KR100397063B1 - 이방성전도성경로를갖춘필름및코팅 - Google Patents

이방성전도성경로를갖춘필름및코팅 Download PDF

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Publication number
KR100397063B1
KR100397063B1 KR1019960032146A KR19960032146A KR100397063B1 KR 100397063 B1 KR100397063 B1 KR 100397063B1 KR 1019960032146 A KR1019960032146 A KR 1019960032146A KR 19960032146 A KR19960032146 A KR 19960032146A KR 100397063 B1 KR100397063 B1 KR 100397063B1
Authority
KR
South Korea
Prior art keywords
composition
film
particles
coating
substrate
Prior art date
Application number
KR1019960032146A
Other languages
English (en)
Korean (ko)
Other versions
KR970012799A (ko
Inventor
버너드 매카들 시아란
버크 조지프
Original Assignee
록타이트(아일랜드) 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 록타이트(아일랜드) 리미티드 filed Critical 록타이트(아일랜드) 리미티드
Publication of KR970012799A publication Critical patent/KR970012799A/ko
Application granted granted Critical
Publication of KR100397063B1 publication Critical patent/KR100397063B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
KR1019960032146A 1995-08-01 1996-08-01 이방성전도성경로를갖춘필름및코팅 KR100397063B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE950589 1995-08-01
IE950589 1995-08-01

Publications (2)

Publication Number Publication Date
KR970012799A KR970012799A (ko) 1997-03-29
KR100397063B1 true KR100397063B1 (ko) 2003-11-10

Family

ID=11040839

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960032146A KR100397063B1 (ko) 1995-08-01 1996-08-01 이방성전도성경로를갖춘필름및코팅

Country Status (4)

Country Link
KR (1) KR100397063B1 (de)
AT (1) ATE200596T1 (de)
DE (1) DE69612437T2 (de)
HK (1) HK1004246A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101746334B1 (ko) * 2016-03-25 2017-06-13 한국과학기술원 전자 직물의 전기접속용 접착필름 및 그 접속 방법
KR101785151B1 (ko) * 2015-08-05 2017-10-18 한국과학기술원 비구형 형태의 전도성 입자를 이용한 굴곡이 있는 기판의 전기 접속용 이방성 전도 필름
KR102062482B1 (ko) * 2019-01-24 2020-01-03 한국과학기술원 폴리머 필름 내 단일층 니켈 도금된 도전입자에 자기장을 가하여 균일 분산시키는 방법 및 이를 이용한 이방성 전도 필름의 제조 방법
WO2024058500A1 (ko) * 2022-09-13 2024-03-21 주식회사 아이에스시 내부에 자성입자가 정렬된 도전성 입자의 제조방법, 도전성 입자 및 시트형 커넥터

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101532981B1 (ko) * 2014-10-02 2015-07-02 (주)포웰 과립담체가 충전된 간헐폭기 공정을 이용한 폐하수 고도처리 방법을 구현하는 고도처리 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0402546A2 (de) * 1989-06-14 1990-12-19 Poly-Flex Circuits, Inc. Gedruckte Schaltungsplatte

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0402546A2 (de) * 1989-06-14 1990-12-19 Poly-Flex Circuits, Inc. Gedruckte Schaltungsplatte

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101785151B1 (ko) * 2015-08-05 2017-10-18 한국과학기술원 비구형 형태의 전도성 입자를 이용한 굴곡이 있는 기판의 전기 접속용 이방성 전도 필름
KR101746334B1 (ko) * 2016-03-25 2017-06-13 한국과학기술원 전자 직물의 전기접속용 접착필름 및 그 접속 방법
KR102062482B1 (ko) * 2019-01-24 2020-01-03 한국과학기술원 폴리머 필름 내 단일층 니켈 도금된 도전입자에 자기장을 가하여 균일 분산시키는 방법 및 이를 이용한 이방성 전도 필름의 제조 방법
US11472933B2 (en) 2019-01-24 2022-10-18 Korea Advanced Institute Of Science And Technology Method of uniformly dispersing nickel-plated conductive particles of single layer within polymer film by applying magnetic field to polymer film and method of fabricating anisotropic conductive film using the same
WO2024058500A1 (ko) * 2022-09-13 2024-03-21 주식회사 아이에스시 내부에 자성입자가 정렬된 도전성 입자의 제조방법, 도전성 입자 및 시트형 커넥터

Also Published As

Publication number Publication date
KR970012799A (ko) 1997-03-29
ATE200596T1 (de) 2001-04-15
HK1004246A1 (en) 1998-11-20
DE69612437T2 (de) 2001-09-27
DE69612437D1 (de) 2001-05-17
MX9603138A (es) 1997-07-31

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