KR100374910B1 - Exposure device - Google Patents

Abstract

The present invention relates to an exposure apparatus for transferring a pattern of a mask onto a substrate well without causing a decrease in productivity. In the present invention, the exposure apparatus that performs exposure while moving the mask and the base with respect to the projection optical system includes a mask image of a region different from the first illumination optical system ILa and the first illumination optical system that illuminates the mask M image. A second illumination optical system ILb to illuminate, a first projection optical system PLa which forms an image of the mask illuminated by the first illumination optical system on the base P, and a mask illuminated by the second illumination optical system It has a 2nd projection optical system PLb which forms the upright image of on a board | substrate. Here, the illumination region moving means 101a, 102a, 101b, 102b for moving the illumination region are set in the first and second illumination optical systems.

Description

Exposure device

The present invention relates to a scanning exposure apparatus for exposing an image of a first object onto a second object while moving a first object such as a mask, for example, a substrate.

In recent years, many liquid crystal display panels are used as display elements used in word processors, personal computers, TVs, and the like.

At the time of manufacture of such a liquid crystal display panel, patterning a thin film electrode to a desired shape by the method of photolithography on a glass substrate is performed.

As an apparatus of this kind, the aligner of the mirror projection type as shown in FIG. 10 is known, for example.

In FIG. 10, the mask M is illuminated by the arc-shaped illumination field MI by illumination optical system which is not shown in figure.

The light from the illumination field MI is deflected by about 90 ° to the reflective surface 71a of the trapezoidal mirror 71, and is again concave through the concave mirror 72 and the convex mirror 73. It reaches the mirror 72.

The light reflected by the concave mirror 72 is placed on a plate P made of a glass substrate coated with a photosensitive material (light resistant material) after the optical path is deflected by 90 ° to the reflective surface 71b of the trapezoidal mirror 71. The image PI of the illumination field MI is formed.

Here, by scanning the mask M and the plate P in the direction of an arrow in the figure, the image of the mask M is transferred onto the plate P. As shown in FIG.

In the prior art as described above, in the case of enlarging the exposure area, it may be considered to perform exposure by first dividing the exposure area into a plurality of areas.

At this time, by exposing while replacing a plurality of divided masks, a mask image is sequentially formed on a plurality of divided exposure regions on the plate (substrate).

However, in this exposure method, in the flame process of exposing a plurality of exposure areas, the replacement operation of the mask is required, resulting in a decrease in productivity, and a pattern must be precisely connected between the plurality of exposure areas. In each mask, it is necessary to greatly increase the precision of the pattern.

Next, after the exposure operation while scanning the mask and the plate using a mask larger than the field of view of the investment optical system in order to enlarge the exposure area without replacing the mask, the mask and the plate are moved in the scanning orthogonal direction (step operation) ), There is a method of scanning and exposing the mask and the plate again.

Also in such a method, since it is necessary to repeat the scanning exposure operation and the step operation alternately, there is a problem of lowering the productivity.

It is therefore an object of the present invention to provide an exposure apparatus capable of transferring a pattern of a mask onto a substrate satisfactorily without causing a decrease in productivity.

In order to achieve the above object, for example, as shown in FIG. 1, the exposure apparatus according to the present invention is provided to the illumination optical system while moving the mask M which is the first object and the substrate P which is the second object in a predetermined direction. Illuminating the first object and projecting and exposing the image of the first object to the second object by a projection optical system having a fixed position with respect to the illumination optical system, wherein the illumination optical system is provided with a first illumination area MIa on the first object. And a first illumination optical system ILb for forming a second illumination region MIb, which is different from the first illumination region MIa, on the first object.

And the projection optical system is illuminated by the first projection optical system PLa which forms the upright image of the first object illuminated by the first illumination optical system ILa on the second object, and the second illumination optical system ILb. It has a 2nd projection optical system PLb which forms the upright image of the 1st object made on a 2nd object.

And the 1st illumination optical system ILa has the 1st illumination area | region movement means 101a, 102a which moves the 1st illumination area | region MIa on a 1st object with respect to 1st projection optical system PLa, and 2nd The illumination optical system ILb has second illumination region moving means 101b and 102b for moving the second illumination region MIb on the first object with respect to the second projection optical system PLb.

A lighting apparatus according to the present invention is a lighting apparatus in which a pattern of a first object is combined with a projection exposure apparatus that projects and exposes a pattern of a first object onto a second object, wherein the first lighting region and the first lighting region are provided on the first object. Illumination optical means for forming a second illumination region different from the illumination region of the apparatus; And means for adjusting the positional relationship between the first illumination region and the second illumination region.

Moreover, the projection exposure apparatus which concerns on this invention is a projection exposure apparatus which project-exposes the pattern of a 1st object on a 2nd object, Comprising: The said illumination apparatus; And projection optical means for forming an image of the pattern of the first object on the second object.

Further, the illumination method according to the present invention is an illumination method for illuminating the first object when projecting and exposing the pattern of the first object onto the second object, wherein a first illumination region is formed on the first object. Process of doing; Forming a second illumination region different from the first illumination region on the first object; And adjusting a positional relationship between the first illumination region and the second contrast region.

Moreover, the projection exposure method by this invention is a method of projecting-exposing the pattern of a 1st object on a 2nd object, The method of illuminating the said 1st object by the above-mentioned illumination method; Forming an image of the pattern of the illuminated first object on the second object.

The apparatus for projecting exposure according to the present invention is a device for projecting and exposing a pattern of a first object onto a second object, the apparatus for transferring the pattern of the first object into a first exposure area on the second object; At the same time, projection optical means for transferring the pattern of the first object in a second exposure area different from the first exposure area on the second object; And means for scanning the first and second exposure areas onto the second object, wherein the first and second exposure areas form an overlap area by the scanning, and for adjusting the exposure amount of the overlap area. A means is also provided.

Moreover, according to the illuminating device of the present invention, an illuminating device in which a pattern of a first object is combined with a projection exposure apparatus that projects and exposes a pattern on a second object, the illuminating device comprising: a first illumination region on the first object; Illumination optical means for forming a second illumination region different from said first illumination region; Means for adjusting the positional relationship between the first illumination region and the second illumination region, wherein the illumination optical means comprises: a first field stop for defining the first illumination region; And a second field of view aperture for defining the second illumination region, wherein the means for adjusting the positional relationship adjusts the positional relationship of the first and second field of view apertures.

Further, according to the projection exposure method according to the present invention, in the method of projecting exposure of a pattern of a first object onto a second object, the step of transferring the pattern of the first object in a first exposure area on the second object. And; Transferring a pattern of the first object into a second exposure area different from the first exposure area on the second object; And scanning the first and second exposure areas onto the second object, wherein the first and second exposure areas form an overlap area by adjusting the exposure amount, and adjusting the exposure amount of the overlap area. It is also characterized in that it comprises.

Moreover, according to the illumination method of this invention, the illumination method used when projecting-exposing the pattern of a 1st object on a 2nd object WHEREIN: The process of forming a 1st illumination area | region on the said 1st object; Forming a second illumination region on the first object that is different from the first illumination region; Adjusting a positional relationship between the first illumination region and the second illumination region, wherein the first illumination region is defined by a first field of view aperture, and the second illumination region is second It is prescribed | regulated by the visual field stop of this, It is characterized by adjusting the positional relationship of the said 1st and 2nd visual field stop in the process of adjusting the said positional relationship.

According to an exposure apparatus according to the present invention, there is provided an illumination optical system for illuminating a mask and a projection optical system for projecting a pattern of the mask onto a substrate, wherein the pattern of the mask is moved while moving the mask and the substrate in a scanning direction. An exposure apparatus for exposing to a substrate, wherein the illumination optical system includes correction means for correcting the irradiation deviation on the mask while being disposed at a position optically conjugate with the mask.

According to the exposure apparatus according to the present invention, there is provided an illumination optical system for illuminating a mask and a projection optical system for projecting the pattern of the mask onto a substrate, wherein the pattern of the mask is moved while moving the mask and the substrate in a scanning direction. An exposure apparatus for exposing to a substrate, wherein the illumination optical system includes correction means for correcting the variation in the exposure amount on the substrate, disposed at a position optically conjugate with the mask.

In addition, the "sizing image" in this invention refers to the image by which the horizontal magnification in a scanning direction and a scanning orthogonal direction becomes positive.

In the exposure apparatus according to the present invention as described above, since a plurality of projection optical systems are configured, a large exposure area can be obtained by one exposure, and the productivity can be improved.

In addition, in the present invention, since the first and second illumination regions can be moved on the mask by the illumination region moving means, the energy is always exposed on the plate even when there is an assembly error of a plurality of illumination optical systems. You can make a schedule.

Moreover, in this invention, the structure which makes the optical axis which at least one of a 1st and 2nd projection optical system have is movable with respect to the optical axis of the other projection optical system is preferable.

This configuration makes it possible to always transfer the pattern of the mask accurately to the position on the substrate.

Here, in the first and second projection optical systems, when the relationship between the mask-side optical axis and the relationship between the substrate-side optical axis is not equal, the first and second illumination areas are defined by the illumination area moving means in the width of the illumination area scanning direction. Even if it is adjusted so that it will always be constant, in the image (1st exposure area | region) of the 1st illumination area | region formed on a board | substrate, and the image (2nd exposure area | region) of a 2nd illumination area | region, 1st and 2nd illumination area | region Since the positional relationship in the mask plane inward direction with respect to the deviation, the width of each exposure area scanning direction is not constant.

At this time, since the exposure amount on a board | substrate does not become constant and the line width of the pattern transferred on a board | substrate differs partially, it is not preferable.

In addition, in the exposure apparatus according to the present invention, since a large exposure area can be realized without increasing the exposure area of each projection optical system, there is an advantage that the size of the projection optical system can be reduced, and the projection optical system itself can be easily and precisely. You can do it.

Further, in the exposure apparatus according to the present invention, since each optical member constituting the projection optical system is small, the generation of an absolute aberration amount is reduced, and there is an advantage that scanning exposure can be realized under good optical performance.

Hereinafter, an embodiment according to the present invention will be described with reference to the drawings.

1 is a diagram schematically illustrating an embodiment of an exposure apparatus according to the present invention.

1, the scanning direction of the mask M and the plate P is a Z direction, and the direction orthogonal to a scanning direction in the surface of the mask M and the plate P is a Y direction, and a mask M ) And the normal line direction of the plate P are made into the X direction.

In FIG. 1, five illumination optical systems ILa-ILe form five illumination regions Ia-MIe on the mask M, respectively.

Since these illumination optical systems ILa-ILe have the same structure, respectively, only the structure of illumination optical system ILa is demonstrated here.

The light source 1a consists of an ultrahigh pressure mercury lamp which emits exposure light of δ line (435.8 nm) or h line (404.7 nm), for example, and the exposure light from the light source 1a is provided by the ellipsoid mirror 2a. After reflection and condensing, it becomes a parallel light flux through an input lens (not shown) and enters the optical interlator 3a.

The optical integrator 3a is composed of, for example, a fly's eye lens, and forms a plurality of secondary light sources on its exit surface based on the exposure light from the light source 1a.

The light from the optical integrator 3a is condensed by the condenser lens 4a having the front focusing position on the secondary light source surface formed by the optical integrator 3a, and uniformly illuminates the field stop 5a. .

Light through the opening of the field stop 5a sequentially reaches the mask M through the pair of parallel plane plates 101a and 102a and the relay lens systems 6a and 7a.

Here, the field stop 5a and the mask M surface are arranged to be conjugated by the relay lens systems 6a and 7a including the lens group 6a and the lens group 7a, and uniform on the mask M. An illumination region MIa of one light amount distribution is formed.

Therefore, on the mask M, the illumination regions MIa to MIe defined in the predetermined shapes are formed by the field stops 5a to 5e, and only the patterns in the illumination regions MIa to MIe on the mask M are formed. Is illuminated.

Next, the light from the pattern on the mask M illuminated by the illumination regions MIa to MIe passes through the five projection optical systems PLa to PLe provided in the optical path between the mask M and the plate P. The upright image of the mask M pattern in the illumination regions MIa to MIe is formed on the plate P as the exposure regions PIa to PIe.

Since these projection optical systems PLa-PLe have the same structure, respectively, the structure of only projection optical system PLa is demonstrated here.

The projection optical system PLa is a reflecting surface 12a that is inclined at 45 ° with respect to the mask M surface (YZ plane) and 45 ° with respect to the plate P surface (YZ plane). A triangular mirror member 8a having a lens, a lens system 10a having an optical axis parallel to the mask M surface and a plate P surface, and a roof-shaped reflective member 11a having two reflective surfaces perpendicular to each other. Have

Here, the ridge lines of the two reflective surfaces of the roof-shaped reflecting member 11a are provided so as to be in the front focal position of the lens system 10a.

Such a projection optical system is disclosed in, for example, Japanese Patent Laid-Open No. 49-35453.

By the way, the light path from the pattern on the mask M illuminated by the illumination region MIa is deflected by 90 ° by the reflecting surface 9a of the triangular mirror member 8a, and the light is passed through the lens system 10a. Then, it is reflected by the roof-shaped reflection member 11a, and injects into the lens system 10a again.

Light from the roof-shaped reflecting member 11a through the lens system 10a is deflected by 90 degrees by the reflecting surface 12a of the triangular reflecting member 8a, and then a pair of parallel plane plates 103a, 104a) reaches the plate P sequentially.

Here, in the projection optical system PLa, since the imaging relationship in the Y direction is reversed by the roof-shaped reflecting member 11a, an upright image of the equal magnification of the mask M is formed on the plate P even with a single imaging system. .

Although not shown in FIG. 1, in the exposure apparatus according to the present embodiment, the mask M and the plate P are placed on a stage movable in the Z direction in the drawing.

The mask M and the plate P are integrally moved while illuminating the mask M by the illumination optical systems ILa to ILe, so that the mask illuminated on the plate P in the illumination regions MIa to MIe. Upright phases of equal magnification of (M) are formed in sequence.

As a result, the pattern of the mask M is transferred onto the plate P. FIG.

In the present embodiment, five sets of illumination optical systems and projection optical systems are provided, but the illumination optical systems and projection optical systems are not limited to only five sets.

In addition, in this embodiment, although the illumination optical systems ILa-ILe have a linear optical axis, you may provide the mirror for optical path deflection in the optical path of the illumination optical systems ILa-ILe.

However, in this embodiment, since there are a plurality of sets of illumination optical systems, when there is a mechanical assembly error, the image of the field stops 5a to 5e is imaged out of a predetermined position on the mask M, i.e., the illumination region ( There exists a possibility that the problem that MIa-MIe) may shift | deviate from a predetermined position may arise.

Therefore, in the present embodiment, parallel plane plates 101a, 102a to 101e, 102e as the illumination region moving means are provided in the optical paths of the illumination optical systems ILa to ILe.

A description with reference to FIGS. 2 and 3 is as follows.

FIG. 2 is an XZ cross-sectional view of the illumination optical system ILa, and FIG. 2 shows only the optical path from the condenser lens 4a to the mask M. In FIG.

3 is a YZ plan view showing an illumination region that is an image of the field stops 5a to 5e on the mask M. As shown in FIG.

In FIG. 2, the parallel plane plate 101a is rotatably provided with the Z direction as the axis in the figure, and the parallel plane plate 102a is rotatable with the Y direction (plane vertical direction) in the figure as the axis. It is installed.

In addition, since the rear focusing position of the lens group 6a and the front focusing position of the lens group 7a coincide with each other, the relay lens groups 6a and 7a are both telecentric optical systems.

In addition, in FIG. 2, when the parallel plane plate 102a is in the reference position shown with the broken line in a figure, ie, when the normal line of a parallel plane plate matches the optical axis of illumination optical system ILa, The relationship between the field stop 5a and the image of the field stop 5a with respect to the optical axis does not change.

Next, as shown by the solid line in the figure, when the parallel plane plate 102a is rotated in the Y direction from the reference position indicated by the broken line in the figure, the luminous flux from the field stop 5a is the solid line in the figure. As shown by the figure, after being deflected sideways in the Z direction by the parallel plane plate 102a, it enters into the relay lens system 6a, 7a.

The light beam from the parallel plane plate 102a through the relay lens systems 6a and 7a is transverse to the optical axis (optical axis of the relay lens systems 6a and 7a) of the illumination optical system ILa, and the mask M Reach the phase.

At this time, the image (lighting area MIa) of the visual field stop 5a formed on the mask M moves to Z direction in a figure.

In the case where the parallel plane plate 101a is rotated in the drawing with the Z direction as the axis, the image (illumination area MIa) of the field stop 5a formed on the mask M is in the Y direction in the drawing. Move.

As described above, in the present embodiment, the illumination region MIa on the mask M can be moved in the YZ plane by the rotation operation of the pair of parallel plane plates 101a and 102a.

In addition, since it is the same structure as illumination optical system ILa about illumination optical system ILb-ILe here, only the structure of one set of illumination optical system ILa was demonstrated.

Next, with reference to FIG. 3, the illumination area | regions MIa-Mle by these illumination optical systems ILa-ILe are made from a predetermined relationship by the error at the time of assembly in several sets of illumination optical systems ILa-ILe, etc. The adjustment method in case of deviation will be described.

In FIG. 3, when there are assembly errors in a plurality of sets of illumination optical systems ILa to ILe, the field stops 5a to 5e are masked as illumination regions MIa _{1 to} MIe ₂ as shown by broken lines in the drawing. It forms on the (M) surface.

At this time, when the scanning exposure is performed by moving the mask M and the plate P along the Z direction in the drawing, the illuminance distribution on the mask M plane does not become uniform in the Y direction (scan orthogonal direction). There arises a problem that variations in the exposure amount occur on (P), and as a result, the line width of the pattern transferred onto the plate P is partially different.

Therefore, in this embodiment, the images of the field stops 5a to 5e are adjusted by rotating the parallel plane plates 101a, 102a to 101e, and 202e in the illumination optical systems ILa to ILe with the Y or Z direction as the axis. before the move to the illuminated region (MIa ₁ ~MIe ₂₎ illumination area, which from the snow line illustrated in FIG. 3 (MIa ₂ ~MIe _2).

At this time, in the illumination areas MIa _{2 to} MIe ₂ after adjustment, the sum of the lengths of the illumination areas in the Z direction (scanning direction) is always constant at any position in the Y direction.

Thereby, on the mask M, uniform illuminance distribution can be implement | achieved in a Y direction, Furthermore, the exposure amount on the plate P can be made uniform.

In the present embodiment, the illumination region on the mask M can be moved in two directions in the YZ plane. However, in order to obtain a uniform illuminance distribution on the mask M, the illumination region in the at least Y direction is provided. The configuration can be moved.

That is, in each illumination optical system ILa-ILe, if the parallel plane plates 101a-101e which are rotatable about Z-axis are provided, the uniform illuminance distribution on the mask M can be achieved. .

In addition, in the present embodiment, since there are a plurality of sets of projection optical systems PLa to PLe, when there is a mechanical assembly error between each projection optical system, the illumination regions MIa to MIe are predetermined on the plate P. There is a problem of missing an image from the position of. At this time, even if the illumination area MIa-MIe is set to a predetermined position by the illumination area moving means in the illumination optical systems ILa-ILe, the problem which the exposure area PIa-PIe hits from a predetermined position arises. .

Therefore, in this embodiment, a pair of parallel plane plates 103a, 104a to 103e, 104e are respectively provided in the optical paths of the projection optical systems PLa to PLe as the exposure region moving means.

A description with reference to FIGS. 4 and 5 is as follows.

4 is an XZ cross-sectional view of the projection optical system PLa, and FIG. 5 is a YZ plane view showing an exposure area that is an image of the illumination areas MIa to MIe on the plate P. As shown in FIG.

In FIG. 4, in the optical path between the triangular mirror member 8a of the projection optical system PLa and the plate P image, the parallel plane plate 103a rotatably provided on the Z direction in the figure. And in the figure, the parallel plane plate 104a provided so as to be rotatable about the Y direction (plane vertical direction) is arrange | positioned.

By the way, when the parallel plane plate 104a is in the reference position shown with the broken line in the figure in FIG. 4, ie, when the normal line of the parallel plane plate 104a is parallel with the optical axis of the projection optical system PLa, , The relationship between the illumination area MIa (not shown) and the exposure area PIa (not shown) with respect to the optical axis of the projection optical system PLa does not change.

Next, as shown by the solid line in the figure, when the parallel plane plate 104a is rotated in the Y direction along the axis from the reference position indicated by the broken line in the figure, the luminous flux from the illumination region MIa is shown in the figure. As indicated by the solid line, the plane is reached on the plate P after the parallel plane plate 104a is caused to fall in the Z direction.

Thereby, exposure area PIa (image of illumination area MIa) formed on plate P moves to Z direction in a figure.

In the case where the parallel plane plate 103a is rotated around the Z direction in the drawing, the exposure area formed on the plate moves in the Y direction in the drawing.

As described above, in the present embodiment, the exposure area PIa on the plate P can be moved in the YZ plane by the operation of rotating the pair of parallel plane plates 103a and 104a.

In addition, since other projection optical systems PLb-PLe are the same structure as the above-mentioned projection optical system PLa, only the structure of one set of projection optical system PLa is demonstrated here.

Next, in FIG. 5, when there are errors in assembling the plural sets of projection optical systems PLa to PLe, the illumination regions MIa to MIe on the mask M are indicated by broken lines in the drawing. an exposure region (PIa ₁ ~ PIe ₁₎ is imaged on the plate (P).

Here, in the drawing, when scanning exposure is performed by moving the mask M and the plate P along the Z direction, the illuminance distribution on the plate P is uniform in the Y direction (scan orthogonal direction). Since it is not, the variation in the exposure amount occurs on the plate P.

This causes a problem that the line widths of the patterns of the masks M to be transferred onto the plate P are partially different.

Thus, in the present embodiment, the parallel plane plates 103a, 104a to 103e and 104e in the projection optical systems PLa to PLe are rotated in the Y direction or the Z direction as described above, so that the image of the illumination regions MIa to MIe is rotated. Is moved from the exposure areas PIa _{1 to} PIe ₁ before adjustment to the exposure areas PIa _{2 to} PIe ₂ indicated by solid lines in FIG. 3.

At this time, in the exposure areas PIa _{2 to} PIe ₂ after adjustment, the sum of the lengths of the illumination areas in the Z direction (scanning direction) is always constant at any position in the Y direction.

Thereby, on the plate P, uniform illuminance distribution can be achieved in a Y direction, and also the exposure amount on the plate P can be made uniform.

In addition, in the present Example, although the exposure area | region on the plate P is made to be movable in 2 directions in the YZ plane, in order to acquire uniform exposure distribution on the plate P, it exposes at least in the Y direction. The configuration can be used to move the area. That is, in each projection optical system PLa to PLe, if only parallel plane plates 103a to 103e which are rotatable about the Z direction are provided, uniform exposure distribution on the plate P can be achieved. have.

As described above, in the present embodiment, a pair of parallel plane plates is provided as the illumination area moving means and the exposure area moving means, but instead the optical axis of the illumination optical system or the projection optical system, for example, as shown in FIG. It is also possible to provide a pair of rotatable prepregs 105 and 106 that can be rotated around the center.

For example, as shown in FIG. 6 (b), instead of the pair of parallel plane plates, a pair of declination prisms 107 and 108 which can move in the direction along the optical axis of the illumination optical system or the projection optical system may be provided. .

In addition, in the present embodiment, the field stops 5a to 5e in each illumination optical system may be provided so that the position can be adjusted.

At this time, for example, by providing the field stops 5a to 5e to be movable in the Y direction and the Z direction, the illumination regions MIa to MIe formed on the mask can be moved in two directions in the YZ plane.

Further, for example, when the field stops 5a to 5e are rotatably provided around the optical axis of the illumination optical systems ILa to ILe, the illumination regions MIa to MIe formed on the disk are rotated in the YZ plane, respectively. You can do it.

Incidentally, in the embodiment shown in FIG. 1, the field stops 5a to 5e are provided in each of the illumination optical systems ILa to ILe. However, as shown in FIG. 7, for example, the illumination optical systems ILa to FIG. A configuration may be provided in which one field stop 50 having openings 50a to 50e corresponding to the number of ILe) is provided.

By the way, in the above-described embodiment, it is assumed that the illumination deviation caused by the illumination optical system and the exposure dose deviation caused by the projection optical system are completely corrected.

However, when a manufacturing error etc. exist in an illumination optical system, there exists a possibility that the illumination deviation on the mask M may generate | occur | produce, and also the exposure amount deviation on the plate P may generate | occur | produce.

Moreover, even in the case of a completely uniform illuminance distribution on the mask M, if there is a manufacturing error or the like in the projection optical system, there is a possibility that variation in the exposure amount on the plate P may occur.

Next, with reference to FIGS. 8 (a) and 8 (b), a method of illumination deviation correction and exposure amount deviation correction will be described.

FIG. 8A is a plan view showing a field stop in the illumination optical system, and FIG. 8B is an enlarged view of a main part of FIG. 8A.

In FIG. 8 (a), the field stop has rectangular openings 51a to 51e in which the scanning orthogonal direction (Y direction) is in the longitudinal direction, and an area in which each of the openings 51a to 51e overlap with respect to the Y direction ( In the overlap area), as shown in FIG. 8B, a checkerboard grid pattern is provided.

Here, the field stop has, for example, a configuration in which a chrome pattern is deposited on a parallel plane plate, and the checkerboard lattice pattern is also configured by vapor deposition of a chrome pattern.

In addition, the openings 51a to 51e serve as transmission portions.

For example, when there is a difference in illuminance on the mask M between the illumination optical system ILa having the opening 51a of the field stop and the illumination optical system ILb having the opening 51b of the field stop, The pitch of the checkerboard lattice pattern of the overlap area of the opening part 51a and the checkerboard lattice pattern of the overlap area of the opening part 51b may be changed so that illuminance distribution may continue on the mask M. As shown in FIG.

Thereby, the exposure amount distribution on the plate P can be made continuous.

Moreover, when there is a difference in the amount of light transmitted between the projection optical system PLa and the projection optical system PLb, the checkerboard grating of the overlap area of the opening 51a so that the exposure dose distribution on the plate P is continuous. What is necessary is just to change the pitch of a shape pattern, and the sebum of the checkerboard grid pattern of the overlap area | region of the opening part 51b.

The checkerboard lattice pattern is not limited to being provided only in the overlap region, but overlaps so that the illuminance distribution on the mask M or the exposure dose distribution on the plate P is continuously uniform. It may be provided outside the area.

Instead of the checkerboard lattice pattern shown in Figs. 8A and 8B, for example, a configuration in which a dot pattern as shown in Figs. 9A and 9B is provided may be provided. .

9 (a) shows a field stop having trapezoidal openings 52a to 52e, and FIG. 9 (b) is an enlarged view of the main part of the opening.

As shown in Fig. 9B, a dot pattern made of a chrome pattern is provided in the overlap region of the trapezoidal openings 52a to 52e.

Here, the pitch, size, and arrangement of each dot pattern are determined such that the illuminance distribution on the mask M or the exposure dose distribution on the plate P is uniform and continuous.

Thereby, in plate P, it can always be set as a constant exposure amount at the time of scanning exposure.

In addition, instead of moving each illumination region by the illumination region moving means, a configuration may be adopted in which the amount of transmitted light is attenuated in the part of the field stop corresponding to the overlap region.

For example, the field stop may be formed by depositing a chromium pattern on a parallel plane and providing a dot-shaped chrome pattern in a corresponding region of the overlap region.

In the above-described embodiment, a lens system having a front focal position is used as the projection optical system on the ridge of the roof-shaped reflecting member. However, if the optical system can obtain an upright image, for example, two sets of opener type optical systems, two sets of Dyson type optical systems, A pair of refraction lens systems may be provided in series.

In addition, as a relay lens system of the illumination optical system, an optical system having a planar mirror lens and a triangular mirror member at a front focal position, or an optical system having an opener or Dyson optical system and a trapezoidal mirror member or a right angle prism is used. It is okay.

In the present embodiment, a plurality of illumination optical systems corresponding to the respective illumination regions MIa to MIe are provided, but instead, the light from one or a plurality of light sources is used, for example, using an optical fiber or a half mirror. Configuration may lead to.

According to the present invention as described above, it is possible to provide an exposure apparatus capable of satisfactorily transferring onto a substrate without causing a decrease in productivity and without causing an exposure variation in the pattern of the mask.

1 is a schematic diagram schematically illustrating an embodiment according to the present invention.

2 is a cross-sectional view illustrating a main part of the illumination optical system in the embodiment.

3 is a plan view showing the arrangement of the illumination region on the mask.

4 is a cross-sectional view of the projection optical system in the embodiment.

5 is a plan view showing the arrangement of an exposure area on a plate;

6 is a diagram illustrating a modification of the illumination area moving means or the exposure area moving means.

7 illustrates a modification of the field of view aperture.

8 illustrates a modification of the field of view aperture.

9 is a diagram illustrating a modification of the field stop.

10 illustrates a conventional exposure apparatus.

◈ Explanation of symbols for the main parts of the drawings

M: Mask, P: Plate

ILa-ILe: illumination optical system, MIa-MIe: illumination area

PLa-PLe: projection optical system, PIa-PIe: exposure area

101a, 102a, 101b, 102b, 101c, 102c, 101d, 102d, 101e, 102e: lighting area moving means

103a, 104a, 103b, 104b, 103c, 104c, 103d, 104d, 103e, 104e: exposure area moving means

Claims (28)

Illuminating the first object by an illumination optical system while moving the first object and the second object in a predetermined direction, and displaying the image of the first object by the projection optical system having a fixed position with respect to the illumination optical system. In the exposure apparatus projected and exposed to The illumination optical system, A first illumination optical system for forming a first illumination region on the first object; A second illumination optical system forming a second illumination region different from the first illumination region on the first object, The projection optical system; A first projection optical system for forming an upright image of the first object illuminated by the first illumination optical system on the second object; And a second projection optical system for forming an upright image of the first object illuminated by the second illumination optical system on the second object, The first illumination optical system has first illumination region moving means for moving the first illumination region on the first object with respect to the first projection optical system, And the second illumination optical system has second illumination projection means for moving the second illumination region on the first object with respect to the second projection optical system. The method of claim 1, The first and second illumination optical systems each have a field of view aperture installed at a position in conjugate with the first object, The first illumination region moving means is disposed in an optical path between the field of view aperture of the first illumination optical system and the first object, and further comprises an image of the field of view aperture formed on the first object of the first object. It has an optical member which moves to a surface inward direction, The second illumination region moving means is disposed in an optical path between the field of view aperture of the second illumination optical system and the first object, and the image of the field stop is formed on the first object. An optical apparatus which has an optical member which moves to surface inside direction. The method of claim 2, The first illumination region moving means has two parallel plane plates perpendicular to the optical axis of the first illumination optical system, and each of the parallel plane plates is rotatable in an axis perpendicular to each other, The second illumination region moving means has two parallel plane plates perpendicular to the optical axis of the second illumination optical system, and each of the parallel plane plates is rotatable in an axis perpendicular to each other. Exposure apparatus. The method of claim 1, The first illumination region moving means has a field stop set at a position conjoint with the first object in the optical path of the first illumination optical system, and movable to the optical axis of the first illumination optical system, And said second illumination region moving means has a field stop set at a position which is conjugate with the first object in the optical path of the second illumination optical system and movably installed with respect to the optical axis of the second illumination optical system. Exposure apparatus. The method according to any one of claims 1 to 4, The first and second projection optical systems each have exposure area moving means for changing the positional relationship between the optical axis on the first object side and the optical axis on the second object side. The method of claim 5, The said exposure area movement means has two parallel plane plates perpendicular | vertical to the said optical axis, and each said parallel plane plate is rotatable in the mutually orthogonal axis | shaft, The exposure apparatus characterized by the above-mentioned. The method according to any one of claims 1 to 4 or 6, And said first object is a mask for exposure, and said second object is a substrate to be exposed. In the illumination apparatus combined with the projection exposure apparatus which project-exposures the pattern of a 1st object on a 2nd object, Illumination optical means for forming a first illumination region on the first object and a second illumination region different from the first illumination region; And means for adjusting the positional relationship between said first illumination region and said second illumination region. A projection exposure apparatus for projecting exposure of a pattern of a first object onto a second object, An illuminating device according to claim 8; And projection optical means for forming an image of the pattern of the first object on the second object. The method of claim 9, The projection optical means forms an image of the pattern in the first illumination region on the first object in a first exposure region, and the pattern in the second illumination region on the second object. Is formed in a second exposure region different from the first exposure region. The method of claim 10, And means for adjusting the positional relationship between the first exposure area and the second exposure area. An illumination method for illuminating the first object when projecting exposure of the pattern of the first object onto the second object, Forming a first illumination region on the first object; Forming a second illumination region different from the first illumination region on the first object; And a step of adjusting the positional relationship between said first illumination region and said second illumination region. A method of projecting and exposing a pattern of a first object onto a second object, Illuminating the first object by the method of claim 12; And forming an image of the pattern of the illuminated first object on the second object. The method of claim 13, The image of the pattern in the first illumination region on the first object is formed in a first exposure region, and the image of the pattern in the second illumination region on the second object is formed in the first image. It is formed in a 2nd exposure area | region different from an exposure area | region, The projection exposure method characterized by the above-mentioned. The method of claim 14, And a step of adjusting the positional relationship between the first exposure area and the second exposure area. An apparatus for projecting exposure of a pattern of a first object onto a second object, For transferring the pattern of the first object into a first exposure area on the second object and simultaneously transferring the pattern of the first object into a second exposure area different from the first exposure area on the second object. Projection optical means; Means for scanning the first and second exposure areas onto the second object, The first and second exposure areas form an overlap area by the scanning, And a means for adjusting the exposure amount of the overlap area. The method of claim 16, First illumination optical means for forming a first illumination region on said first object; Second illumination optical means for forming a second illumination region different from said first illumination region, The first illumination optical means has a first field of view aperture for defining the first illumination region, The second illumination optical means has a second field of view aperture for defining the second illumination region, The means for adjusting the exposure amount is provided in the first and second field stops, the projection exposure apparatus characterized by the above-mentioned. An illumination device in which a pattern of a first object is combined with a projection exposure apparatus for projecting exposure on a second object. Illumination optical means for forming a first illumination region on the first object and a second illumination region different from the first illumination region; Means for adjusting a positional relationship between the first illumination region and the second illumination region, The illumination optical means includes a first field of view aperture for defining the first illumination region and a second field of view aperture for defining the second illumination region, And means for adjusting the positional relationship adjusts the positional relationship of the first and second field stops. A method of projecting and exposing a pattern of a first object onto a second object, the method comprising: Transferring a pattern of the first object into a first exposure area on the second object; Transferring a pattern of the first object into a second exposure area different from the first exposure area on the second object; And scanning the first and second exposure regions onto the second object, The first and second exposure areas form an overlap area by the scanning, And a step of adjusting the exposure amount of the overlap area. An illumination method used when projecting exposure of a pattern of a first object onto a second object, Forming a first illumination region on the first object; Forming a second illumination region different from the first illumination region on the first object; And adjusting a positional relationship between the first illumination region and the second illumination region, The first illumination region is defined by a first field of view aperture, and the second illumination region is defined by a second field of view aperture, In the step of adjusting the positional relationship, the positional relationship between the first and second visual field stops is adjusted. An exposure apparatus having an illumination optical system for illuminating a mask and a projection optical system for projecting a pattern of the mask onto a substrate, wherein the exposure apparatus exposes the pattern of the mask to the substrate while moving the mask and the substrate in a scanning direction. And the illumination optical system includes correction means for correcting the irradiation deviation on the mask while being disposed at a position optically conjugate with the mask. The method of claim 21, And the correction means includes first and second correction members. The method of claim 22, The illumination optical system includes a first illumination optical system for forming a first illumination region on the mask, and a second illumination optical system for forming a second illumination region at a position on the mask different from the first illumination region, The first correction member is disposed at an optically conjugate position with the mask in the first illumination optical system, and the second correction member is disposed at an optically conjugate position with the mask in the second illumination optical system. Exposure apparatus. The method of claim 22, The first and second correction members each include a dot pattern. An exposure apparatus including an illumination optical system for illuminating a mask and a projection optical system for projecting a pattern of the mask onto a substrate, wherein the exposure pattern exposes the pattern of the mask to the substrate while moving the mask and the substrate in a scanning direction. And said illumination optical system includes correction means arranged at an optically conjugate position with said mask to correct exposure variation on said substrate. The method of claim 25, And the correction means includes first and second correction members. The method of claim 26, The illumination optical system includes a first illumination optical system for forming a first illumination region on the mask, and a second illumination optical system for forming a second illumination region at a position on the mask different from the first illumination region, The first correction member is disposed at an optically conjugate position with the mask in the first illumination optical system, and the second correction member is disposed at an optically conjugate position with the mask in the second illumination optical system. Exposure apparatus made into. The method of claim 26, The first and second correction members each include a dot pattern.