KR100344637B1 - Saw duplexer - Google Patents
Saw duplexer Download PDFInfo
- Publication number
- KR100344637B1 KR100344637B1 KR1020000077950A KR20000077950A KR100344637B1 KR 100344637 B1 KR100344637 B1 KR 100344637B1 KR 1020000077950 A KR1020000077950 A KR 1020000077950A KR 20000077950 A KR20000077950 A KR 20000077950A KR 100344637 B1 KR100344637 B1 KR 100344637B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- saw
- cavities
- stacked
- matching circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
Abstract
PURPOSE: A saw duplexer is provided to increase a space usage in a package by forming a matching circuit of a multi-layer structure so as to have a structure such as an LC equivalent circuit. CONSTITUTION: A ground pattern(43) is formed on the first layer, and the second layer is placed on the first layer. Inductor and capacitor patterns(44) are stacked on the second layer with a multi-layer structure, and patterns on respective layers are connected to each other via through holes so as to form an LC matching circuit of a saw filter. Two cavities where a saw filter is inserted are formed on the third layer, which is stacked on the second layer. The first and second saw filters of different pass bands are inserted in the cavities of the third layer. Formed on the fourth layer is a bonding pad and a pattern for connecting input/output terminals of the saw filters to a ground, a transmission side, a receive side or an antenna terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000077950A KR100344637B1 (en) | 2000-12-18 | 2000-12-18 | Saw duplexer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000077950A KR100344637B1 (en) | 2000-12-18 | 2000-12-18 | Saw duplexer |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100344637B1 true KR100344637B1 (en) | 2002-07-25 |
Family
ID=37488532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000077950A KR100344637B1 (en) | 2000-12-18 | 2000-12-18 | Saw duplexer |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100344637B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040011728A (en) * | 2002-07-30 | 2004-02-11 | 엘지이노텍 주식회사 | Duplexer chip package and methode for manufacturing duplexer chip package |
KR20040100395A (en) * | 2003-05-22 | 2004-12-02 | 주식회사 에이엔티 | The fbar bandpass filter and duplexer using ltcc layer coupling |
KR100574533B1 (en) * | 2002-07-30 | 2006-04-27 | 엘지이노텍 주식회사 | METHOD FOR MANUFACTURING Front End Module CHIP |
KR100579137B1 (en) | 2004-12-10 | 2006-05-12 | 한국전자통신연구원 | Transceiver module using ltcc |
-
2000
- 2000-12-18 KR KR1020000077950A patent/KR100344637B1/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040011728A (en) * | 2002-07-30 | 2004-02-11 | 엘지이노텍 주식회사 | Duplexer chip package and methode for manufacturing duplexer chip package |
KR100574533B1 (en) * | 2002-07-30 | 2006-04-27 | 엘지이노텍 주식회사 | METHOD FOR MANUFACTURING Front End Module CHIP |
KR20040100395A (en) * | 2003-05-22 | 2004-12-02 | 주식회사 에이엔티 | The fbar bandpass filter and duplexer using ltcc layer coupling |
KR100579137B1 (en) | 2004-12-10 | 2006-05-12 | 한국전자통신연구원 | Transceiver module using ltcc |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20070629 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |