KR100491631B1 - (Meth)acrylate oligomer, method for preparing thereof, and UV-thermal dual curable adhesive composition for optical module comprising the same - Google Patents

Abstract

The present invention relates to a (meth) acrylate oligomer, a method for preparing the same, and a double-curable adhesive composition of heat and light for an optical communication module including the same, and more particularly, to (meth) acryl having fluorinated alkyl, siloxane, and vinyl groups. 3 to 90% by weight of late oligomer; 1 to 10% by weight photoinitiator; 5 to 60% by weight of epoxy (meth) acrylate; And 1 to 3% by weight of a thermal acid generator. According to the present invention, the (meth) acrylate oligomer having fluorinated alkyl, siloxane, and vinyl groups is used to bond and align optical fibers and photoconverters (couplers, splitters, waveguides, ferrols, etc.) in a short time through photocuring. In addition to bonding, it is possible to provide a heat and light double curable adhesive that can increase the bondability with the base material through heat curing and can harden uncured portions by not reaching light. In addition, the double-curable adhesive composition of heat and light according to the present invention can provide excellent refractive index integration with the optical component material, high light transmittance, low light loss, and environmental resistance in a relatively simple method.

Description

(Meth) acrylate oligomer, method for preparing the same, and a heat and light double curable adhesive composition for an optical communication module including the same ((Meth) acrylate oligomer, method for preparing conjugate, and UV-thermal dual curable adhesive composition for optical module comprising the same}

The present invention relates to a (meth) acrylate oligomer, a method for preparing the same, and a double-curable adhesive composition of heat and light for an optical communication module including the same, and more particularly, to (meth) acryl having fluorinated alkyl, siloxane, and vinyl groups. A double curable adhesive composition of heat and light for an optical communication module comprising a rate oligomer, a photoinitiator, an epoxy acrylate and a thermal acid generator.

Optical communication systems using optical fibers have a higher transmission volume than telecommunications, but in order to minimize the loss of connection in the connection between optical fibers and optical communication components, the ends of optical fibers should be cut very flat, polished well and then glued Or special connectors, etc., to make a straight line. The reliability of most optical communication systems and components for optical communication results from the splice loss of fiber optic connections. Therefore, in the past, soldering or laser welding has been employed to increase reliability, but the method has a disadvantage in that it is not sufficient to secure a fixed position and requires a high technique. There is a problem in the part where high temperature is applied.

In recent years, research on the use of organosilanes in order to improve the bonding strength of the adhesion promoter and the adhesive to the substrate in the thermosetting adhesive has been actively conducted. The organosilane is used to modify an epoxy resin adhesive to improve adhesion to iron, concrete, aluminum and the like. The organosilanes are also used to improve the overall strength of the composite by modifying the mineral filled phenols, urethanes, polyesters, furans and other thermoset resins to improve the adhesion between the mineral filler and the resin matrix. It is also known to provide improved adhesion to various organic resin binder systems in composites by treating glass fibers and flakes with organosilanes.

For example, Korean Laid-Open Patent Publication No. 2000-0010787 discloses a siloxane modified adhesive component prepared by combining an epoxy resin with an organosilane component, a polysiloxane resin, an amine curing agent, an organometallic catalyst, a base catalyst, and any thickener and extender pigment; And polysiloxane resins and are used in epoxy, phenol, polyester, vinyl ester, polyurethane, polyamide, melamine, furan acrylate, thermoplastic polyvinyl chloride, polyethylene, polycarbonate, ABS, polystyrene, ethylene vinyl acetate, polyvinyl A siloxane modified deposit component containing other resins such as acetates, polyamides and polypropylene resins is disclosed. The document also discloses that the siloxane groups of the siloxane-modified adhesive and the siloxane-modified adherent component are positioned in contact with each other such that an Si-O-Si bond is formed between them to create adhesion.

However, in the case of using the thermosetting adhesive as described above, since the time required for the thermosetting of the adhesive is generally required for 30 minutes or more, it is not preferable in terms of productivity, and especially in the case of application to the coupling of the optical fiber and the optical waveguide. The stage is deformed by heating, causing a problem such as a misalignment of the aligned core and the adhesive during curing. In order to solve the various problems in the optical communication component joining, the recent research on the photocurable adhesives has been concentrated.

For example, US Pat. No. 5,790,762 and Japanese Patent Publication No. 94-148895 disclose photocurable oligomers, fluorinated epoxy (meth) acrylate resins or fluorinated urethane acrylates having one or more acroyl or methacroyl groups in the molecule; An adhesive comprising a photoinitiator is disclosed.

However, when the photosensitive resin composition is used, a process of synthesizing epoxy resins (diglycidyl ethers) containing fluorine atoms and reacting them with acrylic acid or methacrylic acid is used to synthesize fluorinated epoxy (meth) acrylate resins. As the synthesis process is complicated and the reaction does not proceed quantitatively, there is a difficulty in purification. In addition, since it depends only on photocuring, active radicals caused by oxygen in the atmosphere tend to lose their activity, resulting in a problem of poor curing. In particular, such curing failure occurs frequently in the ultraviolet irradiation under the air.

In order to solve the above problems, the present inventors have conducted extensive research, using a (meth) acrylate oligomer having a fluorinated alkyl, siloxane and vinyl group prepared by combining a thermosetting siloxane group and a photo-curable vinyl group. The dual curing of heat and UV light proceeded to obtain a double curable adhesive composition of heat and light for an optical communication module that can be aligned and bonded within a short time, and the present invention was completed based on this.

Accordingly, it is an object of the present invention to provide a (meth) acrylate oligomer having fluorinated alkyl, siloxane and vinyl groups.

Another object of the present invention is to provide a method for producing a (meth) acrylate oligomer having the fluorinated alkyl, siloxane and vinyl groups.

Still another object of the present invention is to provide a double curable adhesive composition for heat and light for an optical communication module capable of light and heat curing, which is excellent in refractive index control, adhesive strength and thermal stability, and which can be aligned and bonded within a short time.

(Meta) acrylate oligomers having fluorinated alkyl, siloxane and vinyl groups of the present invention for achieving the above object is a compound represented by the following formula (1):

Wherein l, m and n are the same as or different from each other, an integer of 1 to 1000, R _f is an alkyl radical of 1 to 20 carbon atoms in which at least one hydrogen is substituted with fluorine, and R is an alkyl radical of 1 to 4 carbon atoms .

Method for producing a (meth) acrylate oligomer having a fluorinated alkyl, siloxane and vinyl group of the present invention for achieving the above another object is 5 to 60% by weight of fluorinated (meth) acrylate, 5 to (meth) acrylate containing hydroxyl group Preparing a prepolymer through copolymerization by adding 1 to 10 wt% of a radical initiator to 60 wt% and 3 to 20 wt% of a siloxane-containing (meth) acrylate monomer, and using the vinyl group-containing isocyanate 2 as a prepolymer. Urethane reaction with -40% by weight.

Heat and light double curable adhesive composition for an optical communication module comprising a (meth) acrylate oligomer having a fluorinated alkyl, siloxane and vinyl group of the present invention for achieving the above another object is a (meth) acryl represented by the formula (1) 3 to 90% by weight of late oligomer; 1 to 10% by weight photoinitiator; 5 to 90% by weight of epoxy (meth) acrylate; And 1 to 5% by weight of thermal acid generator.

Hereinafter, the present invention will be described in more detail.

The (meth) acrylate oligomers having fluorinated alkyl, siloxane and vinyl groups of the present invention are represented by the following general formula (1):

Formula 1

Wherein l, m and n are the same as or different from each other, an integer of 1 to 1000, R _f is an alkyl radical of 1 to 20 carbon atoms in which at least one hydrogen is substituted with fluorine, and R is an alkyl radical of 1 to 4 carbon atoms .

On the other hand, the manufacturing method of the (meth) acrylate oligomer represented by the formula (1) is 5 to 60% by weight of fluorinated (meth) acrylate, 5 to 60% by weight of hydroxyl group-containing (meth) acrylate and (meth) acrylate Preparing a prepolymer through copolymerization by adding 1 to 10 wt% of a radical initiator to 3 to 20 wt% of the monomer, and urethane-reacting the prepolymer obtained through the copolymerization with 2 to 40 wt% of a vinyl group-containing isocyanate. do. In general, the (meth) acrylate oligomers having fluorine, vinyl and siloxane groups as pendant groups have a disadvantage of poor compatibility with epoxy acrylates. However, in the present invention, such a problem can be solved by lowering the molecular weight of the (meth) acrylate oligomer. The prepolymer molecular weight of the (meth) acrylate oligomer decreases in proportion to the content of the radical initiator when copolymerizing the oligomer. Therefore, in order to improve compatibility with the epoxy acrylate, the number average molecular weight of the (meth) acrylate oligomer is preferably 1000 to 4000, and the content of the radical polymerization initiator is 5 to 15% by weight based on the monomer weight%. do.

The fluorinated (meth) acrylate monomer has a function of minimizing light loss and lowering refractive index. Therefore, as the fluorinated (meth) acrylate repeating unit "l" increases in the oligomer represented by Formula 1, the light loss rate and the refractive index decrease. According to the invention, the fluorinated (meth) acrylate monomers include trifluoroethyl methacrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 2,2,3,4,4,4- Preferred are (meth) acrylate monomers containing fluorine atoms as pendant groups, such as hexafluorobutyl methacrylate and perfluorooctyl ethyl methacrylate.

On the other hand, the hydroxyl group-containing (meth) acrylate monomer is provided as a reaction site for introducing a vinyl group in the urethane reaction later, and serves to impart the adhesion to the base. The hydroxyl group-containing (meth) acrylate monomers according to the present invention include 2-hydroxy ethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxy propyl acrylate and 2- Hydroxybutyl methacrylate is included.

In addition, the siloxane-containing vinylsiloxane monomers impart adhesion to the base material and crosslinking function by thermosetting. The siloxane-containing vinylsiloxane monomers usable in the present invention include 3- (trimethoxysilyl) propyl acrylate, 3- (trimethoxysilyl) propyl methacrylate, vinyltriethoxysilane, vinyl trimethoxy silane, and the like. Included.

The vinyl group-containing isocyanate compound according to the present invention may be a 1: 1 reactant of the hydroxyl group-containing (meth) acrylate and isophorone diisocyanate or 2-methacryloxyethyl isocyanate.

On the other hand, the heat and light double-curable adhesive composition according to the present invention has a fluorinated alkyl, siloxane and vinyl group, 3 to 90% by weight (meth) acrylate oligomer represented by the formula (1); 1 to 10% by weight photoinitiator; 5 to 90% by weight of epoxy (meth) acrylate; And 1 to 5% by weight of thermal acid generator.

The photoinitiator is a substance that emits a photocurable (crosslinkable) radically active substance from the vinyl group of the oligomer component by irradiating an energy ray such as light to the adhesive composition. Photoinitiators of the invention are benzophenones and derivatives thereof, benzoin, benzoin alkyl ether benzyldimethyl ketal, 1-hydroxy cyclohexyl phenylketone, diethoxy acetophenone, 2-hydroxy-2-methyl-1-phenylpropa A compound selected from the group consisting of -1-non, and 2-benzyl-2-dimethylamide-1- (4-morpholinaphenyl) -butanane is used, and the amount thereof is used in an amount of 1 to 10% by weight, preferably 3-10 weight% is good.

The epoxy (meth) acrylate of this invention is manufactured by making bisphenol-type epoxy resin of the molecular weight 450-3,000, and (meth) acrylic acid or hydroxy (meth) acrylate react. As said bisphenol-type epoxy resin, Bisphenol-A epoxy resins, such as Epicorte 828, Epicorte 1001, (the brand name of the epoxy resin of Cell company), or Epicorte 4001P, Epicorte 4002P, Epicorte 4003P (Cell Epoxy Company name) Bisphenol F-type epoxy resins, such as), are preferable. Especially preferable bisphenol-type epoxy (meth) acrylate is bisphenol-A epoxy resin.

The thermal acid generator functions as a catalyst in the condensation thermosetting reaction of the siloxane (-Si (OR) ₃ ) group of the meta (acryl) oligomer. The condensation hardening reaction of the siloxane group consists of three steps. First, in the first step, an alkoxy group having 1 to 3 carbon atoms is hydrolyzed by moisture existing in an external environment to generate an oligomer having a silicon functional group. This hydrolysis reaction proceeds rapidly under acid conditions. Then, the second step is a preparation step of the condensation reaction, and hydrogen bonding between the silicon group or the silicon and the hydroxy groups on the inorganic surface is performed. Finally, the hydrogen bonds present between them during post curing enhance moisture adhesion and crosslinking through the condensation reaction while producing water. The thermal acid generator thus catalyzes the acid at 100-140 ° C. to accelerate the reaction. Preferred thermal acid generators for the present invention include blocked dinonylnaphthalene disulfonic acid, blocked dinonylsulphonic acid, blocked dodecylbenzenesulphonic acid, and the like as blocked sulfonic acid.

The heat and double curable adhesives according to the present invention adhere the bases and are primarily photocured, depending on the application. The photocuring conditions are sufficient to irradiate UV for 1 to 3 minutes with an energy of 5 to 20mW / ㎠. As the UV light source, metal and mercury lamps which are usually used in UV paint are used. In addition, the thermosetting is preferably carried out for 30 minutes in an 80 ~ 130 ℃ oven.

The heat and light double curable adhesive composition of the present invention can be used to reduce the coefficient of thermal expansion of the adhesive and shrinkage of the resin upon curing by adding colloidal silica particles within a range that does not impair the object or effect of the present invention. Preferably, the colloidal silica has a particle size of 100 nm or less and is spherical, and the amount of the colloidal silica is preferably 30 to 150% by weight based on 100% by weight of the adhesive component of the present invention.

In addition, the heat and light double curable adhesive composition of the present invention may be a photosensitizer, an organic solvent, a polymerization inhibitor, a polymerization initiator, a leveling agent or a tick depending on the purpose of use within a range that does not impair the object or effect of the present invention. One or more additives selected from the group consisting of preservatives, wetting improvers, surfactants, plasticizers, ultraviolet absorbers, antioxidants, antistatic agents, silane coupling agents, inorganic fillers, pigments and dyes may be further mixed, the amount of which is used in the adhesive 10-99 weight% is preferable with respect to 100 weight% of compositions.

The heat and light double curable adhesive compositions according to the invention can be used in particular for splicing optical fibers such as optical spirits, ferrules, optical modules, optical couplers and optical waveguides.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited to the following Examples.

Preparation Example 1

Synthesis of Epoxy Methacrylate

1 L reactor equipped with a stirrer, reflux, thermometer and four-necked funnel, containing 33.96 g of bisphenol A, 46.6 g of glycidyl methacrylate, 0.02 g of 4-methoxy hydroquinone and 0.2 g of triethylamine 100 ml of ethyl acetate, 100 ml of distilled water and a small amount of sodium chloride were added, and the extraction was repeated twice. After separating the pure organic layer from this, a small amount of magnesium sulfate was added to remove water, and the remaining filtrate was filtered and the solvent was removed in vacuo to give 98.2 g of a faint brown liquid. The reaction is carried out until the epoxy group disappears in the 915 cm ^-1 region on the IR spectrum or the epoxy resin peak disappears on the GPC.

Comparative Example 1

Synthesis of Fluorinated Alkyl, Hydroxyl, and Siloxane-containing (meth) acrylate Prepolymers.

550 g of methyl ethyl ketone was added to a 2 L reactor equipped with a stirrer, a reflux condenser, a thermometer, and a four-neck funnel, and the reaction temperature was raised to 80 ° C. Here, 250 g of trifluoroethyl methacrylate, 160 g of 2-hydroxyethyl methacrylate, 40 g of 3- (methchloroyloxy) propyltrimethoxysilane and 18 g of azobisisobutyronitrile as a radical initiator are dissolved. The monomer mixture was slowly added to the reactor for 2 hours. In addition, 20 g of methyl ethyl ketone solution in which 2 g of azobisisobutyronitrile was dissolved was further added and maintained for 3 hours to obtain a (meth) acrylate oligomer in a solid yield of 43.5%. After measuring the compatibility of the (meth) acrylate oligomer synthesized as described above with an epoxy resin (Epicote 828-Cell Chemical Co., Ltd.), the results are shown in Table 1 below.

Examples 1 to 3

As shown in Table 1, except that the radical initiator content was changed, a (meth) acrylate having a low molecular weight was prepared in the same manner as in Comparative Example 1 to be compatible with an epoxy resin (Epicote 828-Cell Chemical Co., Ltd.). After measuring the sex, the results are shown in Table 1 below.

Initiator weight% Number average molecular weight (GPC) Epoxy Resin Compatibility Viscosity (cps) Comparative Example 1 4 5,500 Bad 2,000 Example 1 7 4,000 usually 1,500 Example 2 10 3,500 Good 1,100 Example 3 13 2,000 Good 800

As can be seen in Table 1, as the initiator weight% increased, the synthesized prepolymer molecular weight decreased and the compatibility with the epoxy resin increased.

Example 4

Synthesis of Fluorinated Alkyl, Vinyl, and Siloxane-containing (meth) acrylate Oligomers.

800 g of the prepolymer solution (solid content 44.0%) synthesized in Example 3 was added to a 2 L reactor equipped with a stirrer, a reflux reactor, a thermometer, and a four-neck funnel, and the reaction temperature was raised to 50 ° C. 0.5 g of dibutyl tin dilaurate was added thereto, and 50 g of 2-methacroyloxy ethyl isocyanate (produced by Showa Denko, Japan) was added for 1 hour, followed by further reaction for 2 hours. At this time, an exothermic reaction occurred by the urethane reaction at the beginning of the reaction and the temperature was increased, so that the gelation risk was maintained. The reaction was terminated by confirming that the isocyanate characteristic peak disappeared in the 2200 cm ^-1 region by IR.

Vacuum distillation was carried out from the reaction to remove methyl ethyl ketone as a solvent. The solid content of the fluorinated alkyl, vinyl and siloxane-containing (meth) acrylate oligomers prepared therefrom was 99.8 wt% and the viscosity was 8,500 cps (25 ° C.). In addition, the structure of the prepared oligomer was confirmed by hydrogen and fluorine nuclear magnetic resonance (NMR). By hydrogen (1H) nuclear magnetic resonance, methacryl groups (C H ₂ = C (CH ₃ ) CO _2- ) at 6.02 and 5.65 ppm and (CH ₂ = C (C H ₃ ) CO ₂ -at 1.846 ppm ) Group was identified as (-Si (OC H ₃ ) ₃ ) group at 3.36ppm, the results are shown in the figure of FIG. In addition, fluorine (19F) nuclear magnetic resonance confirmed the group (-C F ₃ ) at -81.14 ppm.

Examples 5-8

Using the methacrylate oligomer and epoxy methacrylate obtained in Example 4 and Preparation Example 1, respectively, a photoinitiator and a thermal acid generator were added thereto to prepare a thermal and photocurable adhesive. As shown in Table 2, the composition of the above components was changed to prepare an adhesive composition having a blending property of high refractive index, low refractive index, high dielectric transition temperature, and low glass transition temperature according to the use.

Example 6 Example 7 Example 8 Example 9 Division / characteristic High refractive index Low refractive index High Tg Low Tg Example 4: methacrylate oligomer (g) 25 70 50 78 Photoinitiator (1-hydroxy cyclohexyl ketone) (g) 5 5 5 5 Preparation Example 1: Epoxymethacrylate (g) 70 25 28 15 Thermal acid generator (glycidyl dinonylnaphthalene disulfonate) (g) 3 2 2 3 Colloidal Silica (g) - - - - Rating ^a) Exterior Transparency Transparency Transparency Transparency Viscosity (@ 25 ℃) 8,700 cps 4,500 cps 9,000cps 3,550 cps Glass transition temperature (Tg) 95 ℃ 90 ℃ 124 ℃ 50 ℃ Shrinkage <8% <8% <3% <7% Refractive index 1.623 1.398 1.457 1.468 Transmittance (@ 1.1-1.6㎛) > 90 > 91 > 88 > 93 Press Cooker Test ^b) 30hrs pass 30hrs pass 30hrs pass 10hrs pass Thermal expansion 7 × 10 ^-5 / ℃ 8 × 10 ^-5 / ℃ 3 × 10 ^-5 / ℃ 10 × 10 ^-5 / ℃ Shear Strength (BK-7) 184kgf / ㎠ 130kgf / ㎠ 190kgf / ㎠ 150kgf / ㎠

a) Curing condition: 1st photocuring at 10mW / ㎠ for 2 minutes, 2nd thermal curing at 120 ℃ for 30 minutes

b) Test condition: 125 ℃, 2.5atm, 100% relative humidity

c) Specimen size: 25mm × 5mm

As described above, the double-curable adhesive composition of heat and light according to the present invention can be post-cured by thermal curing together with the photocuring to solve the problem of poor curing due to oxygen and UV light not reached. In addition, according to the present invention, it is possible to provide an adhesive composition having excellent adhesion to various substrates such as optical fibers, optical waveguides, and ferrols by introducing thermosetting with siloxane groups.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the 1H-NMR result of the (meth) acrylate oligomer of this invention.

Claims (12)

(Meth) acrylate oligomers having fluorinated alkyl, siloxane and vinyl groups, represented by the following general formula (1): Formula 1 Wherein l, m and n are the same as or different from each other, an integer of 1 to 1000, R _f is an alkyl radical of 1 to 20 carbon atoms in which at least one hydrogen is substituted with fluorine, and R is an alkyl radical of 1 to 4 carbon atoms . 5 to 60% by weight of fluorinated (meth) acrylate, 5 to 60% by weight of hydroxyl group-containing (meth) acrylate and 3 to 20% by weight of siloxane-containing (meth) acrylate monomer are added by adding 1 to 10% by weight of radical initiator. A method of preparing a prepolymer through copolymerization, and urethane-reacting a prepolymer obtained through the copolymerization with 2 to 40% by weight of a vinyl group-containing isocyanate is represented by the following Chemical Formula 1 according to claim 1 ( Method for preparing meta) acrylate oligomer: Formula 1 Wherein l, m and n are the same as or different from each other, an integer of 1 to 1000, R _f is an alkyl radical of 1 to 20 carbon atoms in which at least one hydrogen is substituted with fluorine, and R is an alkyl radical of 1 to 4 carbon atoms . The method of claim 2, wherein the fluorinated (meth) acrylate monomer is trifluoroethyl methacrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 2,2,3,4,4,4- A method for producing a (meth) acrylate oligomer, characterized in that selected from the group consisting of hexafluorobutyl methacrylate and perfluorooctyl ethyl methacrylate. 3. The hydroxyl group-containing (meth) acrylate monomers of claim 2 are 2-hydroxy ethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxy propyl acrylate and A method for producing a (meth) acrylate oligomer, characterized in that selected from the group consisting of 2-hydroxybutyl methacrylate. 3. The siloxane-containing (meth) acrylate monomers according to claim 2, wherein the siloxane-containing (meth) acrylate monomers are 3- (trimethoxysilyl) propyl acrylate, 3- (trimethoxysilyl) propyl methacrylate, vinyltriethoxysilane and vinyl trimethylene. A method for producing a (meth) acrylate oligomer, characterized in that selected from the group consisting of oxy silanes. The (meth) acrylate oligomer according to claim 2, wherein the vinyl group-containing isocyanate compound is a 1: 1 reactant of hydroxyl group-containing (meth) acrylate and isophorone diisocyanate or 2-methacryloxyethyl isocyanate. Manufacturing method. 3 to 90% by weight of the (meth) acrylate oligomer represented by Formula 1 according to claim 1; 1 to 10% by weight photoinitiator; 5 to 90% by weight of epoxy (meth) acrylate; And A heat curable adhesive composition for heat and light for an optical communication module, comprising 1 to 5% by weight of a thermal acid generator: Formula 1 Wherein l, m and n are the same as or different from each other, an integer of 1 to 1000, R _f is an alkyl radical of 1 to 20 carbon atoms in which at least one hydrogen is substituted with fluorine, and R is an alkyl radical of 1 to 4 carbon atoms . The method of claim 7, wherein the photoinitiator is benzophenone and its derivatives, benzoin, benzoin alkyl ether benzyldimethyl ketal, 1-hydroxy cyclohexyl phenylketone, diethoxy acetophenone, 2-hydroxy-2-methyl-1 Heat and light double curable adhesives for optical communication modules, characterized in that selected from the group consisting of -phenylpropa-1-non and 2-benzyl-2-dimethylamide-1- (4-morpholinaphenyl) -butanane Composition. 8. The heat of the optical communication module according to claim 7, wherein the epoxy (meth) acrylate is prepared by reacting a bisphenol-type epoxy resin having a molecular weight of 450 to 3,000 with (meth) acrylic acid or hydroxy (meth) acrylate. Light double curable adhesive composition. 8. The thermal and optical fibers for optical communication modules according to claim 7, wherein the thermal acid generator is selected from the group consisting of blocked dinonylnaphthalene disulfonic acid, blocked dinonylsulphonic acid and blocked dodecylbenzenesulphonic acid. Double Curable Adhesive Composition. 8. The double curable adhesive composition for heat and light for optical communication modules according to claim 7, wherein the (meth) acrylate oligomer has a number average molecular weight of 1,000 to 4,000. The method of claim 7, wherein 100% by weight of the adhesive composition to the colloidal silica filler, photosensitizer, organic solvent, polymerization inhibitor, polymerization initiation aid, leveling agent, thixotropic agent, wetting improver, surfactant, plasticizer, Double heat and light for optical communication module, characterized by further mixing 10 to 99% by weight of at least one additive selected from the group consisting of ultraviolet absorbers, antioxidants, antistatic agents, silane coupling agents, inorganic fillers, pigments and dyes. Curable Adhesive Compositions.