KR100470439B1 - CIO MOUNTED LCD Module - Google Patents

CIO MOUNTED LCD Module Download PDF

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KR100470439B1
KR100470439B1 KR1019970036315A KR19970036315A KR100470439B1 KR 100470439 B1 KR100470439 B1 KR 100470439B1 KR 1019970036315 A KR1019970036315 A KR 1019970036315A KR 19970036315 A KR19970036315 A KR 19970036315A KR 100470439 B1 KR100470439 B1 KR 100470439B1
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fpc
electrode lines
lcd module
tft
cog
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KR1019970036315A
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KR19990012795A (en
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장윤석
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삼성전자주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/42—Arrangements for providing conduction through an insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

본 발명은 COG 실장형 LCD 모듈에 관한 것으로, 본 발명에서는 FPC를 TFT의 내부에 형성하고, 이러한 FPC의 평면상에서 보았을 때 상하면에 FPC 라인을 분할·연결시켜, 전극라인들간의 교차를 방지함으로써, 전극라인들의 신호 왜곡 및 변조를 억제시키고, 그 결과, 전체 장치의 신호전달 속도를 현저히 향상시킬 수 있다.The present invention relates to a COG-mounted LCD module, in the present invention, by forming the FPC inside the TFT, by splitting and connecting the FPC line on the top and bottom when viewed on the plane of the FPC, to prevent the intersection between the electrode lines, Signal distortion and modulation of the electrode lines can be suppressed, and as a result, the signal transmission speed of the entire apparatus can be significantly improved.

Description

씨오지 실장형 엘씨디 모듈CIOGE Mount LCD Module

본 발명은 COG(Chip On Glass) 실장형 LCD 모듈에 관한 것으로, 좀더 상세하게는 FPC의 상하면으로부터 FPC 라인을 분할·연결시켜, 전극라인들간의 교차(cross over)를 방지함으로써, 전체 장치의 신호전달을 신속하게 이룰 수 있도록 하는 COG 실장형 LCD 모듈에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip on glass (LCD) mounted LCD module. More specifically, the FPC line is divided and connected from the upper and lower surfaces of the FPC to prevent cross over between the electrode lines, thereby preventing the signal of the entire apparatus. It relates to a COG-mounted LCD module that allows for fast delivery.

일반적으로, 구동 IC를 TFT-LCD 패널에 실장하는 방식은 도전성의 와이어를 통해 LCD 패널 전극에 구동 IC를 접속하는 방식인 와이어 본딩 방식과, 베이스 필름을 통해 LCD 패널 전극에 구동 IC를 실장하는 방식인 탭(TAB:Tape Automated Bonding) 방식과, 소정의 접착제를 통해 구동 IC를 LCD 패널에 직접 실장하는 방식인 COG 방식 등으로 분류할 수 있다.In general, the method of mounting the driving IC to the TFT-LCD panel is a wire bonding method of connecting the driving IC to the LCD panel electrode through a conductive wire, and the method of mounting the driving IC to the LCD panel electrode through the base film. It can be classified into a tape automated bonding (TAB) method and a COG method in which a driving IC is directly mounted on an LCD panel through a predetermined adhesive.

이러한 여러 가지 실장 방식 중 COG 실장 방식은 실장 면적의 최소화 및 코스트(Cost) 감소라는 중요한 장점을 지니고 있어, 그 사용 영역이 점차 확대되고 있는 추세에 있다.Among these various mounting methods, the COG mounting method has important advantages such as minimizing the mounting area and reducing the cost, and its use area is gradually expanding.

도 1은 이러한 COG 실장 방식을 채용한 종래의 COG 실장형 LCD 모듈의 형상을 개략적으로 도시한 평면도이다.1 is a plan view schematically showing the shape of a conventional COG mounted LCD module employing such a COG mounting method.

도시된 바와 같이, 종래의 COG 실장형 LCD 모듈은 TFT 기판(1)상에 TFT(미도시)를 구동하기 위해 탑재된 구동 IC(4,5)들과, 이 구동 IC(4,5)들의 구동신호를 TFT로 전달하기 위해 FPC(Flexible Printed Circuit:3)와 대응되도록 배열·형성된 전극라인(4a,4b,5a,5b)들을 포함한다. 이때, FPC(3)는 TFT 기판(1)에서 외부로 도출되어 인쇄회로기판(미도시)과 연결된다.As shown, the conventional COG-mounted LCD module has drive ICs 4, 5 mounted on the TFT substrate 1 to drive a TFT (not shown), and the drive ICs 4, 5 of the ICs. It includes electrode lines 4a, 4b, 5a, and 5b arranged and formed to correspond to the FPC (Flexible Printed Circuit) 3 to transfer the driving signal to the TFT. At this time, the FPC 3 is led out of the TFT substrate 1 and connected to the printed circuit board (not shown).

여기서, 미설명 부호 2는 칼라필터 기판이다.Here, reference numeral 2 denotes a color filter substrate.

이때, 전극라인들의 일부(4b,5b)는 TFT와 연결되며, 전극라인들의 다른 일부(4a,5a)는 FPC(3)의 한쪽면과 연결된 FPC 라인(6)과 연결되는 바, 이에 따라, 인쇄회로기판으로부터 출력되는 제어신호는 FPC 라인(6) 및 전극라인(4a,4b,5a,5b)들을 거쳐 TFT로 적절히 전달된다. 그 결과, LCD 패널(미도시) 및 칼라필터 기판(2)에는 사용자가 원하는 소정의 화상 정보가 적절히 디스플레이 된다.At this time, the portions 4b and 5b of the electrode lines are connected to the TFT, and the other portions 4a and 5a of the electrode lines are connected to the FPC line 6 connected to one side of the FPC 3. The control signal output from the printed circuit board is appropriately transferred to the TFT via the FPC line 6 and the electrode lines 4a, 4b, 5a, 5b. As a result, predetermined image information desired by the user is appropriately displayed on the LCD panel (not shown) and the color filter substrate 2.

이러한 구성을 갖는 종래의 COG 실장형 LCD 모듈은, TAB 실장 방식을 채용한 TAB 실장형 LCD 모듈과 달리 구동 IC를 실장하기 위한 별도의 테이프 캐리어(Tape carrier)를 구비하지 않아도 됨으로써, 실장 면적의 최소화 및 부대 비용 저감 효과를 얻을 수 있었다.The conventional COG-mounted LCD module having such a configuration does not require a separate tape carrier for mounting the drive IC, unlike the TAB-mounted LCD module employing the TAB mounting method, thereby minimizing the mounting area. And an additional cost reduction effect.

그러나, 이러한 구성을 갖는 종래의 COG 실장형 LCD 모듈에는 몇 가지 중대한 문제점이 있다.However, there are some serious problems with the conventional COG mounted LCD module having such a configuration.

첫째, 상술한 바와 같이, FPC(3)는 TFT 기판(1)에서 돌출 되어 외부의 인쇄회로기판과 연결되고 상술한 FPC 라인(6)은 이러한 FPC(3)의 한쪽면에 집중·연결되는 바, 이에 따라 FPC 라인(6)과 연결되는 전극라인(4a,4b,5a,5b)들 중 일부가 상호 교차되는 영역(crossover area; A)이 생성되고, 이러한 영역(A)에서는 인접하거나 교차되는 신호선에서 빈번하게 발생하는 기생 용량에 의해 신호가 왜곡되거나 변조되는 경우가 빈번하게 발생됨으로써, 전체 장치의 신호전달이 지연되는 등 심각한 문제점이 있다.First, as described above, the FPC 3 protrudes from the TFT substrate 1 and is connected to an external printed circuit board, and the above-described FPC line 6 is concentrated and connected to one side of the FPC 3. Accordingly, a crossover area A of some of the electrode lines 4a, 4b, 5a, and 5b connected to the FPC line 6 crosses each other, and in this area A, adjacent or intersecting areas are formed. Since the signal is frequently distorted or modulated by parasitic capacitance that frequently occurs in the signal line, there is a serious problem such as delayed signal transmission of the entire apparatus.

둘째, 이러한 신호전달 지연으로 인해, 전체 장치의 품질이 저감되는 심각한 문제점이 있다.Second, due to this signal propagation delay, there is a serious problem that the quality of the entire device is reduced.

따라서, 본 발명의 목적은 FPC를 TFT의 내부에 형성하고, 이러한 FPC의 상하면에 FPC 라인을 분할·연결시켜, 전극라인들간의 교차를 방지함으로써, 종래 전극 라인들에게 빈번하게 발생하는 신호 왜곡 및 변조를 억제시키고, 그 결과, 전체 장치의 신호전달 속도를 현저히 향상시킬 수 있도록 하는 COG 실장형 LCD 모듈을 제공함에 있다.Accordingly, an object of the present invention is to form an FPC inside the TFT, and to divide and connect the FPC lines on the upper and lower surfaces of the FPC to prevent crossover between the electrode lines, thereby preventing signal distortion frequently occurring in conventional electrode lines. It is to provide a COG-mounted LCD module that suppresses the modulation, and as a result, can significantly improve the signal transmission speed of the entire device.

상기와 같은 목적을 달성하기 위한 본 발명은 TFT 기판과; 상기 TFT 기판 상에 형성되어 TFT를 구동하는 구동 IC들과; 상기 TFT 기판의 내부에 형성되어 상기 구동 IC들과 소정의 FPC 라인을 통해 연결되면서 인쇄회로기판으로부터 출력되는 제어신호를 상기 구동 IC들로 전달하는 FPC를 포함하며, 상기 FPC 라인은 상기 FPC의 양쪽 측면으로 인입 되어 상기 FPC와 연결되는 것을 특징으로 한다.The present invention for achieving the above object is a TFT substrate; Drive ICs formed on the TFT substrate to drive a TFT; A FPC formed in the TFT substrate and connected to the driving ICs through a predetermined FPC line to transfer a control signal output from a printed circuit board to the driving ICs, wherein the FPC line has both sides of the FPC; It is drawn to the side is characterized in that it is connected to the FPC.

이에 따라, 본 발명에서는 전극라인들간의 교차에 따른 신호 왜곡 및 변조를 미연에 방지한다.Accordingly, in the present invention, signal distortion and modulation due to intersection between the electrode lines are prevented.

이하, 첨부된 도면을 참조하여 본 발명에 따른 COG 실장형 LCD 모듈을 좀더 상세히 설명하면 다음과 같다.Hereinafter, the COG-mounted LCD module according to the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 COG 실장형 LCD 모듈의 형상을 개략적으로 도시한 평면도이다.2 is a plan view schematically showing the shape of the COG-mounted LCD module according to the present invention.

도시된 바와 같이, 본 발명에 따른 COG 실장형 LCD 모듈은 TFT 기판(1)과, TFT 기판(1)상에 형성되어 TFT를 구동하는 구동 IC들(4,5)과, TFT 기판(1)의 내부에 형성되어 구동 IC(4,5)들과 FPC 라인(21)을 통해 연결되면서 인쇄회로기판으로부터 출력되는 제어신호를 구동 IC(4,5)들로 전달하는 FPC(20)를 포함한다.As shown, the COG-mounted LCD module according to the present invention comprises a TFT substrate 1, drive ICs 4 and 5 formed on the TFT substrate 1 to drive the TFT, and a TFT substrate 1 It is formed in the interior of the drive IC (4,5) and is connected via the FPC line 21 includes a FPC (20) for transmitting a control signal output from the printed circuit board to the drive IC (4,5) .

이때, 본 발명의 특징에 따르면, FPC 라인(21)은 평면상에서 보았을 때 FPC(20)의 상하면으로 각각 인입되어 FPC(20)의 두 곳에서 연결된다. 이에 따라, 전극라인(4a,4b,5a,5b)들간 상호 교차되는 현상은 방지된다.At this time, according to the characteristics of the present invention, the FPC line 21 is drawn into the upper and lower surfaces of the FPC 20 when viewed in plan view, respectively, and connected at two places of the FPC 20. Accordingly, the phenomenon in which the electrode lines 4a, 4b, 5a, and 5b cross each other is prevented.

종래의 경우, FPC는 TFT 기판에서 돌출 되어 외부의 인쇄회로기판과 연결되었고, FPC 라인은 따라서 FPC의 한쪽에 집중·연결되었던 바, 이에 따라 FPC 라인과 연결되는 전극라인의 간격이 좁아져 기생용량이 발생 또는 상호 교차되는 영역이 생성됨으로써, 전극라인(4a,4b,5a,5b)에 인가된 신호가 왜곡되거나 변조되는 현상을 발생 시켰다.In the conventional case, the FPC was protruded from the TFT substrate and connected to an external printed circuit board, and the FPC line was thus concentrated and connected to one side of the FPC. As a result, the gap between the electrode lines connected to the FPC line was narrowed and thus the parasitic capacitance was reduced. This generation or the area where they cross each other is generated, thereby causing a phenomenon in which the signal applied to the electrode lines 4a, 4b, 5a, and 5b is distorted or modulated.

그러나, 본 발명의 경우, FPC(20)는 TFT 기판(1) 내부에 배치되고, 이러한 배치형상에 따라 노출되는 FPC(20)의 상기 상하면으로 각각 FPC 라인(21)이 인입·연결됨으로써, TFT 기판(1)에는 일정한 여유공간이 생성되고, 이러한 여유공간을 이용하여 FPC 라인(21)을 자유롭게 배치할 수 있어, 전극라인(4a,4b,5a,5b)들간 교차되는 현상을 방지하고, 그 결과 전극라인(4a,4b,5a,5b)에서 발생하는 신호 왜곡 및 신호 변조를 미연에 방지할 수 있다.However, in the case of the present invention, the FPC 20 is disposed inside the TFT substrate 1, and the FPC lines 21 are drawn in and connected to the upper and lower surfaces of the FPC 20 exposed according to the arrangement shape, so that the TFTs A certain clearance is created in the substrate 1, and the FPC line 21 can be freely arranged using this clearance to prevent the phenomenon of crossing between the electrode lines 4a, 4b, 5a, and 5b. As a result, signal distortion and signal modulation occurring in the electrode lines 4a, 4b, 5a, and 5b can be prevented.

도 2에서 FPC 라인(21)과 전극라인(4a, 4b, 5a, 5b)의 교차가 발생될 수 있지만, 이는 도 2에 도시된 바와 같이 FPC 라인(21)의 하부면에서 나온 FPC 라인(21)은 전극라인(4a, 4b, 5a, 5b)과 교차되지 않도록 구동 IC(5)의 상부면에 연결시켜 FPC 라인(21)과 전극라인 (4a, 4b, 5a, 5b)의 교차를 방지할 수 있다.In FIG. 2, the intersection of the FPC line 21 and the electrode lines 4a, 4b, 5a, 5b may occur, but this is the FPC line 21 coming from the bottom surface of the FPC line 21 as shown in FIG. 2. ) May be connected to the upper surface of the driving IC 5 so as not to intersect with the electrode lines 4a, 4b, 5a, and 5b to prevent the FPC line 21 and the electrode lines 4a, 4b, 5a, and 5b from crossing each other. Can be.

더욱이, 본 발명에서는 외부로 인출되던 전극라인(4a,4b,5a,5b)의 일부를 구동 IC(4,5)들 내에 형성된 FPC 라인(21)으로 대체·형성함으로써, 상술한 전극라인의 교차 현상 및 신호 왜곡 및 변조는 현저히 저감된다.Further, in the present invention, a part of the electrode lines 4a, 4b, 5a, and 5b drawn out to the outside is formed and replaced by the FPC line 21 formed in the driving ICs 4 and 5, thereby intersecting the above-described electrode lines. The phenomenon and signal distortion and modulation are significantly reduced.

이 후, 인쇄회로기판으로부터 출력되는 제어신호는 FPC 라인(21) 및 전극라인(4a,4b,5a,5b)들을 거쳐 TFT로 전달된다. 그 결과, LCD 패널 및 칼라필터 기판(2)에는 사용자가 원하는 소정의 화상 정보가 디스플레이 된다.Thereafter, the control signal output from the printed circuit board is transferred to the TFT via the FPC line 21 and the electrode lines 4a, 4b, 5a, and 5b. As a result, predetermined image information desired by the user is displayed on the LCD panel and the color filter substrate 2.

이와 같이, 본 발명에서는 FPC의 상기 상하면에 FPC 라인을 분할·연결시켜, 전극라인들간의 교차를 방지함으로써, 전체 장치의 신속한 신호전달을 이룰 수 있다.As described above, in the present invention, the FPC lines are divided and connected to the upper and lower surfaces of the FPC to prevent crossover between the electrode lines, thereby achieving rapid signal transmission of the entire apparatus.

이러한 본 발명은 제조라인에서 제조되어지는 전 기종의 LCD 장치에서 두루 유용한 효과를 나타낸다.This invention exhibits useful effects throughout all types of LCD devices that are manufactured in manufacturing lines.

그리고, 본 발명의 특정한 실시예가 설명 및 도시되었지만 본 발명이 당업자에 의해 다양하게 변형되어 실시될 가능성이 있는 것은 자명한 일이다.And while certain embodiments of the invention have been described and illustrated, it will be apparent that the invention may be embodied in various modifications by those skilled in the art.

이와 같은 변형된 실시예들은 본 발명의 기술적사상이나 관점으로부터 개별적으로 이해되어져서는 안되며 이와 같은 변형된 실시예들은 본 발명의 첨부된 특허청구의 범위 안에 속한다 해야 할 것이다.Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

이상에서 상세히 설명한 바와 같이, 본 발명에 따른 COG 실장형 LCD 모듈에서는 FPC를 TFT의 내부에 형성하고, 이러한 FPC의 양쪽면에 FPC 라인을 분할·연결시켜, 전극라인들간의 교차를 방지함으로써, 전극 라인에서의 신호 왜곡 및 신호 변조를 억제하고, 그 결과, 전체 장치의 신호전달 속도를 현저히 향상시킬 수 있다. As described in detail above, in the COG-mounted LCD module according to the present invention, the FPC is formed inside the TFT, and the FPC lines are divided and connected to both sides of the FPC to prevent the crossover between the electrode lines. Signal distortion and signal modulation in the line can be suppressed, and as a result, the signal transmission speed of the entire apparatus can be significantly improved.

도 1은 종래의 COG 실장형 LCD 모듈의 형상을 개략적으로 도시한 평면도.1 is a plan view schematically showing the shape of a conventional COG-mounted LCD module.

도 2는 본 발명에 따른 COG 실장형 LCD 모듈의 형상을 개략적으로 도시한 평면도.2 is a plan view schematically showing the shape of the COG-mounted LCD module according to the present invention.

Claims (1)

TFT 기판과; A TFT substrate; 상기 TFT 기판 상에 형성되어 TFT를 구동하는 구동 IC들과;Drive ICs formed on the TFT substrate to drive a TFT; 상기 TFT 기판의 내부에 형성되어 상기 구동 IC들과 소정의 FPC 라인을 통해 연결되면서 인쇄회로기판으로부터 출력되는 제어신호를 상기 구동 IC들로 전달하는 FPC를 포함하며,An FPC formed in the TFT substrate and connected to the driving ICs through a predetermined FPC line and transferring a control signal output from a printed circuit board to the driving ICs, 상기 FPC 라인은 상기 FPC의 평면상에서 보았을 때 상하면으로 인입 되어 상기 FPC와 연결되는 것을 특징으로 하는 COG 실장형 LCD 모듈.The FPC line is a COG-mounted LCD module, characterized in that the upper and lower surfaces are connected to the FPC when viewed from the plane of the FPC.
KR1019970036315A 1997-07-31 1997-07-31 CIO MOUNTED LCD Module KR100470439B1 (en)

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