KR100473998B1 - Organic Electroluminescent Device and Method for Fabricating the same - Google Patents

Abstract

According to an embodiment of the present invention, there is provided a display apparatus comprising: a first substrate on which a subpixel area that is a minimum unit for implementing a screen is defined; A thin film transistor formed on the inner surface of the first substrate in subpixel units; A first electrode connected to the thin film transistor under the thin film transistor; An organic light emitting layer formed under the first electrode; A second electrode formed on an entire surface of the substrate covering the lower portion of the organic light emitting layer; A second substrate spaced apart from the first substrate, the second substrate being an encapsulation substrate disposed to face the first substrate; A recess formed in an inner surface of the second substrate; A moisture absorbent contained in the recess; By providing an active matrix organic electroluminescent device comprising a protective layer made of a durable material provided to cover the outer surface of the second substrate, since the outer surface of the encapsulation substrate includes a protective layer in the form of a tape or film, The glass can be prevented from being damaged even by external impact, and the moisture permeation in the recess of the glass can be effectively prevented, so that the product defect rate can be reduced, the production yield can be increased, and it can be easily applied to a large area substrate, thereby enhancing product competitiveness. Can be.

Description

Organic electroluminescent device and method of manufacturing the same {Organic Electroluminescent Device and Method for Fabricating the same}

The present invention relates to an organic electroluminescent device, and more particularly to an organic electroluminescent device having a durable film or tape.

One of the new flat panel displays (FPDs), the organic light emitting display device is self-luminous and thus has a better viewing angle and contrast than the liquid crystal display device. Is also advantageous. In addition, since it is possible to drive DC low voltage, fast response speed, and all solid, it is strong against external shock, wide use temperature range, and especially inexpensive in terms of manufacturing cost.

In particular, unlike the liquid crystal display device or the plasma display panel (PDP), the deposition and encapsulation equipment are all in the manufacturing process of the organic light emitting device, and the process is very simple.

In the related art, a passive matrix having no separate switching device has been mainly used as a driving method of the organic light emitting device.

However, in the passive matrix method, since the scan lines and the signal lines are configured to form a device in a matrix form, the scanning lines are sequentially driven over time in order to drive each pixel, thereby requiring the average luminance. In order to indicate, the instantaneous luminance is equal to the average luminance multiplied by the number of lines.

However, in the active matrix method, a thin film transistor, which is a switching element for turning on / off a pixel, is positioned for each subpixel, and the first electrode connected to the thin film transistor is The second electrode, which is turned on / off in subpixel units and faces the first electrode, becomes a common electrode.

In the active matrix method, a voltage applied to a pixel is charged in a storage capacitor (C _ST ), so that power is applied until the next frame signal is applied, thereby relating to the number of scan lines. Run continuously for one screen without

Therefore, according to the active matrix method, since the same luminance is applied even when a low current is applied, it has the advantage of low power consumption, high definition, and large size.

Hereinafter, the basic structure and operation characteristics of the active matrix organic electroluminescent device will be described in detail with reference to the accompanying drawings.

1 is a view showing a basic pixel structure of a general active matrix organic electroluminescent device.

As shown, a scanning line is formed in a first direction, and a signal line and a power supply line are formed in a second direction crossing the first direction and spaced apart from each other by a predetermined distance. Define the subpixel area.

A switching TFT, which is an addressing element, is formed at the intersection of the scan line and the signal line, and is connected to the switching thin film transistor and the power supply line to form a storage capacitor C _ST . A driving thin film transistor, which is connected to the storage capacitor C _ST and a power supply line, is formed, and the driving thin film transistor is connected to the driving thin film transistor to form an organic electroluminescent diode.

When the organic light emitting diode is supplied with a current in the forward direction, the organic light emitting diode has a positive (N) junction between the anode electrode, which is a hole providing layer, and the cathode electrode, which is an electron providing layer. Electrons and holes recombine with each other as they move through the part, and thus have a smaller energy than when the electrons and holes are separated, thereby utilizing the principle of emitting light due to the energy difference generated.

2 is a schematic cross-sectional view of a conventional active matrix organic electroluminescent device.

As illustrated, a thin film transistor T is formed on the inner surface of the first substrate 10 in which a subpixel area, which is the smallest unit for implementing a screen, is defined, and is connected to the thin film transistor T. The first electrode 12 is formed in a pixel unit, and covers an edge portion of the first electrode 12 below the first electrode 12, and has a main region of the first electrode 12 as the opening 14. An interlayer insulating layer 16 is formed, and an organic light emitting layer 18 is formed below the interlayer insulating layer 16 and connected to the first electrode 12 through the opening 14 described above. ), A second electrode 20 is formed on the entire surface of the substrate.

Although not shown in detail in the drawings, the above-described subpixels consist of red, green, and blue subpixels that emit red, green, and blue colors, and the red, green, and blue subpixels constitute one pixel.

The organic light emitting layer 18 interposed between the first and second electrodes 12 and 20 and the first and second electrodes 12 and 20 forms an organic light emitting diode device (E).

The thin film transistor T includes a semiconductor layer 2, a gate electrode 4, a source electrode 6, and a drain electrode 8, and the first electrode 12 substantially includes the drain electrode 8. Through the connection of the current is supplied from the thin film transistor (T).

Although not shown in detail in the drawings, the organic light emitting diode thin film transistor is a switching thin film transistor which serves as a switching element is located at the intersection of the gate wiring and data wiring, the drain electrode and power supply wiring of the switching thin film transistor and A driving thin film transistor is connected to supply a current to the organic light emitting diode device (E), the thin film transistor (T) in the drawing corresponds to the driving thin film transistor.

The second substrate 22 is disposed to face the first substrate 10 and is an encapsulation substrate spaced apart from the organic light emitting diode device E by a predetermined distance. The first and second substrates are disposed. Edge portions between the substrates 10 and 22 are sealed by the seal pattern 30.

In addition, a recess 24 is formed in the inner central portion of the second substrate 22, and the recess 24 includes a moisture absorbent 26 and a tape on the inner surface of the substrate including the moisture absorbent 26. (28) is attached.

The material forming the encapsulation substrate is characterized in that the glass (glass). Using glass as an encapsulation substrate can be lighter and thinner than the conventional encapsulation substrate made of stainless steal, and can solve the problem of flatness more than the encapsulation method using canisters. Has the advantage that can be easily applied to the product.

However, in the case of using the glass as the encapsulation substrate, it is necessary to form a recess on the substrate for filling the moisture absorbent, which causes the recess to be thinly processed.

The method of forming a recess in the encapsulation substrate made of glass may include a physical processing method, a wet etching method using a physical processing method, a method using only wet etching, and the like. When machining the recesses, cracks may occur due to minute cracks or cracks inside the recesses due to physical impacts. If encapsulated using the cracked glass, the glass may be broken even with a small mechanical impact. There was a problem that the likelihood of penetration of moisture into these parts increases.

In addition, as applied to large area products, the durability problem and moisture penetration problem are further aggravated by the increase in the recess area necessary for the filling of the absorbent.

In order to solve the above problems, it is an object of the present invention to provide an organic electroluminescent device comprising an encapsulation substrate that is durable and can effectively prevent moisture penetration.

To this end, the present invention is to provide a protective layer of a tape or film material having a durable material on the outer surface of the encapsulation substrate.

In the present invention, a material made of a durable material having no adhesive force is defined as a film, and a material made of a durable material having adhesive force is defined as a tape.

In order to achieve the above object, according to a first aspect of the present invention, there is provided a display device including: a first substrate in which a subpixel area that is a minimum unit for implementing a screen is defined; A thin film transistor formed on the inner surface of the first substrate in subpixel units; A first electrode connected to the thin film transistor under the thin film transistor; An organic light emitting layer formed under the first electrode; A second electrode formed on an entire surface of the substrate covering the lower portion of the organic light emitting layer; A second substrate spaced apart from the first substrate, the second substrate being an encapsulation substrate disposed to face the first substrate; A concave portion having an area smaller than that of the organic light emitting layer on an inner surface of the second substrate; A moisture absorbent contained in the recess; Provided is an active matrix organic light emitting display device including a protective layer made of a durable material provided to cover an outer front surface of the second substrate.

According to a second aspect of the present invention, there is provided a display device comprising: a first substrate on which a subpixel area that is a minimum unit for implementing a screen is defined; A thin film transistor formed on the inner surface of the first substrate in subpixel units; A first electrode connected to the thin film transistor under the thin film transistor; An organic light emitting layer formed under the first electrode; A second electrode formed on an entire surface of the substrate covering the lower portion of the organic light emitting layer; A second substrate spaced apart from the first substrate and disposed to face the first substrate; A concave portion having an area smaller than that of the organic light emitting layer on an inner surface of the second substrate; A moisture absorbent contained in the recess; A protective layer formed on an outer surface of the second substrate and made of a durable material in a region overlapping with the moisture absorbent; The present invention provides an active matrix organic light emitting display device including a seal pattern encapsulating an edge portion between the first and second substrates.

The protective layer according to the first and second aspects of the present invention may be formed of any one of a tape or a film, and an area inside the second substrate including the moisture absorbent may be attached to the tape, and the material constituting the second substrate may be Glass is glass, and the material forming the protective layer is selected from any one of polyester (polyester), PVC (polyvinyl chloride), PE (polyethylene), silicon-based material or the material forming the protective layer is fluorine ( It is characterized in that it is selected from polymer-based materials comprising F).

Forming a thin film transistor in subpixel units on a first substrate on which a subpixel region according to a third aspect of the present invention is defined; Forming an organic light emitting diode device connected to the thin film transistor; Forming a concave portion on one surface of the second substrate which is an encapsulation substrate, the recess having an area smaller than the area corresponding to the entire area of the organic light emitting diode device; Filling a moisture absorbent into the recess; Attaching a protective layer of a durable material to another surface of the second substrate; The method of manufacturing an active matrix type organic light emitting display device comprising the step of encapsulating the organic light emitting diode device and the moisture absorbent forming portion of the second substrate using the second substrate. To provide.

The material constituting the protective layer is selected from any one of polyester, polyvinyl chloride (PVC), polyethylene (PE), and silicon-based material, or the material constituting the protective layer is a polymer containing fluorine (F). It is characterized by being selected from the series materials.

The material constituting the protective layer is selected from any one of a tape or a film, the protective layer of the tape material is selected from any one of a print screen method or a roll coating method, the protective layer of the film material is sprayed by a spray method It is characterized by consisting of.

Prior to the encapsulating, forming a seal pattern on an edge of one of the first and second substrates, and attaching the protective layer comprises: a second surface of the second substrate; Attaching to a region covering the front surface, or attaching to a local region covering the absorbent filled region of the second surface of the second substrate.

According to a fourth aspect of the invention, a plurality of first electrodes are formed on a first substrate inner surface in a first direction; An organic light emitting layer formed under the first electrode; A plurality of second electrodes formed below the organic light emitting layer in a second direction crossing the first electrode; A second substrate spaced apart from the first substrate, the second substrate being an encapsulation substrate disposed to face the first substrate; A concave portion having an area smaller than that of the organic light emitting layer on an inner surface of the second substrate; A moisture absorbent contained in the recess; Provided is a passive matrix organic electroluminescent device formed at a position covering the moisture absorbent on the outer surface of the second substrate and including a protective layer made of a durable material.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

Example 1

3 is a schematic cross-sectional view of an active matrix organic light emitting display device according to Example 1 of the present invention.

As shown, the first and second substrates 110 and 150 are spaced apart from each other by a predetermined distance, and the first and second substrates 110 and 150 are defined in a subpixel area, which is a minimum unit for implementing a screen. The thin film transistor T is formed on the inner surface of the first substrate 110 in subpixel units, and the first electrode 134 connected to the thin film transistor T is disposed in the subpixel units below the thin film transistor T. An interlayer insulating layer 138 is formed below the first electrode 134 and has an opening 136 that covers an edge portion of the first electrode 134 and exposes a main region of the first electrode 134. The organic light emitting layer 140 connected to the first electrode 134 through the opening 136 is formed below the interlayer insulating layer 138, and the second electrode is formed on the entire surface of the substrate covering the lower portion of the organic light emitting layer 140. 142 is formed.

Although not shown in detail in the drawings, the above-described subpixels consist of red, green, and blue subpixels that emit red, green, and blue colors, and the red, green, and blue subpixels constitute one pixel, or are monochrome organic. When the electroluminescent layer is adopted, three neighboring subpixels constitute one pixel.

The organic light emitting layer 140 interposed between the first and second electrodes 134 and 142 and the first and second electrodes 134 and 142 forms an organic light emitting diode device (E).

In more detail, the buffer layer 112 is formed on the entire inner surface of the first substrate 110, and the active region I is formed in subpixel units below the buffer layer 112. And a semiconductor layer 114 having source regions II and drain regions III positioned at both peripheral portions of the active region I, and having a gate insulating layer under the active region I of the semiconductor layer 114. 116 and the gate electrode 118 are formed in order, and the first and second contacts exposing the source region II and the drain region III of the semiconductor layer 114 on the lower front surface of the gate electrode 118. A first passivation layer 124 having holes 120 and 122 is formed, and is connected to the source region II of the semiconductor layer 114 through the first contact hole 120 under the first passivation layer 124. A source electrode 126 is connected to the drain region III of the semiconductor layer 114 through the second contact hole 122. An electrode 128 is formed, and a second passivation layer 132 having a third contact hole 130 exposing a part of the drain electrode 128 is formed under the source electrode 126 and the drain electrode 128. It is. The first electrode 134 described above is connected to the drain electrode 128 through the third contact hole 130 under the second passivation layer 132, and is formed in a subpixel unit, and the lower portion of the first electrode 134 is provided. As described above, the interlayer insulating film 138, the organic light emitting layer 140, and the second electrode 142 are sequentially formed.

In addition, a recess 152 is formed on an inner surface of the second substrate 150, a moisture absorbent 154 is included in the recess 152, and a substrate internal region including the moisture absorbent 154 is formed. The tape 156 is attached, and a protective layer 158 made of a durable material is attached to the outer front surface of the second substrate 150.

The second substrate 150 corresponds to an encapsulation substrate, and is preferably made of glass.

For reference, when the moisture absorbent 154 is attached to the second substrate 150 without being etched, the moisture absorbent 154 may come into contact with the organic light emitting layer element. In this case, the organic electroluminescence is emitted by the moisture absorbent material. Since the device may be damaged, a recess for filling the moisture absorbent 154 should be formed in the inner surface of the second substrate 150.

In the present invention, the position where the moisture absorbent 154 is formed is not limited to the position on the drawing, and the pattern of the second substrate 150 may be variously changed to the one-step structure in addition to the two-step structure as shown in the drawing. The formation area of the moisture absorbent 154 described above may also be variously changed.

The protective layer 158 is attached for the purpose of solving problems of insufficient impact resistance and water penetration, which is a problem in an encapsulation substrate having an existing recess, and is a method such as a tape form or coating having self adhesiveness Can be formed into a film form.

As such, the active matrix type organic light emitting display device having the above-described protective layer 158 may further increase durability and moisture permeation prevention effect when applied to a large area product of 10 inches or more.

The protective layer 158 described above may be attached in the form of a tape having an adhesive force by a print screen method or a roll coating method, or may be attached in the form of a film through spraying a material of a spray method. have.

In addition, an edge portion between the first and second substrates 110 and 150 is encapsulated by the seal pattern 160, and a space between the first and second substrates 110 and 150 is filled with an inert gas atmosphere. It is preferable.

Particularly, in the present invention, when the protective layer 158 is formed of a tape or film material, the material constituting the protective layer 158 is polyester, polyvinyl chloride (PVC), polyethylene (PE), or silicone-based material. It is preferred to be selected from.

In addition, in the present invention, the protective layer 158 to serve as a moisture blocking role, the material forming the protective layer 158 may be selected from a polymer-based material containing fluorine (F).

The material constituting the seal pattern 160 is preferably selected from UV (ultra violet) curing agents.

Example 2

In this embodiment, the protective layer is formed of a durable material that can cover the moisture absorbent forming portion with an area slightly larger than the portion filled with the moisture absorbent.

4 is a cross-sectional view of an active matrix type organic light emitting display device according to a second embodiment of the present invention, and a portion overlapping with that of FIG. 3 will be briefly described.

As shown, the first and second substrates 210 and 250 are spaced apart from each other to face each other, the first substrate 210 has a subpixel area defined therein, and the first substrate 210 is disposed inside the first substrate 210. The thin film transistor T is formed on the surface of each subpixel, and the first electrode 212 is formed in the subpixel unit by being connected to the thin film transistor T and covering the lower surface of the first electrode 212. The organic light emitting layer 214 and the second electrode 216 are sequentially formed on the entire substrate.

In addition, a recess 252 is formed on an inner surface of the second substrate 250, and a moisture absorbent 254 is included in the recess 252 to prevent moisture from penetrating into the organic electroluminescent element. In the substrate inner region in which the moisture absorbent 254 is contained, a tape 256 is attached and a protective layer 258 made of a durable material is formed at a position covering the moisture absorbent 254 on the outer surface of the second substrate 250.

The edges between the first and second substrates 210 and 250 are sealed by the seal pattern 260.

However, in the present invention, for the description of the encapsulation glass, the number of subpixels and the number of thin film transistors, according to the present invention, are limited.

The organic light emitting display device according to Examples 1 and 2 relates to a bottom light emitting method for emitting light emitted from the organic light emitting layer of the organic light emitting diode device toward the first electrode.

However, the present invention can also be applied to a top emission product that emits light emitted from the organic electroluminescent layer to the second electrode. In this case, the light emitted to the encapsulation substrate is transmitted, so that the moisture absorbent is applied to the substrate. It is located on the outside, the location of the protective layer of the durable material can be changed accordingly.

That is, in the present invention, the protective layer of the durable material, it characterized in that the above-mentioned protective layer is located at a position corresponding to the portion where the thickness of the substrate becomes thinner as the absorbent is filled.

5 is a process flowchart showing step by step a manufacturing process of an active matrix organic electroluminescent device according to the present invention.

In ST1, a thin film transistor is formed in subpixel units on a first substrate on which a subpixel region is defined.

The thin film transistor includes a switching thin film transistor used as a switching element, and a driving thin film transistor for driving an organic light emitting diode device. The thin film transistor further includes forming a storage capacitance connected to the thin film transistor.

In step ST2, an organic light emitting diode device connected to a driving thin film transistor among the thin film transistors is formed.

The organic light emitting diode device includes a first electrode patterned in units of subpixels, a second electrode formed on the entire surface of the substrate, and an organic light emitting layer interposed between the first and second electrodes.

In ST3, it is a step of providing a 2nd board | substrate which is an encapsulation board | substrate, and forming a recessed part in the 1st surface of a 2nd board | substrate.

The material constituting the second substrate is preferably selected from glass.

The concave portion may be formed in a two-step structure or a first step structure, and may be formed by a method using a wet etching method, a method using a wet etching method, or the like using a physical method or a physical method using beads.

In ST4, the step of filling the moisture absorbent into the recess.

This step includes sealing the first surface area of the second substrate filled with the absorbent with tape.

In ST5, the protective layer of the durable material is attached to the second surface of the second substrate.

The material constituting the protective layer is selected from a polymer material such as polyester, PVC, PE, silicon-based material, and made of a tape material having a thick film type adhesive force by a print screen method or a roll coating method, or by a spray method It may be produced in the form of a thin film type through the material spinning.

In addition, the material forming the protective layer may be selected from a polymer-based material containing fluorine for the purpose of moisture blocking.

In addition, it is important that the protective layer is attached to a region corresponding to the recess of the second substrate filled with the moisture absorbent, and may be attached to the entire surface of the second substrate or may be formed in a local area larger than a moisture absorbent formation region. .

In ST6, the first and second substrates are encapsulated using the organic light emitting diode element of the first substrate and the moisture absorbent forming portion of the second substrate as inner surfaces, respectively.

Prior to this step, the method may further include forming a seal pattern on an edge portion of one of the first and second substrates.

However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

For example, the encapsulation structure of the organic light emitting device according to the present invention may be applied to a passive matrix organic light emitting device that does not have a separate thin film transistor. In the passive matrix type, a plurality of first and second electrodes are disposed to intersect with each other, and an organic light emitting layer is interposed between the first and second electrodes, and the encapsulation substrate has the same structure as the above-described embodiment. Can be.

As described above, according to the organic light emitting device according to the present invention, since the outer surface of the encapsulation substrate includes a protective layer in the form of a tape or a film, the glass can be prevented from being damaged even by an external impact, and the glass is concave. In addition, the moisture permeability can be effectively prevented, so that the product defect rate can be lowered, the production yield can be increased, and it can be easily applied to a large-area substrate, thereby increasing the product competitiveness.

1 is a view showing a basic pixel structure of a general active matrix organic electroluminescent device.

  2 is a schematic cross-sectional view of a conventional active matrix organic electroluminescent device.

3 is a schematic cross-sectional view of an active matrix organic light emitting display device according to Example 1 of the present invention;

4 is a cross-sectional view of an active matrix organic light emitting display device according to Example 2 of the present invention;

5 is a process flowchart showing step by step a manufacturing process of an active matrix organic electroluminescent device according to the present invention;

<Explanation of symbols for main parts of the drawings>

110: first substrate 112: buffer layer

114: semiconductor layer 116: gate insulating film

118: gate electrode 120: first contact hole

122: second contact hole 124: first protective film

126 source electrode 128 drain electrode

130: third contact hole 132: second protective film

134: first electrode 136: opening

138: interlayer insulating film 140: organic light emitting layer

142: second electrode 150: second substrate

152: recess 154: moisture absorbent

156: tape 158: protective layer

160: seal pattern I: active area

II: source region III: drain region

E: organic light emitting diode device T: thin film transistor

Claims (17)

A first substrate on which a subpixel area that is a minimum unit for implementing a screen is defined; A thin film transistor formed on the inner surface of the first substrate in subpixel units; A first electrode connected to the thin film transistor under the thin film transistor; An organic light emitting layer formed under the first electrode; A second electrode formed on an entire surface of the substrate covering the lower portion of the organic light emitting layer; A second substrate spaced apart from the first substrate, the second substrate being an encapsulation substrate disposed to face the first substrate; A concave portion having an area smaller than that of the organic light emitting layer on an inner surface of the second substrate; A moisture absorbent contained in the recess; Protective layer made of a durable material provided to cover the outer front surface of the second substrate An active matrix organic electroluminescent device comprising a. A first substrate on which a subpixel area that is a minimum unit for implementing a screen is defined; A thin film transistor formed on the inner surface of the first substrate in subpixel units; A first electrode connected to the thin film transistor under the thin film transistor; An organic light emitting layer formed under the first electrode; A second electrode formed on an entire surface of the substrate covering the lower portion of the organic light emitting layer; A second substrate spaced apart from the first substrate and disposed to face the first substrate; A concave portion having an area smaller than that of the organic light emitting layer on an inner surface of the second substrate; A moisture absorbent contained in the recess; A protective layer formed on an outer surface of the second substrate and made of a durable material in a region overlapping with the moisture absorbent; Seal patterns for sealing edges between the first and second substrates An active matrix organic electroluminescent device comprising a. The method according to claim 1 or 2, The protective layer is an active matrix organic electroluminescent device comprising any one of tape or film. The method according to claim 1 or 2, The active matrix organic electroluminescent device of claim 2, wherein the inside of the second substrate containing the moisture absorbent is attached to the tape. The method according to claim 1 or 2, The material constituting the second substrate is glass (glass) active matrix organic light emitting device. The method of claim 3, wherein The material forming the protective layer is an active matrix organic light emitting device selected from any one of polyester (polyester), PVC (polyvinyl chloride), PE (polyethylene), silicon-based material. The method of claim 3, wherein The active layer type organic electroluminescent device is selected from a polymer-based material including fluorine (F). Forming a thin film transistor in subpixel units on a first substrate on which a subpixel region is defined; Forming an organic light emitting diode device connected to the thin film transistor; Forming a concave portion on one surface of the second substrate which is an encapsulation substrate, the recess having an area smaller than the area corresponding to the entire area of the organic light emitting diode device; Filling a moisture absorbent into the recess; Attaching a protective layer of a durable material to another surface of the second substrate; Encapsulating the first substrate using an organic light emitting diode device, an absorbent forming part of the second substrate as an inner surface, and using the second substrate Method for manufacturing an active matrix organic electroluminescent device comprising a. The method of claim 8, The material constituting the protective layer is a method of manufacturing an active matrix organic electroluminescent device selected from any one of polyester (polyester), PVC (polyvinyl chloride), PE (polyethylene), silicon-based material. The method of claim 8, The material forming the protective layer is a method of manufacturing an active matrix organic electroluminescent device is selected from a polymer-based material containing fluorine (F). The method of claim 8, The material constituting the protective layer is a method of manufacturing an active matrix organic electroluminescent device is selected from any one of a tape or a film. The method of claim 11, The tape protective layer is a method of manufacturing an active matrix organic electroluminescent device is selected from any one of a print screen method or a roll coating method. The method of claim 11, The protective layer of the film material is a method of manufacturing an active matrix organic electroluminescent device made by radiation by a spray method. The method of claim 8, Before the encapsulating step, the method of manufacturing an active matrix organic electroluminescent device comprising the step of forming a seal pattern on the edge of any one of the first, second substrate. The method of claim 8, The attaching of the protective layer is a method of manufacturing an active matrix organic light emitting display device, wherein the attaching is performed on a region covering the entire surface of the second surface of the second substrate. The method of claim 8, And attaching the protective layer to a local region covering a moisture absorbent filling region of a second surface of the second substrate. A plurality of first electrodes formed on the inner surface of the first substrate in a first direction; An organic light emitting layer formed under the first electrode; A plurality of second electrodes formed below the organic light emitting layer in a second direction crossing the first electrode; A second substrate spaced apart from the first substrate, the second substrate being an encapsulation substrate disposed to face the first substrate; A concave portion having an area smaller than that of the organic light emitting layer on an inner surface of the second substrate; A moisture absorbent contained in the recess; A protective layer formed at a position covering the moisture absorbent on the outer surface of the second substrate, the durable material Passive matrix organic electroluminescent device comprising a.