KR100392964B1 - Packaging method of organic electroluminescent device - Google Patents
Packaging method of organic electroluminescent device Download PDFInfo
- Publication number
- KR100392964B1 KR100392964B1 KR1019960056616A KR19960056616A KR100392964B1 KR 100392964 B1 KR100392964 B1 KR 100392964B1 KR 1019960056616 A KR1019960056616 A KR 1019960056616A KR 19960056616 A KR19960056616 A KR 19960056616A KR 100392964 B1 KR100392964 B1 KR 100392964B1
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- South Korea
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- paraffin
- upper portion
- electroluminescent device
- organic electroluminescent
- electrode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
본 발명은 발광층이 유기물로 형성되어 있는 전기발광표시소자의 패케이징 방법에 관한 것으로, 특히 종래의 유기 전기발광소자의 패케이징 재료로 사용되던 에폭시를 대신하여 파라핀에 디핑하여 패케이징을 실시하는 유기 전기발광소자의 패케이징 방법에 관한 것이다.The present invention relates to a method for packaging an electroluminescent display device in which a light emitting layer is formed of an organic material, and more particularly to a method of dipping a paraffin in place of an epoxy used as a conventional packaging material for an organic electroluminescent device, To a packaging method of an organic electroluminescent device.
종래에는 유기 전기발광소자를 패케이징하기 위하여 에폭시를 솔벤트에 녹인 다음, 에폭시 몰딩법과 같은 방법으로 유기 전기 발광소자를 패케이징하였다.Conventionally, in order to package an organic electroluminescent device, an epoxy is dissolved in a solvent, and then the organic electroluminescent device is packaged by a method such as epoxy molding.
상술한 종래의 유기 전기발광소자의 에폭시를 이용한 패케이징 방법은 에폭시가 녹아 있는 솔벤트에 의하여 발광물질에 영향을 주어 전기발광소자에 영향을 주어 전기발광소자의 수명을 단축시킨다는 문제점이 있다.The conventional packaging method using an epoxy in the organic electroluminescent device has a problem that the light emitting material is influenced by the solvent in which the epoxy is dissolved and affects the electroluminescent device to shorten the lifetime of the electroluminescent device.
또한 음극 전극으로 사용되는 금속전극을 산화시켜 전기발광소자에 손상을 준다는 문제점도 있다.There is also a problem that the metal electrode used as the cathode electrode is oxidized to damage the electroluminescent element.
본 발명은 상기 문제점을 해결하기 위하여 패케이징의 재료로 사용되는 에폭시를 대신하여 파라핀을 용융시킨 다음, 패케이징 시킬 디바이스를 상기 녹아 있는 파라핀에 넣어 완전 패케이징시킨 후, 유기발광물질로 부터 발광된 빛이 방사되는 유리기판의 전면부에 패케이징된 파라핀을 제거하여 전기발광소자를 패케이징함으로써, 패케이징시 패케이징 재료에 의한 발광물질과 금속전극의 손상을 방지할 수 있는 유기 전기발광소자의 패케이징방법을 제공하는 것을 목적으로 한다.In order to solve the above-described problems, the present invention provides a method of manufacturing a semiconductor device, which comprises melting a paraffin in place of an epoxy used as a material for the padding and then completely padding the device to be padded with the paraffin, The paraffin is removed from the front surface of the glass substrate through which the light emitted from the panel is radiated to prevent the damage of the light emitting material and the metal electrode due to the packing material at the time of packaging And a method of packaging an organic electroluminescent device capable of emitting light.
도1은 본 발명에 따라 패케이징한 유기 전기발광소자의 단면도.1 is a sectional view of an organic electroluminescent device packaged according to the present invention.
<도면의주요부분에대한부호의설명>Description of the Related Art
11 : 유리기판 12 : 투명전극11: glass substrate 12: transparent electrode
13 : 유기 발광물질 14 : 전자수송물질13: Organic luminescent material 14: Electron transport material
15 : 금속전극 16 : 인듐15: metal electrode 16: indium
17 : 전원 18 : 파라핀17: power supply 18: paraffin
본 발명은 유기 전기발광소자를 제조하는데 최종 단계인 패케이징 공정에 관한 것으로, 패케이징 과정에서 발생할 수 있는 발광물질의 손상을 방지하고, 패케이징물질과 직접 접촉하는 금속 전극의 산화를 방지하기 위하여 패케이징 물질로 파라핀을 사용한 유기 전기발광소자의 패케이징 방법에 관한 것이다.The present invention relates to a packaging process, which is a final step in the fabrication of an organic electroluminescent device, to prevent the damage of a light emitting material which may occur during the packaging process, to oxidize the metal electrode in direct contact with the packaging material And to a method of packaging organic electroluminescent devices using paraffin as a packaging material.
도1은 본 발명에 따라 패케이징된 유기 전기발광소자의 단면을 나타낸 것으로, 그 방법은 먼저 유리기판(11) 상부에 양극으로 사용될 투명전극(12)을 코팅하고, 상기 코팅된 투명전극(12) 상부에 전기에 의해 발광을 일으키는 물질로 발광층(13)을 형성한다. 다음에 상기 형성된 발광층(13) 상부에 전자의 수송을 원활하게 하기 위하여 전자수송물질(14)을 코팅하고, 그 상부에 음극을 인가하기 위한 음전극으로 금속전극(15)을 코팅한다. 상기와 같은 공정은 재료들의 산화를 방지하기 위하여 진공챔버 내에서 이루어진다. 그러나 본 발명에서와 같이 파라핀에 디핑 방법으로 패케이징시키기 위해서는 대기 중에 노출시켜야 하기 때문에 노출되는 소자의 물질들이 산화하는 것을 방지하기 위하여 진공챔버에서 꺼내기 전에 금속전극 상부에 인디움(16)을 증착시킨다.FIG. 1 is a cross-sectional view of a packaged organic electroluminescent device according to the present invention. First, a transparent electrode 12 to be used as an anode is coated on a glass substrate 11, 12, the light emitting layer 13 is formed on the upper part by a material which causes light emission by electricity. Next, an electron transport material 14 is coated on the light emitting layer 13 to smoothly transport electrons, and a metal electrode 15 is coated on the anode as a cathode for applying a cathode. Such a process is performed in a vacuum chamber to prevent oxidation of materials. However, in order to package the paraffin in the dipping method as in the present invention, it is necessary to expose the indium 16 to the upper part of the metal electrode before removing the exposed material from the vacuum chamber, .
상기 공정에 의해 제조된 소자를 패케이징시키기 위하여 패케이징 재료인 파라핀에 온도를 가하여 액체상태로 만들고, 그 액체에 상기 진공챔버에서 꺼낸 소자를 완전히 담그어 소자 전체를 패케이징 시킨다. 이때 소자의 온도로 인하여 소자에 접촉한 파라핀(18) 용액은 굳어짐으로 간단하게 패케이징할 수 있다. 다음에 완전히 패케이징된 전기발광소자의 빛을 방출하는 유리면 상의 파라핀을 제거한다.In order to package the device manufactured by the above process, paraffin, which is a packing material, is put into a liquid state by applying a temperature, and the device taken out from the vacuum chamber is completely immersed in the liquid to package the entire device. At this time, the paraffin (18) solution in contact with the device due to the temperature of the device can be easily packaged by hardening. Next, the paraffin on the glass surface that emits the light of the fully-packaged electroluminescent device is removed.
상기 공정에서 패케이징재료인 파라핀은 비교적 낮은 온도인 약 70°C 에서 액체상으로 존재하고 상온에서 고체상태로 존재하기 때문에 패케이징과정에서의 소자손상을 방지할 수 있으며, 솔밴트와 같은 용매가 필요 없으므로 발광물질의 손상과 금속전극의 손상을 방지할 수 있다.In this process, paraffin, which is a packing material, is present in a liquid state at a relatively low temperature of about 70 ° C and exists in a solid state at room temperature, so that it is possible to prevent damage to the device during the packeting process. It is possible to prevent the damage of the light emitting material and the damage of the metal electrode.
본 발명에 따라 파라핀을 이용하여 패케이징을 실시하게 되면 완전한 패케이징을 함으로써 소자의 손상을 방지할 수 있고, 음전극의 손상을 방지함으로써, 유기전기발광소자의 수명을 연장시킬 수 있다.According to the present invention, if paring is performed using paraffin, damage to the device can be prevented by performing complete packetizing, and damage to the negative electrode can be prevented, so that the lifetime of the organic electroluminescent device can be prolonged.
상기 파라핀에 디핑하는 방법으로 패케이징하는 방법은 수분 또는 산소 등에 민감하게 반응하는 물질이 포함되어 있는 각종 소자에 적용할 수 있다.The paring method by dipping the paraffin can be applied to various devices including a substance sensitive to moisture or oxygen.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960056616A KR100392964B1 (en) | 1996-11-22 | 1996-11-22 | Packaging method of organic electroluminescent device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960056616A KR100392964B1 (en) | 1996-11-22 | 1996-11-22 | Packaging method of organic electroluminescent device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980037810A KR19980037810A (en) | 1998-08-05 |
| KR100392964B1 true KR100392964B1 (en) | 2003-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960056616A KR100392964B1 (en) | 1996-11-22 | 1996-11-22 | Packaging method of organic electroluminescent device |
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| KR (1) | KR100392964B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030080619A (en) * | 2002-04-09 | 2003-10-17 | 김시환 | Organic Electro Luminescent Display |
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1996
- 1996-11-22 KR KR1019960056616A patent/KR100392964B1/en not_active IP Right Cessation
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| KR19980037810A (en) | 1998-08-05 |
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