복수의 전극을 상호 연결시키는 유기튜브와,상기 산화물이 코팅된 유기튜브 상부에 금속을 증착시켜 형성된 게이트,로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자.
- 제 6 항 또는 제 8 항 또는 제 9 항에 있어서, 상기 산화물은,Al2O3, TiO2, HfO2, ZrO2, ZnO, SiO2, Ta2O3 중 하나의 물질로 이루어진 것을 특징으로 하는 실린더 형태의 게이트를 갖는 나노 전자소자.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030046517A KR100544324B1 (ko) | 2003-07-09 | 2003-07-09 | 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법및 나노 전자소자 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030046517A KR100544324B1 (ko) | 2003-07-09 | 2003-07-09 | 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법및 나노 전자소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050006634A KR20050006634A (ko) | 2005-01-17 |
KR100544324B1 true KR100544324B1 (ko) | 2006-01-23 |
Family
ID=37220419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030046517A KR100544324B1 (ko) | 2003-07-09 | 2003-07-09 | 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법및 나노 전자소자 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100544324B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7803675B2 (en) | 2006-10-02 | 2010-09-28 | Samsung Electronics Co., Ltd. | Gate-all-around type semiconductor device and method of manufacturing the same |
KR100996100B1 (ko) * | 2008-07-01 | 2010-11-22 | 경북대학교 산학협력단 | 나노입자를 사용한 전자소자 제조방법과 이를 위한베이스템플릿 및 이에 의해 제조된 전자소자 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100647330B1 (ko) * | 2004-10-13 | 2006-11-23 | 삼성전자주식회사 | 캐리어 트래핑 물질을 구비한 유니폴라 나노튜브트랜지스터 및 그 제조방법 |
KR100755367B1 (ko) | 2005-06-08 | 2007-09-04 | 삼성전자주식회사 | 실린더형 게이트를 갖는 나노-라인 반도체 소자 및 그제조방법 |
KR100618900B1 (ko) | 2005-06-13 | 2006-09-01 | 삼성전자주식회사 | 다중 채널을 갖는 모스 전계효과 트랜지스터의 제조방법 및그에 따라 제조된 다중 채널을 갖는 모스 전계효과트랜지스터 |
KR100757328B1 (ko) | 2006-10-04 | 2007-09-11 | 삼성전자주식회사 | 단전자 트랜지스터 및 그 제조 방법 |
-
2003
- 2003-07-09 KR KR1020030046517A patent/KR100544324B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7803675B2 (en) | 2006-10-02 | 2010-09-28 | Samsung Electronics Co., Ltd. | Gate-all-around type semiconductor device and method of manufacturing the same |
US8395218B2 (en) | 2006-10-02 | 2013-03-12 | Samsung Electronics Co., Ltd. | Gate-all-around type semiconductor device and method of manufacturing the same |
KR100996100B1 (ko) * | 2008-07-01 | 2010-11-22 | 경북대학교 산학협력단 | 나노입자를 사용한 전자소자 제조방법과 이를 위한베이스템플릿 및 이에 의해 제조된 전자소자 |
Also Published As
Publication number | Publication date |
---|---|
KR20050006634A (ko) | 2005-01-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI463654B (zh) | 奈米管/奈米導線場效電晶體之自行對準製程 | |
Chai et al. | Low-resistance electrical contact to carbon nanotubes with graphitic interfacial layer | |
EP2586744B1 (en) | Nanostructure and precursor formation on conducting substrate | |
Wang et al. | Field-effect transistors based on two-dimensional materials for logic applications | |
US7709827B2 (en) | Vertically integrated field-effect transistor having a nanostructure therein | |
US8951609B2 (en) | CNT devices, low-temperature fabrication of CNT and CNT photo-resists | |
JP2002118248A (ja) | カーボンナノチューブの水平成長方法及びこれを利用した電界効果トランジスタ | |
EP2587514B1 (en) | Nanostructure-based electron beam writer | |
Choi et al. | Selective growth of carbon nanotubes for nanoscale transistors | |
KR100544324B1 (ko) | 실린더 형태의 게이트를 갖는 나노 전자소자의 제조 방법및 나노 전자소자 | |
Xu et al. | Lateral piezopotential-gated field-effect transistor of ZnO nanowires | |
Wu et al. | High-yield GaN nanowire synthesis and field-effect transistor fabrication | |
Zhang et al. | Carbon nanotubes: from growth, placement and assembly control to 60mV/decade and sub-60 mV/decade tunnel transistors | |
US20080149970A1 (en) | Multi-gated carbon nanotube field effect transistor | |
KR101399347B1 (ko) | 탄소나노튜브 이용한 나노 채널 제조 방법 및 이를 이용한 나노 구조물 | |
KR20020095800A (ko) | 카본나노튜브의 수평 성장 방법 | |
US20100068828A1 (en) | Method of forming a structure having a giant resistance anisotropy or low-k dielectric | |
Chen et al. | Nanowelded carbon nanotubes: From field-effect transistors to solar microcells | |
JP6658121B2 (ja) | グラフェンナノリボン及びその製造方法、デバイス | |
CN1251247C (zh) | 一种提高纳米材料电性能的方法 | |
KR101319612B1 (ko) | 탄소나노튜브 수평성장방법 및 이를 이용한 전계 효과 트랜지스터 | |
JP2004172270A (ja) | 内包フラーレンによる分子及び薄膜トランジスタ | |
KR101319613B1 (ko) | 탄소나노튜브 수평성장방법 및 이를 이용하여 형성된 수평배선 | |
US20230180591A1 (en) | Method for forming nanostructure and field effect transistor device on a substrate | |
Zhang et al. | Graphene Transistors |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130111 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140206 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150108 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160111 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20170109 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180117 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190107 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20200312 Year of fee payment: 15 |