KR100452538B1 - external appearance inspection apparatus of semiconductor device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for inspecting the appearance of semiconductor devices. The present invention relates to an apparatus for inspecting the appearance of semiconductor devices having a size of several millimeters, which can be accurately and quickly inspected, and are classified into good, defective, and retested products. A semiconductor element supplying and aligning portion for sequentially supplying and aligning a plurality of semiconductor elements around the supply plate; The semiconductor element is sucked from the semiconductor element supply and alignment unit around a circular lower cover rotating in the opposite direction to the supply plate, and the top or bottom and front surfaces of the semiconductor element are sequentially photographed by a plurality of cameras to inspect the appearance. A first inspection unit; A second device for adsorbing a semiconductor device from the first inspection unit around another circular lower cover rotating in a direction opposite to the lower cover, and sequentially photographing a lower surface or an upper surface and a rear surface of the semiconductor element with a plurality of cameras to inspect the appearance; Characterized in that it comprises an inspection unit.

Description

External appearance inspection apparatus of semiconductor device

The present invention relates to a device for inspecting the appearance of a semiconductor device, and in more detail, it is possible to accurately and quickly inspect the appearance of a semiconductor device having a size of several millimeters and to classify it as a good product, a defective product, and a retested product, and to discharge it. The present invention relates to an apparatus for inspecting appearance of semiconductor devices.

Recently, various semiconductor devices such as integrated circuits (ICs) and passive devices have been greatly reduced in size and manufactured in units of millimeters. After the assembly of the semiconductor device is completed, not only the electrical inspection but also the appearance thereof is inspected. The appearance inspection is usually performed by manual labor. In other words, semiconductor devices are classified into good or bad by inspecting for abnormalities in their appearance using optical equipment such as microscopes.

However, the inspection of the appearance of the semiconductor device as described above has a disadvantage that not only takes a long time, but also the accuracy of the inspection by a large number of people manually. In addition, the increase in labor costs is one of the reasons for raising the price of semiconductor devices.

Therefore, the present invention has been made to solve the above-mentioned conventional problems, the object of the present invention is to accurately and quickly inspect the appearance of a semiconductor device having a unit of several millimeters and at the same time classified as good, defective and re-inspected product The present invention provides an apparatus for inspecting the appearance of a semiconductor device that can be discharged quickly and accurately.

1 is a plan view showing an appearance inspection apparatus of a semiconductor device according to the present invention.

2A and 2B are a plan view and a cross-sectional view showing a first inspection unit and a second inspection unit in the inspection apparatus according to the present invention.

3A and 3B are a plan view and a cross-sectional view showing a state where an upper cover, an air injection port, and an element discharge port are mounted and positioned in a first inspection unit and a second inspection unit in the inspection apparatus according to the present invention.

4A and 4B are a plan view and a cross-sectional view of an element lower cover which is one component of the first inspection unit in the inspection apparatus according to the present invention.

5A and 5B are a plan view and a cross-sectional view of an upper cover which is one component of the second inspection unit in the inspection apparatus according to the present invention.

Figure 6 is a plan view showing a suction plate located between the lower cover and the upper cover which is one component of the first inspection unit and the second inspection unit in the inspection apparatus according to the present invention.

7A and 7B are a plan view and a cross-sectional view of a fixing plate which is one component of the first and second inspection units in the inspection apparatus according to the present invention.

-Description of the main symbols in the drawings-

1000; Appearance inspection apparatus of semiconductor element according to the present invention

100; A semiconductor device supply and alignment unit 102; Element storage

104; Tube 106; Supply plate

108; Step 110; Device aligner

112; X direction adjusting knob 114; Y direction adjustment knob

116; Angle adjustment knob 200; First Inspection Department

202; Motor 204; Gearbox

206; Axis 208; bearing

210; Fixing plate 212; Arc through hole

214; Air suction line 216; Lower cover

218; Through hole 220; First through

222; Second through hole 224; water level

226; Top cover 228; incline

230; Camera 1 232; Outlet 1

234; First air jet 236; Camera 2

238; Outlet 240; No. 2 air nozzle

242; Adsorption plate 300; Second Inspection Department

302; Motor 304; Gearbox

306; Axis 308; bearing

310; Fixing plate 312; Arc through hole

314; Air supply line 316; Lower cover

320; First through hole 322; 2nd through

324; Horizontal plane 326; Top cover

328; Slope 330; Camera 3

332; Outlet 3 334; No. 3 air nozzle

336; Camera 4 338; Outlet 4

340; 4 air nozzle 342; Adsorption plate

342; Outlet for retest 346; 5th air nozzle

348; Outlet 350 for good; 6th air nozzle

402; Frame 404; Support plate

406; Upper plate

In order to achieve the above object, an apparatus for inspecting appearance of a semiconductor device according to the present invention includes: a semiconductor device supply and alignment unit for sequentially supplying and aligning a plurality of semiconductor devices around a circular circular supply plate; The semiconductor element is sucked from the semiconductor element supply and alignment unit around a circular lower cover rotating in the opposite direction to the supply plate, and the top or bottom and front surfaces of the semiconductor element are sequentially photographed by a plurality of cameras to inspect the appearance. A first inspection unit; A device for adsorbing a semiconductor device from the first inspection unit around another circular upper cover rotating in the opposite direction to the lower cover, and sequentially photographing the lower surface or the upper surface and the rear surface of the semiconductor element with a plurality of cameras to inspect the appearance; Characterized in that it consists of two inspection.

Here, the first inspection unit and the second inspection unit is formed with a discharge port of the defective semiconductor element on the side of each camera, so as to discharge the semiconductor element determined to be defective as a result of the inspection by the camera, the lower cover on the upper portion of each discharge port Alternatively, an air injection port for injecting high pressure air toward the semiconductor element is provided so that the semiconductor element adsorbed around the upper cover is easily discharged toward the discharge port.

In addition, the second inspection unit is further formed with a re-examination outlet and a good-quality outlet, the upper portion of each of the outlet so that the semiconductor element adsorbed around the upper cover can be discharged to the outlet, the high pressure toward the semiconductor element An air jet port for injecting air is provided.

In addition, the lower cover and the upper cover of the first inspection unit and the second inspection unit have a plurality of through-holes radially formed from the inner side to the outer side of the origin, and the adsorption plate is further adapted to adsorb the semiconductor elements through the respective through-holes. It is installed.

In addition, the first inspection unit is located at the bottom of the lower cover at the same time the upper cover slightly smaller than the lower cover is in close contact, the second inspection unit is located at the top and at the bottom of the The lower cover slightly smaller in diameter than the upper cover is in close contact, and the suction plate is in close contact with the upper cover and the lower cover.

In addition, a fixing plate having a substantially arc-shaped through hole is further formed below the lower cover to allow air to be sucked into the lower cover.

An element support plate is further formed between the first cover and the lower cover of the second inspector so that the semiconductor device can easily move from the first inspector to the second inspector.

As described above, according to the apparatus for inspecting the appearance of a semiconductor element according to the present invention, a plurality of semiconductor elements are sequentially moved while adsorbing one side around a suction plate provided in each of the first and second inspection units, and at the same time. Examine the top, bottom, front, and back of the semiconductor device using four cameras on each side. If it is defective, discharge it immediately to the defective outlet. If it needs to be retested, discharge it to the re-examination outlet. By discharging, the external appearance of the semiconductor device can be inspected accurately and quickly.

(Example)

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

1 is a plan view showing an appearance inspection apparatus 1000 of a semiconductor device according to the present invention. As shown, the present invention provides a supply and alignment unit 100 for supplying a semiconductor device largely, a first inspection unit 200 for inspecting a semiconductor element primarily, and a second inspection unit for inspecting the semiconductor element secondaryly ( 300).

First, the semiconductor element supplying and arranging unit 100 is formed in a substantially cylindrical shape and includes an element receiving opening 102 in which a plurality of semiconductor elements are stored, and on one side of the element receiving opening 102 from the receiving opening 102. The tube 104 is sequentially provided with a semiconductor element discharged, the supply plate 106 is provided at the end of the tube 104 so that the semiconductor element discharged from the tube 104 can be seated. Here, the device receiving hole 102 vibrates at a predetermined frequency and discharges the semiconductor device through the tube 104. In addition, the tube 104 is inclined downward at an angle so that the semiconductor device can easily flow down the supply plate 106. In addition, the semiconductor device is seated around the supply plate 106, and a step 108 is formed around the semiconductor device so that the semiconductor device can be seated at a stable and constant position. In addition, the device aligner 110 is further positioned at one side of the tube 104 and the supply plate 106 so that the semiconductor element may be supplied to the step 108 of the supply plate 106 at a predetermined position and state. It is. The device aligner 110 may include the X direction adjusting knob 112 and the Y direction adjusting knob 114 so that the semiconductor device discharged from the tube 104 may be accurately positioned in the step 108 of the supply plate 106. And an angle adjusting knob 116. Here, the supply plate 106 in which the semiconductor element is sequentially seated on the step 108 is rotated clockwise around the origin, for example.

Subsequently, a first inspection unit 200 that receives a semiconductor element from the semiconductor element supply and alignment unit 100 and performs an actual inspection is formed adjacent to one side of the supply plate 106. The first inspection unit 200 will be described in more detail below, but for example, rotates by sucking the semiconductor element from the supply plate 106 around the lower cover 216 that rotates counterclockwise around the origin. While inspecting the appearance of the semiconductor device. Here, the circumference of the lower cover 216 and the step 108 of the supply plate 106 are in contact with each other.

On the other hand, on the outer circumference of the lower cover 216, for example, the first camera 230 and the second camera 236 that are capable of distance adjustment in the X and Y directions at the 3 o'clock and 12 o'clock directions are provided. The first camera 230 inspects the upper surface of the semiconductor element by, for example, photographing the semiconductor element adsorbed around the lower cover 216 from the upper surface to the lower surface direction. In addition, the second camera 236 inspects the front surface of the semiconductor device by, for example, photographing the semiconductor device adsorbed around the lower cover 216 from the front side to the rear side.

In addition, the first discharge port 232 and the second discharge port 238 are formed at the sides of the first camera 230 and the second camera 236, respectively. The discharge holes 232 and 238 serve as the semiconductor device through the first discharge port 232 when the upper surface is determined to be defective by inspecting the semiconductor device by the first camera 230 and the second camera 236. The semiconductor device is separated from the lower cover 216 and discharged from the lower cover 216 when the front surface is determined to be defective. Of course, in order to separate the semiconductor device from the lower cover 216, the first air inlet 234 and the second air inlet 240 for injecting high-pressure air are respectively provided on the upper portions of the outlets 232 and 238, respectively. . The air injection holes 234 and 240 are installed in the upper plate 406 installed on the upper portion of the first inspection unit 200.

Subsequently, a second inspection unit 300, which receives the semiconductor device from the first inspection unit 200 and performs the remaining inspection, is formed adjacent to one side of the first inspection unit 200. The second inspection unit 300 will be described in more detail below, for example, the semiconductor from the lower cover 216 of the first inspection unit 200 around the upper cover 326 which rotates clockwise around the origin. The remaining appearance of the semiconductor device is inspected while the device is sucked and rotated. Here, the circumference of the lower cover 216 of the first inspection unit 200 and the upper cover 326 of the second inspection unit 300 are in contact with each other.

On the other hand, at the outer circumference of the upper cover 326, for example, the third camera 330 and the fourth camera 336 which are adjustable in the X and Y directions at the 6 o'clock and 9 o'clock directions are provided. The third camera 330 inspects the lower surface of the semiconductor element by, for example, photographing the semiconductor element adsorbed around the upper cover 326 from the lower surface to the upper surface direction. In addition, the fourth camera 336 inspects the front surface of the semiconductor device by, for example, photographing a semiconductor device adsorbed around the upper cover 326 from the front to the rear direction. Here, the semiconductor device is inspected while the front surface of the semiconductor device becomes the rear surface and the rear surface becomes the front surface during the transfer from the first inspection unit 200 to the second inspection unit 300.

In addition, the third outlet 332 and the fourth outlet 338 are formed at the sides of the third camera 330 and the fourth camera 336, respectively. The discharge holes 332 and 338 are discharged through the discharge holes 332 when the lower surface is determined to be defective as a result of inspecting the semiconductor device by the cameras 330 and 4 336. If the front (that is, the rear) is determined to be defective serves to discharge through the fourth outlet (338). Of course, in order to separate the semiconductor device from the lower cover 316, the third air injection hole 334 and the fourth air injection hole 340 for injecting high-pressure air are respectively provided on the upper portion of each discharge port (332, 338). . The air injection holes 334 and 340 are installed in the upper plate 406 installed on the upper portion of the second inspection unit 300. Here, the upper plate 406 is integrally installed on the upper portion of the first inspection unit 200 and the second inspection unit 300.

In addition, at about 12 o'clock of the second inspection unit 300, a re-inspection discharge port 342 and a good-quality discharge port 348 are provided, respectively, and the upper part of each of the discharge ports 342 and 348 sprays high-pressure air. The first air injection port 346 and the sixth air injection port 350 are provided. That is, among the semiconductor devices that have passed through the first inspection unit 200 and the second inspection unit 300, the element that needs to be re-examined is discharged to the re-examination outlet 342, and the element determined to be good is the non-defective outlet 348. To be discharged.

2A and 2B are a plan view and a cross-sectional view showing the first inspection unit 200 and the second inspection unit 300 in the inspection apparatus 1000 according to the present invention.

As shown, the first inspection unit 200 and the second inspection unit 300 are installed on the frame 402, and motors 202 and 302 are provided under the frame 402, respectively. Gear boxes 204 and 304 are connected to 202 and 302, and shafts 206 and 306 supported by bearings 208 and 308 are coupled to the gear boxes 204 and 304, and the first inspection unit 200 is connected to the upper ends of the shafts 206 and 306, respectively. ) And lower covers 216 and 316 of the second inspection unit 300 are fixed.

Here, fixing plates 210 and 310 in which arc-shaped through holes 212 and 312 are formed at outer peripheries of the shafts 206 and 306 as lower portions of the lower covers 216 and 316 are provided. In addition, the air intake pipes 214 and 314 are installed in the fixing plates 210 and 310 so as to be connected to the arc-shaped through holes 212 and 312, and the description of the fixing plates 210 and 310 will be described in detail below.

In addition, lower covers 216 and 316 are positioned on upper portions of the fixing plates 210 and 310, and sizes of the lower covers 216 and 316 are slightly different in the first inspection unit 200 and the second inspection unit 300. That is, in the first inspection unit 200, the lower cover 216 is rotatable while directly contacting the fixing plate 210, and an upper cover 226 is formed at an upper portion thereof. In addition, the upper cover 226 has a diameter slightly smaller than that of the lower cover 216, so that the horizontal surface 224 is formed around the lower cover 216. The reason why the horizontal plane 224 is formed in this way is that the light of the first camera 230 is directed from the upper surface of the semiconductor device to the lower surface, in order to minimize inspection error rate by minimizing light scattering or interference. That is, since the semiconductor device is adsorbed around the lower cover 216, light is irradiated from the upper surface to the lower surface toward the semiconductor device. At this time, the inclined surface 228 of the upper cover 226 is disposed around the semiconductor device. If they are located adjacent to each other, light scattering or reflection may occur severely, thereby reducing the accuracy of the inspection. However, when the horizontal surface 224 is formed around the semiconductor element, such an error rate is greatly reduced. Here, only the upper upper cover 226 and the lower cover 216 rotates in the counterclockwise direction, and the fixing plate 210 does not rotate. In addition, the lower cover 216 has a through hole 218 formed around the origin, which is in communication with the arc-shaped through hole 212 of the fixing plate 210.

On the other hand, the second inspection unit 300 has a lower cover 316 is attached to the top of the fixing plate 310, the upper cover 326 is in close contact with the upper portion of the lower cover 316. Of course, as described above, the diameter of the lower cover 316 is smaller than the diameter of the upper cover 326, thereby minimizing an error rate when inspecting a semiconductor device. Of course, the through hole 318 is formed so that the air is sucked into the lower cover 316. In addition, the lower cover 316 and the upper cover 326 is rotated in the clockwise direction around the origin, the fixing plate 310 does not rotate.

Here, the support plate 404 in the boundary region of the first inspection unit 200 and the second inspection unit 300 so that the semiconductor device can be easily and accurately transferred from the first inspection unit 200 to the second inspection unit 300. It is installed. That is, the lower cover 216 of the first inspection unit 200 and the upper cover 326 of the second inspection unit 300 are in contact with each other, the support plate 404 is installed on the contact portion By doing so, the semiconductor element can be delivered more easily and accurately.

3A and 3B show an upper plate 406, an air injection port 234, 240, 332, 340, 346, 348, and an outlet 232, 238, 332, 338, 342, 348 mounted and positioned on the first inspection unit 200 and the second inspection unit 300 in the inspection apparatus 1000 according to the present invention. It is a top view and sectional drawing which shows the state. As shown in the upper portion of each outlet is provided with an air injection port for injecting high-pressure air, the lower cover 216 and the upper cover 326 of the first inspection unit 200 and the second inspection unit 300 by the air injection hole The semiconductor element adsorbed around the periphery is discharged toward each outlet.

4A and 4B are a plan view and a cross-sectional view of the lower cover 216 which is one component of the first inspection unit 200 in the inspection apparatus 1000 according to the present invention. As shown, a plurality of through holes 218 are formed, and the through holes 218 communicate with arc-shaped through holes 212 of the fixing plate 210, not shown. The lower cover 216 of this structure has a semiconductor element adsorbed around it.

5A and 5B are a plan view and a cross-sectional view of the upper cover 226 which is one component of the second inspection unit 300 in the inspection apparatus 1000 according to the present invention. As shown, it is formed in a substantially disk shape, and a plurality of semiconductor elements are adsorbed around it.

6 is a suction plate (242, 342) located between the lower cover (216, 316) and the upper cover (226, 326) as a component of the first inspection unit 200 and the second inspection unit 300 in the inspection apparatus 1000 according to the present invention It is a plan view showing the. As shown in the figure, it is formed in a substantially disk shape, and the first through holes 220 and 320 and the second through holes 222 and 322 are approximately radially arranged around the origin. Here, the width of the first through holes (220,320) is formed wider than the width of the second through holes (222,322), the first through holes 220,320 and the second through holes (222,322) are in communication with each other. That is, the region where the semiconductor element is actually adsorbed is the adsorption plates 242 and 342 in close contact between the lower cover and the upper cover, and the semiconductor elements are adsorbed to the second through holes 222 and 322 of the adsorption plate. The suction plates 242 and 342 have the same diameter as the lower cover 216 in the first inspection unit 100, and have the same diameter as the upper cover 326 in the second inspection unit 200.

In addition, the first through holes 222 and 322 of the adsorption plates 242 and 342 are communicated with the respective through holes 218 and 318 formed in the lower covers 216 and 316, so that the air sucked into the second through holes 222 and 322 of the adsorption plates. The first through holes 220 and 320, the through holes 218 and 318 of the lower cover, and the fixed plates 212 and 312 are sucked into the air suction pipes 214 and 314.

7A and 7B are plan views and cross-sectional views of fixing plates 210 and 310 which are components of the first inspection unit 200 and the second inspection unit 300 in the inspection apparatus 1000 according to the present invention. As shown, the fixing plates 210 and 310 are substantially disc-shaped, and arc-shaped through holes 212 and 312 are formed around the periphery. However, the arc-shaped through holes 212 and 312 occupy different positions in the first inspection unit 200 and the second inspection unit 300. That is, in the first inspection unit 200, the arc-shaped through hole 212 is integrally formed from approximately 9 o'clock to 5 o'clock, and in the second inspection unit 300, the arc-shaped through hole 312 is formed. It is formed integrally from the approximately 3 o'clock direction to the 1 o'clock direction (see Fig. 1). Therefore, the suction plate 242 of the first inspection unit 200 is not sucked with air from the approximately 5 o'clock position to the 9 o'clock direction. . That is, in this section, the semiconductor device may not remain in the suction plate 242 and the lower cover 216. In addition, the suction plate 342 of the second inspection unit 300 is not sucked air from approximately 1 o'clock to 3 o'clock. That is, in this section, the semiconductor device may not remain in the upper cover 326 or the suction plate 342. In addition, since the first inspection unit 200 and the second inspection unit 300 are in contact with each other at the 9 o'clock and 3 o'clock directions, the second inspection unit 300 is disposed on the lower cover 216 of the first inspection unit 200. It can be seen that the semiconductor device is naturally transferred to the upper cover 326 of the.

The operation of the external appearance inspection apparatus 1000 of the semiconductor device will be described below.

First, a plurality of semiconductor devices are supplied by the semiconductor device supply and alignment unit 100. That is, the semiconductor element is discharged along the inclined tube 104 from the element storage port 102, and the semiconductor element discharged is sequentially positioned at the step 108 of the supply plate 106 rotating (rotating) clockwise. do.

Here, the X direction, the Y direction and the angle of the semiconductor device are appropriately adjusted by the element aligner 110 provided at one side of the tube 104 and the supply plate 106.

Subsequently, the semiconductor device on the supply plate 106 as described above is attracted to the lower cover 216 and the adsorption plate 242 of the first inspection unit 200 and rotates in a predetermined direction. That is, the semiconductor element is adsorbed around the lower cover 216 and the adsorption plate 242 of the first inspection unit 200, and rotates counterclockwise. At this time, the upper surface of the semiconductor device is inspected by the first camera 230 installed in the 3 o'clock direction of the first inspection unit 200. The semiconductor device determined as defective as a result of the inspection is discharged through the first outlet 232. That is, the first air injection port 234 installed above the first discharge port 232 discharges the high pressure air, thereby discharging the defective semiconductor device attached to the lower cover 216 toward the first discharge port 232.

Subsequently, the front surface of the semiconductor device is inspected by the second camera 236. The semiconductor element determined as defective as a result of the inspection is discharged toward the second discharge port 238 by the high pressure air of the second air injection port 240.

Subsequently, the semiconductor elements adsorbed on the lower cover 216 and the adsorption plate 242 of the first inspection unit 200 are sequentially disposed on the upper cover 326 and the adsorption plate 342 which are rotated in the clockwise direction of the second inspection unit 300. Is adsorbed and delivered. That is, since the lower cover 216 of the first inspection unit 200 has no air sucked from about 5 o'clock to 9 o'clock, the force for absorbing the semiconductor element is lost, and thus the semiconductor element is easily provided. The upper cover 326 and the suction plate 342 of the second inspection unit 300 is moved. Of course, since the support plate 404 is positioned between the first inspection unit 200 and the second inspection unit 300, the transfer and transfer of the semiconductor device is more easily and accurately performed.

Subsequently, the lower surface of the semiconductor device is inspected by the third camera 330 installed at the six o'clock direction of the second inspection unit 300. The semiconductor element determined as defective as a result of the inspection is discharged to the third discharge port 332 by the high pressure air of the third air injection port 334.

In addition, the semiconductor device is inverted and transferred from the first inspection unit 200 to the second inspection unit 300 by the fourth camera 336 installed at the 9 o'clock position of the second inspection unit 300. Is actually the back side of the semiconductor element). The semiconductor element determined as defective as a result of the inspection is discharged to the fourth discharge port 338 by the high pressure air of the fourth air injection port 340.

Finally, the semiconductor device that needs to be retested is discharged toward the reexamination outlet 342 by the air injection port 340, and the good semiconductor device is directed to the discharge outlet 348 by the air injection port No. 6 Discharged. Of course, the second inspection unit 300 has no suction force of the lower cover 316 from approximately 1 o'clock to 3 o'clock, so that no semiconductor element remains in the lower cover 316 of the section.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the appearance inspection apparatus of the semiconductor element according to the present invention, a plurality of semiconductor elements are sequentially moved while adsorbing one side around the adsorption portion provided in the first and second inspection portions, respectively, Examine the top, bottom, front, and back of the semiconductor device using two cameras, and immediately discharge them to the defective outlet when the defect is bad, and discharge them to the discharge outlet for re-inspection if re-inspection is required. As a result, the appearance of the semiconductor device can be inspected accurately and quickly.

Claims (7)

(delete) (delete) (delete) (Correction) a semiconductor element supply and alignment unit 100 for sequentially supplying and aligning a plurality of semiconductor elements around a circular supply plate 106 that rotates; Adsorbed plate 242 is provided with a plurality of through-holes 220 and 222 radially from the inner side toward the outer side of the origin, the lower cover 216 is in close contact with the lower portion of the suction plate 242, the suction plate 242 The upper cover 226 is in close contact with the upper portion of the upper plate 226 to attract the semiconductor element from the supply plate 106 to the circumferential surface and to rotate in the opposite direction to the supply plate 106, and to the outside of the lower cover 216. At the periphery, the first camera 230 is installed to photograph the upper surface of the adsorbed semiconductor device to perform an appearance inspection, and one side of the first camera 230 is a semiconductor having a bad top surface by the first air injection port 234. The first outlet 232 is installed so that the device is discharged, and the second camera 236 is installed on the other outer periphery of the lower cover 216 to photograph the front surface of the absorbed semiconductor device and perform an appearance inspection. The second camera 236 The first inspection unit 200, one side of the front defective semiconductor device is such that outlet 238 2 discharged by the air ejection port 240 is provided twice; And, Adsorbed plate 342 is provided with a plurality of through-holes 320 and 322 radially from the inside toward the outside of the origin, the lower cover 316 is in close contact with the lower portion of the suction plate 342, the suction plate 342 The upper cover 326 is in close contact with the upper portion of the upper portion of the first inspection unit 100, and absorbs the semiconductor element from the lower cover 216 of the first surface while rotating in the opposite direction to the lower cover 216, the upper On the outer circumference of the cover 326, the third camera 330 is installed to photograph the lower surface of the adsorbed semiconductor device and perform an appearance inspection, and the third air injection port 334 is disposed on one side of the third camera 330. By the third discharge port 332 is installed so that the defective semiconductor device is discharged, and the other side of the upper cover 326, the fourth camera (4) to perform the appearance inspection by photographing the rear surface of the absorbed semiconductor device 336 is installed, the 4 On one side of the camera 336, the fourth discharge port 338 is installed so that the semiconductor device having a bad back surface is discharged by the fourth air injection port 340, and the fifth air injection hole (338) is provided on the other outer circumference of the upper cover 326. The re-examination outlet 342 is installed to discharge the semiconductor element to be re-examined by the 346, and on the other outer circumference of the upper cover 326, the good-quality semiconductor element is discharged by the air injection port 350 at the sixth end. Apparatus for inspecting the appearance of a semiconductor device, characterized in that it comprises a second inspection unit 300 is provided with a discharge port (348). (Correction) The diameter of the first inspection unit 200, the lower cover 216 is larger than the diameter of the upper cover 226, the second inspection unit 300 is the diameter of the upper cover 326 Apparatus for inspecting the appearance of a semiconductor device, characterized in that larger than the diameter of the lower cover (316). (Correction) The method of claim 4, wherein the lower surface of the lower cover (216, 316) of the first and second inspection unit (200, 300) is formed in the through hole (212, 312) of the arc-shaped so that air is sucked into the lower cover (216, 316) Apparatus for inspecting the appearance of a semiconductor device, characterized in that the fixing plate (210,310) having a further installed. (Correction) The semiconductor device according to claim 4, wherein a semiconductor device is disposed between the first inspection unit 200 and the second inspection unit 300 at a lower portion of the contact surfaces of the lower covers 216 and 316. Apparatus for inspecting the appearance of a semiconductor device, characterized in that the device support plate (404) is further formed so as to be easily moved to the inspection unit (300).