KR100485847B1 - 개선된 연마용 패드 및 이에 관한 방법 - Google Patents

개선된 연마용 패드 및 이에 관한 방법 Download PDF

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Publication number
KR100485847B1
KR100485847B1 KR10-1999-7009038A KR19997009038A KR100485847B1 KR 100485847 B1 KR100485847 B1 KR 100485847B1 KR 19997009038 A KR19997009038 A KR 19997009038A KR 100485847 B1 KR100485847 B1 KR 100485847B1
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KR
South Korea
Prior art keywords
polishing
pad
polishing pad
abrasive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-1999-7009038A
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English (en)
Korean (ko)
Other versions
KR20010005961A (ko
Inventor
존 브이. 에이치. 로버츠
데이비드 비. 제임스
리 멜버른 쿡
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20010005961A publication Critical patent/KR20010005961A/ko
Application granted granted Critical
Publication of KR100485847B1 publication Critical patent/KR100485847B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR10-1999-7009038A 1997-04-04 1998-04-03 개선된 연마용 패드 및 이에 관한 방법 Expired - Lifetime KR100485847B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4340497P 1997-04-04 1997-04-04
US60/043,404 1997-04-04
US4944097P 1997-06-12 1997-06-12
US60/049,440 1997-06-12
PCT/US1998/006622 WO1998045087A1 (en) 1997-04-04 1998-04-03 Improved polishing pads and methods relating thereto

Publications (2)

Publication Number Publication Date
KR20010005961A KR20010005961A (ko) 2001-01-15
KR100485847B1 true KR100485847B1 (ko) 2005-04-28

Family

ID=26720384

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7009038A Expired - Lifetime KR100485847B1 (ko) 1997-04-04 1998-04-03 개선된 연마용 패드 및 이에 관한 방법

Country Status (5)

Country Link
EP (1) EP1015176B1 (https=)
JP (1) JP2001518852A (https=)
KR (1) KR100485847B1 (https=)
DE (1) DE69812127T2 (https=)
WO (1) WO1998045087A1 (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6354915B1 (en) * 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US20010041511A1 (en) * 2000-01-19 2001-11-15 Lack Craig D. Printing of polishing pads
JP4615813B2 (ja) * 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用の研磨パッド
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6568997B2 (en) 2001-04-05 2003-05-27 Rodel Holdings, Inc. CMP polishing composition for semiconductor devices containing organic polymer particles
JP2003062748A (ja) * 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
US7059936B2 (en) 2004-03-23 2006-06-13 Cabot Microelectronics Corporation Low surface energy CMP pad
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
SG160368A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4898172B2 (ja) * 2005-09-08 2012-03-14 日本ミクロコーティング株式会社 研磨パッド及びその製造方法並びに研磨方法
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
BRPI0714710A2 (pt) 2006-07-14 2013-03-26 Saint Gobain Abrasives Inc artigo abrasivo sem reforÇo
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
JP5634903B2 (ja) 2010-02-25 2014-12-03 東洋ゴム工業株式会社 研磨パッド
JP2017064886A (ja) * 2015-10-02 2017-04-06 富士紡ホールディングス株式会社 研磨パッド
EP3571009A4 (en) 2017-01-20 2021-01-20 Applied Materials, Inc. THIN PLASTIC POLISHING ITEM FOR CMP APPLICATIONS
KR102203714B1 (ko) * 2018-07-17 2021-01-18 한국철도기술연구원 사출강도 개선을 위한 인서트 일체형 롤러
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
JPH04310365A (ja) * 1991-04-08 1992-11-02 Toshiba Corp 研磨皿
US5273558A (en) * 1991-08-30 1993-12-28 Minnesota Mining And Manufacturing Company Abrasive composition and articles incorporating same
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
EP1011919B1 (en) * 1997-08-06 2004-10-20 Rodel Holdings, Inc. Method of manufacturing a polishing pad

Also Published As

Publication number Publication date
JP2001518852A (ja) 2001-10-16
DE69812127D1 (de) 2003-04-17
EP1015176A4 (en) 2000-12-06
DE69812127T2 (de) 2003-11-27
EP1015176B1 (en) 2003-03-12
KR20010005961A (ko) 2001-01-15
EP1015176A1 (en) 2000-07-05
WO1998045087A1 (en) 1998-10-15

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