KR100397843B1 - Mechanical Conjunction Device For Sheet Metal Pair - Google Patents

Abstract

The present invention relates to an apparatus for mechanical bonding of thin plate pairs by requiring bonding through the direct plastic processing to the thin plate pairs without the need for additional material supply and processing. At this time, a cylindrical primary punch attached to the inner center of the case having an open end and a cylindrical shape, a cylindrical coil spring fitted to the primary punch, and a disc shape in which both sides of the coil spring are in close contact with each other. And a primary punch part including a blank holder fitted to the primary punch by forming a hole in the center thereof. The die is formed in a cylindrical shape at the lower portion of the primary punch portion and a through hole in the center thereof, the upper portion of the through hole is tapered in a V shape, and the lower portion is cylindrical in shape and is bisected in the longitudinal direction with a locking groove in the middle region. It is provided. In addition, the secondary punch is inserted into the through hole and the upper portion is in a rhombus shape and is in close contact with the tapered inclined surface in the V-shape of the through hole, and the lower portion has a cylindrical shape and the lower portion has a disc-shaped locking portion formed to fit into the locking groove of the through hole. It is characterized in that it comprises a plurality of rings fitted to the outer periphery of the die to join the dividing die.

Description

Mechanical Conjunction Device For Sheet Metal Pair

The present invention relates to an apparatus for joining thin plate pairs, and more particularly, to an apparatus for mechanical joining of thin plate pairs that can be joined without having to supply and process additional materials by making the shape of the joining portion reverse tapered. .

Conventional bonding techniques for thin plate layers have been used, such as welding, riveting, bolting, and the like. In recent years, the bonding of thin plates through spot welding has been mainly used, but there are some difficulties in applying them to metal sheets having different properties such as steel sheets and aluminum or difficult welding. However, compared to a situation in which demand for aluminum is increased in order to reduce the weight of a vehicle in a field such as the automobile industry, the thin plate bonding by welding, which is not performed well, is no longer seen as the best method.

In addition, the joining technology of thin sheets by welding has been in high demand in parallel with the development of the automotive industry.In order to join thin products or machinery in which two or more layers are laminated, a part of the thin sheet is applied by applying a laser or other heat source. Melting and bonding techniques have been used. However, a method of joining by welding is impossible for metals in which oxide film formation is rapidly progressing, such as aluminum. In addition, it could not be applied to materials that are not metallic or do not cause chemical reactions.

In addition, the method or bolt fastening by the rivet is to make a hole in the two thin plates and then to combine the rivet or bolt in the hole. In this case, since the circular holes need to be drilled in the two thin plates, stress concentration may occur and defects in the product may be high. In addition, there is a disadvantage in that it takes a long time when tightening, and productivity must be reduced because there must be a continuous supply of rivets and bolts.

In order to overcome the drawbacks of the mechanical joining method, a new bonding method has been studied to combine the geometrical constraints and deformation of the sheet material itself. This technology is a method that can be directly bonded to the overlapping thin plate by its own shape. However, the thin plate bonded in this way also had a limit to withstand shear and tensile forces and needed improvement. In other words, the existing technology in generating a cylindrical projection on the thin plate had a limit in the shear force and tensile force that can be easily disassembled or unwound due to its simple shape. In addition, in the conventional method, the two thin plates are joined by a reverse tapered shape. The die shape for processing the reverse tapered shape is a simple cylinder, and thus it is difficult to obtain a complete reverse tapered shape.

Accordingly, the present invention has been made in view of the above-described conventional problems, and the first object of the present invention is to perform the first machining with the first punch and the second machining with the second punch, thereby inverting the shape of the joint. It is to provide a device for the mechanical bonding of the thin plate pair to have a stronger bonding force in the tapered shape.

A second object of the present invention is to provide an apparatus for mechanical bonding of thin plate pairs by directly plastic working thin plate pairs without using additional joining products such as rivets or bolts.

In addition, a third object of the present invention is to provide an apparatus for mechanical bonding of a thin plate pair by directly plastic processing the thin plate pair that cannot be welded or make holes.

The objects of the present invention include a cylindrical primary punch attached to an inner center of an open end of a cylindrical case;

Elastic means inserted between the outer periphery of the primary punch and the inner periphery of the case to support the flow of the case;

A blank holder in which one surface is in close contact with the coil spring, has a predetermined thickness in a disk shape, and has a hole formed at a center thereof to fit the first punch;

A die which is positioned below the blank holder and forms a through hole in a center thereof, wherein an upper portion of the through hole is tapered in a V shape, and a lower portion is cylindrical and bisected in a longitudinal direction with a locking groove in an intermediate region;

A secondary punch embedded in the through hole, the upper part of which is attached to the inclined surface tapered in a V shape of the through hole in a rhombus shape, and the lower part of which has a cylindrical shape and a hook portion of a disc shape is attached to the lower part thereof;

It is achieved by a device for mechanical bonding of a thin plate pair, characterized in that it comprises; a plurality of rings fitted to the outer periphery of the die to couple the die divided in the longitudinal direction.

And the other end of the primary punch is formed with a recessed circular groove in the center portion, characterized in that the edge portion of the circular groove is formed a rounded corner, characterized in that the elastic means is a coil spring.

In addition, an outer circumferential groove is formed at an outer circumference of the blank holder, and a fitting portion fitted to the outer circumferential groove is formed at an open end of the case, so that the fitting portion is not separated from the outer circumferential groove than the outer diameter of the blank holder. Characterized in that the inner diameter of the fitting portion is made smaller.

And the upper edge of the through-hole formed in the die is characterized in that the reverse tapered and rounded protrusions are formed to bend the thin plate pair in a reverse tapered shape, the secondary punch is the diameter of the upper end so that the thin plate pair is smoothly bent It is smaller than the diameter of the circular groove of the primary punch and is characterized in that the corner is round.

In addition, the length (r) of the engaging portion is made larger than the maximum length (t) extending of the through hole, wherein the ring fitted to the outer periphery of the die is coupled to the dividing the die while the secondary punch It is characterized in that the elastic material so as to easily rise. And the die is characterized in that a plurality of ring grooves are formed so that the ring can be coupled.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings.

1 is an exploded perspective view of an apparatus for mechanical bonding of a thin plate pair according to the present invention;

Figure 2 is a cross-sectional view of the preparation for the processing of the thin plate pair in the apparatus for mechanical bonding of the thin plate pair according to the invention,

3 is a cross-sectional view of a state in which a device for mechanical bonding of a thin plate pair according to the present invention starts the first processing of the thin plate pair;

4 is a cross-sectional view of a state in which a device for mechanical bonding of a thin plate pair according to the present invention has completed the first processing of the thin plate pair;

5 is a cross-sectional view of a state in which a device for mechanical bonding of a thin plate pair according to the present invention has completed the secondary processing of the thin plate pair;

6 is a cross-sectional view of a state in which the primary punch portion of the apparatus for the mechanical bonding of the thin plate pair according to the present invention is completely raised to complete the machining.

<Description of the symbols for the main parts of the drawings>

10: 1st punch part 20: 2nd punch part

30: thin plate 100: case

110: fitting portion 150: first punch

170: circular groove 200: coil spring

300: blank holder 310: outer groove

400 die 410 protrusion

420: through hole 430: locking groove

440: ring groove 500: the second punch

600: ring

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is an exploded perspective view of an apparatus for mechanical bonding of a thin plate pair according to the present invention.

As shown in FIG. 1, an apparatus for mechanical bonding of a thin plate pair is provided with a first punch portion 10 at an upper portion and a second punch portion 20 at a lower portion thereof. The thin plate pair 30 is positioned between the secondary punch units 20 to allow a bonding process. At this time, the primary punch part 10 is provided with a cylindrical case 100 having one side open, and a cylindrical primary punch 150 is attached to the inner center of the case 100. Here, the first punch 150 is a portion directly applying to the thin plate pair 30, one end is attached to the inner center of the case 100 and the other end in contact with the thin plate pair 30 is a circular recessed in the center The groove 170 is formed. And the edge formed in the edge portion of the circular groove 170 is characterized in that the rounded process is curved.

In addition, the coil spring 200 is mounted as an elastic means between the outer periphery of the primary punch 150 and the inner periphery of the case 100. In this case, two or more coil springs 200 may be mounted with different radii to generate a large elastic force even in a narrow space of the case 100. In addition, the coil spring 200 is in close contact with one surface and has a predetermined thickness and has a plate-shaped blank holder 300 having a plate on both sides, and a hole is formed at the center thereof, so that the outer periphery of the primary punch 150 and the case 100 are formed. It is sandwiched between the inner circumferences of). In addition, an outer circumferential groove 310 is formed at an outer circumference of the blank holder 300, and a fitting portion 110 fitted to the outer circumferential groove 310 is formed at an edge of the open end of the case 100. Is characteristic. Here, the fitting part 110 is fitted into the outer circumferential groove 310 of the blank holder 300 so that the blank holder 300 is not separated from the case 100 by the elastic force of the coil spring 200. This is to prevent it.

And the lower portion of the primary punch portion 10 is provided with a secondary punch portion 20, the secondary punch portion 20 is a cylindrical shape is composed of a die 400 divided in the longitudinal direction around the center point It is. Here, the die 400 forms a predetermined number of ring grooves 440 on the outer circumference to insert the ring 600 into the ring grooves 440 so that the divided pieces are combined.

A through hole 420 is formed at the center of the die 400, and an upper portion of the through hole 420 is tapered in a V shape, and a lower portion thereof is penetrated in a cylindrical shape. In addition, a cylindrical locking groove 430 is formed in the middle region of the cylindrically penetrated portion of the through hole 420. In addition, a rounded protrusion 410 is formed in an inverse taper shape at the upper edge region of the tapered portion in the V shape of the through hole 420. The protrusion 410 serves as a guide so that the bonding portion is bent in a reverse tapered shape when the thin plate pair 30 is processed.

The secondary punch 500 is inserted into the through hole 420 having the above-described shape. The secondary punch 500 has a rhombus shape at an upper portion thereof and is tapered to a V-shaped portion of the through hole 420. In close contact with the intermediate part is a cylindrical shape, the lower end of the cylindrical shape is formed in the disk-shaped locking portion is fitted into the locking groove 430 of the through hole 420. In addition, the upper end of the secondary punch 500 having a rhombus shape has a circular surface smaller than the diameter of the circular groove 170 of the primary punch 150. And the upper edge is characterized in that the bonding portion of the thin plate pair 30 is smoothly bent at the time of processing the thin plate pair 30 in a round shape.

And the secondary punch 500 is lowered until the engaging portion touches the lower end of the locking groove 430 of the through hole 420 during the bonding process of the thin plate pair 30 and the through hole 420 The die 400 divided into a predetermined number by the tapered inclined surface of the V-shape is opened horizontally. In addition, after the locking portion reaches the lower end of the locking groove 430, the secondary punch 500 is again along the inclined surface tapered in the V-shape of the through hole 420 by tightening the ring 600. It is characterized by a rising structure.

2 to 6 illustrate a process showing an operating state of a device for mechanical bonding of a thin plate pair having the above structure, which will be described in detail with reference to FIGS. 2 to 6.

First, Figure 2 is a cross-sectional view of the state prepared for the processing of the thin plate pair 30 in the apparatus for mechanical bonding of the thin plate pair according to the present invention.

The thin plate pair 30 is compressed and bitten between the blank holder 300 and the die 400. That is, when the force is applied to the case 100 and pressed downward, one surface of the blank holder 300 compresses the thin plate pair 30 and the coil spring 200 irrespective of the strength of pressing the case 100. By pressing the thin plate pair 30 with a constant force.

3 is a cross-sectional view of a state in which the apparatus for the mechanical bonding of the thin plate pair according to the present invention starts the primary processing of the thin plate pair 30. That is, the primary punch 150 is pushed by the primary punch 150 which is attached to the inner center of the case 100 and simultaneously descends while pressing the case 100 downwardly through the state shown in FIG. 2. Along the shape of the bottom end, the junction of the thin plate pair 30 begins to be molded.

4 is a cross-sectional view of a state in which the apparatus for mechanical bonding of the thin plate pair according to the present invention has completed the primary processing of the thin plate pair 30. If the primary punch 150 continues to descend while forming a joint, the force for pressing the secondary punch 500 also increases. Accordingly, the secondary punch 500 is also lowered together with the primary punch 150. The secondary punch 500 is divided by the inclined surface tapered into the V-shape of the through hole 420 in contact with the secondary punch 500. The die 400 is spread horizontally.

As a result, the lowering of the secondary punch 500 continues until the engaging portion of the secondary punch 500 reaches the lower end of the engaging groove 430 of the through hole 420, and the die 400 divided therein is The maximum goes on. In this case, the through hole 420 is characterized in that the length (r) of the engaging portion is made larger than the maximum length (t) that is extended to the maximum. At this time, the shape of the junction portion of the thin plate pair 30 is bent to the side spread along the shape of the round tapered protruding portion 410 formed in the upper portion of the through hole 420.

5 is a cross-sectional view of a state in which the apparatus for mechanical bonding of the thin plate pair according to the present invention has completed the secondary processing of the thin plate pair 30. When the secondary punch 500 descends to the maximum, the primary punch 150 again rises together with the case 100. At this time, as the force for pressing the secondary punch 500 disappears and the ring 600 fitted to the outer circumference of the die 400 is tightened, pieces of the die 400 that are opened are added together and at the same time the through hole ( The secondary punch 500 is also raised by the inclined surface of 420. Then, when the secondary punch 500 is raised, the thin plate pair 30 positioned above the secondary punch 500 is raised to secondary process the shape of the joint into a completely reverse tapered shape.

6 is a cross-sectional view of a state in which the primary punch portion 10 of the apparatus for mechanical bonding of the thin plate pair is completely raised and all processing is completed. As shown in FIG. 6, after the bonding process of the thin plate pair 30 is finished as shown in FIG. 5, the process for separating the thin plate pair according to the present invention from the thin plate pair 30 is performed. It shows the state completed.

As described above, according to the apparatus for mechanical bonding of the thin plate pair according to the present invention, in joining two or more layers of thin plate pair 30, the shape of the joint is completely reverse tapered to have a stronger bonding force. In addition, since the thin plate pair 30 is directly plasticized to be bonded only in its own shape, it is not necessary to use additional bonding products such as rivets and bolts.

In addition, when using rivets or bolts, holes must be made in two foils for fastening, thus solving the problem of stress concentration and the complicated work process during fastening. In addition, it is possible to bond with each other more reliably without any obstacles even for metal sheets having different properties such as steel sheets and aluminum or difficult to weld.

Although the invention has been described in connection with the preferred embodiments mentioned above, other numerous modifications and variations will be possible without departing from the spirit and scope of the invention. Accordingly, it is intended that the appended claims cover such modifications and variations as fall within the true scope of the invention.

Claims (10)

One end is open and has a cylindrical shape attached to the inner center of the cylindrical case 100 is formed in the center of the other end with a circular groove 170 to a predetermined depth, the edge of the circular groove 170 is curved Primary punch 150; A coil spring (200) inserted between an outer circumference of the primary punch (150) and an inner circumference of the case (100) to support the flow of the case (100); A blank holder 300 in which one surface is in close contact with the coil spring 200 and has a predetermined thickness in a disc shape, and the first punch 150 is fitted into a hole formed at a center thereof; The through hole 420 is formed at the bottom of the blank holder 300, and the through hole 420 is tapered in a V shape, and the upper edge of the through hole 420 formed in the die 400. In order to bend the thin plate pair 30 in a reverse tapered shape, a rounded protrusion 410 is formed in a reverse tapered shape, and the lower portion is cylindrical and bisected in the longitudinal direction with a locking groove 430 provided in the middle area. Die 400; The secondary punch 500, which is embedded in the through hole 420 and has an upper portion, is in a rhombus shape, and is in close contact with the tapered inclined surface of the through hole 420 in a V shape, and the lower portion has a cylindrical shape with a disc-shaped locking portion at the bottom thereof. )Wow; And a plurality of rings 600 which are elastic materials so as to easily raise the secondary punch 500 while joining the dies 400 divided in the longitudinal direction by being fitted to the outer circumference of the die 400. Apparatus for mechanical bonding of thin plate pairs, characterized in that. delete delete According to claim 1, wherein the outer periphery of the blank holder 300 is formed with an outer circumferential groove 310, the open end of the case 100 is formed fitting portion 110 to be fitted to the outer circumferential groove 310 The inner part of the thin plate pair is characterized in that the inner diameter of the fitting part 110 is made smaller than the outer diameter of the blank holder 300 so that the fitting part 110 is not separated from the outer circumferential groove 310. Device for. delete delete According to claim 1, wherein the secondary punch 500 is the diameter of the upper end is smaller than the diameter of the circular groove 170 of the primary punch 150 so that the thin plate 30 is smoothly bent corners Apparatus for mechanical bonding of thin plate pairs. 2. The apparatus of claim 1, wherein the length r of the locking portion is made larger than the maximum length t of the through hole 420. delete The apparatus of claim 1, wherein a plurality of ring grooves (440) are formed in the die (400) to allow the ring (600) to be coupled thereto.