KR100484112B1 - Dual type heat sink and plasma dispaly panel assembly using the same - Google Patents

Abstract

A dual heater sink and a plasma display assembly employing the same are disclosed. The present invention relates to a plasma display device, a chassis base supporting the plasma display device, an adhesive means for adhering the plasma display device to the chassis base, a plurality of circuit boards attached to the chassis base, and a plasma display device. A cabinet accommodating the chassis base, wherein the cabinet includes a first fixing plate, a first heater sink portion having a first heat dissipation plate, a second fixing plate installed with an electronic component interposed therebetween, and a second cabinet. A heater sink having a second heater sink having a heat dissipation plate and a connecting means installed at a lower end of the first or second heater sink and fixed to the circuit board is installed. The generated heat can be quickly discharged to the outside through the first and second heater sinks symmetrical.

Description

Dual type heat sink and plasma dispaly panel assembly using the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display assembly, and more particularly, to a dual type heater sink having an improved structure of a heater sink so as to quickly discharge heat generated from a circuit board to the outside, and a plasma display assembly employing the same. It is about.

In general, the plasma display device assembly forms light electrodes on opposite surfaces of a plurality of substrates, and applies a predetermined power in a state in which discharge gas is injected into the space therebetween to emit light emitted by ultraviolet rays generated in the discharge space. Refers to an image display device that implements an image by using a. Plasma display assembly can be manufactured with a thin thickness of several centimeters or less, can have a large screen, and is attracting the spotlight as the next generation image display device in view of wide viewing angle of 150 degrees or more.

The plasma display device assembly manufactures a front panel and a rear panel, respectively, combines them, assembles a chassis base on the back of the panel, and mounts a circuit board on the chassis base so as to transmit electrical signals to the plasma display device. The manufacturing is completed by a predetermined inspection process and then mounted in a cabinet.

The circuit board includes various boards, such as X boards, Y boards, logic boards, image processing boards, power supply boards, addresser buffer boards, and the like, for transmitting electrical signals to the panel. Each of these boards is provided with a heater sink for quickly discharging heat generated during the operation of the plasma display device to the outside.

1 illustrates a heater sink 10 in which a conventional electronic component 100 is mounted.

Referring to the drawing, the electronic device 100 is mounted on the heater sink 10. The electronic component 100 is fixed to the heater sink 10 by a fastening means such as the bolt 110. The heater sink 10 in which the electronic component 100 is mounted is soldered to the circuit board 120.

The heater sink 10 includes an upright fixed plate 11 and a heat dissipation plate 12 extending in the horizontal direction from the fixed plate 11. The electronic component 100 is fastened to the back of the fixing plate 11 by the bolt 110, and the electronic component 100 is a component such as an FET that generates a lot of heat. The heat dissipation plate 12 is formed in a stacked form to be spaced apart from the fixed plate 11 by a predetermined interval. A connection member 130 is installed at the lower end of the heater sink 10 to solder and fix the heater sink 10 to the circuit board 120.

In the conventional heater sink 10 having the structure as described above, the electronic component 100 is mounted on the rear surface of the fixing plate 11, and the connection member 130 provided at the lower end of the heater sink 10 has a circuit board 120. ), The heat generated from the electronic component 100 during the driving of the plasma display device is quickly discharged to the outside through the heater sink 10 as indicated by the arrow.

However, the conventional heater sink 10 has the following problems.

Recently, the electronic component 100 mounted on the circuit board 120 has been highly integrated. The highly integrated electronic component 100 is known as a high heat generating element that generates a lot of heat. Accordingly, the design of the heater sink 100 to expel heat quickly will be necessary.

Second, the heater sink 100 is a cantilever, one fixing plate 11 is fixed, and the other heat dissipation plate 12 extending therefrom is a shape having a degree of freedom, an electronic component that is a noise source There is no separate means to prevent the vibration of the 100 to properly leak out.

Third, the heater sink 100 is concentrated on one side of the heat dissipation plate 12, so it is vulnerable to strength as it does not balance the force.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a dual type heater having an improved structure for quickly discharging heat generated from an electronic component mounted on a circuit board that electrically transmits a signal to a plasma display device. It is an object of the present invention to provide a sink and a plasma display assembly employing the same.

Another object of the present invention is to provide a dual heater sink having an improved structure to block noise generated from an electronic component, and a plasma display assembly employing the same.

It is still another object of the present invention to provide a dual heater sink having a reinforced strength by installing a heater sink having a left and right opposite structure on a circuit board, and a plasma display device assembly employing the same.

Dual heater sink according to an aspect of the present invention to achieve the above object,

A first heater sink having an upright shape first fixing plate and a plurality of first heat dissipation plates spaced apart from the first fixing plate by a predetermined interval in a horizontal direction;

A second heater sink having an upright shape second fixing plate and a plurality of second heat dissipation plates spaced apart from the second fixing plate by a predetermined interval in a horizontal direction; And

And connecting means formed on a lower end of the first or second heater sink part to solder and fix the first and second heater sink parts onto a substrate.

The first and second heater sinks may be symmetrical to each other.

In addition, an electronic component is attached by the fastening means between the outer surfaces of the first and second fixing plates so that heat can be discharged to both sides.

Furthermore, the connection means may include a connection groove provided on the rear surface of the heat dissipation plate, and a connection member having one end connected to the connection groove and having the other end connected to the circuit board.

In addition, the upper surface of the first and second fixing plate is characterized in that the noise prevention plate for covering both the first and third fixing plate in order to further block the noise generated from the electronic component.

Further, the noise prevention plate is characterized in that formed integrally with the first or second fixing plate.

Plasma display assembly employing a dual heater sink according to another aspect of the present invention,

A plasma display device for implementing an image;

A chassis base supporting the plasma display device;

Bonding means for mutually bonding a plasma display device to the chassis base;

A plurality of circuit boards attached to the chassis base; And

And a cabinet accommodating the chassis base coupled to the plasma display device.

The circuit board may include a first heater sink having a first fixing plate and a plurality of first heat dissipation plates spaced apart from each other by a predetermined distance in a horizontal direction so as to quickly discharge heat generated while driving the plasma display device; And a second heater sink portion having a second fixing plate provided with an electronic component interposed therebetween, a second heat dissipation plate formed in plurality in a horizontal direction from the second fixing plate in a horizontal direction, and the first or second portion. It is characterized in that the heater sink is installed at the lower end of the two sink portion and provided with a connecting means for fixing it to the circuit board.

Hereinafter, a plasma display device assembly according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 illustrates a plasma display assembly 20 according to an embodiment of the present invention.

Referring to the drawings, the plasma display device assembly 20 includes a plasma display device 21, a chassis base 22 supporting the plasma display device 21, and a plasma display device with respect to the chassis base 22. And a plurality of circuit boards 24 attached to the chassis base 22, and a chassis base 22 assembled with the plasma display device 21. The cabinet 25 is included.

The plasma display apparatus 21 includes a front panel 21a and a rear panel 21b which are installed to be coupled to face the front panel 21a.

On the front panel 21a, an X and Y electrode, a bus electrode for reducing the line term of the X and Y electrode, an X and Y electrode, a front dielectric layer filling the bus electrode, and a protective film layer covering the front dielectric layer Is formed.

On the rear panel 21b, an address electrode having a shape orthogonal to the X and Y electrodes, a back dielectric layer filling the address electrode, and a discharge space formed on the back dielectric layer are divided to cross-talk. And a red, green and blue phosphor layer formed inside the partition wall.

In the chassis base 22, a plasma display device 21 is fixed to the front surface of the chassis base 22 by a bonding means 23, and a circuit board 24 having a plurality of electronic components 26 mounted thereon is mounted on an opposite surface thereof. .

The adhesive means 23 has a double-sided tape interposed between the plasma display device 21 and the chassis base 22 in order to adhere the plasma display device 21 to the chassis base 22. In addition, a heat dissipation sheet may be further installed on the rear surface of the plasma display apparatus 21 so as to be attached together with the double-sided tape to perform an adhesive role and to dissipate heat.

The front cabinet 25a is located in front of the chassis base 22, the plasma display device 21 coupled to the front surface of the chassis base 22, and the circuit board 24 coupled to the rear surface of the chassis base 22. ) Is installed. A cover back 25b to which the front cabinet 25a is coupled to provide a space for accommodating the plasma display device 21, the chassis base 22, and the circuit board 24 behind the chassis base 22. It includes.

According to a feature of the invention, a circuit, for example an energy recovery circuit, for recovering energy lost from the circuit board 24, in particular, the plasma display device 21, which is in electrical communication with the plasma display device 21. The electronic component 26 disposed on the recovery circuit (ERC) is provided with a dual type heat sink for quickly dissipating heat due to high integration and blocking noise generated from vibration.

In more detail, as shown in FIG.

3 illustrates a heater sink 30 according to a first embodiment of the present invention, and FIG. 4 is a cross sectional view of FIG. 3.

Referring to the drawings, the heater sink 30 may include a first heater sink unit 31, a second heater sink unit 310 installed to face the first heater sink unit 31, and the first and second heater sinks 31. And a noise prevention plate 390 installed on the second heater sinks 31 and 310.

The first heater sink portion 31 is provided with a first fixing plate 32 having an upright shape. The first heat dissipation plate 33 is formed in a horizontal direction from one side wall of the first fixing plate 32. A plurality of first heat dissipation plates 33 are disposed to be spaced apart at predetermined intervals in the vertical direction of the first fixing plate 32 to widen the heat dissipation area, and are integrally formed with the first fixing plate 32. .

Fixing means are formed in the first heater sink part 31 to fix it on the circuit board 39. The fixing means includes a connection groove part 34 formed on the rear surface of the heat dissipation plate 33a positioned at the lowermost part of the first heat dissipation plate 33 of the stack type, and a connection member 35 inserted into the connection groove part 34. . One end 35a of the connection member 35 is inserted into the connection groove 34, and the other end 35b is solderable to the circuit groove 39a on the circuit board 39.

The second heater sink unit 310, which is installed to face the left and right sides of the first heater sink unit 31, has the same basic structure as that of the first heater sink unit 31.

That is, a second fixing plate 320 upright is formed in the second heater sink 310, and from one side wall of the second fixing plate 320, a second heat dissipation plate of flat type in the horizontal direction is formed. 330 is formed. The plurality of second heat dissipation plates 330 are disposed to be spaced apart by a predetermined interval in the vertical direction of the second fixing plate 320.

In this case, the second fixing plate 320 is disposed to be spaced apart from the first fixing plate 32 by a predetermined interval, and a space S exists between the outer walls of the first and second fixing plates 32 and 320. Doing. In the space S, a highly integrated electronic component 40 that generates a lot of heat, such as a FET, is disposed.

Both surfaces of the electronic component 40 are in contact with the first and second fixing plates 32. The electronic component 40 penetrates and is fixed to the first and second fixing plates 32 using a fastening means such as the bolt 41. In this case, the buffer tapes 48a and 48b may be additionally interposed on both surfaces of the electronic component 40 to prevent damage during fastening.

The second heater sink 310 has a connection groove 340 formed on a rear surface of the heat dissipation plate 331 located at the bottom of the stacked second heat dissipation plates 330 to fix it on the circuit board 39. It is. One end 351 of the connection member 350 may be inserted into the connection groove 340. The other end 352 of the connection member 350 is solderable to the circuit groove 39a on the circuit board 39.

As described above, the heater sink 31 is provided with the first sink 31 and the second sink 310 which are substantially symmetrical with each other, and the first and second sinks 31 and 310. The position of the electronic component 40 is set by the bolt 41 in the space S between them.

In addition, the first and second connection members 35 and 350 are inserted into the first and second connection grooves 34 and 340 formed at the lower ends of the first and second sinks 31 and 310, respectively. And end portions 35b and 352 of the first and second connection members 35 and 350 are fixed to the circuit groove portions 39a of the circuit board 39, respectively, so that the circuit board 39 The heater sink unit 30 is fixed in a state in which stress is not concentrated on either side.

On the other hand, the noise prevention plate 390 is installed on the heater sink portion 30. The noise prevention plate 390 is installed to simultaneously cover an upper surface of the first heater sink unit 31 and an upper surface of the second heater sink unit 310.

That is, the noise prevention plate 39 may include first and second heater sinks disposed between the electronic component 40 to seal the upper side of the space S in which the electronic component 40 is installed to the outside. 31) The upper surface of 310 is covered.

In this case, the area where the noise prevention plate 39 is formed on the upper surfaces of the first heater sink unit 31 and the second heater sink unit 310 is an upper portion of the space S in which the electronic component 40 is installed. The side area should be included and the area occupied on the first and second heater sink portions 31 and 310 should be substantially the same in order to maintain the left and right balance.

The noise prevention plate 39 may be provided separately from the first and second heater sinks 31 and 310 and may be coupled to an upper surface of the first and second heater sinks 31 and 310. It will be advantageous to manufacture integrally with the first and second heater sinks 31 and 310 in terms of preventing vibration and enhancing strength.

Looking at the operation of the dual-type heater sink 30 having the above structure as follows.

The first and second heater sinks 31 and 310 which are symmetrical to each other are soldered and fixed on the circuit board 39, and the space S therebetween is highly integrated electronic component 40 that generates a lot of heat. ) Is penetrated by the bolt 41 through the first and second fixing plates 32 and 320. In addition, the first and second heater sinks 31 and 310 are fixed to the circuit board 39 by soldering. On the other hand, the noise prevention plate 390 is formed on the upper surfaces of the first and second fixing plates 32 and 320 to block the upper region of the space S in which the electronic component 40 is installed from the outside. .

Accordingly, when heat is generated in a driving board or the like in which the energy recovery circuit is patterned while driving the plasma display device, the heat generated from the electronic component 40 such as the FET is generated as shown by the arrow in FIG. 4. It is quickly discharged to the outside through the first and second heat dissipation plate 330 disposed at predetermined intervals in the vertical direction via the first and second fixing plates 32, 320 from both surfaces of the 40. .

In addition, vibration of the electronic component 40 may cause noise while the plasma display device is being driven, and noise propagated in an upper direction of the space S in which the electronic component 40 is installed may be caused by the noise prevention plate 390. It is blocked by) and will not leak out.

Applicant's experiment result of temperature change and noise measurement of the electronic component 40 after the dual heater sink 30 is mounted on the energy recovery circuit portion of the circuit board of the plasma display device is shown in Table 1. Same as one.

Example Comparative example Temperature of Electronic Components (℃) 89 105 Noise (dB) 27 31

Referring to Table 1, first of all, an experimental standard was used for a plasma display device implementing a 42-inch screen, and the atmospheric temperature was performed at 25 ° C. A comparative example is the conventional heater sink 10 shown in FIG. 1, and the embodiment is a heater sink 30 according to the embodiment of the invention shown in FIG. 3.

When the dual heater sink 30 is mounted on the drive board, the temperature of the electronic component 40 is 89 ° C. On the other hand, when the conventional heater sink 10 was measured under the same conditions, the temperature of the electronic component 100 showed 105 ° C. As such, the case in which the dual-type heater sink 30 was mounted showed a temperature reduction effect of 16 ° C. compared with the case in which the conventional heater sink 10 was mounted.

In addition, the noise in the case of mounting the dual-type heater sink 30 represents 27dB, the conventional heater sink 10 represents 31dB, showing a noise reduction effect of 4dB.

As such, when the electronic component 100 is disposed in the conventional cantilever heater sink 10, the electronic component 100 vibrates according to the flow of current due to excessive power consumption, and thus the heater sink 10. The vibration causes the noise.

On the other hand, in the dual heater sink 30 according to the present invention, the noise prevention plate 390 is installed on the first and second heater sinks 31 and 310 so that the first and second heater sinks are installed. The parts 31 and 310 are mechanically formed from an open type to a closed type. Therefore, vibration of the first and second heater sinks 31 and 310 can be limited, so that vibration noise can be prevented.

In addition, as in the conventional case, when the electronic component is disposed between a plurality of heater sinks (not shown) than the heater sink 10 attached only to one surface of the electronic component 100, the electronic component 100 is thermally improved. When the contact heat resistance of the other surface is small with respect to one surface of the role of the heater sink 10 becomes meaningless.

On the contrary, when the noise prevention plate 390 is installed on the first and second heater sinks 31 and 310, as in the dual heater sink 30 according to the present invention, the first and the second facing sinks 30 are provided. The temperature difference occurring between the two heater sinks 31 and 310 can be thermally equilibrated.

In addition, when only one surface of the electronic component 100 is attached to the heater sink 10, it is not possible to recover from damage of the connection member 130 due to torsion or dropping impact because it is an open structure.

On the other hand, since the dual heater sink 30 according to the present invention is a closed structure in which the noise prevention plate 390 is installed on the first and second heater sinks 31 and 310, the first and second heater sinks 30 are provided. 2 heater sinks 31 and 310 are connected by an anti-noise plate 390. Accordingly, the bearing force to withstand the force applied structurally is more than twice as much as in the conventional case, it can be said that it is resistant to impact.

5 to 7 show a heater sink according to the second to fourth embodiments of the present invention.

Here, the same reference numerals as in the above-described drawings indicate the same members having the same function.

Referring to FIG. 5, the heater sink 50 may include a first heater sink 51 and a second heater sink 510 symmetrically.

The first heater sink 51 includes an upright first fixing plate 52 and a plurality of first heat dissipation plates 53 extending in a horizontal direction from the first fixing plate 52. In addition, the second heater sink unit 510 includes a second fixing plate 520 having an upright shape and a plurality of second heat dissipation plates 530 extending therefrom in a horizontal direction.

An electronic component 40 is interposed between the first and second fixing plates 52 and 520, and both surfaces of the electronic component 40 are the first and second fixing plates 52 and 520. It is in contact with the outer surface. The electronic component 40 is fastened and fastened through the first and second fixing plates 52 and 520 by bolts 41.

An upper surface of the first and second heater sinks 51 and 510 covers a space in which the electronic component 40 is installed, and noise is prevented over the first and second heater sinks 51 and 510. The plate 590 is provided.

At this time, a connecting means 55 is formed on the rear surface of the heat dissipation plate 531 located at the bottom of the second heat dissipation plate 530 to fix the heater sink 50 to the circuit board 39. Since the structure of the connecting means 55 is mentioned in Embodiment 1, it will be omitted here.

In the case of Fig. 6, unlike the second embodiment, the noise prevention plate is not installed.

That is, the heater sink 60 is installed on the first heater sink 61 and symmetrically thereto, and the second heater sink 610 of which the lower end is soldered and fixed to the circuit board 39 by the connecting means 650. ).

The first heater sink unit 61 includes a first fixing plate 62 and a first heat dissipation plate 63 disposed in a horizontal direction, and the second heater sink unit 610 is second fixed. The plate 620 and the second heat dissipation plate 630 disposed in the horizontal direction.

In the case of FIG. 7, unlike the second embodiment, when the margin of the circuit board 39 is insufficient, the overall width of the heater sink 70 is designed to be narrowed by W ₁ + W _2, as shown by the dotted line. will be.

That is, the first heater sink portion 71 including the first fixing plate 72, the first heat dissipation plate 73 in the horizontal direction, the second fixing plate 720, and the second heat dissipation in the horizontal direction. The overall width of the second heater sink 710 made of the plate 730 is about one half of the heater sink 50 shown in the second embodiment. Noise prevention plates 790 are formed on upper surfaces of the first and second heater sinks 71 and 710.

As such, the dual-type heater sink consists of first and second heater sinks which are symmetrical, and has various shapes such as no connection means or no noise prevention plate applied to one of the heater sinks according to the specification of the circuit board. Can be designed.

As described above, in the dual heater sink of the present invention and the plasma display device assembly employing the same, the first and second heater sinks are symmetrically disposed, and a noise prevention plate is installed on the first and second heater sinks. And as the electronic component that generates a lot of heat between the second heater sink portion can be obtained the following effects.

First, the first and second fixing plates in which heat generated from the electronic component is in contact with both surfaces of the electronic component during driving of the plasma display device, and the first and second heat dissipation plates connected to a plurality of horizontally connected to the first and second fixing plates. As it is quickly discharged through the second heater sink, the heat dissipation efficiency is greatly improved.

Second, since the heater sinks are supported by both sides of the electronic parts, the vibration of the electronic parts, which are noise sources, is primarily prevented, and since the noise prevention plates are installed on the upper surfaces of the first and second heater sinks, the secondary occurs. Blocks noise from leaking outside. This significantly reduces noise.

Third, since the first and second heater sinks are symmetrically disposed on the substrate, and the noise prevention plate is provided at the top, the balance of power is maintained. As a result, the strength is increased.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a cross-sectional view showing a heater sink equipped with a conventional electronic component,

2 is an exploded perspective view illustrating a plasma display assembly according to an embodiment of the present invention;

3 is an exploded perspective view illustrating a heater sink equipped with an electronic component according to a first embodiment of the present disclosure;

4 is a cross-sectional view of FIG.

5 is a cross-sectional view illustrating a heater sink in which an electronic component is mounted according to a second exemplary embodiment of the present invention;

6 is a cross-sectional view illustrating a heater sink equipped with an electronic component according to a third exemplary embodiment of the present invention;

7 is a cross-sectional view illustrating a heater sink in which an electronic component according to a fourth embodiment of the present invention is mounted.

<Brief description of symbols for the main parts of the drawings>

20.Plasma Indicator Assembly

21 Plasma indicator 22 Chassis base

23. Adhesive means 24 ... Circuit board

25a ... front case 25b ... cover bag

30.Heater sink 31 ... First heater sink

32..First fixing plate 33 ... First heat dissipation plate

34 ... Connection groove 35 ... Connection member

310 ... second heater sink 320 ... second fixing plate

2nd heat dissipation plate 340

350 ... connection member

Claims (10)

A first heater sink having an upright shape first fixing plate and a plurality of first heat dissipation plates spaced apart from the first fixing plate by a predetermined interval in a horizontal direction; A second heater sink unit having an upright shape second fixing plate and a plurality of second heat dissipation plates formed to be spaced apart from the second fixing plate by a predetermined interval in a horizontal direction; And connecting means formed at a lower end of the first or second heater sink to solder the first and second heater sinks onto a substrate. An electronic component is attached by the fastening means so that heat can be discharged to both sides between the first and second fixing plates, and the upper surface of the first and second fixing plates blocks noise generated from the electronic components. In order to cover the first and the second fixed plate to prevent the noise prevention plate is installed, The connecting means has a dual heater sink, characterized in that one end is connected to the connecting groove formed in the lower end of the first or second heat dissipation plate, the other end is connected to the circuit board. The method of claim 1, Dual heater sinks, characterized in that the first and second heater sinks are symmetrical. delete delete delete The method of claim 1, And the noise preventing plate is integrally formed with the first or second fixing plate. A plasma display device for implementing an image; and A chassis base for supporting the plasma display device; Bonding means for adhering a plasma display device to the chassis base; A plurality of circuit boards attached to the chassis base; And a cabinet accommodating the chassis base coupled to the plasma display device. The circuit board includes a first heater sink portion and a second heater sink portion disposed to face the first heater sink portion and provided with an electronic component between the first heater sink portion, The first heater sink unit is provided with a first heat dissipation plate and a plurality of first heat dissipation plates formed to be spaced apart from each other by a predetermined distance in the horizontal direction, and the second heater sink unit is spaced apart from the second fixing plate by a predetermined distance in the horizontal direction. A plurality of second heat dissipation plates are installed, An upper surface of the first and second fixing plate is provided with a noise prevention plate for covering the first and second plate together to block noise generated from the electronic components, And a connecting means provided at a lower end of the first or second heater sink unit to fix it to a circuit board. The method of claim 7, wherein And the first and second heater sinks are symmetrical to each other. delete The method of claim 7, wherein And the noise preventing plate is integrally formed with the first or second fixing plate.