KR100363569B1 - A sending apparatus for semiconductor inspector - Google Patents

Abstract

The present invention relates to a semiconductor device inspector, the semiconductor device inspector according to the present invention comprises a plurality of adsorbers arranged laterally to adsorb the semiconductor device; A mounting table for guiding the adsorber to be slidably moved laterally; Vertical drive means for driving the mounting table up and down; Front and rear drive means for driving the vertical drive means back and forth; An interval adjusting plate having a plurality of gap adjusting holes in which an intermediate portion is axially coupled to the mounting base, and a length thereof becomes longer toward both sides of the shaft hole, the slant being formed at an angle, and the supporting protrusions formed on the adsorber are fitted; It is coupled to one end of the spacing plate is provided to rotate the spacing plate about the shaft hole, but as the spacing plate rotates, the support protrusions of the adsorbers move around the spacing hole in the spacing hole to adjust the spacing between the spacing units. It is provided with a rotation means to be, because the gap adjusting plate installed in the transfer device of the semiconductor device tester according to the present invention is provided with a plate body formed with a plurality of gap adjusting holes is light in weight to maintain a stable working state of the device In addition, since the configuration of the device for adjusting the spacing can be formed more simply, there is an effect that the manufacturing efficiency of the device is further improved.

Description

A sending apparatus for semiconductor inspector

The present invention relates to a semiconductor device inspector, and more particularly, to adjust the spacing of the adsorbed device according to the pitch of the test space when adsorbing and transporting the device contained in the customer tray for inspection of the device It relates to a transfer device of the semiconductor device inspector having.

In general, the semiconductor device inspector is a device that absorbs the transported device contained in the customer tray of the plastic material, transfers the transported device to the test tray, and then tests the semiconductor device in the test tray.

By the way. In general, the customer tray is manufactured in different shapes, sizes, capacities, and pitches of the spaces in which the elements are contained, so that the pitches of the spaces formed in the customer trays (parts containing elements) and the pitches of the spaces formed in the test trays are different. Almost all are different. For this reason, the transfer device of the semiconductor device inspector is equipped with a device spacing device so as to be able to adjust to different pitches. In the past, a number of such device spacing devices have been developed and filed in Korea. Among them, in the case of "Application No. 1995-7512," which is applied for a domestic utility model registration application, a plurality of links having different sizes are connected to each other so that the spacing between the adsorbers is controlled. However, in this technique, the link has a problem that the position of the adsorber is not accurately controlled since the operation range is too long.

The technology to solve this has been applied for registration of a utility model in Korea "Application No. 1996-22005". Here, some of the problems in the prior art are solved by connecting links of the same size, but too many parts for the coupling of these links and the structure are too complicated to increase the manufacturing cost of the device and due to the tolerance of the parts There was a problem that the deviation occurs.

Therefore, as a further improved technology there is a registration number "10-248704" registered and registered in the domestic patent. In this technology, there are two ways to adjust the spacing. The first is of circular camshaft and the second is of cam plate.

In the case of the camshaft, a plurality of inclined grooves are formed on the outer periphery of the camshaft, and the use of this camshaft can minimize the occurrence of deviation, which is a problem of the above-described techniques. However, this camshaft is naturally a cylinder of metal having considerable strength. The weight is therefore quite heavy, and the process for the accurate realization of the shape is quite demanding.

In other words, the weight of the camshaft acts as a significant load on the conveying device, thereby deteriorating the durability of the conveying device and causing a large vibration, which may cause an error in maintaining the deviation of the adsorber. In addition, since the coupling end of the adsorber is fitted into the groove of the inclined long hole formed in the camshaft, a large load is applied to the coupling part of the adsorber by the rotation of the camshaft.

Of course, the length of the groove formed in the camshaft is formed around the entire circumference to solve this problem, and a separate bearing or the like is installed in the coupling portion, but it does not prevent the occurrence of such a problem. In order to reduce the solution of the problem, high precision is required in the manufacturing process, and the manufacturing efficiency of the device is reduced by using a separate component.

And in the case of the cam plate is implemented as a plate body formed with a plurality of cam grooves inclined on the inner surface. In order to operate the cam plate, the guide plate must be provided with separate guide means at both ends of the cam plate to perform the smooth forward and backward movement of the cam plate. And since the cam plate is installed in a horizontal state, the front and rear width of the gap adjusting device is lengthened, and the size of the device is increased as a whole. That is, in case of the cam plate, some problems caused by the camshaft can be solved, but by installing a separate guide means, the number of parts increases and ultimately the weight of the device also increases, and at the same time, the size of the gap adjusting device increases. There is this.

The present invention is to solve the above problems, an object of the present invention is to improve the manufacturing efficiency of the device by implementing a simpler and lighter configuration by improving the device spacing device installed in the transfer device of the semiconductor device tester An object of the present invention is to provide a transfer device for a semiconductor device inspector having an element spacing controller.

1 is a front view of a device transfer device installed in the semiconductor small-scale inspection device according to the present invention.

2 is a perspective view showing a device transfer device of the semiconductor device tester according to the present invention.

Figure 3 is an enlarged perspective view showing a coupling state of the pickup device and the variable control plate in the device transfer device of the semiconductor device tester according to the present invention.

Figure 4 is an enlarged perspective view showing a variable control plate in the device spacing device of the semiconductor device tester according to the present invention.

Figure 5a is an operating state diagram showing the pre-operational state of the variable control plate in the device transfer device of the semiconductor device tester according to the present invention.

Figure 5b is an operating state diagram showing a state after the operation of the variable control plate in the device spacing device of the semiconductor device tester according to the present invention.

** Description of the symbols for the main parts of the drawings *

100 ... frame

160 ... front and rear drive plate

210 ... up and down drive plate

300 ... mounting stand

400 ... Adsorber

500 ... Spacing Plate

510 ... Spacing hole

530 ... cylinder

The semiconductor device inspector according to the present invention for achieving the above object is a plurality of adsorbers arranged laterally to adsorb the semiconductor device; A mounting table for guiding the adsorber to be slidably moved laterally; Vertical drive means for vertically driving the mounting table; Front and rear drive means for driving the vertical drive means back and forth; An interval adjusting plate having a shaft hole in which an intermediate portion is axially coupled to the mounting table, and a plurality of gap adjusting holes formed to be inclined at a predetermined angle, the support protrusions formed in the adsorber being fitted to be longer in length toward both sides of the shaft hole. ; It is coupled to one side end of the gap adjusting plate is provided to rotate the gap adjusting plate to the shaft hole shaft, the support protrusion of the adsorber moves around the axis hole as the gap adjusting plate rotates in the gap adjusting hole It is provided with a rotating means for adjusting the interval between the adsorber.

The gap adjusting holes are formed to extend upwardly to one side and downwardly to the other side with respect to the shaft hole at the position where the support protrusions are fitted.

In addition, the rotation means is provided with a rod coupled to the one end of the end of the gap adjustment plate and a piston of the cylinder coupled to the mounting table, the front and rear drive means includes a front and rear drive plate is installed, the vertical drive means, Up and down drive means is installed on one side of the front and rear drive plate and the vertical drive motor for generating power; It is driven by the vertical drive motor, the front and rear drive plate is supported at both ends, and one side includes a timing belt coupled to the vertical drive plate.

And the vertical drive means is characterized in that it comprises a spring coupled to one end of the front and rear drive plate, the other end is coupled to the vertical drive plate.

Hereinafter, one preferred embodiment according to the present invention will be described in detail with reference to the drawings.

The semiconductor device inspector according to the present invention includes a transfer device for absorbing the semiconductor device seated on the customer tray and transporting the semiconductor device to the test tray. This conveying apparatus is for adsorbing and conveying a semiconductor element in three directions of X, Y, and Z axes.

The transport apparatus installed in the semiconductor device tester according to the present invention for this purpose is classified into a large class and has a mounting table mounted with a plurality of adsorbers stacked sideways. And a vertical drive means for driving the mount up and down, front and rear drive means for driving the mount up and down by the front and rear drive means, and left and right drive means for driving the front and rear drive means from side to side.

First, as shown in FIGS. 1 and 2, the front and rear driving means includes a frame 100 having an intermediate portion extending from the front side to the rear side, a front and rear drive motor 110 installed above the end of the frame 100, and a front and rear drive. Two front and rear drive pulleys 120 disposed up and down to transfer the power of the motor 110, and the front and rear drive belts 130, both ends of which are wound around the front and rear drive pulley 120, the opening of the frame 100 The intermediate portion is provided with a front and rear timing belt 140 extending in the front and rear directions.

And it is provided with a front and rear drive plate 160 placed in the side of the frame 100. The front and rear drive plate 160 has an LM guide 161 coupled to the guide rails 150 formed on the upper and lower surfaces of the frame 100, respectively, on the upper inner surface and the lower inner surface, and the front and rear timing belts in the middle portion. Coupling jaw 162 coupled with the 140 is formed protruding.

On the other hand, the frame 100 is provided with a left and right drive means having a configuration substantially similar to the front and rear drive means, although not shown in the figure. The frame 100 is driven left and right by this left and right driving means.

Next, the upper and lower drive means is wound around the upper and lower drive motor 200 installed on the upper and rear drive plate 160 and the rotary shaft of the upper and lower drive motor 200, the lower end is installed on the lower side of the front and rear drive plate 160 A vertical timing belt 220 wound around a pulley (not shown) is provided.

And it is coupled to the upper and lower timing belt 220, and the upper and lower driving guide 210 is mounted on the inner surface of the upper and lower LM guide 230 is installed on the elevating guide rail 163 formed on the front and rear drive plate 150. . Here, the load applied to the vertical drive motor 200 due to the weight of the vertical drive plate 210 is reduced between the vertical drive plate 210 and the front and rear drive plate 160 to smoothly move up and down the vertical drive plate 210. The upper end is mounted to the bracket 164 installed on the upper and lower driving plate 210, the spring 240 is supported on the front and rear driving plate 160 is installed.

Next, the mounting table 300 is integrally installed at the lower end of the up and down drive plate 210 and is provided as a plate body disposed to be disposed to the side of the plurality of adsorbers 400. And the side of the mounting 300 extends in the transverse direction to the mounting 300 to penetrate through the through holes 412 formed in the adsorber block 410 so that the adsorber blocks 410 to be described later are supported on the mounting 300 The guide shaft 330 is provided.

Here, the adsorber 400 includes an adsorber block 410 for coupling with the aforementioned guide shaft 330 and an adsorption pin 420 provided with a vacuum pressure to allow adsorption to the semiconductor device.

As shown in FIG. 3, the adsorber block 410 of the adsorber 400 is selectively provided by the L guide 430 on the upper or lower side of the inner surface of the guide rail 340 formed above and below the front surface of the mounting table 300. Supported.

That is, if the upper part of one adsorber block 410 is supported by the upper guide rail 340 by the LM guide 430, the other sorbent block 410 installed in contact with the side of the lower LM guide 430 is installed It is supported by the lower guide rail 340. This is also to reduce the number of parts, but more largely to reduce the spacing, that is, the pitch between the adsorber 400.

A support protrusion 411 protruding rearward is formed in the rear center portion of the adsorber block 410, and the inner surface center portion of the mounting table 300 is cut open so that the support protrusion 411 penetrates.

On the other hand, the adsorption unit 400 is mounted on the mounting table 300, the spacing plate 500 to be more precisely matched to the adsorption position and the test position for the semiconductor device by narrowing or widening the interval between them, Rotating means for driving the spacer 500 is installed. Here, a coupling jaw 350 is formed at the rear upper end of the mounting table 300 to protrude downward to allow the central portion of the spacing control plate 500 to be axially coupled.

The gap adjusting plate 500 is formed of a polygonal plate body, the shaft hole 530 is axially coupled to the engaging jaw 350 of the mounting table 300 in the center portion is formed, the center of the shaft hole 530 A plurality of gap adjusting holes 510 are formed to be inclined upwardly to both sides. And the rotating means is coupled to the left end. Here, each gap adjusting hole 510 is longer in length toward the outside with respect to the shaft hole 530.

Next, the rotation means is extended and driven by the cylinder 530 coupled to the bracket 250 provided on the upper and lower driving plate 210 and the cylinder 530, the lower end is formed on the left end of the gap control plate 500 The end of the coupling hole 520 is provided with a piston of the rod 540 axially coupled.

Therefore, when the rod 540 is stretched by the operation of the cylinder 530, the spacing control plate 500 is partially rotated based on the portion coupled to the engaging jaw 350 of the mounting table 300, wherein the adsorber block ( The support protrusion 411 of the 410 slides along the gap adjusting hole 510 so that the gap between the adsorbers 400 is adjusted.

On the other hand, unlike the above-described embodiment, it is possible to increase the number of installation of the adsorber 400 without increasing the size of the gap control plate 500. At this time, by increasing the number of the gap adjusting holes 510 formed in the gap adjusting plate 510, and installing the adsorber 400 before and after the gap adjusting plate 510, the number of installation of the adsorber 400 can be doubled.

Hereinafter, the operation state of the device transfer device of the semiconductor device tester according to the present invention configured as described above will be described.

The semiconductor device inspector according to the present invention first moves the front and rear driving means and the left and right driving means to move to the semiconductor device side in the customer tray which is the vertical driving means. When the vertical drive means is located in the customer tray, the pitch of the absorbers 400 is adjusted to match the pitch by sensing the pitch of the detected elements.

If the pitch adjusting operation between the adsorber 400 at this time will be described in more detail, each of the first adsorber 400, as shown in Figure 5a, if the rod 540 of the cylinder 530 is lowered, likewise Spacer 500 is also rotated in the lowered state. In addition, the support protrusions 411 of the respective adsorber blocks 410 are fitted into the gap adjusting holes 510 of the gap adjusting plate 500.

And all the adsorber 400 is in close contact with each other in the central portion of the spacer 510. That is, the adsorbers 400 located on the left side of the shaft hole 530 of the gap adjusting plate 510 are located at the upper end of the gap adjusting hole 510, and are positioned on the right side of the axis hole 530 of the gap adjusting plate 510. Adsorbers 400 are located in close contact with each other in a state located at the bottom of the gap adjusting hole (510).

When adjusting the pitch of the adsorber 400 in this state, the pitch of each of the adsorber 400 is set to the set pitch interval.

As shown in FIG. 5B, when the cylinder 530 is operated to reduce the rod 540, the gap adjusting plate 500 rotates upward due to the reduction of the rod 540. As the 500 rotates upward, the support protrusions 411 of the adsorber block 410 inserted into each of the gap adjusting holes 510 are slid from each other in the inclined direction while sliding in the respective gap adjusting holes 510. . That is, the adsorbers 400, which are in close contact with the center portion of the gap control plate 500, are opened to the left and right sides to expand the pitch between the respective adsorbers 400.

In this operation, the cylinder 530 is rotated outward with respect to the shaft coupled to the bracket 250 of the up and down driving plate 210.

On the other hand, when the distance between the adsorber 400 is reduced again in the state where the space between the adsorber 400 as described above, the cylinder 530 is operated to extend the length of the rod 540.

At this time, as the length of the rod 540 is extended, the spacer 500 is rotated downward so that the support protrusions 411 of the adsorber block 410, which are coupled to each of the spacer adjusting holes 510, are spaced again. Sliding to the 510 is moved, because of this, each of the adsorber 400 is gathered into the center portion of the spacing plate 500 becomes narrower between each other. And the adjustment of the pitch degree at this time is easily adjusted according to the degree of expansion of the rod 540.

Meanwhile. During the pitch adjustment operation of the adsorber 400, each of the adsorber 400 is guided by the driving guide 430 and the guide shaft 330.

As such, when the pitch of the adsorber 400 is aligned with the adsorption position of the semiconductor device, the up and down driving motor 200 operates to drive the up and down driving plate 210 downward, and the up and down driving plate 210 descends to form an adsorber ( When the positions of the 400 are aligned with the semiconductor device, a vacuum pressure is provided to each of the adsorbers 400 to perform adsorption on the device.

After the adsorption is performed in the adsorber 400, the up and down driving motor 200 is operated in the opposite direction again to restore the up and down driving plate 210, and to the next operation, that is, the test tray side by the front and rear driving means and the left and right driving means. It is to transfer the semiconductor device.

As described above, the gap adjusting device installed in the transfer device of the semiconductor device according to the present invention is implemented by one gap adjusting plate formed of a plate body and a piston for driving the gap adjusting plate.

Here, the spacing plate can be manufactured in a thin plate as long as the strength is maintained, thereby significantly reducing the weight of the device, and the spacing holes are formed to be inclined differently from each other from the center portion of which the length is coupled to the mounting table. Since the curved part is not included, the shape can be easily implemented. In addition, if the number of adsorber is increased, the utilization efficiency of the device is considerably high since the adsorber can be installed in a state in which the adsorbers are arranged in a plural arrangement in front and rear with a gap control plate in between.

Therefore, basically, a plurality of gap adjusting holes in which a gap adjusting plate is formed, and other embodiments in which a part of the other components are modified should be considered to be included in the technical scope of the present invention.

As described above, since the gap adjusting plate installed in the transfer device of the semiconductor device tester according to the present invention is provided with a plate body having a plurality of gap adjusting holes, the weight thereof is light to maintain a stable working state of the device, and also for the gap adjustment. Since the configuration of the device can be formed more simply, there is an effect that the manufacturing efficiency of the device is further improved.

Claims (5)

A plurality of adsorbers arranged laterally to adsorb the semiconductor elements; A mounting table for guiding the adsorber to be slidably moved laterally; Vertical drive means for vertically driving the mounting table; Front and rear drive means for driving the vertical drive means back and forth; An interval adjusting plate having a shaft hole in which an intermediate portion is axially coupled to the mounting table, and a plurality of gap adjusting holes formed to be inclined at a predetermined angle, the support protrusions formed in the adsorber being fitted to be longer in length toward both sides of the shaft hole. ; It is coupled to one side end of the gap adjusting plate is provided to rotate the gap adjusting plate to the shaft hole shaft, the support protrusion of the adsorber moves around the axis hole as the gap adjusting plate rotates in the gap adjusting hole And a rotating means for adjusting the interval between the adsorbers. The semiconductor device inspector of claim 1, wherein the gap adjusting holes extend upwardly at one side and downwardly at the other side at the position where the support protrusions are inserted. The semiconductor device inspector according to claim 1, wherein the rotation means is a piston having a rod coupled to one end of the gap adjusting plate and a cylinder coupled to the mounting table. According to claim 1, wherein the front and rear drive means includes a front and rear drive plate is installed, the vertical drive means, The vertical drive means is installed on one side of the front and rear drive plate and the vertical drive motor for generating power; And a timing belt driven by the vertical drive motor, the both ends being supported by the front and rear driving plates, and having one side coupled to the vertical driving plate. The semiconductor device inspector of claim 4, wherein the vertical driving means includes a spring having one end coupled to the front and rear driving plate and the other end coupled to the vertical driving plate.