KR100477546B1 - Method for organic material deposition and the apparatus adopting the same - Google Patents

Abstract

A method of depositing an organic material and an apparatus using the same are disclosed. The disclosed method comprises: with a substrate and a mask mounted in a vacuum deposition chamber, evaporating the organic material source to be deposited on the substrate outside the deposition chamber to obtain organic vapor and mixing it with a transfer gas to transfer it to the deposition chamber. The organic material deposition is performed. Evaporated organic materials are uniformly sprayed on the entire substrate to rotate the substrate or to deposit organic thin films uniformly on the substrate without scanning the evaporation boat around the substrate. No parts are required, making the device smaller in size.

Description

Organic material deposition method and apparatus applying the same {Method for organic material deposition and the apparatus adopting the same}

The present invention relates to a method for depositing an organic material and a device to which the same is applied. In detail, the present invention relates to an organic material, an organic metal compound, a polymer, and a light emitting material of an organic light emitting device (OLED). It relates to a deposition method and a deposition apparatus using the same.

Recently, there are various flat panel display devices that can reduce volume and weight, which are disadvantages of cathode ray tubes, and such flat panel display devices are liquid crystal displays (LCDs) and field emission displays (FEDs). ), Plasma display panels (PDPs), organic and inorganic electroluminescent devices (ELDs), and the like.

FIG. 1 is a view showing a typical structure of an organic light emitting device (OLED) using an organic light emitting material layer (EML) emitting light by an electric field.

Referring to FIG. 1, in the organic light emitting diode, a transparent electrode 2 is formed on a substrate 1, and is disposed between the metal electrode 8, the metal electrode 8, and the transparent electrode 2 positioned on the top thereof. Formed between the light emitting layer 5 to be formed and the electron injection layer 7 and the electron transport layer 6, the light emitting layer 5, and the transparent electrode 2 formed between the light emitting layer 5 and the metal electrode 8. A hole injection layer 3 and a hole transport layer 4.

The metal electrode 8 is made of aluminum or the like. This metal electrode is connected to a gate driving circuit formed on the substrate. This drive circuit includes a switching element in the case of an active matrix type, and is formed first on the surface of the substrate 1 before the metal electrode 8 is formed. The transparent electrode 2 is formed of a transparent conductive material such as indium-tin-oxide (ITO). A signal is applied to the transparent electrode 2 from the data driver circuit. When the scanning pulse is supplied from the metal electrode 8 and the data is applied from the transparent electrode 2, holes generated from the transparent electrode 2 are accelerated toward the metal electrode 8 and generated from the metal electrode 8. The electrons are accelerated toward the transparent electrode 2. The electron injection layer 7 supplies electrons supplied from the metal electrode 8 to the electron transport layer 6. The electron transport layer 6 accelerates and supplies electrons supplied from the electron injection layer 7 to the light emitting layer 5. The hole injection layer 3 supplies holes supplied from the transparent electrode 2 to the hole transport layer 4. Holes supplied through the hole transport layer 4 and electrons supplied through the electron transport layer 6 collide at the center of the light emitting layer 5. In this case, in the light emitting layer 5, light of visible light is generated by recombination of electrons and holes. The visible light comes out through the transparent electrode to display a predetermined image.

2 is a view showing a conventional organic material deposition apparatus for forming the light emitting layer during the OLED manufacturing process.

Referring to FIG. 2, a deposition source 11a and 11b having red, green, and blue light emitting organic materials, a deposition material container for storing the same, and a heating device are provided below the vacuum chamber 10. The substrate 12 to be deposited is located.

The substrate 12 is supported by the substrate holder 12a, and a metal mask 13 having a deposition pattern is positioned below the substrate 12. The magnet system 14 is provided on the substrate 12 to clamp the substrate 12 and the metal mask 13 in close contact with each other by electromagnetic force. The magnet seat system 14 is coupled to the rotary support rod (14a). The substrate holder 12a and the metal mask 13 are supported by the support 16. Meanwhile, a camera 15 for monitoring the alignment between the metal mask 13 and the substrate 12 is positioned above the chamber 10.

The inside of the vacuum chamber 10 maintains a vacuum state by a vacuum exhaust device (not shown) in order to prevent foreign substances from entering from the outside and improve adhesion of organic materials. The deposition sources store red, green, and blue light emitting organic materials, and dopant materials are stored in addition to the red, green, and blue host materials. These deposition sources 11a and 11b are heated to a predetermined temperature during deposition to evaporate the main material and the coloring material. The metal mask 13 serves to deposit the light emitting material in a predetermined pattern on the substrate 12. To this end, a plurality of holes are formed in the metal mask 13 in a predetermined pattern. These holes selectively pass through the light emitting organic material supplied in a vapor state from the deposition source to supply the substrate 12. At this time, the metal mask 13 is placed on the substrate 12 in a state where the portion of the metal mask 13 and the portion to be deposited on the substrate 12 are exactly aligned with the camera 15 installed on the upper portion of the vacuum chamber 10. It is in close contact with an electromagnet generating electromagnetic force.

In more detail, the deposition process is first supplied to the substrate holder 12a from the outside of the vacuum chamber 10. When the substrate is mounted on the substrate holder 12a, the workers may use the camera 15 to match the substrate 12 and the metal mask 13 and then closely contact each other. At this time, the inside of the vacuum chamber 10 maintains a vacuum state. The deposition of the light emitting organic material on the substrate 12 is started by heating and evaporating the main material and the coloring material stored in the deposition sources 11a and 11b.

Evaporated luminescent organic materials are deposited on the substrate 12 in a predetermined pattern via the holes of the metal mask 13. In this deposition method, since the organic material supplied from the deposition source is evaporated and blown away at one point, it is difficult to deposit a uniform thickness as the size of the substrate 12 increases. In addition, this method is difficult to produce high quality panels at low cost due to limited use efficiency of low deposition materials and difficulty in controlling the mixing ratio of the main material and the coloring material.

The present invention has been made to overcome the above problems, and a first object of the present invention is to provide an organic material deposition method capable of uniformly depositing an organic material on a large area substrate and an apparatus using the same.

It is a second object of the present invention to provide an organic material deposition method capable of depositing an organic material and depositing the mixing ratio of a main material and a coloring material of an organic material, and an apparatus using the same.

A fourth object of the present invention is to provide an organic material deposition method capable of increasing the deposition rate of organic materials and an apparatus using the same.

A fifth object of the present invention is to provide an organic material deposition method and an apparatus using the same which can maximize the use efficiency of the organic material.

According to the present invention to achieve the above object,

A deposition chamber provided with an exhaust unit at one side;

A substrate holder provided in the deposition chamber to mount a substrate to be deposited with an organic material and a metal mask for masking the substrate;

A manifold for supplying organic vapor from the outside facing the substrate to the substrate;

An organic vapor generating unit provided outside the deposition chamber and generating the organic vapor;

A steam transfer unit for transferring steam from the steam generator to the manifold;

A carrier gas supply unit supplying a carrier gas to the steam generator; Provided is an organic material deposition apparatus.

According to one embodiment of the deposition apparatus of the present invention, the substrate holder is arranged in a horizontal direction so that the plane of the substrate can face in the horizontal direction, the manifold is sprayed organic vapor in the horizontal direction to the surface of the substrate To be supplied.

The organic vapor generating unit includes a canister in which the organic source is stored, a heating device for heating the canister, a filter provided in the canister, and a filter for filtering the organic material source. Prevents condensation of steam.

On the other hand, the manifold has a plurality of vapor flow space for diffusing and supplying the introduced organic vapor in multiple stages, the vapor diffusion plate is provided between the vapor flow space.

According to a preferred embodiment of the present invention, the substrate holder is connected to the cooling water supply unit for supplying the cooling water, the substrate holder is provided with a magnet system for in close contact with the surface of the substrate holder with the metal mask, The deposition chamber is heated to 100 ° C. or higher, and nitrogen or argon gas is used as the carrier gas. And for more efficient supply of organic vapor, the manifold has a vapor flow space having a size that gradually expands in the steam traveling direction.

In addition, the organic material deposition method according to the present invention to achieve the above object:

A first step of mounting a substrate, which is an organic material deposition target, and a mask for masking the same, in a deposition chamber;

Exhausting the deposition chamber;

A third step of generating an organic vapor by evaporating an organic source to be deposited on the substrate outside the deposition chamber;

A fourth step of mixing the organic vapor and a transfer gas to the deposition chamber;

And mixing and dispersing the organic vapor and the transport gas mixture to supply the organic vapor to the entire surface of the substrate.

According to a preferred embodiment of the organic material deposition method according to the present invention, for effective organic material deposition, the substrate is disposed so that the plane of the substrate is in the horizontal direction, the organic vapor is advanced in the horizontal direction to contact the substrate, The transfer gas is supplied and mixed together in the process of evaporating the organic material source.

According to another preferred embodiment of the present invention, the transfer gas is heated, the heated transfer gas is mixed with the organic vapor, and nitrogen or argon gas is applied as the transfer gas. In addition, in depositing an organic material according to the present invention, the organic material is deposited while the substrate is cooled. The organic vapor is composed of a plurality of organic materials, the organic materials are evaporated by a separate heating device to be mixed with each other, and heated in the process of transferring the mixed organic vapor and the transfer gas to the deposition chamber.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. 3 is an overall configuration diagram of an organic material deposition apparatus of the organic material deposition method according to the present invention.

The deposition apparatus of the present invention includes a deposition unit 100 in which deposition on a substrate is largely performed, a vacuum exhaust unit 200 exhausting the inside of the deposition chamber, a steam generator 300, and a steam generator 300 of organic materials. Steam transfer unit 400 for transferring the steam from the vapor deposition chamber, and the transfer gas supply unit 500 for supplying the transfer gas to the steam generating unit 300.

The deposition unit 100 may include a substrate holder 102 and a substrate that hold the deposition chamber 108 and the substrate 101 together with the metal mask 104 provided with a gate valve 109 through which a substrate and the like enter and exit at one side. A manifold 103 for supplying organic vapor to the 101 and a metal mask 104 defining a deposition region of the substrate 101 are provided. The manifold 103 is connected to the vapor transport unit 400 to supply organic vapor evenly spread throughout the substrate 101.

The substrate holder 102 is provided with a magnet system 105 to hold the metal mask 104 by the magnetic force of the magnet system 105 to the substrate holder 102 so that the substrate 101 therebetween becomes a substrate holder. It is attached to (102) together. On the other hand, a heating device 600 is provided around the manifold 103 to prevent organic vapor flowing in the manifold 103 from condensing inside the manifold 103. The heating device 600 is not only the manifold 103 but also the wall of the deposition chamber, where the organic matters due to the condensation of organic matters such as the vapor generating unit 300 and the vapor transfer unit 400 of the organic material described above should be prevented. To be prepared.

A lower portion of the substrate holder 102 is provided with a support 106 for supporting it, and a cooling water supply device 107 for cooling the substrate holder 102 is connected thereto. Therefore, a path through which cooling water can be circulated must be provided in the substrate holder 102. The substrate holder 102 cooled by the cooling water absorbs heat from the substrate 101 to solidify the organic vapor deposited on the substrate 101. The manifold 103 diffuses and supplies the supplied organic vapors evenly therein, and diffuses and supplies the organic vapors to the entire substrate 102. The steam generator 300 includes two canisters 301 and 302 in which the source materials are stored, and around the canisters 301 and 302 for evaporating the source material in the canisters 301 and 302. A heating device 601 is provided. In FIG. 3, V1 to V9 are valves for controlling the carrier gas and the organic vapor. The canisters 301 and 302 are connected to the transport gas supply unit 500 so that the transport gas is supplied to the canisters 301 and 302, and the organic vapor generated in the canisters 301 and 302 is then managed by the manifold of the deposition unit 100. It transports to the folder 103. Between the canisters 301 and 302 and the deposition unit 100, an organic vapor transport pipe 401 through which organic vapor and a transport gas transporting the organic vapor flows is provided, and for preventing condensation of vapor transported therein. The heating device 600 is provided. The transport gas supply unit 500 is connected to the exhaust unit 200 for exhausting the deposition chamber 108 of the deposition unit 100 through a bypass path provided with valves V6 and V7, and the exhaust unit ( 200 can be bypassed.

FIG. 4A shows one embodiment of a steam generator for evaporating organic material, and FIG. 4B schematically shows another embodiment.

Referring to FIG. 4A, an organic source is accommodated in the lower portions of the canisters 301 and 302, and a lower end of the carrier gas injection tube 303 extends to the bottom of the canisters 301 and 302. The gas injection pipe 303 is provided with a gas flow regulator 305 and valves V4 and V5 and V2 and V3 for controlling the flow of gas. The organic vapor transport pipe 401 provided with the valves V2 and V3 is connected to the upper portions of the canisters 301 and 302. A filter 304 for filtering organic vapor is provided above the canisters 301 and 302.

In the case of the canister 301a shown in FIG. 4B, the carrier gas injection pipe 303 and the organic vapor transport pipe 401 are respectively connected to both sides thereof, and an organic material source is provided at the inner center of the canister 301a. Filters 304 and 304 are provided on both sides. A diffusion space 312 for a carrier gas may be provided at one side of the canister 301b, and the diffusion space may be provided at the canister 301a of FIG. 4A.

5A and 5B show schematic cross-sectional structures of embodiments of manifolds 103a and 103a 'provided inside the deposition chamber 108. FIGS. The manifold 103a shown in FIG. 5A has a trumpet-shaped vapor flow space 103b that linearly expands in diameter, and has two vapor diffusion plates 103c and 103d having a plurality of vapor passage holes formed therein. It is prepared. A heating device 600 is provided on the inner wall 103e of the steam flow space 103b. The manifold 103b shown in FIG. 5B differs in that the steam flow space 103b 'has a diameter that is curved and enlarged, and the rest of the manifold 103b is about the same.

Referring to Figure 3, an embodiment of the organic material deposition method according to the present invention will be described in detail.

The interior of the deposition chamber 108 is continuously exhausted by the vacuum exhaust unit 200 having a vacuum pump or the like to maintain a vacuum state. The deposition chamber 108 is heated to a temperature of about 150 ° C., for example, to prevent deposition of organic matter on the inner wall of the deposition chamber 108 and the like during deposition of the organic material.

After receiving the canister of the main material and the coloring material of the organic material as the deposition material, it is heated by a heating device 601 provided in the canisters 301a and 301b to heat and evaporate the organic material source in the canister.

When the canisters 301a and 301b are heated above the evaporation temperature of the organic material, a carrier gas for transporting the canisters 301a and 301b is supplied to the canisters 301a and 301b so that the carrier gas contacts the organic source as much as possible and then evaporates. Allow organic vapor to be supplied to the deposition chamber. At this time, the powder particles are filtered by a filter installed in the canisters 301a and 301b and only steam is supplied to the deposition chamber 108. At this time, it is preferable to allow the carrier gas and the organic material source to be sufficiently contacted. The passing size of the filter is preferably set in the range of 0.03 ~ 0.1㎛. At this time, in order to increase the contact area between the carrier gas and the source material, the carrier gas is sufficiently diffused in the diffusion space 312 so as to have a uniform partial pressure in the canisters 301a and 301b.

In addition, only the carrier gas or the vapor of the organic source passing through the canister passes, and the organic source particles are not allowed to pass through the multiple filters of the solid. Such a structure serves to generate a sufficient source of vapor even at low temperatures and to rule out the possibility that solid organic source particles can be directly supplied to the deposition chamber.

As such, the use of a carrier gas promotes vaporization of the organic material source, and effectively transports a large molecular weight organic material from the canister to the deposition chamber 108. At this time, the carrier gas is preferably heated to the same or higher temperature of the canister. For this purpose, it is preferable to have a gas heating system for heating a separate carrier gas, but it is also possible to make the transport pipe 401 of the carrier gas long or spirally rolled to have a sufficient time for heating. In addition, it is preferable that all the tubes through which the carrier gas or the vapor of the organic source passes through are heated sufficiently by the heating device 600 so that the organic source does not condense and stick. The heating temperature of the transport pipe 401 is preferably heated to a temperature equal to or higher than the temperature of the canister. In this case, when using the main material and the coloring material at the same time, by controlling the temperature of heating each organic source and the flow rate of the carrier gas, it is possible to accurately control the amount of the coloring material as an additive.

When the vapor of the organic source is moved by the carrier gas and arrives at the distribution manifold 103, the vapor of the organic source is well mixed through the double or more diffusion spaces and the diffusion plate so that the vapor is uniformly sprayed onto the substrate 101. And uniform spraying is achieved. In each of the spaces partitioned by multiple diffusion plates, the organic source is sufficiently diffused and mixed and then supplied to the substrate 101. The shape of the flow space in the manifold may have various shapes other than those of FIGS. 5A and 5B. At this time, the manifold 103 is preferably heated to a temperature equal to or higher than the temperature of the transport pipe 401 by the heating device 600. For this purpose, it is preferable to wind the heating wire directly inside the manifold, to circulate using a medium of a constant temperature in a heat exchange system, or to heat using a lamp heater.

The organic vapors uniformly injected from the manifold 103 are deposited on the substrate 101, where the substrate 101 is sufficiently cooled to allow the organic vapors to sublime and be deposited on the substrate, It is desirable to cool to a temperature lower than the vapor pressure of each organic source to prevent thermal expansion. More preferably, the temperature is controlled to 50 ° C or lower.

In the case of depositing a thin film using two organic materials, the deposition chamber 108 is heated to a predetermined temperature (about 150 ° C.) to maintain a predetermined vacuum state (10 Torr or less). In addition, the carrier gas is heated and maintained above the evaporation temperature of the organic main material, and the organic color developing material is also heated above the evaporation temperature to maintain a sufficient amount of the organic source. At this time, if the evaporation temperature of the main material and the coloring material is different, it is natural that the temperature of the canister or carrier gas should be controlled differently. The prepared carrier gas is bypassed through the flow regulator to keep the flow regulator stable. The temperature of the substrate holder is controlled to maintain the room temperature by circulating the cooling water at room temperature. When the substrate is positioned over the substrate holder through the gate valve, the substrate is seated on the substrate holder by the vertical pin. When placed on the substrate holder, the alignment line is exactly matched through the camera for accurate alignment with the metal mask, and then the metal mask is placed to overlap the substrate. At this time, the magnet system 105 is operated to be in close contact with the metal mask so that organic matter is not deposited in the gap between the metal mask and the substrate during deposition. In addition, the distribution manifold is heated to the same or higher temperature than the steam inlet tube so that the entire manifold is kept at a uniform temperature. Through the above process, the preparation step for depositing the organic material on the substrate is completed. Now, the carrier gas that has been bypassed is blocked by the valves V6 and V7, and the valves V2, V3, V4 and V5 are opened to pass through the organic material source, and then injected into the substrate 101 through the manifold. After allowing the organic source vapors to be ready for the desired time, shut off all valves V2, V3, V4 and V5 before and after the valve canister and open V6 and V7 to bypass the transport gas through the bypass path to the exhaust side. After deposition is complete, the magnet system is operated to remove the metal mask from the substrate, and then the metal mask is moved upward to completely remove the metal mask from the substrate. When the metal mask is removed, the substrate is raised to move the substrate by a robot (not shown). The organic layer may be deposited through a repeated process.

As shown in FIG. 3, a vertical deposition method in which the organic vapor is supplied vertically may be taken. Meanwhile, a horizontal deposition method in which the surface of the substrate faces the horizontal direction, that is, the organic vapor flows in the horizontal direction may be employed. Can be taken.

The horizontal deposition method is schematically illustrated in FIG. 6. Referring to FIG. 6, the plane of the substrate 101 and the metal mask 104 corresponding thereto is installed to be horizontal. Corresponding to this arrangement, the manifold 103 is also installed in the horizontal direction so that the steam jet plate faces the metal mask 104 and the substrate 101.

Such a structure can effectively prevent sagging of the substrate, the metal mask, and the like due to gravity caused when the planes of the substrate 101 and the metal mask 104 face the horizontal direction, as shown in FIG. 3. .

As described above, according to the present invention, the organic vapor is not diffusely distributed at one point as in the related art, but can be uniformly supplied to the entire surface of the substrate after being sufficiently diffused in the manifold. This is made possible by the structure that allows organic vapors to be generated outside of the deposition chamber and supplied to the manifold within the deposition chamber.

This method enables effective organic deposition on large area substrates. This possibility helps the development of current organic EL devices, which are mainly used as small display devices such as display windows of portable telephones, to large display devices such as computers and televisions. In addition, a canister generating organic vapor is introduced, and a sufficient amount of organic vapor can be obtained even at a low temperature by maximizing the area where the carrier gas passes through the organic raw material source therein.

In addition, by installing a filter of mesh or other material in the canister, a method of depositing a high-quality organic thin film by fundamentally blocking the possibility that the carrier gas passes through the organic raw material source and the powder raw material source can be directly supplied to the manifold. To provide.

In addition, the structure of the manifold allows the vapor to be mixed and dispersed in a double or more structure to uniformly distribute the organic vapor injected onto the substrate, thereby forming an organic thin film having a uniform thickness.

In addition, the present invention maximizes the efficiency of the organic material by cooling the substrate holder to allow all organic vapors that reach the substrate to be sublimed and deposited.

In addition, since the amount of vapor evaporated from the canister is controlled by the control of the carrier gas by a separate gas flow controller, it is possible to precisely control not only the main raw material but also the coloring material, and in particular, the amount of organic vapor by the amount of carrier gas. Therefore, the deposition rate of the organic thin film can be increased.

Since the deposition chamber is heated, the deposition of the organic thin film on the inner wall of the deposition chamber can be minimized and thus the cleaning cycle of the deposition chamber can be extended.

What has been described above is only one embodiment for carrying out the organic thin film deposition apparatus according to the present invention, the present invention is not limited to the above-described embodiment is beyond the gist of the invention claimed in the following claims. Without departing from the art, any person having ordinary skill in the art may understand that changes can be made.

1 is a cross-sectional view showing a laminated structure of a general organic EL device.

2 is a schematic configuration diagram of a conventional deposition apparatus for depositing an organic material on a substrate.

Figure 3 is a schematic diagram showing an embodiment of an organic material deposition apparatus according to the present invention.

4A and 4B show an embodiment of a canister for evaporating organic materials, which is applied to an organic material deposition apparatus according to the present invention.

5A and 5B show an embodiment of a manifold for supplying (injecting) organic vapor to a substrate, which is applied to an organic material deposition apparatus according to the present invention.

6 shows a schematic configuration of a deposition unit of another embodiment of an organic material deposition apparatus according to the present invention.

Claims (19)

A deposition chamber provided with an exhaust unit at one side; A substrate holder provided in the deposition chamber to mount a substrate to be deposited with an organic material and a metal mask for masking the substrate; The organic vapor is supplied from the outside facing the substrate to the substrate, and has a plurality of vapor flow spaces for diffusing and supplying the introduced organic vapors in multiple stages, and a vapor diffusion plate is provided between the vapor flow spaces. Folds; An organic vapor generating unit provided outside the deposition chamber and generating the organic vapor; A steam transfer unit for transferring steam from the steam generator to the manifold; A carrier gas supply unit supplying a carrier gas to the steam generator; Organic material deposition apparatus characterized in that it comprises. The substrate holder of claim 1, wherein the substrate holder is disposed in a horizontal direction such that the plane of the substrate faces a horizontal direction, and the manifold is configured to supply organic vapor to the surface of the substrate by spraying organic vapors in a horizontal direction. Organic material vapor deposition apparatus. The method of claim 1, The organic material vapor generating unit comprises a canister in which the organic material source is stored, a heating device for heating the canister, and a filter provided in the canister and filtering the organic material source. The organic material of claim 3, wherein an organic material source is provided at an inner center of the canister, a filter is provided at both sides thereof, and a diffusion space is provided at one inner side of the carrier gas before the carrier gas passes through the one filter. Vapor deposition apparatus. The method of claim 1, Organic vapor deposition apparatus characterized in that to prevent the condensation of the organic vapor conveyed through the steam transport by heating the steam transport around the steam transport. delete The method of claim 1, The substrate holder is an organic material deposition apparatus, characterized in that the cooling water supply is connected to supply the cooling water. The method of claim 1, The substrate holder is provided with a magnet system for adhering the substrate in close contact with the surface of the substrate holder with a metal mask. The method of claim 1, The deposition chamber is an organic material deposition apparatus, characterized in that heated to more than 100 ℃. The method of claim 1, Carrier gas is an organic material deposition apparatus, characterized in that nitrogen or argon gas. The method of claim 1, The manifold is an organic material deposition apparatus, characterized in that it has a vapor flow space having a size that gradually expands in the steam traveling direction. A first step of mounting a substrate, which is an organic material deposition target, and a mask for masking the same, in a deposition chamber; Exhausting the deposition chamber; A third step of generating an organic vapor by evaporating an organic source to be deposited on the substrate outside the deposition chamber; A fourth step of mixing the organic vapor and a transfer gas to the deposition chamber; And mixing and dispersing the organic vapor and the transport gas mixture to supply the organic vapor to the entire surface of the substrate. The method of claim 12, Placing the substrate such that the plane of the substrate faces a horizontal direction, and advancing the organic vapor in a horizontal direction to contact the substrate. The method of claim 12, Organic material deposition method characterized in that the feed gas is supplied together in the process of evaporating the organic material is mixed with each other. The method of claim 14, Heating the conveying gas and mixing the heated conveying gas with the organic vapor; The method of claim 12, Organic material deposition method characterized in that for applying the nitrogen gas or argon gas as the transfer gas. The method of claim 12, And depositing the organic material while cooling the substrate. The method of claim 12, The organic vapor is composed of a plurality of organic materials, The organic material deposition method characterized in that the organic material is mixed with each other after being evaporated by a separate heating device. The method of claim 12, And heating the mixed organic vapor and the transfer gas to the deposition chamber.