KR100382350B1 - Manufacturing process of piezo-electric transducer for part feeder - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a piezoelectric element for a component feeder, in order to provide a piezoelectric element, which is used as a vibration transport plate power source, in particular in a parts feeder for assembling an IC component for an electronic device.

In the conventional piezoelectric element manufacturing process, the manufacturing process is extremely difficult and unstable due to the problem of losing the cracks and the unique characteristics of the ceramic due to the heat generated when connecting the bubble layer and the lead wire caused by the residue of foreign substances and the lack of adhesion due to the anaerobic adhesive in the core bar cleaning operation. It is produced by working process and processing process, so it is easy to burn out and has shortcomings.

Accordingly, the present invention is to completely remove the foreign matter by the second cleaning with a quick-drying degreasing spray with the first cleaning and the ceramic 20 is adhered to the ceramic bar in a state that the conductive carbon and the adhesive is uniform and conductive to the core bar By bonding the conductive copper tape 40 to the secondary epoxy coating by the primary epoxy coating and the shrink tube 42, and connecting the lead wire 43 to the secondary epoxy coating, there is no breakdown during use of the piezoelectric element. By making it possible to achieve a production that does not occur, the power supply is smooth, the insulation effect is increased, and long time use can be achieved without burning.

Description

Manufacturing process of piezoelectric element for part feeder {Manufacturing process of piezo-electric transducer for part feeder}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a piezoelectric element for a component feeder, in order to provide a piezoelectric element, which is used as a vibration transport plate power source, in particular in a parts feeder for assembling an IC component for an electronic device.

As is well known, various electronic components soldered to a printed circuit board are soldered in a continuous supply by a parts feeder and by connecting and transferring the supplied parts by a robot in order to supply the work line regularly and continuously. .

Such a component feeder typically generates a vibration continuously by vibrating the transport plate using the suction force of the electromagnet and the restoring force of the leaf spring so that the parts placed on the vibration transport plate are moved in one direction.

The parts feeder using the electromagnet has a lot of power consumption because it uses the electromagnet as the power source, and it is troublesome to adjust the natural frequency to the power frequency by adjusting the spring, and as the weight of the conveying parts increases, the amount of current flowing through the electromagnet also increases. The problem that causes the fatal failure of the electromagnet burned out due to overdriving and the control device adopts the PWM modulation method to supply and drive the voltage so that the waveforms of the sine wave and the serious wave oscillation are compared and output. It is converted into a PWM signal and used as a control source of the power switching element.

Accordingly, in order to prevent the short-circuit phenomenon of the power switching device (FET), a rest (delay) portion must be formed in the output waveform.

The rest period and the distortion part on the waveform act as a factor causing abnormal vibration in the device, and when the micro parts are transported, unstable operation occurs on the chute, and it jumps up, down, left, and right and cannot have a correct position. .

In the case of the distorted part, it is represented by the noise of the parts feeder, which develops into the resonant frequency of the feeder itself and the complex abnormal noise, and the inconvenience and time loss of having to adjust the spring continuously from the initial assembly work to the completion of work. And it has an uncomfortable problem of matching the natural frequency of the component supply with the frequency output from the control device.

In order to improve this problem, a piezoelectric element is used as a power source of the vibration transport plate, thereby achieving stable and uniform vibration of parts.

As described above, the piezoelectric element is subjected to a treatment operation after adhering ceramics on both sides of a thick core bar (iron plate) in order to produce a piezoelectric element (bimol) of a vibration generating source of a piezoelectric vibrator.

That is, in the conventional piezoelectric element manufacturing, both sides of the core bar are cleaned with a cleaning agent, and a clean cloth is used to remove foreign substances adhered to the surface and to dry naturally, thereby adhering the ceramics on which the electrodes are printed. ) And the other side of the electrode (-) are injected to face the side where the adhesive is applied to both sides of the core bar (iron plate).

At this time, since the adhesive used is an anaerobic product, it is a natural curing adhesive in the absence of air, and in order to cure the residue of the adhesive flowing out after adhesion, it must be cured by using an UV oven.

In addition, in order to remove the air (bubble) between the ceramic adhesive surface and the core bar, a jig for pressurizing is used because the air must be drawn out by applying a constant pressure on both sides.

If the air layer remains in the cured state by the above, the application of a voltage causes a problem of losing the intrinsic properties of the ceramic from the non-bonded portion, and the piezoelectric element (bimol) is for the purpose of generating vibration. Because it is used, stress concentration occurs in the part where cracks are generated due to continuous repetitive movement, and electrodes are applied to both sides of the ceramic, so the electrode on the opposite side adhered to the core bar is exposed to the outside and there is a danger of electric shock. It also has the complexity of insulating.

At this time, the insulation treatment is performed by wrapping a ceramic exposed portion using a heat shrink tube.

Accordingly, the core bar forms one pole of the power supply, and both surfaces of the ceramic opposite electrode bonded to each other form one pole of the power supply.

In order to supply power to the piezoelectric element, a power supply part is formed on a part of the base where the iron plate is fixed, and lead wires are connected to both surfaces of the ceramic to supply power.

Electrodes printed on both sides of the ceramic form a thin film of a micron unit, and have a property of melting or burning when applied with high heat, and also by applying heat when soldering for lead wire connection, stress is concentrated on the heated ceramic part. Phenomenon occurs, which causes a problem of shortening the life of the product.

As described above, in the conventional manufacturing process, the manufacturing process as described above is extremely difficult and is produced by unstable work and processing processes, and thus has many disadvantages of crack generation, easily burned out problems, and short lifespan.

The present invention is directed to obtaining a piezoelectric element which is used as a vibration transport plate power source in a parts feeder for assembling electronic devices.

The present invention is bonded to the ceramic 20 in a state in which the conductive carbon and the adhesive on the core bar by the secondary cleaning with a quick-drying degreasing spray with a uniform and conductive, and the conductive copper tape 40 on the ceramic 20 ) Secondary insulation by primary epoxy (EPOXY) coating and shrink tube (42) and then connecting lead wire (43) to secondary epoxy coating to prevent breakdown during use of piezoelectric element It is an invention for the purpose of enabling the power supply by the ease and the conductive carbon to be smooth and the insulation effect is increased.

1 is a perspective view showing a core bar of the present invention

Figure 2 is a side cross-sectional view of steps 2 and 3 in which a carbon layer and an adhesive layer are formed on the ceramic of the present invention.

3 is an explanatory diagram for bonding a ceramic to the core bar of the fourth step of the present invention.

4 is a plan view of the copper tape bonded to the ceramic according to the fourth step of the present invention.

5 is a cross-sectional view of FIG. 4.

6 is a sectional view of a sixth process epoxy coating state of the present invention.

7 is a cross-sectional view of the seventh process primary shrink tube coating state of the present invention

Figure 8 is a cross-sectional view showing a lead wire connection and secondary epoxy coating state of the present invention.

Figure 9 is a side view showing a conventional adhesive coating state.

Explanation of Signs of Major Parts of Drawings

10; Core bar 11; Conductive carbon 12; glue

20; Ceramic 31; Cushioning material 32; guide

30; Clip 40; Copper tape 41; Epoxy

42; Shrink tube 43; Lead wire 44; 2nd epoxy

If described in detail the effect of the embodiment of the present invention for achieving the above object.

1 is a perspective view showing a core bar of the present invention and FIG. 2 is a side cross-sectional view of steps 2 and 3 in which a carbon layer and an adhesive layer are formed on the ceramic of the present invention, and FIG. 3 is an explanatory view of bonding the ceramic to the core bar of the fourth step of the present invention. And FIG. 4 is a plan view of the copper tape bonded to the ceramic according to the fourth step of the present invention.

FIG. 5 is a cross-sectional view of FIG. 4 and FIG. 6 is a cross-sectional view of a sixth process epoxy coating state of the present invention, FIG. 7 is a cross-sectional view of a seventh process primary shrink tube coating state of the present invention, and FIG. 8 is a lead wire connection of the present invention. And a cross-sectional view showing a secondary epoxy coating state.

Embodiments of the present invention as shown in the drawings will be described in detail below.

1st process

As shown in FIG. 1, the core bar 10 having a predetermined shape of a raw material iron plate is coated with an oil layer on the surface of the core bar 10 because it is precipitated and stored in oil for reasons of rust prevention during work or storage with a piezoelectric element.

The core bar 10 is washed with a detergent and removes oil with a cloth, and the foreign substances are not cleaned even when the core bar is washed with a detergent in a clean tissue. The remainder of the foreign matter is bonded together with the foreign matter when ceramic bonding, the adhesive strength is weakened, and when the vibration occurs, the vibration effect is reduced or serves as a cushion to absorb the vibration.

Accordingly, in the present invention, after washing with a first detergent, a second wash is performed with a quick-drying degreasing spray and wiped with a clean tissue or cloth.

In the case of the quick-drying degreasing spray core bar washing process to completely remove the foreign matter by using a property that flies quickly into the air together with the foreign matter attached to the surface when spraying,

2nd process

When the adhesive is applied to the ceramic surface washed in the first step, the entire surface of the adhesive is not formed to have a uniform thickness, and as shown in FIG. 9, the surface of the adhesive is formed as an uneven surface. This causes a problem of preventing the smooth supply of power and voltage while reducing conductivity.

In order to improve the problem of the adhesive to reduce the conductivity of the carbon printing process for printing the conductive carbon (11) at a uniform interval and height on the electrode surface of the ceramic 20 before printing the adhesive, and

3rd process

Adhesive printing process for printing the adhesive on the ceramic electrode using a silk screen to apply a predetermined amount of adhesive 12 to a uniform thickness on the dried conductive carbon surface,

When the adhesive 12 is silkscreen printed on the dried conductive carbon 11 of the second process, the adhesive 12 is filled and coated between the carbons, which are conductive layers, as shown in FIG. 10 and the adhesive surface can be brought into close contact with each other and the conductive carbon 11 is directly in contact with the core bar 10 to form an electrode to smoothly supply power.

4th process

When the anaerobic adhesive is used in the adhesion, the core bar 10 and the ceramic 20 are adhered to each other, and then pressurized with a press to remove air (bubbles) formed inside the adhesive surface, thereby curing the adhesive.

At this time, if the surface of the core bar 10 is not uniform when the pressure is applied to the press, the ceramic 20 is warped or cracks are generated by the press pressure.

In addition, cracks do not occur, but the product bonded in a state where the warpage is caused a problem that cracks occur due to the concentration of stress generated during vibration.

Accordingly, in order to solve the air problem, the present invention uses a thermosetting adhesive 12 as shown in FIG. 3 and directly transfers pressure to the ceramic 20 on both sides of the core bar laminated with the carbon printing and adhesive printing processes. In order to prevent the cushioning material 31 is attached to the iron plate guide 32 is placed on both sides of the ceramic is fixed by the clip 30 is made of a ceramic bonding process to bond.

This adhesion prevents the cushion material temperature from being directly transmitted to the ceramic 20 when the intermediate cushioning material 31 is heated, and a method for preventing the adhesive 12 from coming up toward the electrode by riding on the ceramic edge portion so as not to be attached to the iron plate guide 32. The guide is held in a state in which the guide is fixed with a clip (30) and put in an oven to maintain a proper temperature and to cure.

At this time, care should be taken if the proper temperature and time are not maintained, as the ceramic may be released from the initial place and the adhesive may not be completely cured.

5th process

The electrode of the ceramic 20 loses its magnetic properties when high heat is applied and its shape is deformed, or when the high heat is intensively applied to a part, the ceramic 20 is stressed.

Copper tape adhering process for cutting the conductive copper tape 40 to adhere to the ceramic 20 as shown in Figure 4 to solve this problem,

After the adhesion, the copper tape 40 is rubbed using a roller so as to be in close contact with the ceramic electrode, and the sharp hatching portion formed on the cut portion of the copper tape 40 is preferably smoothly finished by roller work.

6th process

The electrode of the ceramic 20 is corrosive, and if exposed for a long time, the electrode is melted, and thus, power supply is impossible and its characteristics are lost.

This is not a phenomenon occurring in the initial product, but it takes a long time to identify it as occurring during years or months of use.

Some urethane coatings are used to protect this problem, but the characteristics of the urethane are not permanent because the adhesive surface is exposed to corrosive oil.

Accordingly, in the present invention, as shown in FIGS. 4 and 5, the first epoxy (EPOXY) coating process of coating the epoxy portion 41 on the surface of the ceramic 20 except for the soldering portion,

In the case of the epoxy (41) coating, it is preferable to use a silk screen to process a uniform size on the entire surface of the ceramic (20), and epoxy coating insulates the entire surface of the electrode so that short or electric shock does not occur even if water or oil flows into it. In addition, damage to the electrode will be secured.

7th process

Since the complete insulation is impossible even with the epoxy coating of the sixth step, the tube coating process, which is the secondary insulation operation, is performed by using the shrinkage tube 42 again on the coating layer.

In other words, in the case of the conventional shrink tube, when a general product is applied and exposed to oil, it may be stretched or corroded. It is prevented, but the effect in the secondary shrink tube coating of the present invention has not been obtained.

8th process

Lead wire connecting process for soldering the lead wire 43 on the copper tape 40 as shown in Figure 8 to form electrodes on both sides of the ceramic,

The stress caused by heat is caused by soldering the lead wire 42 on the copper tape 40 processed in the fifth process because the crack is generated in the ceramic 20 by directly soldering the electrode directly on the electrode. It is not concentrated in the (20) can protect the ceramic (20) and can also be a safe operation to prevent burnout of the electrode.

9th process

After the lead wire 43 is connected in the eighth step, the tube, the lead wire, the copper tape, and the epoxy coating part are all coated with the secondary epoxy 44 to prevent the solder part from being burned out and derailed during assembling the product. It consists of a secondary epoxy process.

According to the present invention, the manufacturing process is extremely difficult due to the problem of losing the cracks and the ceramic intrinsic properties due to the heat generated when connecting the bubble layer and the lead wire, which are caused by the residue of foreign matter and the lack of adhesion due to the anaerobic adhesive in the conventional core bar cleaning operation. It is produced by a difficult and unstable work process and processing process, so it is easily burned and has a short lifespan.

Accordingly, the present invention is to completely remove the foreign matter by the second cleaning with a quick-drying degreasing spray with the first cleaning and the ceramic 20 is adhered to the ceramic bar in a state that the conductive carbon and the adhesive is uniform and conductive to the core bar By bonding the conductive copper tape 40 to the secondary epoxy coating by the primary epoxy coating and the shrink tube 42, and connecting the lead wire 43 to the secondary epoxy coating, there is no breakdown during use of the piezoelectric element. By making it possible to achieve a production that does not occur, the power supply is smooth, the insulation effect is increased, and long time use can be achieved without burning.

As described above, the present invention uniformly applies the conductive carbon and the adhesive to the core bar by the second washing with the quick-drying degreasing spray together with the first washing to bond the ceramic 20 to a solid state with conductivity and the ceramic 20 The conductive copper tape 40 is adhered to and the lead epoxy 43 is connected after the secondary insulation by the primary epoxy coating and the shrink tube 42, so that the secondary epoxy coating is used. It is a useful invention that can exhibit the effect that there is no crack generation and the ease of manufacture and the power supply by the conductive carbon smoothly and the insulation effect is increased.

Claims (1)

In the conventional piezoelectric element manufacturing method of connecting the lead wires while adhering the ceracic with an anaerobic adhesive by removing the foreign substance by washing the core bar, The core bar washing step of wiping with a tissue by performing a second wash with a quick-drying degreasing spray in addition to washing with the first cleaner, Adhesive using silk screen for applying a certain amount of adhesive 12 to a uniform thickness on the dried conductive carbon surface with a carbon printing process in which the conductive carbon 11 is printed at a uniform interval and height on the ceramic electrode surface and dried. Printing process, Ceramic adhesive process of bonding and curing process by laminating the ceramic 20 printed with the adhesive and placing the iron plate guide 32 with the cushioning material 31 on both sides of the ceramic so as not to transmit pressure directly, and fixing it with a clip 30. and, A copper tape adhering process for adhering the conductive copper tape 40 to the ceramic 20, a primary epoxy coating process for coating with an epoxy 41 on an electrode portion except for the surface solder of the ceramic 20, and Using the shrinking tube 42 again on the epoxy coating layer, the tube coating process, which is the second insulating operation, and the lead wire 43 are soldered and connected to the copper tape 40 for forming electrodes on both surfaces of the ceramic, and the connection part is protected. Piezoelectric element manufacturing method for a component supply, characterized in that the secondary epoxy process for coating with a secondary epoxy (44) for.