KR100362506B1 - Screen for marking a reject unit of circuit board of matrix type - Google Patents

Abstract

The present invention relates to a screen for marking a defective unit of a matrix circuit board, comprising: a frame having a window having a window formed at a position corresponding to a unit of the circuit board, the frame having a substantially rectangular shape so that the defect mark is accurately displayed only on the defective unit; In the frame, a plurality of partition walls have a horizontal column and a vertical column to cross each other, so that a window of a predetermined space is formed between the partition walls, wherein the window includes a sub screen formed at a position corresponding to the unit of the matrix circuit board. In this case, it is possible to perform the display of the defect mark on the surface of the encapsulation portion formed after the encapsulation process of the matrix circuit board inside the window.

Description

Screen for marking a reject unit of circuit board of matrix type

The present invention relates to a screen for marking a defective unit of a matrix circuit board, and more particularly, a screen having a window formed at a position corresponding to a unit of a circuit board so that a defect mark is accurately displayed only on a defective unit. It is about.

In the semiconductor package manufacturing field, a circuit board is a glass fiber reinforced thermosetting composite (resin layer), a resin film or a tape, and a sandwich using a conductive wiring pattern. It means what laminated in the form.

Circuit boards of this type are usually manufactured in so-called strip units by connecting a number of units in which one semiconductor package is produced in a row. In recent years, as semiconductor chips and the like become smaller in size, the units are arranged in rows and columns. Matrix circuit boards arranged in a checkerboard shape are mainly manufactured.

A schematic planar structure of the matrix circuit board 10 as described above is illustrated in FIG. 1A, and a conventional structure will be briefly described as follows.

An approximately rectangular (or square) frame 11 is provided as the resin layer, and a plurality of sub-matrix 12 is connected to the inside of the frame 11 at the boundary of the slot 18. Here, the cluster of the plurality of sub-matrix 12 will be defined as the main matrix.

Each of the sub-matrix 12 is arranged in a plurality of units 14 rows and columns in which one semiconductor package is produced. In FIG. 1A, 25 units 14 are formed in one sub-matrix 12. . That is, 25 semiconductor packages can be manufactured in one sub-matrix 12.

Although not shown in detail, each unit 14 is provided with a semiconductor chip mounting portion, and a conductive wiring pattern is formed radially on the outer periphery of the semiconductor chip mounting portion, which is connected to an input / output pad and a connecting means of the semiconductor chip. One unit 14 is formed, including a bond finger, a conductive via hole for changing an electrical path to the other surface, a ball land connected to the via hole, and a conductive ball fused thereto.

On the other hand, the frame 11 is formed with a plurality of holes 15 to perform the role of loading or fixing the circuit board 10 during the manufacturing process, one side of the frame 11 of the unit 14 The marking unit 16 for displaying the defective unit provided with the display unit 17 is formed in the number corresponding to the number.

That is, as shown in FIG. 1A, since there are a total of 25 units 14 in the sub-matrix 12, a total of 25 display units 17 are formed in the marking unit 16.

In the circuit board 10, a semiconductor chip is mounted on each unit 14 of the sub-matrix 12, and after the electrical connection is performed, the entire sub-matrix 12 is normally encapsulated with an encapsulant so that an approximately square encapsulation is performed. A portion 13 is formed (see Fig. 1B).

After the encapsulation portion 13 is formed as described above, each unit 14 of the sub-matrix 12 and its boundary are covered by the encapsulation portion 13 and are in a state not visible from the outside.

In addition, after the encapsulation process as described above, a plurality of conductive balls are fused to the back surface of the circuit board 10, and then the circuit board 10 is subjected to a singulation process so that each unit 14 is separated into an independent semiconductor package. Is committed. That is, by sawing the boundary area of each unit 14 covered by the sealing part 13, it isolate | separates into individual semiconductor packages.

On the other hand, after the sealing process as described above, since there is a bad unit 14 of the unit 14 of the circuit board 10, the defect mark 20 is displayed so that the operator or equipment can detect this.

That is, the circuit board 10 causes defects in the plurality of units 14 during the manufacturing process of the circuit board 10 itself or the semiconductor packaging process, and each time the frame 11 of the circuit board 10 is damaged. The predetermined display unit 17 of the marking portion 16 provided in the) is marked as defective. For example, a black pen is written in black on the display unit 17 corresponding to the unit 14.

However, since the display unit 17 cannot be used in each semiconductor package that is separated after the singulation process, as shown in FIG. The defective display mark 20 is formed in the unit. That is, the worker marks the defect mark 20 of approximately "X" shape on the surface of the unit 14 (that is, the surface of the encapsulation portion 13) corresponding to that indicated on the frame 11.

However, since the actual mark 14 is not visible, such a bad mark is performed by the operator with an approximate eyeball or guess, and thus the accuracy is very low. In addition, due to the illusion of the operator, the bad unit is not a good unit. ), There is a disadvantage that it is easy to commit an error of displaying the defective mark 20.

In addition, the display of the defective mark 20 manually performed by an operator is easy to inking to the good unit outside the range of the defective unit, so that the defective mark remains on the surface of the good semiconductor package after the singulation process. It is a cause of degrading a commercial property.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and has a screen having a window formed at a position corresponding to a unit of a circuit board to provide a screen in which a defect mark is accurately displayed only in a defective unit. .

FIG. 1A is a plan view showing a conventional matrix circuit board, and FIG. 1B is a plan view showing a state in which a defective unit is marked after the sealing process.

Fig. 2A is a plan view showing a defective unit marking screen according to the present invention, and Fig. 2B is a plan view showing a state in which a defective unit is marked using the screen.

-Description of the main symbols in the drawings-

100; Screen 101 according to the present invention; frame

102; Sub screen 103; septum

104; window

10; Circuit board 11; frame

12; Submatrix 13; Encapsulation

14; Unit 15; hall

16; Marking part 17; Display unit

18; Slot 20; Bad mark

In order to achieve the above object, the screen according to the present invention includes a frame having an approximately rectangular shape; A window having a plurality of partition walls arranged horizontally and vertically in the frame to cross each other, such that a predetermined space is provided at a position corresponding to each unit of the matrix circuit board; The plurality of windows are clustered to include a sub-screen formed in a size corresponding to the sub-matrix of the matrix circuit board, and the display of the defect mark on the surface of the sealing portion formed after the encapsulation process of the matrix circuit board is performed inside the window. It is characterized by being able to.

Here, the sub screen may be further connected to form a main screen so as to have the same shape as the main matrix of the matrix circuit board.

According to the screen for defective unit marking of the matrix circuit board according to the present invention as described above, a window surrounded by a partition wall is formed at a position corresponding to the unit of the matrix circuit board, whereby the boundary of the unit is found on the surface of the encapsulation unit. Therefore, there is an advantage that the defect mark can be accurately displayed only on the defective unit of the circuit board.

In addition, since the window is surrounded by the partition wall, it is possible to prevent the bad mark display from being displayed even in the adjacent good unit, thereby improving the marketability of the semiconductor package.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

Figure 2a is a plan view showing a screen 100 for defective unit marking according to the present invention.

As shown in the drawing, a substantially rectangular (or square) frame 101 is provided, and a plurality of sub screens 102 are provided inside the frame 101.

In the sub-screen 102, a plurality of partitions 103 have horizontal and vertical columns intersecting with each other, such that a window 104 of a predetermined space is formed between the partitions 103, and the windows 104 are formed in a matrix. It is formed at a position corresponding to the unit 14 of the type circuit board 10, respectively. That is, the partition 103 is formed to correspond to the boundary area between the units 14 of the circuit board 10.

In addition, a plurality of sub screens 102 are further connected inside the frame 101, and the plurality of sub screens 102 may be defined as a main screen.

In short, the screen 100 is formed so as to match the length, width of the matrix circuit board 10 to be used, and the forming position of each unit 14.

Accordingly, the screen 100 is formed for each type of the matrix circuit board 10. That is, the circuit board 10 may be formed in a different number and size of the unit 14, the window 100 is also very different depending on the number and size of the window 104 of the unit (14). It can be formed in various kinds.

FIG. 2B is a plan view illustrating a state in which a defective unit is marked by using the screen 100, and a method of displaying a defective mark on the defective unit will be described briefly using the screen 100.

As illustrated, a circuit having a screen 100 having a window 104 formed at a position corresponding to each unit 14 of the matrix circuit board 10, and the screen 100 having a sealing portion 13 formed therein. It is located on the upper surface of the substrate 10. At this time, by matching the position of the sub-matrix 12 of the circuit board 10 with the position of the sub-screen 102 of the screen 100, the unit 14 of the circuit board 10 and the screen 100 are automatically Each window 104 is matched.

Subsequently, the unit 14 of the circuit board 10 corresponding to that in which the display unit 17 becomes black (other colors are possible) in the marking unit 16 for displaying the defective unit 14 of the circuit board 10 is removed. The defect mark is displayed on this unit 14 (the surface of the sealing part 13). In this case, the defective unit 14 of the circuit board 10 is located inside the window 104 of the screen 100 and is surrounded by the partition 103, so that the defective mark is surrounded by the partition 103. It is formed only inside the window 104. Therefore, the defect mark does not invade adjacent adjacent good units, and the partition 104 separates the window 104, so that the unit 14 of the circuit board 10 can be easily distinguished. There is this.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the screen for defective unit marking of the matrix circuit board according to the present invention, a window surrounded by partition walls is formed at a position corresponding to the unit of the matrix circuit board, whereby the boundary of the unit can be found on the surface of the encapsulation unit. Therefore, there is an effect that the defect mark can be accurately displayed only on the defective unit of the circuit board.

In addition, since the window is enclosed by the partition wall, the bad mark display is not displayed on the adjacent good unit, and thus, the marketability of the semiconductor package can be improved.

Claims (2)

An approximately square frame; A window having a plurality of partition walls arranged horizontally and vertically in the frame to cross each other, such that a predetermined space is provided at a position corresponding to each unit of the matrix circuit board; Comprising the plurality of windows comprises a sub-screen is formed in a size corresponding to the sub-matrix of the matrix circuit board, Screen for defective unit marking of the matrix circuit board, characterized in that the display of the defect mark on the surface of the sealing portion formed after the sealing process of the matrix circuit board can be performed inside the window. The defective unit marking screen of claim 1, wherein a plurality of the sub screens are further connected to form a main screen so as to have the same shape as the main matrix of the matrix circuit board.