KR100523348B1 - The insulation and vibration-absorption material made of polystyrene foam chips, and the manufacturing method of it - Google Patents

Abstract

According to the present invention, a needle-shaped styrofoam chip is randomly shuffled three-dimensionally, and a plurality of pores are formed therein, and the needle-shaped styrofoam chip is physically bonded to the needle-shaped styrofoam flooring material, and a method for manufacturing the same. It is about.

The heat-insulating dustproof material of the present invention is a styrofoam chip-binder mixture in which 25 to 75% by weight of a needle-like styrofoam chip having a diameter of 50 mm or less and a circumscribed circle circumferentially perpendicular to the longitudinal direction is 20 mm or less and a binder 25 to 75% by weight. Forming a styrofoam chip as a plate-shaped object dried and compressed after injection molding into a mold; Kneading the styrofoam chip and the water-soluble binder (200); A step 300 of filling the kneaded strofoam chip-binder mixture into a mold to form a plate; Drying the molded straw foam chip-binder mixture at a temperature of 80 ° C. or less (400); The molded, dried strofoam chip-binder mixture is made through rolling step 500.

The heat insulating dustproof material of the present invention is characterized by using a styrofoam chip cut into a needle, and by mixing the styrofoam chips to form a plurality of voids therein, better insulation and sound absorption and shock absorption than styrofoam before cutting In addition, the waste styrofoam can be easily recycled, it is expected to help prevent the discharge of environmental pollutants.

Description

The insulation and vibration-absorption material made of polystyrene foam chips, and the manufacturing method of it}

The present invention relates to a heat-insulating dustproof material which combines a styrofoam chip with a water-soluble binder and a method of manufacturing the same. More specifically, the needle-like styrofoam chips are randomly mixed in three dimensions to form a plurality of pores therein. By having the needle-like styrofoam chips physically coupled to have a light yet excellent heat insulation and dustproof structure, to increase the heat insulation of the various buildings, and to prevent the shock and noise transmitted to the insulation dustproof flooring made of styrofoam chip The manufacturing method is related.

Today, most of the apartments nationwide in Korea are reinforced concrete structures, unlike the general office buildings, which are steel structures, and the upper and lower floors are divided into ordinary concrete slabs.

The steel structure is a structure in which the ceiling of the upper floor and the lower floor are separated from the steel frame, and vibration and noise of the floor of the upper floor caused by the movement of people in the upper floor are not transmitted to the ceiling of the lower floor. Because of this, people in the lower level can not know the movement of the upper level.

However, in the case of a general apartment house, a light-bubble concrete layer as a heat insulating layer and an underfloor pipe are installed on the concrete slab, and a bottom layer closed by cement is closely adhered to each other, and the upper surface of the floor layer laminated on the upper surface of the slab is the upper floor. The floor of the slab becomes the ceiling of the lower floor, and since the slab, the heat insulation layer, and the bottom layer are rigid bodies, the vibration or noise of the upper floor is immediately transmitted to the ceiling of the lower floor.

Thus, people living in the lower floors of the apartment can immediately see the movements of the people living in the upper floors, and vibrations and noises through the lower ceilings, which makes it possible to know the movements of the upper floors, are particularly quiet during the evening hours. It puts a lot of stress on people in the lower class, and in severe cases, it also causes emotional quarrels between the upper and lower inhabitants.

As described above, the phenomenon in which the vibration and noise of the upper layer are transmitted to the lower layer is an inevitable problem of the concrete slab, but a method for constructing the concrete slab to a predetermined thickness or more as a method for solving such a problem, and as shown in FIG. 1. As described above, a method of adding a dustproof material layer 13 between the lightweight foamed concrete layer 12 and the bottom slab layer 14 directly below the bottom layer 11 on which the ondol pipe P is installed is mainly used.

Among the above methods, the method of constructing the thickness of the slab makes the slab difficult to vibrate as the slab is thick and heavy, and the degree of transmission from the top of the slab to the bottom is reduced even when the slab is generated. Although it can be reduced, there is a problem that the construction cost increases.

In other words, as the slab becomes thicker, the slab construction cost increases, and at the same time, the construction cost increases due to the reinforcement of a wall for supporting the heavy slab.

In addition, the method of adding a dustproof material layer as described above is generally made in a manner of covering the upper surface of the slab with a pad-shaped dustproof material having a suitable elasticity, the handling and cutting for cutting the dustproof material in the form of a floor due to its heavy weight This is not easy, there is a problem that the construction time becomes longer.

Therefore, in order to solve the above problems, an interlayer impact sound buffer and a binder which can easily form a dustproof layer on the upper surface of the constructed concrete slab have been developed.

The impact sound absorbing material and the binder are preferable in terms of utilizing waste tires by combining the tire pulverized product and the organic binder, but since the tire is made of not only rubber but also steel cord or steel wire and various fiber fibers, In order to use, in particular, it is necessary to separate the metal components, there is a problem that it is difficult to separate the metal components.

In other words, when the metal components are used without separation, the metal components may be deteriorated with time, which may deteriorate the surrounding materials, or rust and water may leak out. Unless otherwise specified, waste tire rubber has a process problem to completely separate the metal parts of the rotor.

Therefore, the waste tires may be used to select only parts without metal components such as steel cords or steel wires, but since the waste tire parts without metal components are used for other purposes, they are not suitable for use as shock-absorbing materials and tire grinding materials for binders. The amount is very short.

In addition, since the waste tire is compressed at high pressure due to the characteristics of a tire that must withstand the harsh environment of high pressure and high load, its waste weight is heavier than foam materials such as styrofoam, and there is no pore inside so that vibration absorption or insulation is inferior. .

In addition, the styrofoam, which is widely used in various packaging materials and insulation materials, is not naturally decomposed when disposed, causing many problems in the environment. However, the waste styrofoam should be recycled as much as possible. There is little way to easily recycle it.

The present invention is to solve all the problems of conventional flooring materials that have been conventionally constructed for the insulation and dustproof and sound absorption of the building, and can perform the role of the heat insulation layer, the dustproof layer and the sound absorbing layer at the same time because of the light and excellent insulation, It is an object of the present invention to provide a heat insulation and dustproof flooring material and a method of manufacturing the same, which are not only easy to construct but also short to construction time, thereby reducing construction cost.

In addition, it is intended to provide a method for easily recycling the waste styrofoam that does not decompose naturally.

The object of the present invention is achieved by a styrofoam chip cut or crushed to a certain size (hereinafter referred to as 'cutting').

As a raw material of the styrofoam chip constituting the heat insulating dustproof material of the present invention, not only styrofoam not used, but also styrofoam to be discarded after being used, the styrofoam chip may be used for the styrofoam characteristics of the first foamed state. Since it has excellent sound absorption, dustproofing, and thermal insulation performance, there is a technical feature of the present invention to use a needle-shaped styrofoam chip rather than the shape of a bulk lip.

The styrofoam, which is a raw material of the styrofoam chip constituting the present invention, is also called a polystyrene foam or EP (Expanded Poly-Styrene) as a trade name (hereinafter, commonly used 'styrofoam'). Foamed polystyrene beads containing lower hydrocarbons as a blowing agent in polystyrene are put into a mold and heat-foamed about 60 times, and then extruded into sheets to be vacuum formed, or by adding foaming agents to ordinary polystyrene, heat-expanding about 30 times. It is made by a method such as extruding into a plate shape after the extrusion or low-foam injection molding about 2 times.

The styrofoam, which is white and light and has excellent water resistance, heat insulation, sound insulation, and cushioning properties, is made into a plate shape or various three-dimensional shapes and widely used as a packaging material, a building material, a daily necessity material, and the like, when incinerated for disposal after use. Since environmental pollutants such as dioxin are discharged and landfill is not naturally decomposed, it is most preferable to recycle them, and the present invention is a physical method of cutting styrofoam into small pieces so that the styrofoam to be disposed of can be easily recycled. By utilizing the method, but cut the styrofoam into a needle-like shape of a relatively long length in the direction orthogonal to the cross-sectional dimension of the cut styrofoam, using the cut needle-shaped styrofoam chip has the uniqueness of the present invention.

However, since the styrofoam is made of spherical expandable polystyrene beads, in the cutting process of the styrofoam, the foamed polystyrene beads or the bulk styrofoam granules in which a plurality of beads are combined are generated, thereby forming an insulating dustproof material using the styrofoam grains. If the styrofoam grains are staggered to each other, the durability of the insulating dustproof material may be reduced or the filling rate may be reduced. Thus, the bulky styrofoam grains may be used after changing to the shape of the chip through reprocessing such as cutting or pressing. Preferably, each bead is very small and is not used in the thermal insulation dustproof material of the present invention.

In other words, cutting and using the styrofoam into the shape of the chip longer than the cross section as described above, dispersing or transmitting heat or vibration by the non-uniformity obtained by irregularly stacked styrofoam chips are divided or inclined state This is to improve the damping characteristics by disturbing.

The styrofoam chip is first cut styrofoam into a bar shape of a rectangular cross section, second cut the styrofoam bar to an appropriate length and then squeezed by a squeezing roller to complete the styrofoam chip used in the thermal insulation dustproof material of the present invention. do.

At this time, the cross-sectional shape of the styrofoam bar can not be substantially precise and uniform square cross-section as the cross-section of the bark, which is elastically recovered after cutting the styrofoam was cut by the cutting load when cutting the styrofoam This is because the beads are torn off during the process, and the roughly rectangular cross-sectional shape after cutting is further disappeared by the pressing roller, but the shape of the styrofoam chip is stabilized by pressing, thereby keeping the styrofoam chip in a compressed state. By forming a stable laminated structure, voids are efficiently formed in the laminated layer.

As described above, the styrofoam is cut in the shape of a needle having a relatively long length compared to the horizontal, vertical, or diameter of the cross section, and the styrofoam chips cut using a binder as a binder are filled into a mold, dried, pressed, and pressed. When the insulating dustproof material is made, and filling the styrofoam chips mixed with the binder in the mold during the above process, the styrofoam chips are laid in a substantially parallel direction or inclined state rather than being erected on the bottom of the mold. It becomes a structure laminated randomly.

Therefore, the upper, lower, left and right of the strofoam chips are staggered with each other to increase the binding force between the styrofoam chips to improve the durability of the insulating dustproof material.

However, when the styrofoam rips are used, the styrofoam lip is easy to fall off due to external force, especially friction, such as styrofoam before being cut, and the styrofoam chip is used instead of the strofoam lip for the thermal insulation material of the present invention.

In addition, the size of the styrofoam chip is directly related to the construction of the dustproof chip of the present invention and the performance of the dustproof layer, and it is preferable that the diameter of the circumscribed circle circumscribed to a cross section orthogonal to the longitudinal direction is 50 mm or less. Do.

In order to limit the size of the styrofoam chip as described above, it is possible to use it even if it is out of the above size, but in order to consider the construction and the filling rate. If the size is out of the size, the filling rate of the dustproof layer is lowered and the sprayability is deteriorated. Because.

And, as a binder for bonding the styrofoam chips, a water-soluble binder is used, and the water-soluble binder serves to improve the elastic recovery force and the suction and dust resistance of the styrofoam chip, the representative may include latex, It is not necessarily limited to the latex alone.

That is, as the water-soluble binder, ethylene vinyl acetate, acrylic alkyd, epoxy, melamine-based binder, etc. may be used as the water-soluble binder, and the use of the water-soluble binder as described above has high work stability in the production of the insulating dustproof material, and environmental pollution. This is because there is little room for trouble.

The latex, which is representative of the various types of water-soluble binders, is extracted from a rubber tree, and centrifugal cleaning and cleaning of a sticky liquid natural rubber having a specific gravity of 0.98 based on approximately 60% by weight of water and 35% by weight of rubber. It is a natural product that concentrates the rubber component content in the range of 50 to 70% by weight through the evaporation method and evaporation method. Depending on the workability and the coating amount, it can be used only latex or diluted with water. Due to this, it is possible to further improve the shock absorbency and sound insulation and heat insulation of the heat insulating dustproof material, but the manufacturing cost is increased.

Detailed description of the present invention, including the technical configuration of the anti-vibration chip according to the present invention with reference to the drawings showing a preferred embodiment of the present invention in detail as follows.

FIG. 2 is a perspective view of a columnar styrofoam chip model, a perspective view of styrofoam chips having various shapes in FIG. 3, and FIG. 4 is a perspective view of an insulating dustproof material according to one embodiment of the present invention.

At this time, the styrofoam chip model is an example of an ideally cut columnar shape to define the size of the styrofoam chip 21 of the various shapes shown in Figure 3, when the actual styrofoam cutting the spherical styrofoam particles are cut Since the corners and faces of the styrofoam chips 21 that are partially dropped or torn before being cut, do not form an exact straight line or an angle, and have a very irregular shape, the shape cannot be accurately defined. As described above, the size of the styrofoam chip 21 used in the heat insulating dustproof material of the present invention is defined as the columnar model 21 '.

As shown in Figure 5, the heat insulating dustproof material 2 of the present invention is molded in a plate-like form, such as a conventional heat insulating material, the binder 22 in a state in which the styrofoam chips 21 are irregularly stacked alternately bite each other. Coupled to each other, and a plurality of voids V are formed between the styrofoam chips 21 to further improve sound absorption, heat insulation, and shock absorption.

As described above, the heat-insulating dustproof material of the present invention, in which the styrofoam chips are bonded to the plate by a binder, is made of 25 to 75 wt% of the styrofoam chip and 25 to 75 wt% of the binder, wherein the total amount of the styrofoam chip and the binder is 100 wt% The bar, the reason for limiting the content of the binder as described above based on the styrofoam chip is as follows.

That is, if the binder content is less than 25% by weight, the bonding force between the styrofoam chips is reduced and the pores are excessively formed between the styrofoam chips and are not formed independently of each other, so that the styrofoam chips are easily dropped and the durability is lowered. However, the sound absorption, heat insulation, etc. are deteriorated by the space | gap which extends from one surface to the other surface.

In addition, when the content of the binder exceeds 75% by weight, the styrofoam chips are not uniformly dispersed in the binder and partially biased, and the formation of voids between the styrofoam chips by the excessive binder makes the insulation and dustproof properties difficult. At the same time, molding is difficult due to excessive binders, and at the same time, the drying time is long, and the production productivity of the heat insulating dustproof material is drastically lowered.

Looking at the manufacturing method of the insulating dustproof material of the present invention made of a styrofoam chip and a binder as described above are as follows.

The manufacturing method of the present invention, as shown in Figure 6, the step of cutting the styrofoam or waste styrofoam into the shape of the chip (100); Kneading the styrofoam chip and the binder (200); A step 300 of filling the kneaded strofoam chip-binder mixture into a mold to form a plate; Drying the molded straw foam chip-binder mixture at a temperature of 80 ° C. or less (400); The step 500 consists of pressing the molded, dried strofoam chip-binder mixture by rolling.

At this time, the drying temperature after drying the forming the strofoam chip-binder mixture is limited to 80 ℃ in order not to exceed the heat resistance temperature of the strofoam chip, the compression of the dried strofoam chip-binder mixture by rolling In order to increase the shape stability as a molded object, and to provide the deformation | transformation of a material inside by a stress, it is to raise the elastic force of the heat insulating dustproof material of this invention.

In addition, since the insulating dustproof material of the present invention manufactured through the above steps is better in construction characteristics than styrofoam and does not break easily, it is easy to install because it does not break even after carrying on workability, and is not used as shown in FIG. 7. It is also preferable to use another type of heat insulating plate 61, such as non-styrofoam or gypsum board, by laminating a heat insulating dustproof material 2 of the present invention.

In order to improve the soundproofing against light impact sound of the insulating dustproof material of the present invention composed of a styrofoam chip and a binder as described above, it is also preferable to add one or at least one of waste paper, sawdust or rice husk crushed products, in which case the amount added is styrofoam- It is preferable to set it as 1-10 weight part with respect to 100 weight part of binder mixtures, and when the said addition content does not reach 1 weight part, the effect will be insignificant, and when it exceeds 10 weight part, specific gravity will increase more than necessary, and its own weight will become large. Insulating property is deteriorated while handling property is reduced.

In particular, in the case of waste paper, the waste paper absorbs the binder due to the nature of the paper that absorbs moisture, and thus, the drying time becomes long, thereby reducing productivity.

And, one of the waste paper, sawdust or rice husk crushed, kneaded together with the styrofoam chip and the binder is added in the 'step of kneading the styrofoam chip and binder (200)' of the various steps (process) of the method of the present invention do.

Two examples of the present invention insulation dustproof material and Styrofoam No. 2 and the existing floor was configured to perform a floor shock test, and the floor structure and test results using each are shown in Tables 1 and 2 below.

  division                   Floor structure  Example 1 Floor slab 150mm + Insulation dustproof material 20mm + Lightweight foam concrete 40mm + Finish mortar 50mm  Example 2 Floor slab 150mm + Insulation dustproof material 20mm + Lightweight foam concrete 40mm + Finish mortar 50mm  Styrofoam 2 Floor slab 150mm + Styrofoam No. 2 20mm + Lightweight foam concrete 40mm + Finish mortar 50mm  Old floor Floor slab 150mm + lightweight foam concrete 40mm + finish mortar 50mm

        division  Example 1  Example 2  Styrofoam 2  Existing floor    Styrofoam chips   weight%    50    48       -     -    Bar in the   weight%    50    50       -     -    Waste paper   Parts by weight     0     2       -     -    importance g / cm ³   0.035   0.036    0.025     -    Thermal conductivity  kcal / mh ℃   0.033   0.034    0.032     -  Floor shock sound blocking performance  Lightweight   L index   L-55   L-53    L-66    L-70  weight   L index   L-50   L-50    L-54    L-55

* Measurement of the floor impact sound blocking performance of Table 2 above, in the case of light impact sound tapping machine

   tapping machine, or bang machine in case of heavy shock.

   It carried out according to the method of KS F 2810-1, 2 performed using.

* The waste paper grind is parts by weight based on 100 parts by weight of the styrofoam chip-binder mixture.

Table 1 and 2, the heat insulating dustproof material of the present invention is slightly increased due to the inclusion of a binder compared to the general styrofoam, it can be seen that the thermal conductivity is almost the same, but the barrier performance against the impact sound, that is, the absorption of the impact sound is improved. .

As described above, the heat insulating dustproof material of the present invention is composed of styrofoam chips cut into styrofoam needles, and a plurality of voids are formed therein, so that the insulation and sound absorption and shock absorbing properties are superior to those of the styrofoam before cutting. There is this.

In addition, the waste styrofoam can be easily recycled to help prevent the discharge of environmental pollutants, there is an advantage that can be made inexpensive excellent dustproof material according to the utilization of the waste styrofoam.

1 is a cross-sectional view of the floor structure of a conventional apartment.

Figure 2 is a perspective view of a columnar styrofoam chip model for defining the size of the styrofoam chips constituting the insulating dustproof material of the present invention.

3 is a perspective view of styrofoam chips having various shapes.

Figure 4 is a perspective view of an embodiment of the present invention insulating dustproof material.

5 is a partial cross-sectional view of an embodiment of the present invention insulating dustproof material.

Figure 7 is a perspective view showing an example of the use of the heat insulating dustproof material of one embodiment of the present invention.

           ((Explanation of symbols for main part of drawing))

             2. Insulation dustproof material 11. Floor layer

            12. Lightweight aerated concrete layer 13. Dustproof material layer

            14. Concrete slabs 21. Styrofoam chips

            22. Binder

            P. Ondol piping V. Void

Claims (6)

Styrofoam chip made of 25-75% by weight of acicular styrofoam chip cut to 50mm or less in length and circumferential circumferential diameter of 20mm or less in cross section perpendicular to the longitudinal direction and 25-75% by weight of water-soluble binder -An insulating dustproof material made of styrofoam chip, which is molded and dried from a binder mixture into a plate-like body. delete delete The styrofoam-binder-grind mixture according to claim 1, wherein one of waste paper, sawdust and rice husk crushed powder is added to the styrofoam-binder mixture in an amount of 1 to 10 parts by weight based on 100 parts by weight of the styrofoam-binder mixture. An insulated dustproof material made of styrofoam chip, which is a plate-like body which is molded and dried by pressing into a mold. delete Making a styrofoam chip by cutting a three-dimensionally formed styrofoam into a needle so that the diameter of the circumscribed circle circumscribed to the cross section orthogonal to the longitudinal direction is 50 mm or less in length in a needle shape; To the styrofoam chip-binder mixture consisting of 25 to 75% by weight of the styrofoam chip and 25 to 75% by weight of binder, 1-10 parts by weight of waste paper, sawdust and rice husk grits are added to 100 parts by weight of the mixture and kneaded. Step 200; Filling the kneaded mixture into a mold to form a plate 300; Drying the molded mixture at a temperature of 80 ° C. or less (400); Method for producing a heat insulating dustproof material consisting of a styrofoam chip, comprising the step of pressing the compacted, dried mixture by rolling (500).