KR100426011B1 - Lead-through type filter with square shape elements on substrate - Google Patents

Abstract

The present invention relates to a through-type filter used as a noise blocking filter in a direct current line or a signal line. The present invention relates to a through-type filter in which a square element is mounted on a substrate. At least one rectangular filter element having electrodes formed on one side and the other side of the filter; A center conductor electrically connected to a DC power supply line and electrically connected to one electrode of the filter element; The outer surface of the plate is coated with a conductive film, and includes one or more device mounting portions of the outer surface corresponding to the upper and lower sides of the conductive film is removed, the center portion of each device mounting portion, the substrate formed with a center conductor through hole; includes And inserting the center conductor through the center conductor through hole of the substrate, and mounting one or more rectangular filter elements to each of the element mounting portions, electrically connecting one electrode of each element to the center conductor, and the other side thereof. The electrode is electrically connected to the conductive film of the substrate, and according to the present invention configured as described above, a capacitor incorporated in the through-type filter is fabricated into a polygon, and the polygonal element is mounted on a substrate to form a filter. Capacity management is easy, so the error can be minimized, the voltage resistance is high, and a plurality of through-hole cones on one substrate The present invention relates to a through-type filter in which a square element is mounted on a substrate that can produce a denser, thereby improving productivity.

Description

Through-hole filter with square element on board {LEAD-THROUGH TYPE FILTER WITH SQUARE SHAPE ELEMENTS ON SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a through-type filter used as a noise blocking filter in a direct current line or a signal line. In particular, by fabricating an element embedded in the through-type filter into a polygon, and mounting the polygonal element on a substrate to implement the filter. The capacity of the capacitor can be easily managed to minimize errors, the withstand voltage is high, and a plurality of through-type capacitors can be manufactured on a single substrate, so that the angular element is mounted on the substrate to improve the manufacturability. It is about a type filter.

In general, EMI (electromagnetic interference or electromagnetic interference) refers to an electromagnetic wave directly radiated or conducted from an electric or electronic device that interferes with an electromagnetic reception function of another device, and EMI is an unnecessary electromagnetic signal or an electromagnetic noise. It is also said that the reception of the desired electromagnetic signal is disturbed.

In the early days, EMI was mainly dealt with in the range of radio noise interference, and then it dealt with radiated EMI that radiates directly from electric and electronic devices, and conductive EMI that leaks along power lines. Due to the explosive increase of devices and the development of digital technology and semiconductor technology, the application field of precision electronic devices has become widespread, and the electromagnetic disturbances generated from them affect the living body such as radio noise interference, mutual malfunction of precision electronic devices, and human body. The impact of electronic energy on biological ecosystems has emerged as a major problem, resulting in biological hazards.

Hereinafter, the conventional through filter will be described.

1 is a perspective view showing the internal structure of a conventional through filter, the conventional through filter shown in Figure 1 is a ground plate 15 between the front insulator 13 and the rear insulator 16 is provided with a pin terminal 12 The ground plate 15 is provided with a through hole through which a plurality of center conductors are interposed, and a tubular capacitor 14 is inserted into the through hole while being inserted into the center conductor. The metal front cell 11 is to be installed.

Figure 2 is a perspective view showing the internal structure of another conventional through-type filter, the conventional through-type filter shown in Figure 2 with a tubular ferrite bead 26 is inserted into the center conductor between the planar capacitor 23 of the two layers. It is built in the case 21, and the potting 22 is built in both outer sides of the planar capacitor 23 of the two layers.

However, such a conventional through-type filter has two problems largely due to the tubular capacitor and its structure, one of which is difficult to control errors due to the shape of the tubular capacitor, and the other is poor in manufacturability due to the shape. This was there.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. Accordingly, an object of the present invention is to fabricate an element embedded in a through-type filter into a polygon, and mount the polygonal element on a substrate to implement a filter, It is easy to manage capacity, minimizes errors, has high withstand voltage, and can also manufacture a plurality of through capacitors on a single substrate. To provide.

In addition, another object of the present invention is to provide a through-type filter equipped with a square element on the substrate to enable the realization of more stable filter characteristics even in the high frequency band without the effect of the dielectric inductor by using a square capacitor in the through-type filter. It is.

1 is a perspective view showing the internal structure of a conventional through filter.

Figure 2 is a perspective view showing the internal structure of another conventional through filter.

Figure 3a is a perspective view showing a substrate structure for a first embodiment of a through-type filter according to the present invention, Figure 3b is a cross-sectional view taken along line AA 'of Figure 3a.

4A and 4D are structural diagrams in which elements are mounted on the substrate of FIG. 5A.

Figure 5a is a perspective view showing a substrate structure for a second embodiment of the through-type filter in accordance with the present invention, Figure 5b is a cross-sectional view taken along line BB 'of Figure 5a.

6A-6D are structural diagrams in which elements are mounted on the substrate of FIG. 5A.

7A and 7B are structural diagrams in which a device is mounted by adding a ferrite block to the substrate of FIG. 5A.

8 is a perspective view showing a substrate structure of a third embodiment of a through filter according to the present invention.

9 is a structural diagram in which an element is mounted on the substrate of FIG. 8.

10 is a perspective view showing a substrate structure of a fourth embodiment of a through filter according to the present invention.

11A and 11B are structural diagrams in which elements are mounted on the substrate of FIG. 10.

12 is a perspective view showing a substrate structure of a fifth embodiment of a flow-through filter according to the present invention.

13 is a perspective view showing a substrate structure of a sixth embodiment of a flow-through filter according to the present invention.

14A and 14B are structural diagrams in which elements are mounted on the substrate of FIG. 13.

15A and 15B are exploded perspective views in which a connector is applied to a through filter according to the present invention.

Explanation of symbols on the main parts of the drawings

10a, 15,81a, 81b: ground plate

31,41,51,61,91,101,111,121,131: substrate

32.42,62,82,92,102,112: conductive film

33,43,63,83,93,103: Fastener

34, 34a, 34b, 44, 64, 84, 94, 104, 114

35,65,85,105,115: Center conductor through hole

L, L1, L2: Center conductor C1-C4: Square capacitor

F1, F2: Ferrite FB: Ferrite Block

G: element mounting piece R: resistance element

S: Insulating resin V1: Varistor

As a technical means for achieving the above object of the present invention, the present invention is a through-type filter equipped with a square element on a substrate, consisting of a rectangular ceramic body, each of one side and the other side of the ceramic body At least one square filter element having electrodes; A center conductor electrically connected to a DC power supply line and electrically connected to one electrode of the filter element; The outer surface of the plate is coated with a conductive film or a conductive plate, and includes one or more element mounting portions having the conductive film removed on both sides of the outer surface corresponding to the upper and lower sides, and a central conductor through hole is provided at the center of each element mounting portion. A substrate formed therein, the center conductor penetrating into the center conductor through hole of the substrate, and at least one element filter element is mounted in each element mounting portion, and one electrode of each element is electrically connected to the center conductor. The other electrode was electrically connected to the electrically conductive film of the said board | substrate.

In addition, as another technical means for achieving the object of the present invention, the present invention is a through-type filter equipped with a square element on the substrate, consisting of a rectangular ceramic body, each of one side and the other side of the ceramic body At least one square filter element having an electrode formed thereon; A center conductor electrically connected to a DC power supply line and electrically connected to one electrode of the square filter element; And a substrate having one or more element mounting portions penetrating up and down on an outer surface coated with a conductive film. The substrate includes a substrate inserted into the center of the element mounting portion of the substrate, and each of the element mounting portions has one or more rectangular filters. And an electrode for each element, electrically connected to the central conductor, and the other electrode electrically connected to the conductive film of the substrate.

EMBODIMENT OF THE INVENTION Hereinafter, the penetrating filter which mounted the square element on the board | substrate which concerns on this invention is demonstrated in detail with reference to attached drawing.

According to the present invention, the element embedded in the through-type filter is manufactured in a polygon, and the polygonal element is mounted on a substrate and implemented as a filter, so that the capacitance of the capacitor can be easily managed to minimize errors, and the voltage resistance is high. It is possible to manufacture a plurality of through-type capacitor on one substrate to improve the manufacturability.

Figure 3a is a perspective view showing a substrate structure of a first embodiment of a through-type filter according to the present invention, Figure 3b is a cross-sectional view taken along the line AA 'of Figure 3a, Figures 4a-4d is a device in the substrate of Figure 5a It is a structural diagram mounted.

3A, 3B and 4A-4D, the through filter according to the first embodiment of the present invention is formed of a rectangular ceramic body, and the electrode (e1. 1) is formed on each of one side and the other side of the ceramic body. One or more square filter elements C1-C4 formed with e2 and a center conductor L electrically connected to a DC power supply line and electrically connected to one electrode e1 of the filter elements C1-C4. And one or more element mounting portions 34 in which a plate-shaped outer surface is coated with a conductive film or made of a conductive plate and whose conductive films are removed on both sides of the outer surface corresponding to each other up and down. In the center portion of the c) includes a substrate 31 having a central conductor through hole 35 formed thereon.

The square filter element is made of a ceramic body in a rectangular shape, a combination of square and pentagonal shape, etc., the square filter element according to the present invention is produced in a polygonal shape not limited to a specific square element. An electrode e1 is formed on one side of the ceramic body thus manufactured, and an electrode e2 is formed on the other side of the one electrode. The square filter element includes a capacitor and a center for providing capacitance for noise removal. It can be manufactured as a varistor to eliminate surges coming through the terminals. Such devices apply to all embodiments of the present invention.

The through-type filter of the present invention having such a configuration is inserted into the center conductor through hole 35 of the substrate 31 so as to penetrate the center conductor L, and each of the element mounting portion 34 has one or more squares. Filter elements C1, C2 and V1 are mounted, one electrode e1 of each element C1, C2 and V1 is electrically connected to the center conductor L, and the other electrode e2 is connected to the substrate. And electrically connected to the conductive film 32.

As shown in Figs. 4A, 4B and 4D, the rectangular filter element may be composed of one or more capacitors, or may be composed of one or more capacitors and one or more varistors, as shown in Fig. 4C. In the case where the square filter element is composed of a plurality of capacitors, the dielectric constants of the plurality of capacitors may be configured to have the same dielectric constant, or the plurality of capacitors may be configured to have different dielectric constants, or a plurality of capacitors. May be configured to have different capacities.

Referring to FIG. 4B, the element mounting portion 34a of the substrate 31 according to the present invention is an area in which the conductive element 32 of the substrate 31 is partially removed to mount the filter element. A groove may be formed to facilitate the incorporation of the element for the square filter in the manufacture of the through-type filter, and the element mounting portion 34 may further include the element filters C1 and V1 as shown in FIG. 4C. In order to stably separate the inner electrode of the element for the square filter element, that is, the electrode electrically connected to the center conductor L, with the ground conductive film 32 of the substrate 31 when the is mounted, the g of FIG. As referred to, the conductive film around the electrode of the center conductive L may be partially removed.

In the same manner as the element is mounted on the element mounting portion 34 on the substrate 31, the element filter for the rectangular filter may be mounted on the element mounting portion below the substrate 31.

Figure 5a is a perspective view showing a substrate structure of a second embodiment of the through-type filter according to the present invention, Figure 5b is a cross-sectional view taken along the line B-B 'of Figure 5a, Figure 6a, 6b is a device in the substrate of Figure 5a Sectional view of the mounted structure. 7A and 7B are cross-sectional views of a structure in which a device is mounted by adding a ferrite block to the substrate of FIG. 5A.

5 to 7, the through filter corresponding to the second embodiment of the present invention is formed of a ceramic body of a square shape, and for at least one square filter having electrodes formed on each of one side and the other side of the ceramic body. The elements C1-C4, V1, a central conductor l electrically connected to a DC power supply line, and electrically connected to one electrode of the rectangular filter element, and penetrate vertically through an outer surface coated with a conductive film. And a substrate 41 on which at least one device mounting portion 44 is formed.

The through-type filter of the present invention having such a configuration is inserted into the center conductor (L) through the center of the element mounting portion 44 of the substrate 41, each of the element mounting portion 44 at least one square filter Element C1-C4 and V1, and one electrode of each element is electrically connected to the center conductor L, and the other electrode is electrically connected to the conductive film 42 of the substrate.

6A, 6B and 6C, the through filter may include one or more square capacitors C1-C4 or square varistors V1 and V2 in the element mounting portion 44 of the substrate. Also, as shown in FIG. 6D, the through filter may include one or more square capacitors and one or more square varistors V1 and V2 in the element mounting portion 44 of the substrate. Further, one or more square filter elements may be further mounted on the upper and lower sides of the capacitor.

As shown in FIG. 6D, the through filter includes one or more square capacitors in an element mounting portion of the substrate, and one or more inductors may be mounted on upper and lower sides of the capacitors. As shown in 7a, the inductor is constructed using a donut shaped ferrite or a plurality of ferrite blocks.

On the other hand, as shown in Figs. 6A and 6D, the donut-type ferrite F1 is mounted on the element mounting portion 44 of the substrate 41, and the rectangular filter element is further mounted on the upper and lower portions of the ferrite F1. The element placement part 44 of the board | substrate 41 is equipped with a square filter element, for example, a square capacitor and a square varistor, and arrange | positions an element different from this, The upper and lower portions may further comprise donut-type ferrite or ferrite blocks.

6C, 6D, and 7B, as illustrated in FIGS. 6A and 6B, through-type filters may be configured by using two substrates including filter elements. The above-described elemental filter element such as a rectangular capacitor, a rectangular varistor, or an inductor may be inserted between the element mounting portion and the element mounting portion on the lower substrate. Here, the inductor may use a donut type or a ferrite block.

Meanwhile, referring to FIGS. 6E and 6F, the through filter shown in FIGS. 6E and 6F is configured by further mounting filter elements on the upper and lower portions of the through filter shown in FIGS. 6C and 6D. The through filter shown in Fig. 6C further includes a square filter element of the through filter of Fig. 6C, that is, a square capacitor or a square varistor, and the through filter shown in Fig. 6F is a filter element of the through filter of 6D. That is, it is equipped with donut type ferrite or ferrite block.

FIG. 8 is a perspective view showing a substrate structure of a third embodiment of a through filter according to the present invention, and FIG. 9 is a structural diagram in which an element is mounted on the substrate of FIG.

8 and 9, the through filter corresponding to the third embodiment of the present invention is an embodiment using two or more substrates in the through filter as described in the second embodiment of the present invention. The upper substrate 61 having at least one element mounting portion 64 penetrating up and down on the outer surface coated with the conductive film 62 and the outer surface of the plate is coated with the conductive film 72. The lower substrate 71 includes one or more element mounting portions 74 on which both conductive layers have been removed.

The substrate includes a filter element in which one electrode is electrically connected to the center conductor and the other electrode is connected to each conductive film of the two substrates. Here, in the third embodiment of the present invention, the number of substrates is not limited.

10A and 10B are perspective views showing a substrate structure of a fourth embodiment of a through filter according to the present invention, and FIGS. 11A and 11B are structural diagrams in which elements are mounted on the substrate of FIG. 10.

10 and 11, the through filter according to the fourth embodiment of the present invention is formed of a ceramic body of a square shape, and for at least one square filter having electrodes formed on one side and the other side of the ceramic body, respectively. A center conductor L electrically connected to the elements C1 and C2, a DC power supply line, and electrically connected to one electrode of the square filter element C1 and C2, and one or more center conductor through holes 85 It includes a ferrite substrate 81 including).

10 and 11, the center conductor L1. L2 is inserted through the element mounting portion 84 of the substrate 81, and each of the element mounting portions 84 has one or more rectangular filter elements ( C1-C4 and ferrite cores F1 and F2 are mounted, and one electrode of each element C1-C4 is electrically connected to the center conductors L1 and L2, and the other electrode is connected to the conductive substrate of the substrate. 81 is electrically connected.

Also, referring to FIGS. 10A and 11A, one or more rectangular elements are mounted on a first center conductor L1 having a step T1 for supporting the front insulator FI, and a ferrite including a center conductor through hole. The lower end of the first center conductor L1 is inserted into the center conductor through hole of the core F, and one or more rectangular elements are disposed in the second center conductor L2 having the step T2 for supporting the rear insulator RI. After mounting, the upper end portion of the second center conductor L2 is fitted to the lower end portion of the first center conductor L1, and the two conductive substrates 81a and 81b including one or more element mounting portions in the coupled state. It is constructed between the

10B and 11B, the center conductor through hole of the ferrite core F including the center conductor through hole in the first center conductor L1 having the step T1 for supporting the front insulator FI is formed. Insert the first center conductor (L1), at least one of the square elements is mounted on the lower end of the first center conductor (L1), and on the center conductor (L2) formed with a step (T2) for supporting the rear insulator (RI). After inserting the center conductor L2 into the center conductor through hole of the ferrite core including the center conductor through hole, the upper end portion of the second center conductor L2 is fitted to the lower end of the first center conductor L1 and then coupled. In the configuration is mounted between the conductive substrate 91 including one or more device mounting holes.

Here, the center conductor is composed of two center conductors (L1, L2) as shown in Figure 11a, 11b, the insertion hole is formed in the second center conductor (L2) of the two center conductors in the manufacture of the through-type filter The first center conductor L1 may be inserted into the second center conductor L2, and the first and second center conductors L1 and L2 may have stepped T1 and T2, respectively, so that the front insulator is formed. Support (FI) and back insulator (RI).

In the fourth embodiment of the present invention, even when no resin is used, the element mounting portion 84 of the substrate 81 is cut into a predetermined region of the conductive substrate as shown in the opening door, as referred to by G1 and G2 in FIG. 10A. The filter element of this invention can be mounted elastically with the element mounting piece G1 and G2 formed by lifting.

10B and 11B, the through-type filter of the present invention having such a configuration is inserted into the element mounting portion 94 of the substrate 91 so as to penetrate the center conductor L1.L2. One or more square filter elements C1-C4 and F1-F4 are mounted on each of the element mounting parts 94, and one electrode of each element C1-C4 is electrically connected to the center conductors L1 and L2. The other electrode is electrically connected to the conductive substrate 91 of the substrate.

The rectangular filter element as described above may be composed of one or more capacitors, one or more capacitors and one or more varistors, and when the rectangular filter element is composed of a plurality of capacitors, The dielectric constants of the capacitors may be configured to have the same dielectric constant, the plurality of capacitors may be configured to have different dielectric constants, or the plurality of capacitors may be configured to have different capacities.

12 is a perspective view showing a substrate structure of a fifth embodiment of a through-type filter according to the present invention. Referring to FIG. 12, the through-type filter corresponding to the fifth embodiment of the present invention is formed of a ceramic body of a rectangular shape. At least one square filter element having electrodes formed on one side and the other side of the ceramic element, a central conductor electrically connected to a DC power supply line, and electrically connected to one electrode of the square filter element; The outer surface of the plate is coated with a conductive film or a conductive plate, and includes one or more element mounting portions 104 in which the conductive film is removed on both sides of the outer surface corresponding to each other up and down. The film 102a and the grounding conductive film 102 are electrically separated from each other, and the center portion 104 of the element mounting portion includes a substrate 101 having a central conductor through hole formed therein.

The through-type filter of the present invention having such a configuration electrically connects the edge conductive film 102a and the grounding conductive film 102 to the resistance element R, and through the center conductor through hole of the substrate 101. The center conductor is inserted through 105, and one or more rectangular filter elements are mounted in the element mounting portion 104, and one electrode of each element is electrically connected to the center conductor, and the other electrode is connected to the substrate. And electrically connected to the conductive film.

As described in the above-described embodiments of the present invention, the rectangular filter element may be composed of one or more capacitors, one or more capacitors and one or more varistors, and the rectangular filter element is provided in plural. When the capacitors are formed of the capacitors of the plurality of capacitors may be configured to have the same dielectric constant, the plurality of capacitors may be configured to have a different dielectric constant, or the plurality of capacitors may be configured to have different capacitances. It may be.

FIG. 13 is a perspective view illustrating a substrate structure of a sixth embodiment of a through filter according to the present invention, and FIGS. 14A and 14B are structural diagrams in which elements are mounted on the substrate of FIG. 13.

Referring to FIGS. 13 and 14, the through filter according to the sixth embodiment of the present invention is formed of a ceramic body of a square shape, and for at least one square filter having electrodes formed on one side and the other side of the ceramic body, respectively. A center conductor electrically connected to the element, a direct current power supply line, and electrically connected to one electrode of the square filter element, and an outer surface of a plate is coated with a conductive film, or a conductive plate, At least one element mounting portion having a conductive film removed on both sides of the upper and lower sides, and electrically separating an edge conductive film and a grounding conductive film around each element mounting portion, and having a central conductor through hole formed at the center of the element mounting portion. And a case fixing the substrate therein and having a through hole formed therein.

The through filter of the present invention having such a configuration inserts the center conductor through the center conductor through hole of the substrate, mounts one or more square filter elements to the element mounting portion, and attaches one electrode of each element. It is electrically connected to a center conductor, and the other electrode is electrically connected to the electrically conductive film of the said board | substrate.

The case 110 is not limited to a circular substrate or a square substrate, and can be changed according to the shape of a substrate to be applied, which has a fastener 113 formed outside and a structure in which a substrate can be embedded therein. Is formed.

As shown in Figs. 14A and 14B, the rectangular filter element may be composed of one or more capacitors, one or more capacitors and one or more varistors, and the rectangular filter element is formed of a plurality of capacitors. In the case of the structure, the dielectric constants of the plurality of capacitors may be configured to have the same dielectric constant, the plurality of capacitors may be configured to have different dielectric constants, or the plurality of capacitors may be configured to have different capacitances. .

15A and 15B are exploded perspective views in which a connector is applied to a through-type filter according to the present invention. Referring to FIG. 15, a metal front cell is included in the through-type filter described in the first to fifth embodiments of the present invention. (FS), front insulator (FI) and back insulator (RI) are optional or all applicable. In addition, in FIG. 15B, unlike the arrangement of the ground plates 81a and 81b facing the element mounting pieces of FIG. 15A, the ground plate is configured such that the element mounting pieces are arranged in the same direction.

In the present invention described above, the method of electrically connecting the electrode, the central conductor and the conductive film of the filter element is not limited to a particular method, but for example, soldering or the like can be used.

According to the present invention as described above, by fabricating the element embedded in the through-type filter in a polygon, and by mounting the polygonal element on a substrate to implement a filter, it is possible to easily manage the capacity of the capacitor to minimize the error, With high voltage resistance, it is also possible to manufacture a plurality of through-type capacitors on one substrate, so that there is a special effect to improve the manufacturability.

The above description is only a description of one embodiment of the present invention, the present invention is capable of various changes and modifications within the scope of the configuration.

Claims (31)

A through-type filter for blocking noise on a plurality of electric lines for supplying power or signals by mounting a plurality of filter elements on a plate-like substrate, The through filter includes a substrate, at least one element for a square filter, and a center conductor, The substrate has a plate-like outer surface coated with a conductive film, and at least one element mounting portion from which a conductive film has been removed is formed on portions of both sides corresponding to the top and bottom of the outer surface, and a central conductor through hole is formed at the center of each element mounting portion. , The element for the square filter is made of a ceramic element of the square, mounted on each element mounting portion of the substrate, and comprises one or more capacitors, Electrodes are formed on one side and the other side of the ceramic body, The center conductor is inserted through the center conductor through hole of the substrate and electrically connected to the electric line. A through-hole filter with a square element mounted on a substrate, wherein one electrode of each of the square filter elements is electrically connected to the center conductor, and the other electrode is electrically connected to a conductive film of the substrate. delete According to claim 1, wherein the element for the square filter A through-flow filter with a square element mounted on a substrate, characterized by at least one capacitor and at least one varistor. According to claim 1, wherein the element for the square filter A through-type filter equipped with a square element on a substrate, characterized by a polygonal square capacitor. According to claim 1, wherein the element for the square filter A plurality of capacitors, The plurality of capacitors have the same dielectric constant as each other, the through filter provided with a square element on a substrate. According to claim 1, wherein the element for the square filter A plurality of capacitors, The plurality of capacitors have different dielectric constants or the plurality of capacitors have different capacities. The method of claim 1, wherein the device mounting portion A through-type filter in which a square element is mounted on a substrate, wherein a groove having a predetermined depth is formed. A through-type filter for blocking noise on a plurality of electric lines for supplying power or signals by mounting a plurality of filter elements on a plate-like substrate, The through filter includes a substrate, at least one element for a square filter, and a center conductor, The substrate is provided with at least one device mounting portion penetrating up and down on the outer surface coated with a conductive film, The square filter element is formed of a ceramic element of a square, and is mounted on each element mounting portion of the substrate, and comprises one or more square capacitors, Electrodes are formed on one side and the other side of the ceramic body, The center conductor is inserted through the center of the element mounting portion of the substrate, is electrically connected to the electric line, A through-hole filter with a square element mounted on a substrate, wherein one electrode of the square filter element is electrically connected to the center conductor, and the other electrode is electrically connected to a conductive film of the substrate. delete The method of claim 8, wherein the through-type filter And at least one square capacitor, wherein at least one square filter element is mounted on the upper and lower sides of the capacitor, wherein the square element is mounted on the substrate. The method of claim 8, wherein the through-type filter And at least one square capacitor, wherein at least one inductor is mounted on the upper and lower sides of the capacitor, wherein the square element is mounted on the substrate. The method of claim 11, wherein the inductor A through-hole filter in which a square element is mounted on a substrate, wherein one of the donut-shaped ferrite and the ferrite block is selected and used. The method of claim 8, wherein the through-type filter At least two substrates formed with at least one element mounting portion penetrating up and down on the outer surface coated with a conductive film, And a filter element in which one electrode is electrically connected to the center conductor and the other electrode is connected to the conductive film of the substrate between the substrates. A through-type filter for blocking noise on a plurality of electric lines for supplying power or signals by mounting a plurality of filter elements on a plate-like substrate, The through filter includes a multilayer substrate, at least one square filter element, and a central conductor, The multilayer board includes a ferrite substrate including one or more center conductor through holes, and a conductive substrate formed on the ferrite substrate and having one or more device mounting portions penetrating up and down corresponding to the center conductor through holes of the ferrite. The elemental filter element is made of a ceramic element of a rectangular, mounted on each of the element mounting portion, and comprises one or more capacitors, Electrodes are formed on one side and the other side of the ceramic body, The center conductor is inserted through the center conductor through hole of the multilayer board and electrically connected to the electric line. A through-hole filter with a square element mounted on a substrate, wherein one electrode of the rectangular filter element is electrically connected to the center conductor, and the other electrode is electrically connected to a conductive substrate of the multilayer substrate. delete 15. The device of claim 14, wherein the rectangular filter element A through-flow filter with a square element mounted on a substrate, characterized by at least one capacitor and at least one varistor. 15. The device of claim 14, wherein the rectangular filter element A through-type filter equipped with a square element on a substrate, characterized by a polygonal square capacitor. 15. The device of claim 14, wherein the rectangular filter element A plurality of capacitors, The plurality of capacitors have the same dielectric constant as each other, the through filter provided with a square element on a substrate. 15. The device of claim 14, wherein the rectangular filter element A plurality of capacitors, The plurality of capacitors have different dielectric constants or the plurality of capacitors have different capacities. A through-type filter for blocking noise on a plurality of electric lines for supplying power or signals by mounting a plurality of filter elements on a plate-like substrate, The through filter includes a substrate, at least one element for a square filter, and a center conductor, The substrate has a plate-like outer surface coated with a conductive film, and at least one element mounting portion having a conductive film removed thereon is formed on both sides of the outer surface corresponding to the upper and lower sides of the substrate. The film is electrically separated, but the edge conductive film and the ground conductive film are electrically connected through a resistance element. A center conductor through hole is formed in the center of the device mounting portion. The elemental filter element is made of a rectangular ceramic element, mounted on the element mounting portion of the substrate, and comprises one or more capacitors, Electrodes are formed on one side and the other side of the ceramic body, The center conductor is inserted through the center conductor through hole of the substrate and electrically connected to the electric line. A through-hole filter with a square element mounted on a substrate, wherein one electrode of the square filter element is electrically connected to the center conductor, and the other electrode is electrically connected to a conductive film of the substrate. delete The method of claim 20, wherein the element for the square filter A through-flow filter with a square element mounted on a substrate, characterized by at least one capacitor and at least one varistor. The method of claim 20, wherein the element for the square filter A through-type filter equipped with a square element on a substrate, characterized by a polygonal square capacitor. The method of claim 20, wherein the element for the square filter A plurality of capacitors, The plurality of capacitors have the same dielectric constant as each other, the through filter provided with a square element on a substrate. The method of claim 20, wherein the element for the square filter A plurality of capacitors, The plurality of capacitors have different dielectric constants or the plurality of capacitors have different capacities. A through-type filter for blocking noise on a plurality of electric lines for supplying power or signals by mounting a plurality of filter elements on a plate-like substrate, The through filter includes a substrate, at least one element for a square filter, a center conductor and a case, The substrate has a plate-like outer surface coated with a conductive film, and at least one element mounting portion having a conductive film removed thereon is formed on both sides of the outer surface corresponding to the upper and lower sides of the substrate. Consists of electrically separating the membrane, A central conductor through hole is formed at the center of each element mounting portion. The elemental filter element is made of a rectangular ceramic element, mounted on the element mounting portion of the substrate, including one or more capacitors, Electrodes are formed on one side and the other side of the ceramic element, The center conductor is inserted through the center conductor through hole of the substrate and is electrically connected to the electric line; One electrode of the rectangular filter element is electrically connected to the center conductor, and the other electrode is electrically connected to a conductive film of the substrate. The case is fixed to the substrate therein, the through-type filter mounted on the substrate, characterized in that the through-hole is formed on the outside. delete 27. The device of claim 26, wherein the square filter element A through-flow filter with a square element mounted on a substrate, characterized by at least one capacitor and at least one varistor. 27. The device of claim 26, wherein the square filter element A through-type filter equipped with a square element on a substrate, characterized by a polygonal square capacitor. 27. The device of claim 26, wherein the square filter element A plurality of capacitors, The plurality of capacitors have the same dielectric constant as each other, the through filter provided with a square element on a substrate. 27. The device of claim 26, wherein the square filter element A plurality of capacitors, The plurality of capacitors have different dielectric constants or the plurality of capacitors have different capacities.