KR100541086B1 - Power amplifier and duplexer composite apparatus for improving impedance matching - Google Patents

Abstract

An object of the present invention is to provide a power amplification and duplexer composite device in which an impedance matching section consisting of λ / 4 striplines is formed in a spiral shape on an inner layer of a substrate in order to match impedances between transmitting and receiving terminals of a duplex in a composite device. have.

The present invention is connected to an antenna (ANT), the duplexer 44 including a reception (RX) filter and a transmission (TX) filter for separating and passing the transmission and reception signals, and amplifying the power of the transmission signal A composite device comprising a power amplifier (41), comprising: a substrate (PCB) on which a plurality of dielectric layers are stacked; Coupled between the power amplifier 41 and the duplexer 44 to form a conductive pattern on a portion of the plurality of dielectric layers of the substrate PCB to sense transmission power from the power amplifier 41. Ring portion 43; And a spiral conductive pattern formed in each of at least two layers of the plurality of dielectric layers of the substrate PCB and connected to each other, for impedance matching between the receive (RX) and transmit (TX) filters of the duplexer. The impedance matching unit 45 is connected between the reception (RX) filter unit of the duplexer 44 and the antenna terminal (ANT).

According to the present invention, the area occupied by the stripline can be reduced, thereby further miniaturization, and the parasitic effects such as signal interference of the stripline itself can be reduced, thereby improving performance.

Power amplification, duplex, composite device, impedance matching, phase shift, λ / 4 strip line, spiral

Description

POWER AMPLIFIER AND DUPLEXER COMPOSITE APPARATUS FOR IMPROVING IMPEDANCE MATCHING

1 is a circuit diagram of a conventional power amplification and duplex composite device.

2 is a cross-sectional view of a conventional power amplification and duplex composite device.

3 is a pattern diagram of an impedance matching unit formed in the substrate of FIG. 2.

4 is a cross-sectional view of a power amplification and duplex composite device according to the present invention.

5A is a stacked structure of the impedance matching unit of FIG. 4, and FIG. 5B is a pattern diagram of each layer of the impedance matching unit.

6A to 6D are detailed pattern diagrams of upper layers, first and second intermediate layers, and lower layers of the impedance matching unit of the present invention.

Explanation of symbols on main parts of drawing

40: composite device

41: power amplifier

42: passive circuit

43: coupling part

44: SAW Duplexer

45: impedance matching unit

46: case

PCB: Board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power amplification and duplexer composite apparatus applicable to a wireless communication terminal such as a mobile phone. In particular, an impedance matching unit comprising a? / 4 stripline for matching impedances between transmitting and receiving terminals of a duplex in a composite apparatus is used. By forming a spiral shape on the inner layer, the area occupied by the stripline can be reduced and further miniaturized, and the parasitic effect such as signal interference of the stripline itself can be reduced, thereby improving impedance matching which can improve performance. Amplification and duplexer composite device.

In general, a cellular or PCS cellular phone terminal or other wireless communication terminal includes a diplexer connected to an antenna ANT to pass a cellular band of approximately 824-894 MHz or a PCS band of approximately 1750-1910 MHz, A duplexer that divides the cellular band into a transmit (TX) band of approximately 824-849 MHz and a receive (RX) band of approximately 869-894 MHz, or a duplexer that divides the PCS band into a transmit (TX) and receive (TX) band Include.

In recent years, mobile communication terminals such as mobile phones have to satisfy the requirements for multifunctionalization in which various functions are combined in terms of functionality, and miniaturization in terms of size, such as reducing the overall size or height. In response to the demand, research and development are being conducted on a complex device in which a power amplifier module and a duplexer are formed in one module to amplify the power of a transmission signal.

1 is a circuit diagram of a conventional power amplification and duplex composite device.

Referring to FIG. 1, a conventional power amplifier and duplex composite device includes a power amplifier 11 for amplifying the power of a transmission signal, and a passive device for impedance matching and power supply noise removal of the power amplifier 11. Passive circuit sections 12A and 12B, a coupling section 13 for detecting output signals of the power amplifier section 11, and a duplexer 14 for separately passing through transmission and reception signals corresponding to a predetermined frequency, respectively. And an impedance matching unit 15 for impedance matching between the transmitting and receiving terminals of the duplexer 14.

Here, the passive circuit unit 12 includes an impedance matching circuit unit 12A of the power amplifier unit 11 and a circuit unit 12B for blocking power / signal interference.

2 is a cross-sectional view of a conventional power amplification and duplex composite device.

Referring to FIG. 2, a conventional power amplification and duplex composite device includes a substrate PCB having a plurality of dielectric layers stacked thereon, a power amplifier 21 amplifying a transmission signal on the substrate PCB, and the power amplification. Receives and passes through a passive circuit unit 22 connected to the power amplifier 21 and a transmission signal and a reception signal corresponding to a predetermined frequency band separately for impedance matching of the unit 21 and removal of power supply noise (RX). A SAW duplexer 24 including a filter unit and a transmit (TX) filter unit is mounted.

In addition, inside the substrate PCB, a portion of the plurality of dielectric layers of the substrate PCB is formed in a conductive pattern, and in order to sense the transmission power from the power amplifier 21, the power amplifier ( 21 and a coupling part 23 connected between the duplexer 24 and a portion of the plurality of dielectric layers of the substrate PCB in a conductive pattern, and receive (RX) and transmit (TX) of the duplexer 14. For impedance matching between the filters, an impedance matching unit 25 connected between the receiving (RX) filter unit and the transmitting (TX) filter unit of the duplexer 14 is embedded.

As described above, in the conventional complex apparatus, an impedance matching part for matching the impedance between the transmitting and receiving ends of the duplex is formed in a part of the inner layer of the substrate on which the duplexer is mounted, so that the height of the duplexer can be reduced. There is an advantage that the miniaturization of the terminal is possible.

3 is a pattern diagram of an impedance matching unit formed in the substrate of FIG. 2.

Referring to FIG. 3, an impedance matching unit 25 formed inside a substrate of a conventional composite device is a λ / 4 strip line connected between an antenna terminal ANT and a receiving terminal RX, and transmits a transmission signal from a duplexer. And transmits the received signal from the antenna end to the receiving end of the duplexer, wherein the λ / 4 stripline corresponds to the λ / 4 length of the frequency of the transmitted signal and is viewed from the antenna side. The receiver is left open, which prevents the transmission from being transmitted to the receiver.

As shown in FIG. 3, the conventional impedance matching unit is formed of a lambda / 4 stripline of a meander type on one inner layer of the substrate, and the length of the lambda / 4 line is about 43 mm, The loss of this [lambda] / 4 stripline is approximately 0.35 dB and the area of the [lambda] / 4 stripline is approximately 3.5 x 3.6 mm.

However, in the conventional power amplification and duplexer composite device, since the λ / 4 stripline is implemented in one layer inside the substrate as a meander type, in case of not maintaining a sufficient gap between striplines for miniaturization When the signal directions S1 and S2 shown in FIG. 3 are opposite to each other, the signal direction may occur several times. In this case, signal interference may occur.

In addition, when sufficient spacing between striplines is maintained in order to reduce the signal interference, the area occupied by the striplines becomes large, which makes it difficult to miniaturize a complicated device.

As described above, the conventional impedance matching unit formed in the inner layer of the substrate as a male type has a limitation on signal interference and miniaturization.

SUMMARY OF THE INVENTION The present invention has been proposed to solve the above problems, and an object thereof is to match an impedance matching part of a λ / 4 stripline in a spiral shape to an inner layer of a substrate in order to match impedance between transmitting and receiving ends of a duplex in a composite device. Formation reduces the area occupied by the stripline, further miniaturization, and also reduces the parasitic effects such as signal interference of the stripline itself, thereby improving power matching and duplexer composites with improved impedance matching to improve performance. To provide.

In order to achieve the above object of the present invention, the power amplification and duplexer composite device of the present invention

A duplexer 44 connected to the antenna terminal ANT, including a reception (RX) filter unit and a transmission (TX) filter unit for separating and passing the transmission and reception signals, and a power amplifier 41 for amplifying the power of the transmission signal. In a composite device comprising a)

A substrate (PCB) on which a plurality of dielectric layers are stacked;

Coupled between the power amplifier 41 and the duplexer 44 to form a conductive pattern on a portion of the plurality of dielectric layers of the substrate PCB to sense transmission power from the power amplifier 41. Ring portion 43; And

Each of the at least two layers of the plurality of dielectric layers of the substrate PCB is formed in a spiral conductive pattern and connected to each other, and the duplexer for impedance matching between the receive (RX) and transmit (TX) filters of the duplexer. Impedance matching section 45 connected between the receive (RX) filter section and antenna stage (ANT) of (44)

Characterized in having a.

In addition, the composite apparatus further includes a passive circuit unit 42 mounted on the PCB and connected to the power amplifier 41 for impedance matching of the power amplifier 41 and power supply noise removal. Characterized in that.

In addition, the impedance matching unit 45 is formed on the first intermediate layer ML1 of the dielectric layer of the substrate PCB, and has one end connected to the antenna terminal ANT to form a first conductive strip line ST1. ); And a second intermediate layer ML2 stacked below the first intermediate layer ML1 of the substrate PCB. The second intermediate layer ML2 is formed in a spiral conductive pattern by being connected to the other end of the first strip line ST1 via via holes. The other end thereof may include a second strip line ST2 connected to the receiving end TX of the receiving filter unit RX.

Here, the total lengths of the first stripline ST1 and the second stripline ST2 may be set to λ / 4 of the transmission frequency output from the transmission TX filter.

The impedance matching unit 45 may include a first shielding pattern SD1 formed of a conductive pattern around the first strip line ST1 and a conductive pattern formed around the second strip line ST2. It further comprises a shielding pattern (SD2).

The first strip line ST1 and the second strip line ST2 may be formed in a spiral conductive pattern having the same signal traveling direction, and further, the first strip line ST1 and the second strip line. Each of the conductive patterns of ST2 is preferably formed such that the intervals between the patterns are the same.

In addition, the impedance matching unit 45 may include the upper pattern TP on the upper layer TL stacked on the first intermediate layer ML1 of the dielectric layer of the substrate PCB, and the dielectric layer of the substrate PCB. The lower pattern BP may be further included in the lower layer BL stacked below the intermediate layer ML2.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings referred to in the present invention, components having substantially the same configuration and function will use the same reference numerals.

4 is a cross-sectional view of a power amplification and duplex composite device according to the present invention.

Referring to FIG. 4, the power amplification and duplex composite apparatus according to the present invention includes a reception (RX) filter unit and a transmission (TX) filter unit connected to an antenna terminal ANT and separating and transmitting a transmission and reception signal. A duplexer 44 and a power amplifier 41 for amplifying the power of the transmission signal.

The composite device of the present invention is formed of a substrate (PCB) in which a plurality of dielectric layers are stacked and a portion of the plurality of dielectric layers of the substrate (PCB) in a conductive pattern, and detects transmission power from the power amplifier 41. To this end, a coupling portion 43 connected between the power amplifier 41 and the duplexer 44 and a part of at least two layers of the plurality of dielectric layers of the substrate PCB are formed in a spiral conductive pattern. Impedance matching unit 45 connected to each other and connected between the receiving (RX) filter unit of the duplexer 44 and the antenna terminal ANT for impedance matching between the receiving (RX) and transmitting (TX) filters of the duplexer. It includes.

The composite apparatus further includes a passive circuit unit 42 mounted on the substrate PCB and including an impedance matching element connected to the power amplifier 41 and a power / signal interference blocking element.

The impedance matching unit 45 preferably includes a stripline formed in a spiral conductive pattern on at least two layers in order to miniaturize and improve performance of the composite device. This will be described with reference to FIG. 4.

4 is a cross-sectional view of a power amplification and duplex composite device according to the present invention, FIG. 5A is a stacked structure of the impedance matching unit of FIG. 4, and FIG. 5B is a pattern diagram of each layer of the impedance matching unit.

4 and 5A and 5B, the impedance matching unit 45 is formed in the first intermediate layer ML1 of the dielectric layer of the substrate PCB, and one end ST1A is connected to the antenna terminal ANT. A first strip line ST1 formed of a spiral conductive pattern and a second intermediate layer ML2 stacked below the first intermediate layer ML1 of the substrate PCB, and formed on the first strip line ST1. One end ST2B is connected to the other end ST1B through the via hole VH to form a spiral conductive pattern, and a second strip line having the other end ST2A connected to the receiver TX of the receiver RX filter part. (ST2).

The spiral stripline of at least two layers thus makes the complex device of the present invention even more compact.

The total lengths of the first stripline ST1 and the second stripline ST2 may be set to λ / 4 of the transmission frequency output from the transmission filter TX. The two striplines ST1 and ST2 correspond to the λ / 4 length of the frequency of the transmission signal, and when viewed from the antenna side, the receiving end is opened for the transmission signal from the duplexer, and eventually the transmission signal from the duplexer is sent to the receiving end. It can't be delivered, and it's delivered to the antenna stage.

The impedance matching unit 45 may include a first shielding pattern SD1 formed of a conductive pattern around the first strip line ST1 and a second strip to block entrance and exit of peripheral signals and noise in a lateral direction. It is preferable to further include a second shielding pattern SD2 formed of a conductive pattern around the line ST2.

In addition, the first shielding pattern SD1 is separated from the first stripline formed for signal connection with the outside, and thus, four shielding patterns each around the first stripline ST1 on the first intermediate layer ML1. SD1A, SD1B, SD1C, SD1D). In addition, the second shielding pattern SD2 is separated from the second stripline formed for signal connection with the outside, and each of the four shielding patterns around the second stripline ST2 on the second intermediate layer ML2. (SD2A, SD2B, SD2C, SD2D).

Accordingly, the first and second shielding patterns SD1 and SD2 block the flow of signals and noise from the surroundings, and the signal on the stripline is prevented from being emitted to the outside.

6A to 6D are detailed pattern diagrams of upper layers, first and second intermediate layers, and lower layers of the impedance matching unit of the present invention.

6A and 6B, the first strip line ST1 and the second strip line ST2 are formed in a spiral conductive pattern having the same signal flow direction, and the first strip line ST1 and the second strip. Each of the conductive patterns of the line ST2 is formed to have the same spacing between the patterns.

As described above, in the present invention, since the impedance matching unit is implemented as a spiral conductive pattern connected to each other up and down, mutual inductance is generated between the upper and lower conductive patterns, that is, the spiral inductor structure has a magnetic induction phenomenon between the upper and lower spiral conductive patterns. To increase the overall inductance, thereby substantially shorter than [lambda] / 4 of the transmission frequency, thereby reducing the charge area by that amount.

For example, the conductive pattern of the impedance matching unit of the composite module of the present invention is a spiral type corresponding to λ / 4 of the transmission frequency, and the length of the pattern is about 38 mm, and the line loss of the pattern loss) is approximately 0.3 dB and the area occupied by this pattern is approximately 3.4 x 3.4 mm.

In addition, the impedance matching unit 45 is disposed on the upper layer TL stacked above the first intermediate layer ML1 among the dielectric layers of the peripheral board PCB to block entrance and exit of peripheral signals and noise in the vertical direction. It is preferable to further include a lower pattern BP on the pattern TP and the lower layer BL stacked below the second intermediate layer ML2 among the dielectric layers of the substrate PCB. Noise inflow is blocked, and the signal on the stripline is blocked from being emitted to the outside.

As described above, in the complex device of the present invention, inductors having the same size inductance are stacked in series by using two upper and lower conductive patterns, so that the inductance value is doubled by each inductance value, so that the upper and lower ends The magnetic mutual induction between layers makes it possible to obtain approximately twice as high inductance.

Accordingly, the inductance several times higher can be obtained as a whole and can be shorter than the conductive pattern length of the conventional [lambda] / 4 line mender type. As such, the conductive pattern can be relatively short, thereby reducing the line loss generated in the pattern line, and also reducing the parasitic effect that can occur in the conductive pattern of the conventional mender type. Can be improved.

According to the present invention as described above, in the power amplification and duplexer composite device applicable to a wireless communication terminal such as a mobile phone, impedance matching consisting of λ / 4 stripline to match the impedance between the transmitting and receiving terminals of the duplex in the composite device By forming the portion spirally on the inner layer of the substrate, the area occupied by the stripline can be reduced, further miniaturization is possible, and the parasitic effects such as signal interference of the stripline itself can be reduced, thereby improving performance. It can reduce the material cost.

Since the above description is only a description of specific embodiments of the present invention, the present invention is not limited to these specific embodiments, and various changes and modifications of the configuration are possible from the above-described specific embodiments of the present invention. It will be apparent to those skilled in the art to which the present invention pertains.

Claims (8)

A duplexer 44 connected to the antenna terminal ANT, including a reception (RX) filter unit and a transmission (TX) filter unit for separating and passing the transmission and reception signals, and a power amplifier 41 for amplifying the power of the transmission signal. In a composite device comprising a) A substrate (PCB) on which a plurality of dielectric layers are stacked; Coupled between the power amplifier 41 and the duplexer 44 to form a conductive pattern on a portion of the plurality of dielectric layers of the substrate PCB to sense transmission power from the power amplifier 41. Ring portion 43; And Each of the at least two layers of the plurality of dielectric layers of the substrate PCB is formed in a spiral conductive pattern and connected to each other, and the duplexer for impedance matching between the receive (RX) and transmit (TX) filters of the duplexer. It is connected between the receive (RX) filter portion of the 44 and the antenna terminal (ANT), is formed in the first intermediate layer (ML1) of the dielectric layer of the substrate (PCB), one end is connected to the antenna terminal (ANT) spiral A first strip line ST1 formed of a conductive pattern on the second intermediate layer ML2 stacked below the first intermediate layer ML1 of the substrate PCB, and the other strip of the first strip line ST1. A second strip line ST2 connected to a terminal hole and a via hole is formed in a spiral conductive pattern, the other end of which is connected to the receiving terminal TX of the receiving filter RX, and is electrically conductive around the first strip line ST1. A first shielding pattern SD1 formed as a pattern, and the second shielding pattern SD1 Impedance and a second shielding pattern (SD2) formed in the conductive pattern in the vicinity of the trip line (ST2), the matching unit 45 Power amplification and duplexer complex device characterized in that it comprises a. The method of claim 1, wherein the composite device And a passive circuit unit 42 mounted on the substrate PCB and connected to the power amplifier 41 for impedance matching of the power amplifier 41 and removing power supply noise. Amplified and duplexer composite device. delete The method of claim 1, wherein the total length of the first strip line ST1 and the second strip line ST2 is And a λ / 4 of a transmission frequency output from the transmission (TX) filter unit. delete The method of claim 1, wherein the first strip line (ST1) and the second strip line (ST2) A power amplification and duplexer composite device, characterized in that formed in a spiral conductive pattern with the same signal progress direction. The conductive pattern of claim 1, wherein each of the conductive patterns of the first strip line ST1 and the second strip line ST2 is Power amplification and duplexer composite device, characterized in that the interval between the patterns are formed equal to each other. The method of claim 1, wherein the impedance matching unit 45 An upper pattern TP on an upper layer TL stacked on an upper portion of the first intermediate layer ML1 of the dielectric layer of the substrate PCB; And Lower patterns BP on the lower layer BL stacked below the second intermediate layer ML2 among the dielectric layers of the substrate PCB. Power amplification and duplexer composite device further comprising.

Images