KR19980076000A - Pick and place of handler systems for semiconductor device testing and methods of presizing semiconductor devices using them - Google Patents

Abstract

The present invention relates to a pick and place of a handler system for testing semiconductor devices and a presizing method using the same. The present invention relates to a frame member (104) having a pair of sidewall members (105), a lower plate (108) on which a plurality of positioning pins (130) are provided for a device receiving groove of a test tray, and a customer tray. In order to pick up a plurality of housed semiconductor devices 109, a lifting cylinder 107 for elevating the movable portion 114 accommodated in the frame member 104 to the customer tray, and a movable portion for lifting up and down by driving of the lifting cylinder 107. A plurality of vacuum adsorption elevating cylinders 112 connected to the 114 and respectively for elevating a plurality of vacuum adsorbers 111 for adsorbing and picking up the semiconductor device 109 contained in the customer tray 110; In order to presize the plurality of semiconductor devices 109 picked up by the 111, vacuum adsorber alignment means for laterally deploying the vacuum adsorber 111 and vacuum adsorber alignment means It characterized in that it comprises a pre-sizing means for pre-sizing a plurality of semiconductor devices 109 separated from the aligned vacuum adsorber 111.

Description

Pick and place of handler systems for semiconductor device testing and methods of presizing semiconductor devices using the same

The present invention relates to a method of picking and placing and presizing a handler system for testing a semiconductor device, and more particularly, to presizing a plurality of devices by picking them from a loading unit and transferring them to a test head unit. A pick-and-place of a handler system for testing semiconductor devices that can shorten test time and a method of presizing a semiconductor device using the same.

In the electronics industry, it is absolutely necessary to make electronic components such as integrated circuits and semiconductor chips cheaper and smaller, and in order to increase the productivity of such electronic components, one of the methods for reducing the unit cost is the simultaneous large amount of electronic components. Speed up the test by testing

When the device under test is tested in the semiconductor device test handler, the transfer is carried out using a tray containing a plurality of devices under test as one unit. Here, the tray used for input / output by the user side is called a customer tray, while in a semiconductor device, it is a test tray of a standard shape as internal conveyance, and the customer tray at the time of supply and discharge of the device under measurement. The device to be measured is conveyed between and the test tray.

Such an electronic component test system (e.g. IC tester) generates various test signals in response to the test, and automatically transfers the test unit to the test head to the master unit for determining the output signal. It consists of an automatic test handler that classifies the tested parts according to the test results.

1 to 4 show a schematic configuration of the handler system disclosed in U.S. Patent No. 5,307,011 of Advantest, Japan.

1A and 2, the handler 20 consists of a lower cabinet 22 (only a portion of which is shown in FIG. 1A), an intermediate portion 24, and an upper portion 26. The lower cabinet 22 houses cables, power components, and electrical connections that control the function and order of testing operations that are predominantly made in the middle and upper portions 24, 26 of the handler 20.

In FIG. 1A, the magazine input region 28 starting at the left side of the middle portion 24 is immediately adjacent to the magazine output region 30 surrounding the front center and right side of the middle portion 24 of the handler 20. These magazine input and output regions 28, 30 are cassettes or magazines 32 or stockers in which a plurality of customer trays 34 in which semiconductor devices 36 to be tested are arranged by the handlers 20 are stacked and stored. A plurality of stations 31 for receiving). This customer tray magazine 32 and customer tray 34 are shown in exploded perspective view in FIG. 1B and will be described in detail later. In FIG. 1A, only one customer tray magazine 32 located in the magazine input area 28 is shown for ease of understanding, but the various stations of the magazine input and output areas 28, 30 each have a similar magazine 32. Will be suitable for accommodating).

Each of the stations 31 in the magazine output area 30 is equipped with a customer tray lifter 38 for lifting the customer tray 34 stored in each magazine 32 at a suitable time. The magazine input area 28 has one lifter 38. Two magazines in the magazine input area 28 receive a customer tray 34 having a semiconductor device 36 to be tested. The magazine 32 located at each station 31 of the magazine output area 30 receives the customer tray 34 of the semiconductor device 36 that has already been tested and classified according to the test results. Therefore, in the example shown in FIG. 1A, a total of ten stations 31 are shown in the output area 30, the number of which stations is for testing a semiconductor device according to eight different categories, one retest. Station, one empty customer tray station. The number of stations in this magazine output area can be changed according to the designer's intention.

Referring again to the middle portion of the handler 20 shown in FIG. 1A, a transfer arm 40 with two pairs of tray arms 42 is in the magazine output area 30. This transfer arm 40 can be moved laterally and up and down and traverses various sections of the handler 20 to carry out a bulk of the customer tray transport operation associated with the handler 20. This movement of the transfer arm 40 is very intelligently controlled by appropriate software commands from the control module, and the display monitor 44 is located to the right of the middle portion 24 of the handler 20.

The upper portion 26 of the handler 20 includes an upper surface 46 that carries the semiconductor device 36 from the customer tray 34 to the test tray 48 and vice versa. The loader region 50 starting from the left side of the upper surface 46 includes loader catchers 52, customer tray buffers 54, and dual load stages 56a and 56b arranged side by side on the upper surface. After the tested semiconductor devices 36 have been tested, an unloader 60 that handles the sorted semiconductor devices 36 is located just to the right of the loader region 50. The unloader 60 includes two pairs of side-by-side unloader stages: unload stages 62a and 62b located on the left side of the upper surface and unload stages 64a and 64b located on the right side. At the rightmost side of the top surface 46 is an empty customer tray buffer.

A soak chamber 68 is located to the left of the middle portion 24 of the handler 20 and extends just above the upper surface 46. The penetration chamber 68 receives the test tray 48 from the upper surface 46, and the test tray 48 receives the semiconductor device 36 to be tested from the presizer 70, which in turn is loaded into the loader region 50. The semiconductor device 36 is received from the positioned load stages 56a and 56b. The semiconductor devices 36 are transported from the load stages 56a and 56b to the presizers 70 by means of a load pick and place 72 that carries directly over the top surface 46 of the handler 20 and the test tray. Is carried at 48.

A pair of unload pick and place mechanisms including a left unload pick and place 74 and a right pick and place 76 are located just to the right of the pick and place 72. The unload pick and place 74, 76 classifies the semiconductor device 36 according to the test results, and the unload stage 62, for continuous transport to the appropriate category magazine stored in the magazine output area 30 directly below. The semiconductor device 36 is positioned at 64. The test tray 48 containing the tested semiconductor device 36 reaches the unload pick and place 74, 76 from an unsoak chamber 78 located to the rear right of the handler 20.

Referring to FIG. 2, the infiltration chamber 68 (located on the right in FIG. 2) receives the test tray 48 from the upper surface 46 of the handler 20, which is handled by the lifter means 80. And gradually descends to the lower surface 82 of the middle portion 24. The purpose of the infiltration chamber 68 is to prepare for testing the semiconductor device 36 by placing the semiconductor device 36 in a suitable temperature and pressure environment. Thereafter, each test tray 48 is transported through test head chambers 84a and b for the necessary testing of each semiconductor device 36. The test tray 48 then enters a non-invasive chamber 78 (located on the right side of FIG. 2) which is gradually raised during return to atmospheric conditions. By exiting the non-invasive chamber 78, each test tray 48 is sorted by two unload pick and place 74, 76.

The test sequence of the handler is shown schematically in FIG. 3. In FIG. 3, only one device is shown, although many semiconductor devices are conveniently and efficiently tested in accordance with the present invention. The magazine 32 containing the plurality of customer trays 34 in which the semiconductor device 36 to be tested is placed is first loaded into the magazine input area 28. A lifter 38 in the input area 28 pushes the customer tray 34 until the top customer tray 34 is raised above the magazine 32. Then, the catcher 52 of the load region 50 is lowered to hold the customer tray 34 having the semiconductor device 36 to be tested.

The catcher 52 carries the customer tray 34 to the buffer 54 waiting for the turn of the catcher 52 by one of the load stages 56a, b. The transfer arm 40 shown in FIG. 1A is used to carry the customer tray 34 from the buffer 54 to one of the load stages 56a, b. The pick and place 72 picks up the semiconductor device 36 by vacuum suction, and precisely positions the semiconductor device 36 with respect to the handler 20, more specifically with respect to the test tray 48. Locate it at 70). Pick and place 72 then picks up semiconductor device 36 again from presizer 70 and correctly places semiconductor device 36 on test tray 48.

Subsequent to the removal of all semiconductor devices 36 to be tested by the pick and place 72, empty customer trays are removed from the load stages 56a, b, and the empty magazine station 31, preferably the magazine output area ( 30 is located in the rightmost customer tray buffer 66 located at the rightmost side or at the rightmost side of the unload area 60. This movement and transport is done by the transfer arm 40.

The test tray 48 is then conveyed to the infiltration chamber 68 which undergoes environmental adaptation. The test tray 48 is then conveyed to the dual test head chambers 84a, b, which are actually tested, ascended through the non-invasive chamber 78, and are extracted from the non-invasive chamber 78 under atmospheric conditions. . The handler 20 then carries the test tray 48 to a position where it can classify approximately one-half of the tested semiconductor devices 36 and moves the semiconductor device 36 to the unload stage 64a or 64b. To place. If the problematic semiconductor devices 36 are not classified by the unload pick and place 76, then the test tray 48 is classified by all of the remaining semiconductor devices 36 by the unload pick and place 74. It is carried by the unload pick and place 74 to a position disposed in two anchor stages 62a or 62b.

At each unload stage 62, 64 the customer tray 34 waits to receive the semiconductor devices classified according to the result and the required classification category. When the customer tray 34 is no longer fully or no longer needed for sorting purposes, the transfer arm 40 moves the customer tray 34 from the unload stages 62 and 64, thereby leaving the magazine output area 30 in the magazine output area 30. It is placed in the sorting magazine 32 located just below the upper surface 46 of the handler 20.

This process is such that the current empty test tray 48 continues below the pick and place 72 to leave the position under the unload pick and place 74 on the left and receive the semiconductor device 36 to be tested. Go to.

However, the conventional handler system as described above, after pick-and-place picks up and picks up the semiconductor device and positions the semiconductor device in the presizer to accurately position the semiconductor device with respect to the test tray, Since the semiconductor device is picked up again and the semiconductor device is accurately positioned on the test tray, there is a problem that a large tack time is required.

Accordingly, an object of the present invention is to provide a pick and place of a handler system for testing a semiconductor device having a structure capable of picking up a semiconductor device from a customer tray as well as presizing the picked up semiconductor device to reduce tack time. have.

It is still another object of the present invention to provide a presizing method for testing a semiconductor device capable of picking up a semiconductor device from a customer tray as well as presizing the picked up semiconductor device to reduce tack time.

1A is a schematic perspective view of a handler system for testing a conventional semiconductor device.

FIG. 1B is a perspective view showing the relationship between the magazine and the lifter of the handler system shown in FIG. 1A. FIG.

FIG. 2 is a rear view of the handler system shown in FIG. 1A. FIG.

FIG. 3 is a flowchart schematically illustrating a test process of a semiconductor device by the handler system shown in FIG. 1A; FIG.

4 is a plan view of the conventional handler system shown in FIG.

5 is a perspective view of a pick and place of a handler system for testing semiconductor devices in accordance with the present invention.

FIG. 6 is a front view of a pick and place of a handler system for testing semiconductor devices according to the invention shown in FIG. 5; FIG.

7 is a plan view schematically showing when the pick-and-place deployment member of the handler system for testing a semiconductor device according to the present invention is extended;

8 is a plan view schematically showing when the pick-and-place deployment member of the handler system for testing a semiconductor device according to the present invention is retracted;

9 is a perspective view showing a state in which a semiconductor device adsorbed to a vacuum adsorber falls on a picker and a placer of a handler system for testing a semiconductor device according to the present invention.

Explanation of symbols on the main parts of the drawings

100: pick and place 101: X axis support

102: guide rail 103: guider

104 frame member 105 sidewall member

106: connecting member 107: lifting cylinder

109: lower plate 110: customer tray

111: vacuum adsorber 112: vacuum adsorber lifting cylinder

114: movable portion 117: bracket

121: deployment member 122: expansion cylinder

127: guide bar 130: positioning pin

131: support plate 132: cam roller

133: movable member 136: presizing cylinder

137: Presizing Home 138: Presizer

The object as described above comprises: a frame member having a pair of side wall members and a lower plate on which a plurality of positioning pins for the device receiving grooves of the test tray are installed; An elevating cylinder for elevating the movable portion accommodated in the frame member to the customer tray to pick up a plurality of semiconductor devices housed in the customer tray; A plurality of vacuum adsorption lift cylinders connected to the movable portion to move up and down by driving the lift cylinder, and for lifting and lowering a plurality of vacuum adsorbers respectively for picking up and picking up a semiconductor device accommodated in the customer tray; Vacuum adsorber alignment means for laterally deploying the vacuum adsorber for presizing a plurality of semiconductor devices picked up in the vacuum adsorber; Presizing means for presizing a plurality of semiconductor devices separated from the vacuum adsorber aligned by the vacuum adsorber alignment means. The pick and place of a handler system for testing a semiconductor device according to an aspect of the present invention. Is achieved.

Alternatively, an object as described above may include: adsorbing a semiconductor device by descending to a customer tray to pick up a semiconductor device housed in a customer tray and lowering a plurality of vacuum adsorber to the semiconductor device housed in the customer tray; After elevating the vacuum adsorber, elevating and returning to its original position; Narrowing the presizer provided at the bottom of the vacuum adsorber to a predetermined distance to move to the test tray and simultaneously deploy the vacuum adsorber laterally to presize the semiconductor device adsorbed to the vacuum adsorber; Blowing air to the presizer narrowed to a predetermined distance so as to drop the semiconductor device separated from the vacuum adsorber; When the test tray is reached, the vacuum adsorber picks up the semiconductor device from the presizer and is raised to its original position, and after opening the presizer, the semiconductor device is placed in the test tray. It is achieved by a presizing method for testing a semiconductor device according to another aspect of the invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

5 is a perspective view of a pick and place of a handler system for testing a semiconductor device according to the present invention, and FIG. 6 is a front view of a pick and place of a handler system for testing a semiconductor device according to the present invention shown in FIG. 5.

As shown in FIG. 5, the pick and place 100 of the handler system for testing a semiconductor device according to the present invention may be driven with an XY axis, and such an X axis drive (Y axis drive system is not shown in the figure). Is a timing belt (not shown) in which a guider 103 moving along a guide rail 102 installed in the X-axis support 101 as shown in FIG. 5 is driven by driving of an X-axis driving motor (not shown). Is connected to). The guider 103 is connected to the Y-axis drive unit by the connecting member 106, so that the pick and place 100 can be X-Y-axis drive.

The frame member 104 is connected to the lower portion of the connecting member 106, and a lifting cylinder 107 (hereinafter referred to as a first cylinder) for driving the frame member 104 is installed on the front surface of the frame member 104. One side portion of the lifting cylinder 107 is formed with an incision 115 through which the piston 107a penetrates, and the piston 107a of the elevating cylinder 107 penetrates the incision 115 to form a frame. A plate-shaped bracket 114 disposed in the member 104 is connected, and a shock absorbing spring 113 is installed between the bracket 114 and the piston 107a, and the shock absorbing spring 113 is the first cylinder 107. Absorb shock generated during the operation of raising and lowering. A pair of side wall members 105 are installed on both sides of the frame member 104 by fastening members such as screws, and the lower plate 108 has a plurality of positioning pins 130 for the device receiving grooves of the test tray. Is installed.

A pair of downward supporters 117 is installed below the bracket 116, and the brackets 116 are connected to the movable part 114 through the supporters 117. Therefore, since the operating force of the first cylinder 107 is transmitted through the bracket 116 and the support 117, the movable portion 114 is elevated by the operation of the first cylinder 107, and the movable portion 114 of the movable portion 114 The lifting motion lifts and lowers a plurality of vacuum adsorption lift cylinders 112 (hereinafter referred to as second cylinders) provided in the movable portion 114.

The second cylinder 112 is a plurality of numbers (number of semiconductor devices 109 housed in the customer tray 110 and adsorbed at one time), respectively, for picking up and picking up the semiconductor device 109 housed in the customer tray 110. The vacuum adsorber 111 is raised and lowered. The vacuum adsorber 111 is installed on a plurality of pairs of vacuum adsorber supports 118 which are alternately arranged alternately with each other, and the second cylinder 112 is respectively installed on the side of the vacuum adsorber support 118, so that the vacuum adsorber ( Elevate 111).

An upper portion of each of the alternately arranged vacuum adsorber supports 118 is connected to the deployment member 121 as shown in FIGS. 6 to 9, and the deployment members 121 are pivotally connected to each other. It is composed of a link 119 has a zigzag shape to stretch. The deployment member 121 is stretched in length by the operation of the expansion and contraction cylinder 122 located in the middle portion.

Referring to the drawings, the expansion and contraction of the expansion member 121 will be described in more detail. A connecting piece 124 is provided at the end of the piston 122a of the expanding cylinder 122, and the connecting piece 124 is a movable part 114. It is connected to the pin 123 provided in the middle portion of the deployment member 121 through the long hole 125 formed in the). The upper part of the vacuum adsorber support 118 alternately at the point 120a at which the links 119 constituting the deployment member 121 intersect each other, that is, the four vacuum adsorber supports 118 in front and the vacuum adsorber in the rear. Support 118 is connected alternately. The deployment member 121 is pulled together by one tension spring 126 for each link 119 to which the two vacuum adsorber supports 118 are connected, thereby preventing flow.

The deployment member 121 is connected to the expansion and contraction cylinder 122 by a bracket 124 connected to the piston 122a of the expansion and contraction cylinder 122 as described above, the deployment member 121 is the center of the movable portion 114 It is connected to a pair of rollers 129 respectively accommodated in the guide grooves 128 formed in the lower portion, and the stretching movement is facilitated by the lateral movement of the roller 129.

Therefore, when the piston 122a of the expansion and contraction cylinder 122 is advanced, the deployment member 121 connected to the piston 122a is extended by the length of the long hole 125, as shown in FIG. The pair of rollers 129 are guided along the sidewall of the guide groove 128. By elongation of this deployment member 121, the vacuum adsorber support 118 supporting the vacuum adsorber 111 is developed in both sides along the guide bar 127. In addition, when the piston 122a of the expansion and contraction cylinder 122 retreats while the vacuum adsorber support 118 is deployed, the deployment member 121 connected with the piston 122a is contracted as shown in FIG. 8. By the contraction of the deployment member 121, the vacuum adsorber support 118 supporting the vacuum adsorber 111 is narrowed along the guide bar 127.

According to the pick and place of the handler system for testing a semiconductor device according to the present invention, a plurality of semiconductor devices 109 picked up by the pick and place 100 in the lower portion of the frame member 104 are transferred to the test tray. Presizing means for sizing are provided.

As shown in the figure, such presizing means is slidably installed along guide rails 140 provided on support plates 131 respectively provided on both side wall members 105 of the frame member 104, and a cam is provided. A pair of movable members 133 each having a roller 132, a presizing cylinder 136 installed to move the support plate 131 up and down relative to the frame member 104, and a movable member 133. It has a camming surface 135 for cam motion with the cam rollers 132, and is connected to the cam member 134 which is installed in each support plate 131, and the lower part of the movable member 133, and is movable. The operation of the member 133 slides in a pair of grooves 139 (shown in FIG. 6) formed under each of the support plates 131, and the plurality of presizing grooves 137 at positions corresponding to the positioning pins 130. ) Is formed a presizer 138 is formed.

As shown in FIG. 9, the presizing groove 137 preferably has side surfaces 142 that are inclined at a predetermined angle so that the semiconductor device 109 can be easily accommodated in the presizing groove 137. Can be.

The presizer 138 is formed of a pair of plate-shaped rod members in which a plurality of presizing grooves 137 are formed, and the camming surface 135 of the cam member 134 has a narrow width portion at the top and a wide width at the bottom. The upper width is sized so that the semiconductor device 109 can be placed in a presizing groove 137 formed in the pair of rod members when the rod members of the presizer 138 approach each other.

Since the support plate 131 is driven up and down with respect to the frame member 104 by the operation of the presizing cylinder 136, the cam member 134 provided in the support plate 131 moves up and down. As shown in FIG. 1A, the movable members 133 on both sides having the cam rollers 132 in contact with the camming surface 135 of the cam member 134 and cam movement along the camming surface 135 are tensioned. By being pressed against each other by the spring 141 toward the camming surface 135, the reciprocating motion is performed toward or away from each other according to the shape of the camming surface 135 of the cam member 134.

Therefore, the presizer 138 connected to the lower portion of the movable member 133 approaches the size for accommodating the semiconductor device 109 according to the reciprocating movement of the movable member 133 or the size for the semiconductor device 109 to pass through. Away.

Referring to the operation of the pick and place of the handler system for testing a semiconductor device according to the present invention having the configuration as described above is as follows.

First, the pick and place 100 operates the first cylinder 107 to pick up the semiconductor device 109 accommodated in the customer tray 110 at the pickup position of the semiconductor device 109. The movable part 114 which supports the vacuum adsorber 111 is lowered. At this time, the deployment member 121 is in a contracted state so as to match the width of the vacuum adsorber 111 to the same width as the width of the semiconductor device 109 accommodated in the customer tray 110, and in this state, the second The cylinder 112 operates to lower the vacuum adsorber 111 to the top of the semiconductor device 109.

The vacuum adsorber 111 picks up the semiconductor device 109 accommodated in the customer tray 110 using the vacuum in a state of being lowered to the upper portion directly above the semiconductor device 109, and operates the second cylinder 112. Is raised. When the vacuum adsorber 111 is raised, the first cylinder 107 raises the movable part 114 supporting the vacuum adsorber 111 to its original position so as to raise the vacuum adsorber 111 that picked up the semiconductor device 109. Is operated.

When the semiconductor device 109 is picked up by the vacuum adsorber 111 and raised to a predetermined position, the pick and place 100 moves from the customer tray 110 along the Y axis to the test tray. While moving to the test tray, the expansion and contraction cylinder 122 operates the deploying member 121 to laterally deploy the vacuum absorber support 118 connected to the deploying member 121, so that the vacuum absorber 111 deploys. It is developed laterally by the operation of the member 121. When the deploying member 121 is deployed laterally, the vacuum adsorber 111 is positioned with a plurality of presizing grooves 137 having positions of the plurality of semiconductor devices 109 picked up in the presizer 138 respectively. At the same time, the presizing cylinder 136 is operated to lower the cam member 134 installed on the support plate 131.

By the lowering of the cam member 134, the cam rollers 132 of the pair of movable members 133, which are in contact with both sides of the camming surface 135 of the cam member 134 and cam-move, are moved by the camming surface 135. Rolled along the upper width, the pair of movable members 133 are brought closer to each other by the tension spring 141. By the approach movement of the movable member 133, the presizers 138 respectively connected to the lower portion of the movable member 133 also approach each other at a predetermined distance.

When the presizer 138 approaches a predetermined distance, the vacuum adsorber 111 is lowered by the operation of the second cylinder 112, and the semiconductor device 109 picked up by the vacuum adsorber 111 is precyed. When the low 138 presizing groove 137 is reached, the vacuum adsorber 111 instantaneously blocks vacuum adsorption and blows out air so that the semiconductor device 109 has a side surface having a predetermined inclined surface ( It correctly falls into the presizing groove 137 along 142. By this operation, the presizing operation of the plurality of semiconductor devices 109 to be tested in the test tray is completed.

When the pick and place 100 reaches the test tray, the vacuum adsorber 111 causes the semiconductor device 109 to be placed in the presizer 138 by the operation of the second cylinder 112. Picked up again, the second cylinder 112 is raised to its original position, and the presizer 138 is opened to a predetermined distance by the operation of the presizing cylinder 136.

After the presizer 138 is opened to a predetermined distance by the operation of the presizing cylinder 136, the vacuum adsorber 111 is lowered to the test tray by the operation of the second cylinder 112, and the semiconductor device 109 is lowered. After the air is blown so as to settle in the receiving grooves formed in the test tray, respectively, the air is returned to its initial state and returned to the position of the customer tray 110.

As described above, according to the present invention, in the handler system for testing a semiconductor device, the presizing is completed at the pick and place while pick and place picks up the semiconductor device from the customer tray and transports the test device to the test tray. Compared to conventional handler systems that presizing at presizers positioned between them while moving to the tray and test tray, the tack time can be reduced by approximately 20%.

Claims (9)

A frame member having a pair of side wall members and a lower plate on which a plurality of positioning pins for the device receiving grooves of the test tray are installed; An elevating cylinder for elevating the movable portion contained in the frame member to the customer tray to pick up a plurality of semiconductor devices housed in the customer tray; A plurality of vacuum adsorption lift cylinders connected to the movable portion to move up and down by driving the lift cylinder, and for lifting and lowering a plurality of vacuum adsorbers respectively for picking up and picking up a semiconductor device accommodated in the customer tray; Vacuum adsorber alignment means for laterally deploying the vacuum adsorber for presizing a plurality of semiconductor devices picked up in the vacuum adsorber; And presizing means for presizing a plurality of semiconductor devices separated from the vacuum adsorber aligned by the vacuum adsorber alignment means. 2. The vacuum adsorber alignment means according to claim 1, further comprising: a plurality of pairs of vacuum adsorber supports, on which respective vacuum adsorbers are installed, alternately arranged alternately with each other; A deployment member arranged alternately to support each of the alternately arranged vacuum adsorber supports at each intersection point, having a zigzag shape, and comprising a plurality of pairs of links pivotally connected to each other at a connection point; A deployment member telescopic cylinder positioned at an intermediate portion of the deployment member and operative to stretch the deployment member; A plurality of tension springs installed on each pair of links to pull the pair of links of the deployment member to each other, thereby preventing the flow of the deployment member; And a guide bar for guiding the stretching movement of the vacuum adsorber support stretched and contracted by the expansion cylinder. According to claim 2, wherein the deployment member is connected to the expansion cylinder through a bracket and a pin connected to the piston of the expansion cylinder, the deployment member is a pair of rollers each received in a groove formed in the lower center of the movable portion Pick-and-place of the handler system for testing a semiconductor device, characterized in that the lateral movement is guided by. 2. The apparatus according to claim 1, wherein the presizing means comprises: a pair of movable members slidably installed along guide rails provided on support plates respectively provided on both side wall members of the frame member; A presizing cylinder installed to support the lifting members relative to the frame member; A cam member having a narrow width of an upper portion and a wide width of a lower portion of the cam roller to be cam-moved with the cam rollers provided on the movable member, the cam member being provided on the support plate; A plurality of presizing grooves are connected to the movable members so as to be movable by the movable members, and slide in a pair of grooves formed under each of the support plates by the operation of the movable members. A pick and place of a handler system for testing semiconductor devices, comprising a presizer formed. 5. The pick and place of a handler system of claim 4, wherein the cam rollers are pressed against the camming surface of the cam member by pulling the movable members together by a tension spring. 5. The pick and place of claim 4, wherein the presizer comprises a pair of plate-shaped rod members each having a plurality of presizing grooves formed therein. The semiconductor device according to claim 6, wherein the upper width of the cam surface of the cam member is sized so that the semiconductor device is placed in a presizing groove formed in the pair of rod members when the rod members approach each other. Pick and place of test handler system. 7. The pick and place of claim 6, wherein the presizing groove has a side surface that is inclined at a predetermined angle. Descending to the customer tray to pick up the semiconductor device housed in the customer tray, and lowering the plurality of vacuum adsorber to the semiconductor device housed in the customer tray to adsorb the semiconductor device; After elevating the vacuum adsorber, elevating and returning to its original position; Narrowing the presizer provided at the bottom of the vacuum adsorber to a predetermined distance to move to the test tray and simultaneously deploy the vacuum adsorber laterally to presize the semiconductor device adsorbed to the vacuum adsorber; Blowing air to the presizer narrowed to a predetermined distance so as to drop the semiconductor device separated from the vacuum adsorber; When the test tray is reached, the vacuum adsorber picks up the semiconductor device from the presizer and is raised to its original position, and after spreading the presizer, placing the semiconductor device in the test tray. Presizing Method for Testing