KR100470750B1 - Electro polishing combined electric plating apparatus and electroless plating apparatus using the same - Google Patents

Abstract

PURPOSE: To provide an electrolytic polishing combined electroplating apparatus for forming a plating film on a plating object formed in a pipe shape and formed of a material selected from the group consisting of precious stone, stainless steel and molybdenum steel, and an electroless plating apparatus using the electrolytic polishing combined electroplating apparatus. CONSTITUTION: The plating system comprising an electrolytic polishing combined electroplating apparatus(10) comprising a transfer means(13) for transferring plating materials(14,15) along a passage in a pipe shaped plating object(16) dipped into an electrolyte(12), and a plating object transfer unit(18) capable of transferring the plating object by impressing a positive voltage to the plating materials connected to the transfer means and impressing a negative voltage to the plating object, or impressing a negative voltage to the plating materials and impressing a positive voltage to the plating object; and an electroless plating apparatus comprising a plating object transfer means which holds the plating object such that the plating object is perpendicular to the horizontal surface of the electrolyte or inclined to the horizontal surface of the electrolyte in a certain angle as an electroless plating apparatus for forming at least one layer of electroless plating film on the surface of the plating object electrolytic polished and/or electroplated by the electrolytic polishing combined electroplating apparatus.

Description

Electroplating combined electroplating apparatus and electroless plating apparatus using the same {Electro polishing combined electric plating apparatus and electroless plating apparatus using the same}

The present invention relates to plating, and more particularly, to an electroplating apparatus for electrolytic polishing. The present invention also relates to an electroless plating system having both electroplating and electroplating and an electroless plating apparatus.

Fluorine resins have characteristics that are extremely resistant to chemicals, have excellent electrical properties, and are stable even at high temperatures, and coating of the fluororesin film on the surfaces of mechanical parts, electrical parts, and electronic parts is generally performed.

Prior to the coating of the fluorine resin film, a treatment is performed in advance to roughen the surface of the object to improve the adhesion of the fluorine resin film to the object.

In order to coat the fluororesin film on the inner and outer surfaces of a plated object such as a pipe, electroplating or electroless plating apparatus has conventionally been used.

However, the above-described conventional plating apparatus has a disadvantage that the plating film is not uniformly coated over the entire surface of the pipe when the length of the pipe is 1 m or more.

In addition, the conventional electroless plating apparatus which forms only the electroless plating film on the plated object has a high possibility of generating pinholes on the surface of the plated film when the plated material is made of a noble metal, stainless steel, or an aluminum alloy. It has the disadvantage of peeling off.

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is an electroplating combined electroplating apparatus that can be applied to the workpiece in the form of pipes made of precious metals, stainless steel or molybdenum steel and using the same An electroless plating apparatus is provided.

Another object of the present invention is to provide an electropolishing combined plating apparatus and an electroless plating apparatus using the same, which can increase the adhesion of the plating layer to the plated material by suppressing pinhole generation between the plated layer and the plated material.

1 is a schematic configuration diagram of an electropolishing combined electroplating apparatus according to an embodiment of the present invention.

2 is a schematic configuration diagram of an electroless plating apparatus according to another embodiment of the present invention.

3 is a schematic configuration diagram of an electroless plating apparatus according to another embodiment of the present invention.

In order to achieve the above object, the electropolishing combined plating apparatus according to an aspect of the present invention, the transfer means for transferring the plating material along the inner path of the plated object to be immersed in the electrolyte; And applying a positive voltage to the plated material connected to the transfer means and applying a negative voltage to the plated material, or applying a negative voltage to the plated material and applying a positive voltage to the plated material. And a plated material transfer device capable of transferring the plated object.

It is preferable that the to-be-plated material consists of a substance selected from the group which consists of a noble metal, stainless steel, and molybdenum steel, and it is preferable that the to-be-plated material has a length of at least 1 m or more.

According to another aspect of the present invention, the plating apparatus, the transfer means for transferring the plating material along the inner path of the plated object to be immersed in the electrolyte, and applying a positive voltage to the plating material connected to the transfer means and And a plated material transfer device capable of applying a negative voltage to the plated material, or applying a negative voltage to the plated material, applying a positive voltage to the plated material, and transferring the plated material. Electrolytic polishing combined plating apparatus; And an electroless plating apparatus for forming at least one layer of electroless plating film on the surface of the workpiece to be electropolished and / or electroplated by the electropolishing combined plating apparatus.

Preferably, the electroless plating apparatus includes a plated material transferring means for transferring the plated object while maintaining the plated object perpendicular to the horizontal plane of the electrolyte or inclined at a predetermined angle.

Preferably, the plated object transfer means has a function of rotating the plated object.

Optionally, the plating apparatus further comprises temperature holding means for maintaining the electrolyte at a constant temperature.

Preferably, the temperature maintaining means includes an outer bath surrounding the inner bath in which the electrolyte solution is contained, containing heat medium oil therein, and a lower part of the inner bath, for cooling or heating the inner bath to a predetermined temperature; A heating device.

Hereinafter, a preferred embodiment of the electropolishing combined electroplating apparatus and the electroless plating apparatus using the same according to the present invention will be described in detail.

1 is a schematic diagram of an electropolishing combined electroplating apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the electroplating combined electroplating apparatus 10 includes a plating material 14 along an inner path of a pipe-shaped plated object 16 immersed in the electrolyte solution 12 contained in the electrolytic cell 11. A conveying apparatus 13 for conveying; And applying a positive voltage to the plating material 14 connected to the transfer device 13 and applying a negative voltage to the plated material 16, or applying a negative voltage to the plating material 14 and Applying a positive voltage to the plated material 16, and includes a plated material transfer device 18 that can transfer the plated object.

In order to use the electrolytic polishing plating apparatus 10 as an electroplating apparatus, as shown in FIG. 1, a negative voltage is applied to the plated object 16 and a positive ( Positive voltage is applied.

When voltage is applied to the plated object 16 and the plated material 14 and 15 as described above, metal ions are ionized from the plated material to precipitate on the surface of the plated material 16 to form a plated layer. This plating layer is formed to have a uniform thickness on the inner surface of the plated object 16 due to the operation of moving the plated material 14 along the inner path of the plated object 16 during electroplating. That is, the difference between the deposition paths from the plating 14 to the inner surface of the plating 16 of the ionized metal ions by moving the plating 14 along the inner path of the plating 16. Because it reduces.

Although not shown in FIG. 1, in order to use the electrolytic polishing plating apparatus 10 as the electropolishing apparatus, a positive voltage is applied to the plated object 16 and a negative voltage is applied to the plated objects 14 and 15. Is approved.

When voltage is applied to the plated object 16 and the plated material 14, 15 as described above, metal ions are ionized from the surface of the plated material 16 and are deposited on the surface of the plated material 14, 15. . As a result, the surface of the plated object 16 is electropolished.

When electroplating or electropolishing, the plated object 16 is preferably made of a material selected from the group consisting of precious metals, stainless steels, and molybdenum steels.

In addition, the electrolytic polishing combined electroplating apparatus described above can be applied irrespective of the length of the plated object 16, and is particularly effective when the plated object 16 has a length of at least 1 m or more.

In FIG. 1, reference numeral 24 is used to supply the electrolyte solution 12 to the electrolytic cell 11 as a pump, and 22 is an electrolyte that overflows so that the electrolyte solution 12 flowing from the electrolytic cell 11 can be reused as a filtration device. 11) filter.

2 and 3 are views showing an electroless plating apparatus used in combination with the electropolishing combined electroplating apparatus shown in FIG.

Referring to FIG. 2, the electroless plating apparatus 40 maintains the pipe-shaped plated object 16 immersed in the electrolyte 43 contained in the first inner tank 41 vertically while the plated object ( 16, the plated material transfer device 45 for transferring the temperature, the temperature holding device for maintaining the electrolyte solution 43, 53 at a constant temperature, and the electrolyte solution 43, 53 from the first inner tank 41 to the second inner tank ( 51, for filtering the pumps 46 and 56 for supplying from the second inner tank 51 to the first inner tank 41, and for filtering the electrolyte solution supplied to the first inner tank 41 or the second inner tank 51. Filtration devices 47, 57. Here, the second inner tank 51 is an auxiliary tank containing the electrolyte to be supplied to the first inner tank (41).

The temperature maintaining device includes first and second outer tanks 42 and 52 that surround the first and second inner tanks 41 and 51 in which the electrolyte solutions 43 and 53 are contained and contain the heat medium oil 48 therein. And a cooling and heating device (49, 59) disposed below the first and second inner tanks (41, 51) for heating or cooling the first and second inner tanks (41, 51) to a predetermined temperature. do.

On the other hand, the electroless plating apparatus 60 shown in Figure 3, the pipe-like to-be-coated object 16 immersed in the electrolyte (63) contained in the first electroless plating bath 61 at a predetermined angle with respect to the horizontal plane. A plated material conveying and rotating device 65 for conveying and rotating the plated material 16 while maintaining it inclined; a temperature holding device for maintaining the electrolytes 63 and 73 at a constant temperature; Pumps 66 and 76 for supplying 73 from the first inner tank 61 to the second inner tank 71, and from the second inner tank 71 to the first inner tank 61, and the first inner tank 61, or And filtration devices 67 and 77 for filtering the electrolyte solutions 63 and 73 supplied to the second inner tank 71.

The temperature maintaining device includes first and second outer tanks 62 and 72 surrounding the first and second inner tanks 61 and 71 in which the electrolyte solutions 63 and 73 are contained, and containing the heat medium oil 68 therein. And a cooling and heating device (69, 79) disposed below the first and second inner tanks (61, 71) to heat or cool the first and second inner tanks (61, 71) to a predetermined temperature. do.

As mentioned above, unlike the electroless plating apparatus 40 of FIG. 2, the electroless plating apparatus 60 of FIG. 3 has the plated object 16 inclined at a predetermined angle with respect to the horizontal plane of the electrolyte 63. , Characterized in that the plated material transfer and rotation device 65 rotates the plated object while the electroless plating is performed. The inclined arrangement and rotation of the plated object 16 allows the electroless plated film to be formed in a uniform thickness on the surface of the plated object.

It is possible to form an electroless plated film which is excellent in adhesion of the plated film to the plated object by combining the electropolishing combined electroplating apparatus of FIG. 1 and the electroless plating apparatus of FIG. 2 or 3. Hereinafter, a method of forming an electroless plating film using the electropolishing combined electroplating apparatus of FIG. 1 and the electroless plating apparatus of FIG. 2 or 3 will be described.

First, the surface of the plated object 16 is electropolished using the electropolishing combined electroplating apparatus of FIG.

Specifically, a positive voltage is applied to the plated object 16 that is the first electrode so that the plated object 16 acts as an anode, and a second voltage is applied to the second electrode 14 by applying a negative voltage. ) Acts as the cathode.

As the voltage is applied, the surface of the plated object 16 serving as the anode is electrically polished. Specifically, the surface of the electroplated workpiece 16 has a structure in which protrusions and recesses alternately appear, and the depth of the recess is very deep. During the electropolishing process, the protrusions on the surface of the plated object 16 are intensively polished to reduce the height difference between the top surface of the protrusion and the bottom surface of the recess. As a result, the likelihood of pinhole generation in the recess decreases, and the adhesion between the surface of the plated material and the plating layer increases. For this reason, the possibility of peeling of a plating layer becomes remarkably low. That is, the surface roughness of the plated material after the electropolishing process is completed is reduced and the gloss is significantly increased.

After the electropolishing process is completed, the plated material is preferably plated over three times. That is, one electroplating using the electropolishing combined electroplating apparatus of FIG. 1 and two electroplating using the electroless plating apparatus of FIG. 2 or 3 are performed.

Optionally, after completion of the electrolytic polishing process, the electroless plating process containing fluorine resin may be performed only once.

In addition, after completion of the electrolytic polishing process, the electroless plating process containing no fluorine resin and the electroless plating process containing fluorine resin may be performed once each.

Referring back to FIG. 1, in order to form an electroplated film on the surface of the plated object on which the electropolishing process is completed, a negative voltage is applied to the plated object 16 and a positive voltage to the plated object 14. Is applied. At this time, the plating material 14 located inside the plated object 16 moves at a predetermined speed along the inner path of the plated object 16. As a result of the above electroplating, a first plated film is formed on the surface of the plated object 16.

Next, referring to FIG. 2, the first electroless plating film is formed on the surface of the first plating film by using the electroless plating apparatus 40.

Specifically, the plated object 16 is vertically positioned in the first electroless plating solution 43 contained in the first inner tank 41 by using the plated object transfer device 45 to be immersed for a predetermined time.

Thereafter, the plated object 16 is extracted from the first electroless plating solution 43, washed with water, and left to dry in an ambient temperature environment.

The first electroless plating solution 43 contains nickel lactate as the metal salt, sodium charine as the reducing agent, succinic acid, succinic acid or lactic acid as the complexing agent, a regulator, a pH adjuster and the like.

Subsequently, the plated object 16 having the first electroplating film and the first electroless plating film is immersed at a predetermined angle in the second electroless plating solution 63 of the electroless plating apparatus of FIG. A plating layer is formed. Then, this to-be-plated object 16 was extracted from the 2nd electroless plating liquid 63, washed with water, and left to stand in room temperature environment, and it dried. Thereafter, the plated object is placed in a furnace kept at 300 ° C. and left to stand for 60 minutes to bake to obtain a plated object, which is a final product on which a thin film by electroless plating is formed on the surface.

The second electroless plating solution 63 contains nickel lactate as the metal salt, sodium hypochlorite as the reducing agent, and polytetrafluoroethylene (PTEF) as the fluorine resin.

The final plated workpiece had a very high flatness and plating adhesion density compared to that of the prior art.

Alternatively, the first and second electroless plating films may be formed using only the electroless plating apparatus of FIG. 2 or the electroless plating apparatus of FIG. To this end, the electroless plating solution contained in the inner tank is converted into the aforementioned composition.

As described above, according to the electroplating apparatus for electropolishing and electroplating of the present invention and the electroless plating apparatus using the same, the pinhole is prevented by preventing the occurrence of pinholes between the plating layer and the plated layer formed of a precious metal, stainless steel or molybdenum steel An electroplating film or an electroless plating film having high adhesion to gold can be formed.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (9)

delete delete delete A transfer means for transferring the plating material along an inner path of the plated object to be immersed in the electrolyte, and a positive voltage is applied to the plating material connected to the transfer means, and a negative voltage is applied to the plated material, An electropolishing combined plating device including a plated material transfer device capable of applying a negative voltage to the plated material, applying a positive voltage to the plated material, and transferring the plated material; And An electroless plating apparatus for forming at least one layer of electroless plating film on the surface of a workpiece to be electropolished and / or electroplated by the electropolishing combined plating apparatus, wherein the plated object is perpendicular to a horizontal plane of the electrolyte solution. Plating apparatus comprising an electroless plating apparatus having a plated material conveying means for conveying the plated material while maintaining inclined at a predetermined angle. delete 5. The plating apparatus according to claim 4, wherein the plated object transferring means has a function of rotating the plated object. The plating apparatus according to claim 4, further comprising a temperature maintaining means for maintaining the electrolyte at a constant temperature. The method of claim 7, wherein the temperature maintaining means, An outer tank surrounding the inner tank in which the electrolyte is contained, and containing heat medium oil therein; And a cooling and heating device disposed below the inner tank to heat or cool the inner tank to a predetermined temperature. The plating apparatus according to claim 4, wherein the plated object is made of a material selected from the group consisting of precious metals, stainless steels, and molybdenum steels.