KR100370877B1 - Welding Machine for Inner Layer Board - Google Patents

Abstract

The present invention lays up a set of inner layer wiring boards in which prepreg is exposed on the surface, and melts and welds the prepregs with a welding head to fix the inner layer wiring boards.

During the manufacturing process of the multilayer printed wiring board, the double-sided wiring board constituting the inner layer and the prepreg are alternately mounted on the jig plate and laid up, and the prepreg is melted by heating and pressing several places in the vicinity of spots. It welds and temporarily fixes the structural member of the said inner layer.

The tape 25 is disposed between the tip of the welding head 17 to be heated and pressurized in the form of a spot, and the welding head 17 does not directly contact the prepreg on the surface of the work 40 so that the prepreg The surface is carbonized or softened to prevent it from adhering to the tip of the welding head 17. Moreover, the processus | protrusion of the surface of the prepreg formed at the front-end | tip of the welding head 17 is pressed by the stamper 27, it is made uniform, and the fall of the adhesive strength of the copper foil of a surface is prevented. Even when the outermost layer is a double-sided wiring board, it may be heated and carbonized at the tip of the welding head 17, and the use of the tape 25 is effective.

Description

Inner Layer Welding Machine {Welding Machine for Inner Layer Board}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of aligning a conductor pattern when forming a plurality of double-sided substrates and an adhesive material (prepreg) alternately to form an inner layer of a multi-layered substrate. The present invention relates to an inner-layer plate welding machine which melt-welds a prepreg to temporarily fix a component of an inner layer.

In recent years, with the miniaturization of electronic components for surface mounting, such as IC chips, resistors, and capacitors, the printed wiring board which mounts these is also required to be high in density, and is often multilayered. Multilayer printed wiring boards, such as 4 and 6 layers, are also used for general use, and multilayer printed wiring boards with many more layers (name up to 50) are used for industrial use.

The multilayer printed wiring board is comprised from the conductor layer exposed to the outside of two front and back layers, and the several unexposed inner layer.

As a (insulating) substrate material of a multilayer printed wiring board, it is mainstream to use a thermosetting glass epoxy resin, and in high-layer wiring boards, heat-resistant resins such as glass, polyimide resin, oil and BT resin are also used. As a conductor material, the copper foil of about 18 micrometers in thickness is used, for example.

When manufacturing a multilayer printed wiring board, the inner-layer double-sided wiring board, copper foil for exposed conductors, and an interlayer adhesive material (henceforth a prepreg) are supplied from a wiring board material manufacturer. Prepreg impregnates glass fiber with thermosetting resins, such as an epoxy resin and a polyimide resin, and heats, presses, and thermosets, and adhere | attaches an adjacent double-sided wiring board, copper foil, etc.

What is necessary is just to think that a double-sided wiring board adhere | attached two copper foils (at the same time as a thermosetting) to the front and back of the prepreg which thermosetting was completed.

In the multilayer printed wiring board, since six or more layers merely have a large number of conductors in the inner layer, a manufacturing method of the six-layer multilayer wiring board will be described below as a manufacturing method of the multilayer printed wiring board. Here, a six-layer multilayer wiring board has two conductor layers, four inner layers (unexposed) and the outermost layer exposed.

Hereinafter, with reference to FIGS. 8-10, the general manufacturing method of a multilayer printed wiring board of six layers is demonstrated.

A flat type, which is an example of a six-layer multilayer printed wiring board, is shown in Fig. 8A, and Fig. 8B schematically shows the material arrangement procedure of this multilayer wiring board in cross section.

Reference numeral 34, shown by the dashed-dotted line, is the size of the multilayer printed wiring board that is separated as a final product. The number of materials obtained by processing at the same time (six in the figure) is estimated to allow a margin on the outer periphery, and the size of the material is determined.

These materials are prepreg 32 having the copper foil 33 of the surface layer, the prepreg 36 without a guide ball, the double-sided wiring board 31, and a guide ball, as shown in FIG. 8 (B) after individual processing. ), The double-sided wiring board 31, the prepreg 36 without a guide hole, and the copper foil 33 of the surface layer. do.

The conductor layer of the inner layer is formed on the copper foil of the front and back of the double-sided wiring board. At least two guide holes 35 and 35 are formed at predetermined positions in the double-sided wiring boards 31 and 31 obtained from the wiring board material maker and cut to a predetermined size.

Next, the photosensitive dry film affixed to the whole surface based on this guide hole 35 and 35 is exposed in accordance with a negative pattern, and it is used as a conductor from the copper foil pasted on both surfaces of the two-sided wiring boards 31 and 31. Unnecessary parts are dissolved (etched) and a pattern is formed. After the pattern is formed on the double-sided wiring boards 31 and 31, roughening treatment (commonly referred to as blackening treatment) is performed to increase the adhesion with the prepreg.

Laying up a plurality of inner-layer double-sided wiring boards which have been etched and matching the positional relationship of the patterns formed on the conductor portions of the respective wiring boards correctly. Usually, a machine called an innerlayer welding machine is used for this work.

FIG. 9: shows the structure of the principal part of this inner-layer plate welding machine, FIG. 9: (A) shows the top view from above, and FIG. 9 (B) shows the welding head vicinity in sectional drawing.

The inner layer welding machine incorporates a plurality of sets (6 sets in the figure) of a pair of upper and lower welding heads 67 and 67X for heating and pressing the prepreg in the form of dots.

The air cylinder 63 is fixed to the upper part of the C type rack 60 fixed to the inner-layer plate welder frame which is not shown in figure, and the welding head 67 is attached to the front-end | tip of the actuator which moves up and down. The welding head 67 is maintained at the temperature of 280-300 degreeC with the heater 68 which covered the welding head 67, for example.

Moreover, this inner layer welding machine is equipped with the pallet 56 for the jig plate combined use for laying up said double-sided board | substrate. The diameters and positions of the guide pins 57, 57 formed on the pallet 56 correspond to the guide holes 35, 35 formed on the double-sided wiring boards 31, 31, respectively.

As shown in FIG. 9 (B), the pallets 56 are formed by inserting the guide holes 35 and 35 of one double-sided wiring board 31 through the guide pins 57 and 57 formed upright on the pallet 56. Mount on the top.

Next, the guide holes 35 and 35 are formed, and the prepreg 32 which has the same external dimensions as the double-sided wiring board 31 is mounted on the double-sided wiring board 31.

In addition, the guide holes 35 and 35 of the second double-sided wiring board 31 are inserted and mounted on the prepreg 32.

The conductor patterns of the two double-sided wiring boards 31 and 31 are matched by inserting the guide holes 35 and 35 through the guide pins 57 and 57, and a pair of inner layer wiring boards 38 (two double-sided wiring boards ( 31 and 31 and the prepreg 32 are laid up.

Here, the upper and lower pairs of welding heads 67, 67X ... (in FIG. 9) in the vertical direction move vertically in opposite directions to press the two double-sided wiring boards 31 and 31 from the top and bottom, and the prepreg 32 Pressurize by heating. The heat hardening of the part pressed by the welding head 67, 67X ... of the prepreg 32 advances to some extent, and the two double-sided wiring boards 31 and 31 are adhesively fixed through the prepreg 32 in six places. For this reason, even if one set of inner-layer wiring board 38 is removed from the pallet 56, a layup state is maintained and the temporary fixing after a layup is completed.

A set of inner layer wiring boards 38 fixed and integrated on the outer periphery are then set to a hot press for pressurized heating. Fig. 10 schematically shows a hot press process, and Fig. 10 (A) shows a state where several trillions of multilayer wiring boards (materials) are simultaneously set in a hot press, and Fig. 10 (B) shows a set of multilayer wiring boards ( The order of arrangement of materials) is shown.

The lower heating pressing plate 71 is fixed to the hot press body 70, and the upper heating pressing plate 72 is supported by the main body 70 so as to be movable up and down, and is sandwiched between the upper and lower heating pressing plates 72 and 71. ) Is heated and pressurized.

Several tanks of materials constituting the multilayer wiring board are mounted on the lower heating pressing plate 71 in order.

In each pair of multilayer wiring boards 39, as shown in FIG. 10 (B), the copper foil 33 of the outermost layer is first mounted. The copper foil 33 is 20-40 mm larger than the double-sided board | substrate 31 in the magnitude | size of an outer periphery. The prepreg 36 (without guide ball), the above-mentioned one set of inner layer wiring boards 38, the prepreg 36, and finally the outermost copper foil 33 are placed thereon. Thus, a plurality of sets of materials 39 constituting a six-layer multilayer wiring board are provided, the arrangement of which is shown in FIG. 10 (B), and each multilayer wiring board becomes the same as that of FIG. 8 (B). . On this, a partition plate 73 made of stainless steel is mounted to divide the compartment.

The material 39 of another multilayer wiring board is placed on the partition board 73, and the material of the partition board 73 and another set of multilayer wiring boards is provided. The material 39 of 10-20 sets of multilayer wiring boards overlaps.

The materials 39 of the plurality of multilayer wiring boards are sandwiched by the upper and lower heating pressing plates 71 and 72 of the hot press and are simultaneously heated and pressurized. The prepreg is thermally cured and bonded to the upper and lower copper foils and double-sided wiring boards, and the set of multi-layered wiring boards are thermally cured and bonded in a single hot press process.

Subsequently, a new guide ball corresponding to the pattern of the inner layer plate (for example, through the guide ball mark provided on the inner layer plate by the X-ray hole forming machine) is formed, and the outermost conductor pattern of the outer layer layer is formed on the basis of the guide ball. Etching and through hole forming are performed. Since the outermost conductor pattern is formed based on the new guide ball, the outermost conductor pattern maintains the positional relationship with the conductor pattern formed in the inner layer.

Moreover, after a plating process, a rust prevention process, etc. are performed, when multiple pieces are obtained by machining, such as a router, it divides into a single wiring board, processes it to a desired outer periphery shape, and a multilayer printed wiring board is completed.

As mentioned above, although the manufacturing procedure of a general multilayer wiring board is demonstrated, as shown in FIG. 10 (B), the upper and lower two prepregs 36 and 36 placed adjacent to the outermost copper foil are the welding machine shown in FIG. Peripheral fixation is not performed.

Prior to the use of innerlayer welders, instead of hot welding prepregs during layup, temporary fixing of metal parts, such as holdfast and tackers, around the outer circumference of the multilayer wiring board material was also used. Since the metal parts often protrude from the surface of the multilayer wiring board in the thickness direction, the metal parts such as hold fasts and tackers of the plates are likely to be easily damaged in the hot pressing plates 71 and 72 and the partition plates 73 in the hot pressing process. The use of an inner layer welding machine has been increased because of the drawbacks of polishing the wound by the wound and requiring a recess process at a position such as a hold fast or a tacker.

However, in the thermosetting (adhesion) process of the prepreg by the hot press of a hot press, the upper and lower two prepregs whose outer peripheries placed adjacent to the copper foil of the outermost layer are not fixed, are the upper and lower heating press plates and partition plates of the hot press. Accidents are often caused by a misalignment on the surface. It is considered that this is because the pressing force of the hot press generates a partial force parallel to the surface of the hot pressing plate or the partition plate by the slight inclination of the hot pressing plate or the partition plate of the hot press. Movement of the prepreg becomes one of the causes of the defect of the multilayer wiring board which is a product, such as damage of the outermost copper foil, or adhesive failure.

Therefore, when temporarily fixing with a welding machine, it is only necessary that the two (outer) prepregs can be fixed in the same manner as in the case where the outer circumference of two double-sided wiring boards with prepregs sandwiched therein is melt-welded. For this purpose, it is necessary to directly contact the heated welding head of the welding machine with the prepreg. For example, in the case of glass epoxy prepreg, the compression molding temperature is 149 to 166 ° C and the compression molding pressure is 21 to 352 kg / cm 2. . Although it is possible to apply pressure, the compression molding temperature needs to be raised for the prepreg to be melt-welded and temporarily fixed. The same applies to the case of polyimide and BT. Further, the thermal conductivity of the glass epoxy laminate is considerably difficult to transmit heat at about 0.3 W / (m · K) at 25 ° C. This is evident in comparison with the thermal conductivity of copper of 370 and that of stainless steel, which has a low thermal conductivity, among metals, of about 16. Thus, if the interior reaches, for example, 160 ° C, it is also possible by the heat capacity of the welding head, but the contact time is several. Seconds to tens of seconds are required, and when the interior reaches 160 ° C., the surface of the prepreg in contact with the welding head is approximately at the temperature of the welding head (280 to 300 ° C.).

In this case, since the temperature gradient of the double-sided wiring board is large, when the internal prepreg is sufficiently heated to melt welding, the prepreg directly heated by the welding head is softened and sticks to the welding head in a thread form or blacks. It is often carbonized to form a fine powder. If the carbonized fine powder falls on the conductor pattern of the inner layer, there is a risk of causing a serious defect in the multilayer wiring board as a product.

Moreover, even when the outermost layer is a double-sided wiring board, the surface may be carbonized and become fine powder, and the same problem may occur even in the case of a double-sided wiring board.

In addition, the surface of the prepreg heated by the welding head of the welding machine may subside in the part which the welding head contacted, and swells and deforms contrary to the outer periphery of a welding head. If there is a projection locally, it may cause problems in adhesion of the copper foil of the outermost layer. Therefore, it is preferable to take preventive measures.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view of the external appearance of the inner layer welding machine of this invention.

2 is a plan view and a sectional view of a welding head portion of an innerlayer welding machine of the present invention.

3 is a perspective view of the welding head of the present invention.

4 is a plan view and a cross-sectional view of the welding head of the present invention.

It is a schematic diagram explaining the structure of a multilayer printed wiring board.

FIG. 6 is a diagram schematically illustrating a situation in which the welding tip of the welding head is inserted into the prepreg and the periphery protrudes.

FIG. 7 is a diagram schematically showing a state in which the protrusion of the prepreg is removed by pushing with a stamper.

It is a schematic diagram explaining the structure of the multilayer printed wiring board processed by the conventional processing method.

It is a schematic diagram explaining the state which lays up an inner layer board with the welding head of the conventional inner layer welding machine.

FIG. 10 is a schematic diagram illustrating a conventional process of heating and pressing a hot press to heat-cure the prepreg and forming a multilayer printed wiring board.

<Explanation of symbols for main parts of drawing>

1: inner layer welding machine, 5, 5: guide rail, 6a: upper pallet, 6b: lower pallet, 7, 7: jig plate, 7a, 7a: guide pin, 11, 11X: welding unit, 12: base, 13, 19, 26: air cylinder, 14: welding head base, 17: welding head, 20: reel base, 21, 22: tape reel, 23, 23: guide roller, 24: winding motor, 25, 25X: tape, 27, 27X: stamper, 31: double-sided printed wiring board, 32, 36: prepreg, 33: copper foil, 35: guide ball, 37: 1 set inner layer wiring board (having prepreg 32 on the outside), 38: 1 set inner layer wiring board (There is no prepreg 32 on the outside), 40: work

MEANS TO SOLVE THE PROBLEM In order to solve the said problem, the jig board which lays up a plurality of inner-layer double-sided wiring boards and prepregs which alternately form an inner layer of a multilayer printed wiring board, lays up as a set of inner-layer wiring boards, and the said jig board An inner layer plate welding machine comprising a plurality of sets of welding heads which press-heat a welded portion from both sides of a set of inner layer wiring boards which are mounted and laid up on the surface to be melt welded and temporarily fixed to the prepreg,

Between the tip of the welding head and the surface of the set of inner layer wiring boards, a deposition preventing material for preventing welding of the prepreg is disposed, and the welding head pressurizes and heats the surface of the set of inner layer wiring boards and a stamper. ) To provide an inner layer plate welding machine which pressurizes the pressing and heating portions of the set of inner layer wiring board surfaces after the pressurization and heating is finished. The deposition preventing material terminates the pressing and heating of the welding head. There is also provided an inner layer welder which is moved a predetermined amount after.

Moreover, the inner layer plate welding machine provided with the stamper which pressurizes the pressurization heating site | part of the said welding head of the said one set of inner layer wiring board surfaces after completion | finish of pressurization heating of the said welding head is also proposed.

An inner layer welding machine which is an embodiment of the present invention will be described with reference to FIGS.

Fig. 1 is a perspective view of the outer appearance of the inner layer welding machine 1 of the present invention, Fig. 2 (A) is a plan view of an inner arrangement of the inner layer welding machine, and Fig. 2 (B) is a welding unit 11, 11X cut by a line AA. It is sectional drawing which shows the arrangement of. 1 and 2 (A), the welding unit 11 is shown in simplified form.

3 is a perspective view of the welding unit 11. 4A is a perspective view of the base 12 in a plan view of the welding unit 11, FIG. 4B is cut along the AA line of FIG. 4A, and FIG. 4C is FIG. 4. Each cross-sectional view cut | disconnected by the BB line of (A) is shown.

The arrows marked with XYZ and the like written in Figs. 1 to 4 denote directions in which the X direction moves in the pallets 6a and 6b and the Z direction in the vertical direction. When the operator stands in the direction of the arrow on the empty arrow 8 in the middle of displaying the operating position of the machine, X is in the left-right direction and Y is in the front-rear direction.

As described above, the inner layer plate welding machine according to the embodiment of the present invention lays up a plurality of double-sided wiring boards forming the inner layer of the multilayer wiring board, and melts and welds several places of the outer circumference of the prepreg to lay up the plurality of double-sided wiring boards. It is a temporary fixing machine.

The work object is composed of a set of a plurality of double-sided wiring board forming the inner layer and one or more prepregs overlapping as described above, and in the general operation description, it is simply a work 40 regardless of the contents composed of a set mainly. FIGS. 1 and 2 It demonstrates with reference to.

In the left half of the housing 2 of the inner-layer plate welding machine 1, several places of the outer periphery of a prepreg are melt-welded. Usually, although covered with the cover 3, in FIG. 1, the cover 3 is shown and the external appearance is shown by the dashed-dotted line.

Reference numeral 4 is a control panel and is mounted to the housing 2. The pair of guide rails 5 and 5 are fixed to the housing 2 along the X direction, and the upper pallet 6a and the lower pallet 6b are respectively formed in two upper and lower grooves engraved in the guide rails 5 and 5, respectively. The unshown work 40 inserted and mounted on the jig plate 7 shown in FIG. 2 by reciprocating between the right-side double-sided wiring board set position and the left-side melt welding position alternately by a drive mechanism not shown. To carry.

The upper and lower pallets 6a and 6b are made in the exact same shape. For example, metal square bars are combined in a rectangular shape, and the inside is void like an edge of a picture frame. Jig plates 7 and 7 made of stainless steel plates or the like are mounted on pallets 6a and 6b, and at least two guide pins 7a and 7b are formed on the jig plate 7 at predetermined positions to form a workpiece ( It inserts into the guide hole 35 of 40, and the layup of the workpiece | work 40 is performed. The size of the jig plate 7 can be changed depending on the size of the workpiece 40 described above.

Moving frames 9 and 9 are installed on the left side of the housing 2 and driven by a servo motor (not shown) to move in the Y direction. In the moving frame 9, three 3-type racks 10 are mounted in the drawing, respectively, and can be moved alone or six simultaneously in the X direction by a manual or unillustrated servo motor.

The welding unit 11 is fixed to the upper part of the C-type rack 10, and the welding unit 11X is fixed to the lower part, and the tip of the welding head 17 and the welding head 17X is facing (at the same XY coordinate).

The moving frame 9 and the C-type rack 10 are moved so that the tip of the welding head 17 and the welding head 17X becomes the designated welding position which is a welding site corresponding to the various size of the workpiece | work 40. FIG.

The welding unit 11 is demonstrated in detail mainly with reference to FIG. 3, FIG.

Three air cylinders 13, 19, and 26 are fixed to the base 12 fixed to the upper portion of the C-shaped rack 10.

The welding head base 14 is horizontally attached to the tip of the actuator 13a of the welding head air cylinder 13 for moving the welding head 17 in the Z direction. Since the slide bar 15 which stands on the rear end of the welding head base 14 slides in the hole of the guide pipe 16 fixed to the base 12, the welding head base 14 is supported so that it may not rotate. The welding head 17 is fixed to the front end of the welding head base 14, the cylindrical heater 18 is fitted in the outer side of the welding head 17, and the welding head 17 is about 280-300 degreeC temperature. Is maintained.

The reel base 20 is fixed to the tip of the actuator 19a of the air cylinder 19. The guide rod 20b which is formed in the base 12 in the groove 20a formed in the reel base 20 is engaged to prevent rotation of the reel base 20.

Two tape reels 21 and 22 are rotatably supported on the reel base 20, and the tape reels 21 are directly connected to the output shaft of the winding motor 24, so that the tape reels 21 are rotated when the winding motor 24 rotates. To rotate.

In order that the surface of the workpiece | work 40 may be a prepreg, the tape 25 which is a welding prevention material of the prepreg attachment prevention is wound on the axis | shaft of the tape reel 22, and the end of this tape 25 is pulled out and a guide roller ( 23, 23, and then fixed to the tape reel (21). When the welding head 17 descends, the tip portion of the welding head 17 comes into contact with the tape 25 between the guide rollers 23 and 23, and the tape 25 of this portion descends while being pushed down. The work 40 is pressurized through 25).

The actuator 19a of the air cylinder 19 moves the tape 25 near the surface of the work 40 in advance when the welding head 17 is lowered, and the welding head 17 moves down to pressurize the work 40. The tape 25 is then subjected to the movement of the tip of the welding head 17 without difficulty.

When the welding head 17 is raised after the welding operation is completed, the tape reel 21 is intermittently rotated by the above-described winding motor 24, and the tape 25 is wound around the tape reel 21 by a predetermined length. Lose. That is, each time the welding operation is performed, the tape 25 is moved so that the bottom of the welding head 17 is always the new surface of the tape 25. As described above, the welding head 17 After one heating step is completed, the anti-deposition material is always moved with respect to the welding head 17 so that a new portion of the anti-deposition material faces the welding head 17 and the prepreg. The interposition between the welding head and the prepreg prevents the prepreg from adhering to the welding head, and also ensures that the winding motor 24 has the tape 25 so that the new side of the welding prevention material always faces the welding head and the prepreg. It is possible to prevent the generation of carbonized fine powder by winding the.

When the surface of the workpiece | work 40 is a prepreg, the unevenness | corrugation may be formed in a prepreg by the heating press of the welding head 17. FIG. If there is a projection locally, it may cause problems in adhesion of the copper foil of the outermost layer. Therefore, it is preferable to take preventive measures.

The stamper 27 is fixed to the tip of the actuator 26a of the air cylinder 26. The material of the stamper 27 is metal, hard plastic, or the like, and the surface is treated with Teflon coating. Since the protrusions are generated near the outer circumference of the welding head 17, the outer diameter of the stamper 27 is sufficiently larger than the diameter of the welding head 17.

The protrusion stuck to the tip of the welding head 17 on the surface of the prepreg of the surface layer is pressed with a stamper 27 so as not to adversely affect the copper foil of the outermost layer.

The distance between the welding head 17 and the stamper 27 (distance D shown in Fig. 4B) is the same in all welding units 11 and 11X (12 sets in the drawing). By the servo mechanism which is not shown in figure, all the C type racks 10 move in the X direction by the distance D, and the stamper 27 is necessarily the position (XY coordinate of the protrusion which stuck to the front-end | tip of the welding head 17). Comes on). When the actuator 26a of the air cylinder 26 descends, the stamper 27 can push in the protrusion which adhered to the surface of the workpiece | work 40. As shown in FIG.

The concrete example of the workpiece | work 40 is demonstrated according to FIG. The double-sided wiring board 31 for inner layers is the same as that shown in FIG. In the conventional construction method, when laying up a double-sided wiring board with an inner layer welding machine, the prepreg and the welding head 67 cannot directly contact each other, as in the configuration of a set of inner layer wiring boards 38 shown in Fig. 8B, The welding head 67 heated and pressed the prepreg 32 via the double-sided wiring board 31.

By providing the tape 25 in the welding units 11 and 11X of the inner-layer plate welding machine 1 of this invention, even when the prepreg 32 is the workpiece | work 40 arrange | positioned on the surface, melt welding after a layup is performed. It can be performed without any trouble. That is, as shown in 37 (C), a set of inner layer wiring boards 37 having a prepreg 32 (having a guide ball) on the outside can be laid up and temporarily fixed.

The layup operation by the inner-layer plate welding machine 1 is demonstrated according to a process sequence.

The jig board 7 required for the work is already fixed to the upper and lower pallets 6a and 6b. The prepreg 31 which has the double-sided wiring board 32 and the guide hole which comprise the inner layer of a multilayer wiring board which is a workpiece | work is prepared.

As shown in Fig. 2, the lower pallet 6b is located at the left end of the housing 2, and the upper pallet 6a is assumed to be in front of the arrow 8, which is the worker position at the right end.

The operator first inserts the prepreg 32 through the guide pins 7a and 7a of the jig plate 7 on the upper pallet 6a and the guide pins 7a and 7a through the guide balls 35 and 35, and then the jig It mounts on the board 7. Next, the guide pins 7a and 7a are inserted into the guide holes 35 and 35 with a total of five sheets in the double-sided wiring board 31, then the prepreg 32, the double-sided wiring board 31 and the prepreg 32 in total. Overlap while passing.

The conductor pattern of the double-sided wiring board 31 on the jig plate 7 is matched in the layup state. When the start button which is not shown in figure is pressed, the upper pallet 6a which mounts a workpiece | movement moves to the welding operation position to the left along X axis.

At the same time, the lower pallet 6b moves to the right and returns in front of the worker. Next, the work is mounted on the jig plate 7 on the lower pallet 6b.

2B shows the above state. Here, the heating and pressurization of the prepreg is performed by the upper and lower welding units 11 and 11X.

Controlled by a control circuit (not shown), the air cylinder 19 is actuated to move the reel base and to close the tape 25 between the guide rollers 23 and 23 near the surface of the work 40.

Next, the air cylinder 13 is operated to lower the welding head 17, and the prepreg 32 is heated while sandwiching the tape 25 between the tip of the welding head 17 and the surface of the prepreg 32. Pressurize.

The welding head 17X which exists in the same XY coordinate raises and presses the prepreg 32 of the lowest layer through 25 A of tapes from the bottom. In the pallets 6a and 6b, since the pathline is about 30 mm different, the height of the work is designated by the pallet from the control circuit described above, and when the work 40 is pressed by the upper and lower welding heads 17 and 17X, the work 40 is horizontal. The amount of movement (in the Z direction) of the pair of welding heads 17 and 17X is controlled so as to be maintained at.

When melt-welding the prepreg 32 with a pair of welding heads 17 and 17X, it is preferable to pressurize the processus | protrusion made in the prepreg 32 with the stamper 27, and to make the processus | protrusion sink. Although the detailed description of the stamper effect will be given later, the distance between the head 17 and the stamper 27 of all the welding units 11 and 11X is unified by D shown in FIG. When all the C-type racks 10 are moved by the distance D and the stamper 27 is lowered by the actuator 26a, the projections of the prepreg can be made uniform at the tip of the stamper 27. The layup process is complete.

When the worker who finishes mounting the next work presses the start button, the lay-up is finished and the upper pallet 6a on which the work 40 is temporarily fixed on the outer side is moved to the right, and the lower pallet 6b is returned. Moving to the left starts the next layup work.

Lay-up ends from the upper pallet 6a, and the workpiece | work 40 temporarily fixed at the outer periphery is removed, and the new workpiece | work 40 is mounted. In this way, work continues automatically.

The tapes 25 and 25X are ideally made of Teflon tape or the like, but ordinary paper having a certain degree of strength and heat resistance can be sufficiently practical. Special paper impregnated with oil may cause prepreg blackening. When the tapes 25 and 25X are wound up and down, the blackened powder may not be dropped by consideration of the inside of the surface in contact with the prepreg.

As shown in Fig. 6A, since the surface of the outer prepreg 32 is heated and pressurized at the front end of the welding heads 17 and 17X, the inner prepreg 32 is softened when the inner prepreg 32 is softened. The outer prepreg 32 softened as B) sinks by E according to the cross-sectional diameter of the welding head 17, and conversely, the resin which is removed near the outer periphery of the welding head 17 becomes a projection of F height. When the welding head 17 rises after heating, the tendency to become a projection accordingly cannot be ignored.

In the following hot press process, the protrusion which protrudes to the height of F from the original surface of the prepreg 32 causes the partial adhesion failure between the copper foil and the prepreg 32 attached to the outer side, and thus the item to be excluded. to be.

Fig. 7 addresses the above problem by pressing the projections with a stamper 27 and making the recessed parts as a whole while the outer prepreg 32 is still soft. If it is just after heat-pressurizing with the welding head 17, it can press into the flat tip of the stamper 27 at all, and it can make a wide and shallow recess, and can prevent local protrusion. As shown in FIG. 7B, even if the copper foil 33 is attached to the prepreg 32, the main part is not bonded, and thus the adhesive strength of the surrounding copper foil is irrelevant. In this vicinity, the wiring board completed in the final step is one by one. When cut out, it is a place that is cut off unnecessarily.

Strictly speaking, the resin thickness corresponding to the volume of the recessed portion of Fig. 7 (A) is very small in a large area, but the sheet thickness will increase, but the amount of change is very small, so that the thickness of the sheet in the hot press process is the same. Silver is absorbed and does not become a problem regarding the adhesive strength of copper foil.

As mentioned above, although the inner-layer plate welding machine was demonstrated as an example of the Example, the method of driving the welding head 17, the tape 25, and the stamper 27 which comprises the welding unit 11 is various.

For example, various mechanisms can be used for the shape of the tape 25, a winding-up method, and the like. The method of moving a sheet | seat of a flat form horizontally, etc. is also included as a basic idea of this invention. The use of a linear drive source other than an air cylinder such as a linear motor, the adoption of a mechanism for converting rotational motion into an approximate linear motion, and the like are also easily considered categories.

As described above, the inner-layer plate welding machine according to the embodiment of the present invention prevents the prepreg from adhering to the welding head by interposing the welding prevention material between the welding head and the prepreg, and always has a new face of the welding prevention material and the welding head. By moving the anti-deposition material to face the prepreg, it is possible to prevent the generation of carbonized fine powder by adhering to the welding head for a long time. Therefore, a set of inner layer wiring boards laid up and temporarily fixed do not interfere with the prepregs on the outside.

Since temporary fixing is performed on all prepregs and double-sided wiring boards, unfixed prepregs are eliminated, and in the following hot press process, unfixed prepregs are shifted horizontally by the pressure of the press and the defective parts are ejected to the side. It can be prevented completely.

In addition, by pressing the projection attached to the surface of the prepreg below the surface by using a stamper, it is possible to prevent adhesion failure of the outer copper foil, thereby contributing to the reduction of the defective rate.

In general, the blackened conductor layer is very susceptible to damage, and if the blackened conductor layer is exposed in the manufacturing process of the printed wiring board, the handling and protection of the conductor portion is performed carefully over time.

In most cases, the outermost layer of a set of inner layer wiring boards temporarily fixed by the inner layer welding machine of the present invention is a prepreg, and the conductor layer does not exist on the surface. Since the conductor layer is not exposed by being covered with the prepreg, transportation until the hot press of the next step is set or handling at the time of set is easy, and the work time can be shortened.

Claims (2)

Jig boards that lay up with a plurality of inner-layer double-sided wiring boards forming an inner layer of a multilayer printed wiring board and a set of inner-layer wiring boards in which prepregs are alternately mounted. and, In the inner layer plate welding machine which has a plurality of sets of welding heads which temporarily fix a said inner layer wiring board mounted on the said jig board and lay-up, by pressing and heating a welding part from both surfaces, and melt-welding the said prepreg, Between the tip of the welding head and the surface of the set of inner layer wiring boards, a deposition preventing material that prevents welding of the prepreg is disposed, and the welding head presses and heats the surface of the set of inner layer wiring boards, and a stamper ( and placing a stamper to apply pressure to the pressurized and heated portions of the set of inner layer wiring board surfaces after finishing the pressurization and heating. The method of claim 1, And the welding prevention material moves a predetermined amount after the pressurization and heating of the welding head are finished.